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FLEXIBLE HYBRID ELECTRONICS: DRIVING AUTOMOTIVE INNOVATION ROADMAPS
SCOTT M. MILLER, NEXTFLEX DIRECTOR OF STRATEGIC PROGRAMS
SEPT. 13 | 2017
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WHAT IS FHE AND WHY CARE?
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WHAT IS FLEXIBLE HYBRID ELECTRONICS?
FHE (FLEXIBLE HYBRID ELECTRONICS) COMBINE THE FLEXIBILITY AND LOW COST OF PRINTED PLASTIC FILM SUBSTRATES WITH THE PERFORMANCE OF SEMICONDUCTOR DEVICES TO CREATE A NEW CATEGORY OF ELECTRONICS
9/13/2017
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• Flexible• Stretchable• Conformable• Transparent• Biocompatible• Lightweight• Cost Effective
250 μm thick Si die
25 μm thick Si die
12mm ROC
FLEXIBLE HYBRID ELECTRONICS
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FHE – INTEGRATED ELECTRONIC SYSTEMS ON EVERYTHING
9/13/2017
Flexible | Stretchable | Conformable | Transparent | Biocompatible | Lightweight | Cost Effective
ELECTRONICS “OUT OF THE BOX”ELECTRONICS IN A BOX
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GAME CHANGINGFHE manufacturing combines previously impossible attributes for systems together to produce form factors, cost points, lot sizes and delivery schedules simply not viable with traditional methods
DIGITAL PROCESSFLOW
Feedback Control Manufacturing, Virtual Assets, No Tooling Overhead
MASS CUSTOMIZATIONEconomic High Mix, Low Volume and
Customized Production
SPEED TO MARKETAbility to Produce a Complete System Concurrently
LOW TEMPERATUREMANUFACTUREBio Materials, TPU, PET, Compatible
IMPOSSIBLE FORMFACTORSFlexible, Stretchable, 3-D
DIGITAL
CUSTOM
FAST
UNIQUE MATERIALS
UNBOUNDED
NEW WORLD ORDER
FHE: ELECTRONICS OUT OF THE BOX
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3D Printing Functional SystemsSIMPLE CO-DEPOSITED ELECTRONICS
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WHAT PROBLEMS CAN FHE HELP SOLVE IN AUTOMOTIVE?
• Weight: o Reduce substrate masso Eliminate separate enclosures and boardso Replace mechanical-electrical components
• Space (volume)o Improve wire routingo Replace wire bundles with printed conductorso Structurally integrate electronicso Decentralize electronics
• Costo Reduce part count and assembly cost
• Functionalityo Simplify sensor & communications integration
SEPTEMBER 13, 2017
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WHERE DOES FHE FIT IN AUTOMOTIVE?
In-Cabin Information
Systems
Controls
Wire Harness Replacement In-seat
Lighting
Electric Drive & Battery
Antennas
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FHE MANUFACTURING TECHNOLOGIES
&AUTOMOTIVE
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Printed Antenna
Integrated Si Die
Printed Battery
Strain Gage
Skin Contact
Stretch Conductor
CMOS Radio
Die on Stretch Die Thinning
Antenna Prin
Trace PrintDie Placement
Integration & Lamination
FHE BUILDING BLOCKS
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AUTOMOTIVE FHE DEVICE MANUFACTURING
Enablers• High T materials• Thermoformable• Harsh environment capable• Design, modeling, & simulation
capability
Laser Direct Structuring (image: Molex)
In-Mold Electronics (image: TactoTek)
Direct Printing (image: Lockheed Martin)
In-Mold Electronics (image: Advanced Decorative Systems)
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WHO IS NEXTFLEX?
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Established 28 August 2015
Lead FlexTech Alliance
Hub Location San Jose, California
Proposal Contributors 145+ in 27 states
Federal Funding $75 million over 5 years
Committed Matching $96 million
Government Agencies Engaged 17 DOD & OGAs
PUBLIC PRIVATE PARTNERSHIP
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BRINGING TOGETHER EXISTING CAPABILITIES
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*Corporate Academic / Non-Profit
Tier 1
Tier 2
Tier 3
Honorary* Founding Member
Observer
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Equipment Affiliate
MEMBERSHIP
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Research
Medical/Wearable Devices
Equipment
Materials
Industrial/AerospaceContract Manufacturing
Process Technology Industry StandardsSemiconductor
Device/Component Manufacturing
Economic Development
FHE ECOSYSTEM
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ENABLERS OF FHE ADOPTION
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DESIGN, MODELING, SIMULATION, AND TESTINGNetlistProduct Definition/
SchematicDesign/Layout/
Analysis Manufacturing/Test
Arduino™ is registered trademark of Arduino
Courtesy: American Semiconductor
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MANUFACTURING TOOLS & MANUFACTURERS
Conductor Printing & Curing
Component Placement
Die Attachment
Interconnect and Antenna Printing
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WORKFORCE DEVELOPMENT
60 occupations
9,628,062 US workers in 2016
1,442,606 job postings in 2016
$55,883 average annual salary
22% women
25% are over 55 years old
6% under 24 years old
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COMMUNITY RESOURCES
• Process Information
• Test Patterns Files and Prints
• Daisy Chain Die
• Die Selector Tool
• Thin Die Bank
• PDK for FHE
• Process Flows
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NEXTFLEX ROADMAPS
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INDUSTRY LED TECHNICAL WORKING GROUPS
Technology Platform Demonstrators
• Asset Monitoring Systems• Human Health & Performance Monitoring• Integrated Antenna Array• Soft & Wearable Robotics
• Modeling & Design• Device Integration, Packaging and Assembly• Materials• Printed Flexible Components and Microfluidics• Standards, Reliability, and Tests
SEPTEMBER 13, 2017
Manufacturing Thrust Areas
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TPD1 Human Monitoring
TPD2 Asset Monitoring
TPD3 Integrate array antenna systems
TPD4 Soft robotics
Demos 1Key Features1.2.
Demos 1Key Features1.2.
“What” we do• Led by Tech council• Strong end-user participation• Demos describe “What” the institute
is doing in manufacturing• Revised annually
Road Mapping and Tech Planning
TPD5 Automotive
MT1. Device Integration and Packaging
MT2. Materials
MT3. Printed Flexible Components& Microfluidics
MT4. Modeling & Design
MT5. Standards, Test & Reliability
“How” we do it• Industry Led at WG level• Clear boundaries, detailed
roadmaps and deliverables feeding into TPDs
• Develop “How” – gap analysis• Drive Project Calls• Revised semi-annually
TIME
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INTEGRATED ANTENNA ARRAYS
9/13/2017
2D Flex Hybrid Array Antenna - Adaptive Flexible and/or Electrically Reconfigurable FlexhybridArray Antenna
• Flexible antenna array including electronic components• Adaptable and/or reconfigurable• May be flexible for deployment and then rigidized during operation or remain
flexible/stretchable during operation)
2.5D Conformal, High Performance Phased Array with Integrated Electronics• Conformal array including electronic components for high performance applications• Fabricated directly on conformal surface or fabricated on flex and conformed to surface• Rigid except for mechanical strain during operation
3D Integration of 2D/3D Antenna Systems with Embedded Electronics and Sensors • Array including electronics (flexhybrid) integrated with embedded electronics and sensors.• May rely on 2D flexible / conformal manufacturing techniques• Utilizes 3D manufacturing techniques – 3D printing, 3D design approaches (including
origami & fractals)• Unique cost, performance and form factor advantages
Flexible array: NASA JPL
Conformal antenna: AFRL, Boeing, Mesoscribe
3D antenna array: SI2 Technologies, UMass Lowell, Raytheon
NEXTFLEX BUSINESS CONFIDENTIAL
State-of-the-art examples:
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INTEGRATED ANTENNA ARRAY
9/13/2017
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2D IAA
2.5D IAA
3D IAA
2017
2019
2018
2021
2020
2023
2022
2025
2024
● 2D FHE arrays with large radius of curvature using rigid COTS electronics
● Conformal IAA for platform anti-jam GPS
● Structurally integrated IAA for vehicle comms, navigation, etc.
●Low cost, low profile sensors (such as facial sensors for CO2-based RR or clothing/shoe embedded sensors)
●Multi-functional array for GPS, Comm, Navigation
● Multi layer FHE array using rigid COTS electronics
●Low cost 2D array with integrated flexible electronics
● Low-cost Xband weather radar
● Air-traffic Control Radar
●3D FHE arrays withrigid COTS electronics
●Low-profile and light-weight arrays for weight-constrained applications such as space
●3D Integrated, unobtrusive automotive arrays for smart and driverless cars
NEXTFLEX BUSINESS CONFIDENTIALNEXTFLEX BUSINESS CONFIDENTIAL
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ASSET MONITORING SYSTEMS
9/13/2017
Safety & Security
Extreme Environment Asset Status
Monitoring (ASM)Asset Health
Monitoring (AHM)
Other
2017
2019
2018
2021
2020
2023
2022
2025
2024
● Chain-of-Custody/Anti-Counterfeit Tags ● Excessive Environment
Awareness for Shipped Items (too hot/cold. Dropped, etc.)
● Multiple Sensor tags for industrial systems health awareness
● Standalone sensors tags for industrial systems health awareness
● Applique systems for household hail or other roof damage
● Wear & Tear Awareness Appliques for Furniture or other Household Products
● Improved Time Based Inventory Management
● Crack, Strain, Load appliques for complex indoor/outdoor structures made from steels/concretes
● Tags for Exposure Awareness to Harmful Solar Radiations (Sunburn, Skin Cancer Prevention)
● Tags for Exposure Awareness to Household Chemical or Biological Events (.i.e., flus)
● Proximity Systems for Safety of Man-Machine Interactions
● Security Event Detections for Cargo or Secure Assets
● Health Monitoring of Munitions, Chem-Bio Threats, or Radiation for Safety of Asset or Person
● Long Range, Long Duration Status tags for Logistics Support in Industrial and Transport
● Self Reporting Prognostic and Diagnostic Status systems for Life Cycle Logistic Supports
● Large area arrays for transport systems (such as airplanes) to provide CBM data
● Embedded and Applied Appliques with prognostics/diagnostics to provide survivability or Remaining Useful Life (RUL) data
● ASM or AHM systems for Space applications
● ASM or AHM systems for Underwater applications
● ASM or AHM systems for Extreme Industrial Applications
NEXTFLEX BUSINESS CONFIDENTIAL
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DEVICE INTEGRATION, PACKAGING AND ASSEMBLY
9/13/2017
Thinned die and compliant attach methods.Stretchable and conformable substrates. Flexible low dielectric / low loss RF materials.
Enablers
Flexible substrates using stretchable circuitry, RF materials and clothing textiles Circuitization
Flex circuit transition to multi-layer with internal pwr/gnd planes, via interconnections and embedded features
Die low I/O (<100) and pitch (>200 µm) for µc, mem, wifi using compliant chip attach methods
Dev of printed conductors, transmission lines, dielectrics, pwr/gnd, vias, R/C/L, 3D features and sensors
Encapsulation
Mostly single-die, S2S/batch
Flexible/ Conformable
Multi-mode & higher I/O countSustainability / Recyclability;Demanding/Harsh Environments
High-volume / low-cost R2R
Flexible interposers for fine-pitch, <50 μm thick dies
Non-Printed Components Interconnection methods for reliable assembly of <50 μm thick dies
Stress- and defect-free thinning & dicing of <50μm wafers
FHE interposers for <10μm thick dies; stretchable interposers; interposers with embedded components
Thinning & dicing of <10μm wafer, incl. non-contact methods
Assembly of <10μm thick dies; FHE integration of power source and passive components
Embedded and integrated passive components for FHE integration
Thin die flip-chip bonding
PnP methods for assembly of <50 μm thick dies without interposerDevice
Assembly
Methods for assembly of <10 μm thick dies with and without interposer; non-contact methods for die assembly
Methods for embedding passive and active components in HD flex circuit boards
S2S to R2R migration for FHE device assembly
Assembly of FHE interposers with fine-pitch, <50 μm thick dies
Clothing textile substrates for wearable app.Printed features for RF and hi-speed functions.Flexible interposers for fine-pitch die attach.
Embedded components and integrated passives.Encapsulation for harsh environment reliability.S2S migration to R2R for FHE device assembly.
NEXTFLEX BUSINESS CONFIDENTIAL
202220212020201920182016 2017
NEXTFLEX BUSINESS CONFIDENTIAL
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MATERIALS
9/13/2017
Application, performance & process specific requirements; Potential BOM based on FHE TPDs; Gap analysis on databases
Enablers Supplier base for functional material sets; In-situ characterization tools; Alignment with FlexTech, DOD, NASA materials databases
Product and application-specific material sets & sources w/ process & integration requirements/capabilities into database
Stretch 20% Elongation, ≤ 10% deformation over 1000cycles
Substrate Materials
Flex/Stretch for extreme natural environment >5yr lifetime; Low loss <0.0003 loss tangent @ ≥10GHz w/ high permeability low magnetic loss at ≥ L-band
Stretch 30-50% Elongation, ≤ 10% deformation over 1000cycles
Bio-degradable substrates for sustainability
In-vivo, soft tissue compatible
Improve conductivity <4X bulk metal; Low T cure ≤130°C; High T solderable ≥230°C; Stretch 20% bidirectional elongation w/ ≤10% resistivity change @ 1000 cycles; ≤ 10µ resolutions; flex battery electrode.Passive
Conductor Materials Improved conductivity ≤2X bulk metal; Printed alternative equivalent to
Cu; Stress absorbing conductor for via/interconnect
Substrate & process compatible dielectrics (D), encapsulants (E) & permeable selective membranes (PSM) for low T cure <130°C; High T ≥230°C stable; Stretchable ≥20% elongation w/ ≤10% deformation @ 1000 cycles; biocompatibility; ≥ L-band compatibility; ≥ 5 year use lifetime in natural environment, high dielectric constant.
Passive Insulator Materials D & E with: <0003 loss tangent @ 10GHz; operation use >260°C; 30-50% elongation
w/ ≤10% deformation @ 1000 cycles; super-hydrophobic; biodegradable; In-vivo compatible: Microfluidic compatible; Flexible NIR plastic & waveguide materials.
Temp, humidity, pressure transductive inks: Force & haptic sensing media
Active Materials
Long use life transductive ink for: T, H, pressure, shock, strain, chem.; Tunable magnetic/varactors; In-vivo micro-stress/strain.
Printed actives for battery/energy storage; Conformal energy harvesting; High res. transducer array for artificial skin
NEXTFLEX BUSINESS CONFIDENTIAL
202220212020201920182016 2017
NEXTFLEX BUSINESS CONFIDENTIAL
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STANDARDS, RELIABILITY AND TESTS
9/13/2017
Tests, reliability and regulatory protocols and gap analysis for FHE; early adoption to validate via TPD/MTA proposals
Protocols and Requirements Identify and define materials and baseline suppliers
to be included in the database
Revised standards for tests, reliability and regulatory needs for the FHE ecosystem; verification based on typical product or reference design
Standards Verification
Materials database
Final version of materials database and standards for tests and reliability available for typical product launch. Ready for product-specific customization
Standards for Different Products Launch
Define and develop standards for different FHE applications; validation through TPD/MTA projects Reliability test database from ongoing FHE projects and collateral technologies
Standards for Different
Applications
Materials database for target application
202220212020201920182016 2017
NEXTFLEX BUSINESS CONFIDENTIAL
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NEXTFLEX PROJECTS
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FHE MANUFACTURING PROCESS FOR ASSET MONITORING APPLICATIONS
JUNE 26, 2017 |
Objective: Develop a distributed strain sensor mesh for structural health monitoring applications. • Application example: force feedback / fly-by-feel• complex motions such as the deformation of an airplane
wing during flight• High accuracy, large area
Benefit: Creation of new methods to blend CMOS sensors and printed structures into large area stretchable sensing arrays.
Deliverable:Prototype design, consistent, high-yield manufactured sensors and manufactured stretchable wires.
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CONFORMAL PRINTING ONTO COMPLEX 3D SURFACES
JUNE 26, 2017 |
Problem: There is a fast growing need for the ability to integrate electronics, sensors, antenna and other intelligent capabilities with 3-Dimensional printing.
Objective: Develop tooling, software and processes enabling 3-Dimensional complex printing of conformal sensors, 3D antennas, and non-planarcircuit routing
Deliverables: • Equipment, software and processes to deposit functional materials
onto non-planar complex surfaces• Pilot line setup at NextFlex node site • 3D demonstrator articles with relevant CAD materials to show the
printing capabilities in a representative manufacturing environment
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FHE PROCESS DESIGN KIT
JUNE 26, 2017 |
Problem:FHE design can be very manual because there is no integrated workflow with design rules and material properties. Wide-scale adoption requires a qualified PDK mapping design to manufacturing capabilities.
Objective:Program and demonstrate an FHE PDK for integration of discrete and deposited elements of electronic systems. Populate PDK with data from statistically relevant samples of fabricated components.
Deliverable:• Delivery of a tested PDK with data for devices with two
materials.• Framework for adding additional devices, materials, and
processes. • NextFlex has licensing and use rights to the PDK across
the FHE community.
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Existing Methods
Existing Infrastructure
New Test Method
New Test Setup
Model
Unique Application
Device Evolution Calibration /
Validation
New Standards
Experimental Characterization
- Development of Test Methods and Standards to Assess Reliability of FHE Components and Systems
- Test Methods for Electrical and Mechanical Durability of Flexible/Rigid Interfaces in Multi-Axial Fatigue and Dynamic Loadings
- Mechanical Test Methods for Flexible Hybrid Electronics Materials and Devices
- Assessment and Optimization of the Reliability of Wearable Performance Monitors
Ref: Adapted from DARPA’s Hand Proprioception and Touch Interfaces (HAPTIX) program, http://nextbigfuture.com/, March 2015
Operational Loads in Wearable Electronics Accelerated Stresses of Daily Motion Under Electrical Bias
Ref: Lall, P., Zhang, H., Survivability and Remaining Useful Life Assessment of Flexible Batteries in Wearable Electronics, Proceedings of the FlexTech Conference, Monterrey, CA, Feb 28-Mar 4, 2016
FlexibleBattery
Simulation of Operational Loads
RELIABILITY STANDARDS FOR FHE
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ROADMAPS FOR AUTOMOTIVE FHE
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ELEMENTS OF AUTOMOTIVE FHE ROADMAPS
Technical Product Demonstrators
Touch Controls • With & without haptic feedback• All electronics self-contained
Wire harness replacement• Signal routing on structural part
Antennas for Interior and exterior communicationsElectric Vehicle Drive Systems
Printed T sensorsDrive thermal monitoringBattery sensors for charge /
discharge and health monitoringEmissions sensors
In-Mold Electronics (IME)• Printed traces , connectors,
Components
Advanced materialsLaser Direct Structuring
3D Electronics• 3D direct write• 3D Laser Sintering• 3D surface placement
Direct-write of high temp materials onto structures
Reliability testing
SEPTEMBER 13, 2017
Manufacturing Thrust Areas
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CONCEPTUAL AUTOMOTIVE FHE ROADMAPTouch controllers with & without haptic feedbackInterior, UI,
and Non-Safety Critical
Demonstrators(TPD)
Printed antennas for infotainment, V2V, V2I
In-mold electronics: conductors, ICs, printed passives, design toolsAutomotive
Manufacturing (MTA)
Materials: High T, High Deformation, Proven Reliability
Design, modeling, & simulation tools: 3D circuit, Multiphysics, Reliabilty (based on Database, PDK)
Key Enablers
Printed sensors by direct write or flexible lamination. Under hood and exhaust applicationsHarsh Environment and Safety-Critical
Demonstrators (TPD)
Structurally integrated conductors for wire-harness replacement
3D Direct Write, Laser Sintering, and Component Placement
Reliability test methods
Design and Manufacturing Standards
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CALL FOR ENGAGEMENT
• Bringing FHE into automotive requires involvement from the auto industry.
• Opportunity to leverage and influence the coming technology wave.
• NextFlex is here to drive technology and applications. We want you to climb on-board.
9/13/2017
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HOW TO ENGAGE WITH NEXTFLEX
9/13/2017
Membership- Shape technical roadmaps & project
directions- Access technical information from
funded projects- R&D IP license to project IP- Participate in funded projects- Contract work at Tech Hub at
preferred rates- Assign staff to Tech Hub
Workshops- Gain technical insight on
focused FHE topics- Engage with other
members of the ecosystem- Share challenges and learn
how others solve them
Sponsored R&D- Engage leaders in the field
to solve your most challenging problems
- Work at Technology Hub, member-sites, or non-members
- Competitively bid or pre-selected performers
- Flexible terms- Confidentiality
Prototyping & Mfg- Rigid-to-FHE conversion or
completely new designs- Low volume and one-off
manufacturing- State of the art tools and capabilities- Expert industry professionals- Serve DoD and commercial needs- Confidentiality
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THANK YOU
FOR MORE INFORMATION, CONTACT:
SEPTEMBER 13, 2017
Scott MillerNextFlex Director of Strategic Programs