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| PAGE 0 DISTRIBUTION A: CLEARED FOR PUBLIC RELEASE DISTRIBUTION A: CLEARED FOR PUBLIC RELEASE FLEXIBLE HYBRID ELECTRONICS: DRIVING AUTOMOTIVE INNOVATION ROADMAPS SCOTT M. MILLER, NEXTFLEX DIRECTOR OF STRATEGIC PROGRAMS SEPT. 13 | 2017

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Page 1: Flexible Hybrid Electronics: Driving Automotive Innovation ... Scott Miller... · FLEXIBLE HYBRID ELECTRONICS: DRIVING AUTOMOTIVE INNOVATION ROADMAPS ... • Revised semi-annually

| PAGE 0DISTRIBUTION A: CLEARED FOR PUBLIC RELEASEDISTRIBUTION A: CLEARED FOR PUBLIC RELEASE

FLEXIBLE HYBRID ELECTRONICS: DRIVING AUTOMOTIVE INNOVATION ROADMAPS

SCOTT M. MILLER, NEXTFLEX DIRECTOR OF STRATEGIC PROGRAMS

SEPT. 13 | 2017

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| PAGE 1DISTRIBUTION A: CLEARED FOR PUBLIC RELEASE

WHAT IS FHE AND WHY CARE?

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WHAT IS FLEXIBLE HYBRID ELECTRONICS?

FHE (FLEXIBLE HYBRID ELECTRONICS) COMBINE THE FLEXIBILITY AND LOW COST OF PRINTED PLASTIC FILM SUBSTRATES WITH THE PERFORMANCE OF SEMICONDUCTOR DEVICES TO CREATE A NEW CATEGORY OF ELECTRONICS

9/13/2017

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• Flexible• Stretchable• Conformable• Transparent• Biocompatible• Lightweight• Cost Effective

250 μm thick Si die

25 μm thick Si die

12mm ROC

FLEXIBLE HYBRID ELECTRONICS

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FHE – INTEGRATED ELECTRONIC SYSTEMS ON EVERYTHING

9/13/2017

Flexible | Stretchable | Conformable | Transparent | Biocompatible | Lightweight | Cost Effective

ELECTRONICS “OUT OF THE BOX”ELECTRONICS IN A BOX

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GAME CHANGINGFHE manufacturing combines previously impossible attributes for systems together to produce form factors, cost points, lot sizes and delivery schedules simply not viable with traditional methods

DIGITAL PROCESSFLOW

Feedback Control Manufacturing, Virtual Assets, No Tooling Overhead

MASS CUSTOMIZATIONEconomic High Mix, Low Volume and

Customized Production

SPEED TO MARKETAbility to Produce a Complete System Concurrently

LOW TEMPERATUREMANUFACTUREBio Materials, TPU, PET, Compatible

IMPOSSIBLE FORMFACTORSFlexible, Stretchable, 3-D

DIGITAL

CUSTOM

FAST

UNIQUE MATERIALS

UNBOUNDED

NEW WORLD ORDER

FHE: ELECTRONICS OUT OF THE BOX

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3D Printing Functional SystemsSIMPLE CO-DEPOSITED ELECTRONICS

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WHAT PROBLEMS CAN FHE HELP SOLVE IN AUTOMOTIVE?

• Weight: o Reduce substrate masso Eliminate separate enclosures and boardso Replace mechanical-electrical components

• Space (volume)o Improve wire routingo Replace wire bundles with printed conductorso Structurally integrate electronicso Decentralize electronics

• Costo Reduce part count and assembly cost

• Functionalityo Simplify sensor & communications integration

SEPTEMBER 13, 2017

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WHERE DOES FHE FIT IN AUTOMOTIVE?

In-Cabin Information

Systems

Controls

Wire Harness Replacement In-seat

Lighting

Electric Drive & Battery

Antennas

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FHE MANUFACTURING TECHNOLOGIES

&AUTOMOTIVE

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Printed Antenna

Integrated Si Die

Printed Battery

Strain Gage

Skin Contact

Stretch Conductor

CMOS Radio

Die on Stretch Die Thinning

Antenna Prin

Trace PrintDie Placement

Integration & Lamination

FHE BUILDING BLOCKS

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AUTOMOTIVE FHE DEVICE MANUFACTURING

Enablers• High T materials• Thermoformable• Harsh environment capable• Design, modeling, & simulation

capability

Laser Direct Structuring (image: Molex)

In-Mold Electronics (image: TactoTek)

Direct Printing (image: Lockheed Martin)

In-Mold Electronics (image: Advanced Decorative Systems)

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WHO IS NEXTFLEX?

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Established 28 August 2015

Lead FlexTech Alliance

Hub Location San Jose, California

Proposal Contributors 145+ in 27 states

Federal Funding $75 million over 5 years

Committed Matching $96 million

Government Agencies Engaged 17 DOD & OGAs

PUBLIC PRIVATE PARTNERSHIP

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BRINGING TOGETHER EXISTING CAPABILITIES

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*Corporate Academic / Non-Profit

Tier 1

Tier 2

Tier 3

Honorary* Founding Member

Observer

**

* * *

*

*

* * *

*

**

* * *

*

** * *

*

*

* ** *

Equipment Affiliate

MEMBERSHIP

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Research

Medical/Wearable Devices

Equipment

Materials

Industrial/AerospaceContract Manufacturing

Process Technology Industry StandardsSemiconductor

Device/Component Manufacturing

Economic Development

FHE ECOSYSTEM

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ENABLERS OF FHE ADOPTION

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DESIGN, MODELING, SIMULATION, AND TESTINGNetlistProduct Definition/

SchematicDesign/Layout/

Analysis Manufacturing/Test

Arduino™ is registered trademark of Arduino

Courtesy: American Semiconductor

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MANUFACTURING TOOLS & MANUFACTURERS

Conductor Printing & Curing

Component Placement

Die Attachment

Interconnect and Antenna Printing

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WORKFORCE DEVELOPMENT

60 occupations

9,628,062 US workers in 2016

1,442,606 job postings in 2016

$55,883 average annual salary

22% women

25% are over 55 years old

6% under 24 years old

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COMMUNITY RESOURCES

• Process Information

• Test Patterns Files and Prints

• Daisy Chain Die

• Die Selector Tool

• Thin Die Bank

• PDK for FHE

• Process Flows

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NEXTFLEX ROADMAPS

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INDUSTRY LED TECHNICAL WORKING GROUPS

Technology Platform Demonstrators

• Asset Monitoring Systems• Human Health & Performance Monitoring• Integrated Antenna Array• Soft & Wearable Robotics

• Modeling & Design• Device Integration, Packaging and Assembly• Materials• Printed Flexible Components and Microfluidics• Standards, Reliability, and Tests

SEPTEMBER 13, 2017

Manufacturing Thrust Areas

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TPD1 Human Monitoring

TPD2 Asset Monitoring

TPD3 Integrate array antenna systems

TPD4 Soft robotics

Demos 1Key Features1.2.

Demos 1Key Features1.2.

“What” we do• Led by Tech council• Strong end-user participation• Demos describe “What” the institute

is doing in manufacturing• Revised annually

Road Mapping and Tech Planning

TPD5 Automotive

MT1. Device Integration and Packaging

MT2. Materials

MT3. Printed Flexible Components& Microfluidics

MT4. Modeling & Design

MT5. Standards, Test & Reliability

“How” we do it• Industry Led at WG level• Clear boundaries, detailed

roadmaps and deliverables feeding into TPDs

• Develop “How” – gap analysis• Drive Project Calls• Revised semi-annually

TIME

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INTEGRATED ANTENNA ARRAYS

9/13/2017

2D Flex Hybrid Array Antenna - Adaptive Flexible and/or Electrically Reconfigurable FlexhybridArray Antenna

• Flexible antenna array including electronic components• Adaptable and/or reconfigurable• May be flexible for deployment and then rigidized during operation or remain

flexible/stretchable during operation)

2.5D Conformal, High Performance Phased Array with Integrated Electronics• Conformal array including electronic components for high performance applications• Fabricated directly on conformal surface or fabricated on flex and conformed to surface• Rigid except for mechanical strain during operation

3D Integration of 2D/3D Antenna Systems with Embedded Electronics and Sensors • Array including electronics (flexhybrid) integrated with embedded electronics and sensors.• May rely on 2D flexible / conformal manufacturing techniques• Utilizes 3D manufacturing techniques – 3D printing, 3D design approaches (including

origami & fractals)• Unique cost, performance and form factor advantages

Flexible array: NASA JPL

Conformal antenna: AFRL, Boeing, Mesoscribe

3D antenna array: SI2 Technologies, UMass Lowell, Raytheon

NEXTFLEX BUSINESS CONFIDENTIAL

State-of-the-art examples:

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INTEGRATED ANTENNA ARRAY

9/13/2017

Page 26

2D IAA

2.5D IAA

3D IAA

2017

2019

2018

2021

2020

2023

2022

2025

2024

● 2D FHE arrays with large radius of curvature using rigid COTS electronics

● Conformal IAA for platform anti-jam GPS

● Structurally integrated IAA for vehicle comms, navigation, etc.

●Low cost, low profile sensors (such as facial sensors for CO2-based RR or clothing/shoe embedded sensors)

●Multi-functional array for GPS, Comm, Navigation

● Multi layer FHE array using rigid COTS electronics

●Low cost 2D array with integrated flexible electronics

● Low-cost Xband weather radar

● Air-traffic Control Radar

●3D FHE arrays withrigid COTS electronics

●Low-profile and light-weight arrays for weight-constrained applications such as space

●3D Integrated, unobtrusive automotive arrays for smart and driverless cars

NEXTFLEX BUSINESS CONFIDENTIALNEXTFLEX BUSINESS CONFIDENTIAL

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ASSET MONITORING SYSTEMS

9/13/2017

Safety & Security

Extreme Environment Asset Status

Monitoring (ASM)Asset Health

Monitoring (AHM)

Other

2017

2019

2018

2021

2020

2023

2022

2025

2024

● Chain-of-Custody/Anti-Counterfeit Tags ● Excessive Environment

Awareness for Shipped Items (too hot/cold. Dropped, etc.)

● Multiple Sensor tags for industrial systems health awareness

● Standalone sensors tags for industrial systems health awareness

● Applique systems for household hail or other roof damage

● Wear & Tear Awareness Appliques for Furniture or other Household Products

● Improved Time Based Inventory Management

● Crack, Strain, Load appliques for complex indoor/outdoor structures made from steels/concretes

● Tags for Exposure Awareness to Harmful Solar Radiations (Sunburn, Skin Cancer Prevention)

● Tags for Exposure Awareness to Household Chemical or Biological Events (.i.e., flus)

● Proximity Systems for Safety of Man-Machine Interactions

● Security Event Detections for Cargo or Secure Assets

● Health Monitoring of Munitions, Chem-Bio Threats, or Radiation for Safety of Asset or Person

● Long Range, Long Duration Status tags for Logistics Support in Industrial and Transport

● Self Reporting Prognostic and Diagnostic Status systems for Life Cycle Logistic Supports

● Large area arrays for transport systems (such as airplanes) to provide CBM data

● Embedded and Applied Appliques with prognostics/diagnostics to provide survivability or Remaining Useful Life (RUL) data

● ASM or AHM systems for Space applications

● ASM or AHM systems for Underwater applications

● ASM or AHM systems for Extreme Industrial Applications

NEXTFLEX BUSINESS CONFIDENTIAL

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DEVICE INTEGRATION, PACKAGING AND ASSEMBLY

9/13/2017

Thinned die and compliant attach methods.Stretchable and conformable substrates. Flexible low dielectric / low loss RF materials.

Enablers

Flexible substrates using stretchable circuitry, RF materials and clothing textiles Circuitization

Flex circuit transition to multi-layer with internal pwr/gnd planes, via interconnections and embedded features

Die low I/O (<100) and pitch (>200 µm) for µc, mem, wifi using compliant chip attach methods

Dev of printed conductors, transmission lines, dielectrics, pwr/gnd, vias, R/C/L, 3D features and sensors

Encapsulation

Mostly single-die, S2S/batch

Flexible/ Conformable

Multi-mode & higher I/O countSustainability / Recyclability;Demanding/Harsh Environments

High-volume / low-cost R2R

Flexible interposers for fine-pitch, <50 μm thick dies

Non-Printed Components Interconnection methods for reliable assembly of <50 μm thick dies

Stress- and defect-free thinning & dicing of <50μm wafers

FHE interposers for <10μm thick dies; stretchable interposers; interposers with embedded components

Thinning & dicing of <10μm wafer, incl. non-contact methods

Assembly of <10μm thick dies; FHE integration of power source and passive components

Embedded and integrated passive components for FHE integration

Thin die flip-chip bonding

PnP methods for assembly of <50 μm thick dies without interposerDevice

Assembly

Methods for assembly of <10 μm thick dies with and without interposer; non-contact methods for die assembly

Methods for embedding passive and active components in HD flex circuit boards

S2S to R2R migration for FHE device assembly

Assembly of FHE interposers with fine-pitch, <50 μm thick dies

Clothing textile substrates for wearable app.Printed features for RF and hi-speed functions.Flexible interposers for fine-pitch die attach.

Embedded components and integrated passives.Encapsulation for harsh environment reliability.S2S migration to R2R for FHE device assembly.

NEXTFLEX BUSINESS CONFIDENTIAL

202220212020201920182016 2017

NEXTFLEX BUSINESS CONFIDENTIAL

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MATERIALS

9/13/2017

Application, performance & process specific requirements; Potential BOM based on FHE TPDs; Gap analysis on databases

Enablers Supplier base for functional material sets; In-situ characterization tools; Alignment with FlexTech, DOD, NASA materials databases

Product and application-specific material sets & sources w/ process & integration requirements/capabilities into database

Stretch 20% Elongation, ≤ 10% deformation over 1000cycles

Substrate Materials

Flex/Stretch for extreme natural environment >5yr lifetime; Low loss <0.0003 loss tangent @ ≥10GHz w/ high permeability low magnetic loss at ≥ L-band

Stretch 30-50% Elongation, ≤ 10% deformation over 1000cycles

Bio-degradable substrates for sustainability

In-vivo, soft tissue compatible

Improve conductivity <4X bulk metal; Low T cure ≤130°C; High T solderable ≥230°C; Stretch 20% bidirectional elongation w/ ≤10% resistivity change @ 1000 cycles; ≤ 10µ resolutions; flex battery electrode.Passive

Conductor Materials Improved conductivity ≤2X bulk metal; Printed alternative equivalent to

Cu; Stress absorbing conductor for via/interconnect

Substrate & process compatible dielectrics (D), encapsulants (E) & permeable selective membranes (PSM) for low T cure <130°C; High T ≥230°C stable; Stretchable ≥20% elongation w/ ≤10% deformation @ 1000 cycles; biocompatibility; ≥ L-band compatibility; ≥ 5 year use lifetime in natural environment, high dielectric constant.

Passive Insulator Materials D & E with: <0003 loss tangent @ 10GHz; operation use >260°C; 30-50% elongation

w/ ≤10% deformation @ 1000 cycles; super-hydrophobic; biodegradable; In-vivo compatible: Microfluidic compatible; Flexible NIR plastic & waveguide materials.

Temp, humidity, pressure transductive inks: Force & haptic sensing media

Active Materials

Long use life transductive ink for: T, H, pressure, shock, strain, chem.; Tunable magnetic/varactors; In-vivo micro-stress/strain.

Printed actives for battery/energy storage; Conformal energy harvesting; High res. transducer array for artificial skin

NEXTFLEX BUSINESS CONFIDENTIAL

202220212020201920182016 2017

NEXTFLEX BUSINESS CONFIDENTIAL

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STANDARDS, RELIABILITY AND TESTS

9/13/2017

Tests, reliability and regulatory protocols and gap analysis for FHE; early adoption to validate via TPD/MTA proposals

Protocols and Requirements Identify and define materials and baseline suppliers

to be included in the database

Revised standards for tests, reliability and regulatory needs for the FHE ecosystem; verification based on typical product or reference design

Standards Verification

Materials database

Final version of materials database and standards for tests and reliability available for typical product launch. Ready for product-specific customization

Standards for Different Products Launch

Define and develop standards for different FHE applications; validation through TPD/MTA projects Reliability test database from ongoing FHE projects and collateral technologies

Standards for Different

Applications

Materials database for target application

202220212020201920182016 2017

NEXTFLEX BUSINESS CONFIDENTIAL

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NEXTFLEX PROJECTS

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FHE MANUFACTURING PROCESS FOR ASSET MONITORING APPLICATIONS

JUNE 26, 2017 |

Objective: Develop a distributed strain sensor mesh for structural health monitoring applications. • Application example: force feedback / fly-by-feel• complex motions such as the deformation of an airplane

wing during flight• High accuracy, large area

Benefit: Creation of new methods to blend CMOS sensors and printed structures into large area stretchable sensing arrays.

Deliverable:Prototype design, consistent, high-yield manufactured sensors and manufactured stretchable wires.

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CONFORMAL PRINTING ONTO COMPLEX 3D SURFACES

JUNE 26, 2017 |

Problem: There is a fast growing need for the ability to integrate electronics, sensors, antenna and other intelligent capabilities with 3-Dimensional printing.

Objective: Develop tooling, software and processes enabling 3-Dimensional complex printing of conformal sensors, 3D antennas, and non-planarcircuit routing

Deliverables: • Equipment, software and processes to deposit functional materials

onto non-planar complex surfaces• Pilot line setup at NextFlex node site • 3D demonstrator articles with relevant CAD materials to show the

printing capabilities in a representative manufacturing environment

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FHE PROCESS DESIGN KIT

JUNE 26, 2017 |

Problem:FHE design can be very manual because there is no integrated workflow with design rules and material properties. Wide-scale adoption requires a qualified PDK mapping design to manufacturing capabilities.

Objective:Program and demonstrate an FHE PDK for integration of discrete and deposited elements of electronic systems. Populate PDK with data from statistically relevant samples of fabricated components.

Deliverable:• Delivery of a tested PDK with data for devices with two

materials.• Framework for adding additional devices, materials, and

processes. • NextFlex has licensing and use rights to the PDK across

the FHE community.

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Existing Methods

Existing Infrastructure

New Test Method

New Test Setup

Model

Unique Application

Device Evolution Calibration /

Validation

New Standards

Experimental Characterization

- Development of Test Methods and Standards to Assess Reliability of FHE Components and Systems

- Test Methods for Electrical and Mechanical Durability of Flexible/Rigid Interfaces in Multi-Axial Fatigue and Dynamic Loadings

- Mechanical Test Methods for Flexible Hybrid Electronics Materials and Devices

- Assessment and Optimization of the Reliability of Wearable Performance Monitors

Ref: Adapted from DARPA’s Hand Proprioception and Touch Interfaces (HAPTIX) program, http://nextbigfuture.com/, March 2015

Operational Loads in Wearable Electronics Accelerated Stresses of Daily Motion Under Electrical Bias

Ref: Lall, P., Zhang, H., Survivability and Remaining Useful Life Assessment of Flexible Batteries in Wearable Electronics, Proceedings of the FlexTech Conference, Monterrey, CA, Feb 28-Mar 4, 2016

FlexibleBattery

Simulation of Operational Loads

RELIABILITY STANDARDS FOR FHE

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ROADMAPS FOR AUTOMOTIVE FHE

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ELEMENTS OF AUTOMOTIVE FHE ROADMAPS

Technical Product Demonstrators

Touch Controls • With & without haptic feedback• All electronics self-contained

Wire harness replacement• Signal routing on structural part

Antennas for Interior and exterior communicationsElectric Vehicle Drive Systems

Printed T sensorsDrive thermal monitoringBattery sensors for charge /

discharge and health monitoringEmissions sensors

In-Mold Electronics (IME)• Printed traces , connectors,

Components

Advanced materialsLaser Direct Structuring

3D Electronics• 3D direct write• 3D Laser Sintering• 3D surface placement

Direct-write of high temp materials onto structures

Reliability testing

SEPTEMBER 13, 2017

Manufacturing Thrust Areas

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CONCEPTUAL AUTOMOTIVE FHE ROADMAPTouch controllers with & without haptic feedbackInterior, UI,

and Non-Safety Critical

Demonstrators(TPD)

Printed antennas for infotainment, V2V, V2I

In-mold electronics: conductors, ICs, printed passives, design toolsAutomotive

Manufacturing (MTA)

Materials: High T, High Deformation, Proven Reliability

Design, modeling, & simulation tools: 3D circuit, Multiphysics, Reliabilty (based on Database, PDK)

Key Enablers

Printed sensors by direct write or flexible lamination. Under hood and exhaust applicationsHarsh Environment and Safety-Critical

Demonstrators (TPD)

Structurally integrated conductors for wire-harness replacement

3D Direct Write, Laser Sintering, and Component Placement

Reliability test methods

Design and Manufacturing Standards

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CALL FOR ENGAGEMENT

• Bringing FHE into automotive requires involvement from the auto industry.

• Opportunity to leverage and influence the coming technology wave.

• NextFlex is here to drive technology and applications. We want you to climb on-board.

9/13/2017

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HOW TO ENGAGE WITH NEXTFLEX

9/13/2017

Membership- Shape technical roadmaps & project

directions- Access technical information from

funded projects- R&D IP license to project IP- Participate in funded projects- Contract work at Tech Hub at

preferred rates- Assign staff to Tech Hub

Workshops- Gain technical insight on

focused FHE topics- Engage with other

members of the ecosystem- Share challenges and learn

how others solve them

Sponsored R&D- Engage leaders in the field

to solve your most challenging problems

- Work at Technology Hub, member-sites, or non-members

- Competitively bid or pre-selected performers

- Flexible terms- Confidentiality

Prototyping & Mfg- Rigid-to-FHE conversion or

completely new designs- Low volume and one-off

manufacturing- State of the art tools and capabilities- Expert industry professionals- Serve DoD and commercial needs- Confidentiality

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THANK YOU

FOR MORE INFORMATION, CONTACT:

SEPTEMBER 13, 2017

Scott MillerNextFlex Director of Strategic Programs

[email protected]