PCB WESTSeptember 25th 2012

Bryan FishNational Sales Manager

Streamline Circuitsbfish@streamlinecircuits.com

Advancements in PCB

Manufacturing

2

Advancements in PCB

Manufacturing

Cell Phones Off PLEASE

3

The Future is HERE!NOW!

Advancements in PCB

Manufacturing

Removing the X factor

4

What is the X-Factor?• It’s how boards have been built for the last 5 decades

– Rely on industry veterans (John the Shop Veteran) at every process– Board shop recipes, the so called “Black Magic”

• Ever seen quality issues spike in your supplier?– Manual processes, labor intensive (Expensive)– Data Driven, little or no engineering support to customer pre Gerber's– Little or no automation except very large facilities– Outdated equipment

Removing the X factor

5

75% Board shops 15% Board shops 10% board shops Standard Emerging Advanced

Layers 6 12 18 & upTrace/Space 5 4 2 & BelowMin PLT Hole 11 8 4

(Mech)Aspect Ratio 10:1 14:1 28:1Min Laser No Equip 4 2Hole size

Mult Lam 2 4 8 & upCycles

Fastest Turn 7 Days 4 Days 24 Hours(14 Layers)

LDI Imaging No Equip 60% 100%

Current Technology US Industry

6

• Approximately 230 shops left in the country– Estimates say there will be less than 150 by 2014

• Most are using out dated equipment and need to modernize– They rely heavily on industry Veterans (John, The X-Factor) for key

processes, limiting productivity• (Industry Veterans are very expensive, if you can find enough of them)

• Feel pressure from offshore competition, erroding pricesThe Decision time is approaching• As a business owner, “What Do I Do ???”

– A: Look for new market segments, Military, ITAR, Flex Rigid» All are costly changes to make, require Capital investment

– B: Close down the business

Current Status of the US Industry

7

• Must use advanced equipment, automation, and technology to manufacture today's printed circuit board requirements– The future in PCB manufacturing is about equipment

and automation (allows for 24/7 operations)• Trained equipment operators = lower Labor costs

– Remove John, industry veteran from the floor• Build low, medium and high tech to balance shop loading• Reinvest into the future: 10% of sales per year minimum

capitalization, Investing into shops future

Removing the X factorHow Do You Remove X-Factor?People – Process - Equipment

8

What is Streamline Circuits:• Manufacturer of rigid, flex, and rigid flex printed circuit boards• High mix, low to medium volume, higher volume quick turn

builds (Gap Builds)• Specialize in deliveries 10 days or less• Engineer and ship 45 - 55 new part numbers per day• Spend majority of our engineering time with customers;

engage early during the design stages, stack ups, DFM’s, material suggestions, design guidelines, Lunch and Learn Tech Seminars, Web Techinars– Our Goal: Help the customer design a manufacturable

product in a cost effective manner using the latest in engineering support and technologies

Equipment and Technology Neededfor the Future

Pre ProductionEngineering

LDI ImageProcessing

ElectrolessTechnology

TestProduct Integrity

QualityVerification

Develop EtchStrip

Laser Drilling Registration and Micro Via’s

Solder MaskSilkscreen

Test CasesOn the Horizon

10

EQUIPMENT ROADMAP

2012

Here Nowand a

Look Into the Future

11

Pre Production Engineering Services:

• “In Plan” planning software• Customer Specific Rules Based Automation

• Valor front end CAM (Unlimited Seats)• Industry Standard for front end engineering

• Stack up consultations, Service Offered No Charge $

• Insight Frontline DFM’s, Service Offered No Charge $

• Tech Seminars /Webinars• Material Science, Latest in Laminates and Pre Preg’s• R&D, Building the Toughest to Gain the Knowledge

• When you need it, we’ll be ready!

Typical Stack Up

Insight DFM Report

BACK

What is Hole to copper

12

Plated Thru Hole to CopperWhat is it?

•It’s the distance between a copper hole wallAnd the closest copper trace or plane

Streamline’s Cost adders startsAt <.007”

BACK

13

LDI Imaging SystemsExample of 25 Micron

(.001” Trace and Space)

LDI (Laser Direct Imaging) Orbotech Paragon SM20

15

LDI Imaging Systems:• 100% Laser Direct Imaging (LDI)

• Repeatable process, computer controlled• 24/7 consistent imaging regardless of shift (X-Factor)• No film means lower tooling costs• No repeating defects

• Consistent trace width• Tighter impedance control (+/- 5 %)• ¼ Mil Accuracy .0008 Min Line/.0005 Space• Layer to layer registration within .0004”• No film growth due to heat expansion

Streamline is currently one of two companies in North America with 4 installations in-house

BACK

SCHMID Precision DES Line (Develop – Etch – Strip)

17

Inner Layer Develop Etch Strip:• January 2012 State of the art Schmid DES line Installed

• Computer controlled for consistent product• Full automation removes human element (X-Factor)• 2 Micron variation over panel• 1 mil core capability for substrate, HDI, and Rigid flex• 4,000 Cores per day capacity based on current copper mix• Tripled capacity upon installation• Positions Streamline for future technologies

BACK

Precision Laser Drilling 5 High Speed Laser Drills

19

Laser Drilling:• 6 Laser drills in house (7th has been purchased)

• Daily processing 4-N-4 of means experience• Higher stacks available

• .0014” Hole, .004” Pad advances technology window• Aspect Ratio: 3:1• Positional Accuracy for Hole Location +/- .0005”

20

Via formation, Aspect Ratios and Stacked Vias for Increased Densities

BACK

IPS Automated Electroless Plating Line

22

Electroless Processing:

BACK

• Completely Automated Line installed January 2012• Industry leading 28:1 Aspect Ratio: allows for higher

density designs• Bar coded processing removes operator errors (X-Factor) • Dwell times established in planning for speed &

efficiency, translating to consistent product (X-Factor)• Ultrasonic, knife edge agitation, vibration & thumper• 36 stations, Oversized tanks (24”x 30” Panels)• High volume throughput capability

Pluritec Inspecta X-ray Registration System

24

Internal Registration

• In unison with “Exact Software” for scaling

• Internal Registration is one of the key attributes in being successful

• X-Ray allows verification in real time

• X-Sections Verify X-Ray

Exacta Scaling Report

Non Conductive Filled Via Wrap Per IPC 6012 Class III

Dendrites(Teeth)

SmoothCopper

ElectrolessWrap

27

Copper Fill Laser Vias & Through Hole Solid Copper Vias

Thermal Via Farms for Thermal Management

BACK

28

• Chip Scale Packaging Requires Streamlines Equipment Sets for

Success-100% LDI

Chip Scale Packaging

LSMDP Laser Solder Mask Defined Pad

Using the LDI’s• Precise Imaging to .0005” clearance

– Allows reduced solder mask clearance sizes– May reduce layer count – Maximize geometry – Using solder mask defined pad (LSMDP)

• You can define a “Pad” on top of a pad

LSMDP Laser Solder Mask Defined Pad

Ink Jet Silkscreen Orbotech Sprint-8 TM

Ink Jet Silkscreen

• “Now Engineers can actually read to debug!”– Ultra Fine Crisp Lines, Down to 3 mil– Serialization on the fly, BAR Code & QR codes– Applied over partially cured mask providing for the mask

and legend to be cure simultaneously to reduce cycle time – Combination inkjet and laser technology (X-Factor)– Dry's the ink as it’s applied

BACK

Everret Charles Flying Probe Testing With the Eliminator

34

Test Capabilities:

BACK

• 100% Flying probe testing (8 Systems)• Flexibility, no fixtures, less cost• Allows for testing sub chapters before final book• Everett Charles Eliminator for faster testing• Every board 100% Net List Tested

35

Quality Verification:•Verify Expected Results

• 2 X-Section labs on site• 200 plus sections per day

• Wet processing lab onsite• CMM For critical measurement reporting• Two TDR’s for impedance verification• Single ended & diff pairs (Separate testing for accuracy• Ionic contamination testing• In process lamination X-ray verification• XRF Gold thickness verification X-Ray

36

Q-Pulse Total Quality Management:

• Quality Assurance Systems• Q-Pulse Quality System

• NCMR’s and Corrective Actions• Audits• Training• Equipment Calibrations

• Quality Certifications• IPC Certified Trainers 6012, 13,15,18 • ISO 9001 AS9100C ITAR MIL-P-55110• Mil-P-31032 In Process

BACK

37

Future Investments

• New Schmid outer layer etcher• 2 Orbotech AOI systems with .0005” (1/2 mil) capability• New Electroless Gold line (Enepig)• 2 Additional LDI systems• New Photo plotter for button and silkscreen film• Additional OEM Press• 2 Additional ESI Laser Drills

BACK

38

Sample Case #1

Highlights:1/1 Trace Space4 N 4 Stacked Micro Vias.225 Mil 1300 Pin BGA1.6 Mil Via – 4 Mil Pad.020 ThickSub Panel Test

Equipment Set:LDI, DESLaser, Inspecta, LDILDI, Inspecta, LDI S/MLDI, Laser, ElectrolessLDI, DES, InspectaFlying Probe

39

Sample Case #2

Speed Test:• 800ea 10 layers• 2 Lamination cycles• Buried vias, 2-9• Laser Micro Blind 2-3, 8-9• Laser Micro Blind 1-2, 9-10 with via in pad• 3/3 trace and space• 6.5 PTH to Copper

Delivered in 4 Days

40

Sample Case #3 Extremely Thin:• 4 Layer Blind vias 2 -3• 2 Lamination cycles• Laser Micro Blind 1-2, 3-4• Finished thickness .0054• Equipment set:

Flex, Rigid Flex, HDI? Yes we do!

RIGID-FLEX EXAMPLES6 Layer Rigid Flex

8 Layer Rigid Flex Micro via

6 Layer Rigid Flex with Cavity

10 Layer Micro via BGA

10 Layer Rigid Flex with Cavity and 4 flex, Microvia, Buried and blind via

Thank You

Questions?