pcb stackup design template with impedance control
TRANSCRIPT
All Dimension are in mm and Zo is in Ohm
RefP: Reference plane T: Thickness W: trace width D: ground strip seperation S: trace seperation Zo: Impedance
C.P.W.G: *******
Diff. pair:
Rowlayer# Layer Type/Material T Er RefP W Zo W D Zo W S Zo W S D Zo
1 SolderMask 0.01 3.5
2 1 Top Conductor/copper 0.018 2 0.1 53 0.1 0.15 95
3 prepreg Dielectric_FR-4 0.075 4.5
4 2 02_PWR1 Conductor/copper 0.035
5 core Dielectric_FR-4 0.05 4.5
6 3 03_GND1 Conductor/copper 0.035
7 prepreg Dielectric_FR-4 0.16 4.5
8 4 04_SIG1 Conductor/copper 0.018 3,5 0.1 52 0.1 0.15 93
9 core Dielectric_FR-4 0.16 4.5
10 5 05_GND2 Conductor/copper 0.018
11 prepreg Dielectric_FR-4 0.12 4.5
12 6 06_SIG2 Conductor/copper 0.018 5,8 0.1 54 0.1 0.15 91
13 core Dielectric_FR-4 0.55 4.5
14 7 07_SIG3 Conductor/copper 0.018 5,8 0.1 54 0.1 0.15 91
15 prepreg Dielectric_FR-4 0.12 4.5
16 8 08_GND3 Conductor/copper 0.018
17 core Dielectric_FR-4 0.16 4.5
18 9 09_SIG4 Conductor/copper 0.018 8,10 0.1 52 0.1 0.15 93
19 prepreg Dielectric_FR-4 0.16 4.5
20 10 10_GND4 Conductor/copper 0.035
21 core Dielectric_FR-4 0.05 4.5
22 11 11_PWR2 Conductor/copper 0.035
23 prepreg Dielectric_FR-4 0.075 4.5
24 12 Bottom Conductor/copper 0.018 11 0.1 53 0.1 0.15 95
17 SolderMask 0.01 3.5
Micro-strip/ Strip-linesingle C.P.W.G Diff. Pair C.P.W.G. Diff
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