pacs ibdr 27/28 feb 2002 pacs cre1 pacs cre development ybe creten, patrick merken, jan putzeys, vic...
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![Page 1: PACS IBDR 27/28 Feb 2002 PACS CRE1 PACS CRE development Ybe Creten, Patrick Merken, Jan Putzeys, Vic Fonderie, Chris Van Hoof IMEC](https://reader033.vdocuments.us/reader033/viewer/2022052701/56649e405503460f94b32140/html5/thumbnails/1.jpg)
PACS CRE 1
PACS IBDR 27/28 Feb 2002
PACS CRE development
Ybe Creten, Patrick Merken, Jan Putzeys, Vic Fonderie, Chris Van Hoof
IMEC
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PACS CRE 2
PACS IBDR 27/28 Feb 2002
Overview
• CRE and FEE design and design status• CRE/FEE Schedule and milestones• CRE and FEE Problems and possible solutions• PA/QA: AIV plan and activities• PA/QA: Key Inspection Points• Conclusions
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PACS CRE 3
PACS IBDR 27/28 Feb 2002
CRE design and design status
• At IIDR:– CRE input stage in spec (in terms of gain/debiasing, noise
and power)
– smallest Cint not functional but solution identified
– linearity of output stage out of spec but solution identified on separate buffer
• QM CRE design iteration– CRE122000 linearity of output stage
– CRE032001 smallest Cint
– CRE102001 increased dynamic range
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PACS CRE 4
PACS IBDR 27/28 Feb 2002
CRE design and design status (ctd)
• Status of CRE122000/CRE032001 – meet key CRE specifications:
• gain/debiasing, noise, power consumption
• linearity of output buffer
– do not meet• dynamic range (<2V, marginally
acceptable)• starting point of integration ramp
• smallest Cint linearity (“integrates”)
– results of IMEC confirmed by CSL
AVG slope @ 4K Vcascp = 3.0V Vcascn = 1.9V Outbias 10uA 4.1pF 2G/200mVExpected Slope : 1.3 V / 17 samples
2
2.5
3
3.5
4
4.5
5
0 5 10 15 20
0.00%
0.05%
0.10%
0.15%
0.20%
0.25%
Measured 02-10
lin trend
Non lin
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PACS CRE 5
PACS IBDR 27/28 Feb 2002
CRE design and design status (ctd)
• Status of CRE102001:– in addition meets dynamic range requirement
– shows smallest Cint approaching linearity spec (absolute value tbc)
CRE032001 CRE102001
AC_ARRAY(10-2001) A1 Iin 0.02nA 0.1pF LvL 1.8V 4K
0.00
1.00
2.00
3.00
4.00
5.00
6.00
0 5 10 15 20
0.00%
0.50%
1.00%
1.50%
2.00%
2.50%
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PACS CRE 6
PACS IBDR 27/28 Feb 2002
CRE Substrate design and design status
• QM_1 without shortcircuit resistors (baseline design)
• QM_2 model (featuring additional resistors)– Two production runs
• with BCB (adhesion deficient)• without BCB (_NB) to deliver sufficient assemblies
• QM_3 model made (to accommodate interface changes) – Available (no BCB version)
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PACS CRE 7
PACS IBDR 27/28 Feb 2002
Harness Substrate design and design status
• Harness QM_1 (baseline design)• Harness QM_2 model (and QM_2NB without BCB)
• Harness QM_3 model in preparation = FM model additional reference lines and reduced (3) temperature
sensor connections ; FM harness substrates scheduled for April 2002
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PACS CRE 8
PACS IBDR 27/28 Feb 2002
FEE status• Multiple FEE assemblies made
– QM_1 FEE delivered 6 July 2001 • 8 CRE082000 on QM_1 substrate delivered
– QM_2 FEE failed• 6 CRE032001 on QM_2 substrate shorted during bonding
– QM_2 FEE recovery• 3 CRE032001 on QM_2 substrate tested and delivered to MPE in November
2001• 3 CRE032001 on QM_2_NB substrate in stock (different R_mirror)• 13 CRE032001 on QM_2_NB assembled, tested and delivered to CSL
(December 2001)
– QM_3 FEE• 25 CRE102001 on QM_3 substrate (29 in process)• plan: phased assembly/test/delivery until Jan. 2002• 29 assembled in February 2002• Presently in test• Full delivery mid March 2002
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PACS CRE 9
PACS IBDR 27/28 Feb 2002
Schedule and MilestonesID Task Name Duration Start Finish
1 Start project #### Fri 9/1/00 Fri 9/1/00
2 FEE QM (Phase I) #### Fri 9/1/00 Fri 9/28/01
3 Design FEE QM #### Fri 9/1/00 Tue 10/31/00
4 Manufacture FEE QM #### Tue 10/31/00 Sat 12/30/00
5 Evaluation/Test FEE QM #### Sat 12/30/00 Wed 2/28/01
6 First FEE QM available #### Wed 2/28/01 Wed 2/28/01
7 Redesign FEE QM #### Tue 10/31/00 Mon 1/29/01
8 Manufacture FEE QM #### Mon 1/29/01 Fri 3/30/01
9 Evaluation/Test FEE QM #### Fri 3/30/01 Tue 5/29/01
10 FEE QM available #### Tue 5/29/01 Tue 5/29/01
11 ECP: QM_2 substrate redesign #### Tue 5/29/01 Mon 9/3/01
12 Milestone after ECP1 #### Fri 9/28/01 Fri 9/28/01
13 Detector Test Feedback #### Wed 2/28/01 Tue 8/14/01
14 Review and Acceptance all Phase I deliverables#### Tue 8/14/01 Tue 8/14/01
15 FEE PFM (Phase II) / FM (Phase III) #### Wed 2/28/01 Fri 4/11/03
16 Design FEE PFM #### Wed 2/28/01 Tue 7/3/01
17 ECP2: circuit redesign #### Mon 6/25/01 Fri 9/28/01
18 Manufacture FEE PFM #### Fri 9/28/01 Fri 11/23/01
19 ECP2: QM_3 assembly and gradual delivery #### Sun 12/2/01 Fri 2/15/02
20 Evaluation/Test FEE PFM #### Fri 11/23/01 Sat 3/2/02
21 Review and Acceptance Phase II #### Sat 3/2/02 Sat 3/2/02
22 Milestone after ECP2 #### Fri 3/15/02 Fri 3/15/02
23 ECP3: Design FEE FM #### Thu 7/11/02 Tue 10/29/02
24 Manufacture/pretest FEE FM #### Tue 10/29/02 Thu 2/6/03
25 Pretest FEE FM #### Thu 2/6/03 Mon 4/7/03
26 FEE FM available #### Fri 4/11/03 Fri 4/11/03
27 Review and Acceptance Phase III #### Fri 4/11/03 Fri 4/11/03
28 FEE FS (Phase IV) #### Fri 4/11/03 Wed 10/8/03
29 Manufacture FEE FS #### Fri 4/11/03 Thu 7/10/03
30 FEE FS available #### Thu 7/10/03 Thu 7/10/03
31 Evaluation/Test FEE FS #### Thu 7/10/03 Wed 10/8/03
32 Review and Acceptance Phase IV #### Wed 10/8/03 Wed 10/8/03
9/1
2/28
5/29
9/28
8/14
3/2
3/15
4/11
4/11
7/10
10/8
Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q32001 2002 2003 2004
Delayed start date TBC
M1 met
M2 met
M3 met 12/2001
M4 moves to 03/2002
M5 moves to 04/2003
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PACS CRE 10
PACS IBDR 27/28 Feb 2002
Schedule: Implications of FM delivery date
11/04/036/02/0329/10/0211/07/02
CREFM design
1 monthCRE
pretest
2 monthsFEE
assembly/test
today
• Counting back from FM delivery date
Answers needed to several questions !- absolute value Cint and background- Iout and Coutput adapation/redesign- latch-up tests on 12 modules- QM test results
06/01/03
FM tapeout
2 monthsCRE
production
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PACS CRE 11
PACS IBDR 27/28 Feb 2002
(Possible+Encountered) Problems and possible solutions
Componentaffected
Problemdescription
Possible solutions
FEE Bond strength onunpassivated MCM
Al vs Au bond wiresDestructive test on additional modules
CRE Radiation tolerancetesting
- Gamma and protons tested at RT- Cryogenic irradiation setup in progress (testing at LLN
and ESTEC)- Indirect evidence: scaled technologies are more rad-
tolerant
CRE Absolute value ofCint
Design iteration if needed
CRE Parasitic Cpara atdetector input andInput leakage current
Known after detector integrationInput bond pad with reduced ESD
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PACS CRE 12
PACS IBDR 27/28 Feb 2002
PA/QA: AIV and Test plan
• A general overview of the manufacturing of the FEE and Harness substrates: document PACS-IM-PL-001.
• Incoming inspection of parts and materials which are used during the manufacturing/assembly of the FEE and Harness substrates: document PACS-IM-PL-002.
• The assembly of the FEE substrates: document PACS-IM-PL-004 (draft).
• Verification of the performance of the FEE: document PACS-IM-PR-001.
• Critical items list: input provided
• FMECA: input provided
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PACS CRE 13
PACS IBDR 27/28 Feb 2002
PA/QA: AIV and Key Inspection Points
• FEE: each FEE is tested at room temperature and at 4 Kelvin. This test will indicate any error in bonding, resistor value, electrical connectivity, etc.
• Harness substrate: Each harness substrate will be visually
inspected before packaging (‘packing’).
Visual inspection
Substratemanufacturing flow
Functional Tests
FEE assembly
Packing
IC manufacturingflow
Harness Substrate
Packing
KIP
KIP
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PACS CRE 14
PACS IBDR 27/28 Feb 2002
Conclusions• FEE deliveries
– 3 FEE on QM_2 delivered for detector tests
– 13 FEE on QM_2NB delivered for module tests
– 25 FEE on QM_3 delivery pending (assembled and partially tested/accepted)
• ‘Forced’ delay in start of FEE FM design. No ‘idle time’ due to this delay:– design/test:
• of QM FEE in sufficient detail
• for correction/change of Cint
– assembly/inspection: • destructive bond-strength testing on spare FEE modules
• ECP for modified CRE substrate and harness substrate
– verification: cryogenic radiation setup and testing
• AIV and test plans available