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IEEE Sensors – Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
Packaged Capacitive Pressure Sensor System for Aircraft Engine Health Monitoring
Dr. Maximilian C. Scardelletti – NASA Glenn Research Center
Dr. Christian A. Zorman – Case Western Reserve University
https://ntrs.nasa.gov/search.jsp?R=20170004122 2020-03-10T08:54:06+00:00Z
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
Introduction
• Sensing systems for harsh environments:
High temperature electronics and sensors
Three Major Industries• Downhole Oil and Gas
Drilling operations were limited 150 to 175°C for reserves in easily
accessible wells
Declining reserves force deeper wells, which increase drilling
temperatures to 300°C
• Automobile
Cylinder pressures temperature: 300°C
Exhaust sensing temperature: 850°C
• Aerospace
Monitoring the health of aircraft engines at temperatures above
300°C (emissions, temperature, blade tip clearance and pressure)
Atmospheric and surface conditions of Venus (480°C)
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
Introduction
Develop a SiC-based MEMs capacitive pressure sensor system that can be used to monitor the pressure of a conventional gas turbofan engine.
Operating Conditions:
Temperature: 25 to 500°C
Pressure: 0 to 300 psi
Vibration: up to 5.3 Grms
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
System Design
The system is realized by integrating the following components on a common, high temperature substrate
1. A novel SiCN MEMS capacitive pressure sensor
2. 6H-SiC MESFET as active device
3. MIM capacitors, wirewound inductors, thick film resistors
4. Low form factor packaging
5. Borescope plug adaptor
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
Electronics DesignThe proposed system uses a Clapp-Type Oscillator Design
• The integrated system uses a
Clapp-type oscillator with
capacitive pressure sensor
located in LC tank circuit
• As pressure increases,
pressure sensor capacitance
decreases, which causes the
operational frequency to
increase
• Cree SiC MESFET used for
driving circuit into oscillation
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
Electronics Design
Clapp-Type Oscillator vs Colpitts Oscillator• The proposed Clapp oscillator requires one inductor,
three capacitors and one MESFET. Requires fewer
components vs. Colpitts oscillator design
• Increases system efficiency
• Increases system reliability under harsh environment
conditions
• LT and CSENSE are in series and CSENSE is used to set the
operational frequency
• C1 and C2 are used to control the gain conditions
• This arrangement increases frequency stability, making it
more frequency stable than the Colpitts design.
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
Pressure Sensor Testing
High Temperature and Pressure Chamber
System Key Features
• Pressure range: 0 to 100 psi
• Temperature range: 25 to 500°C
• LabVIEW control program
• Power source
• Multiple thermocouple
• Multiple feedthroughs
• Sight glass for signal transmission
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
Pressure Sensor
Sporian SiCN Capacitive Pressure Sensor• Parallel plate capacitor model
• SiCN membrane
• Temperature range: up to 1000°C
• Pressure range: 0 to 400 psi
SiCN pressure sensor Capacitance vs Pressure
Pressure
(psi)
Capacitance
(pF)
0 3.84
50 3.6
100 3.3
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
Oscillator Design
Circuit Simulations
Keysight’s Advanced Design System
(ADS) Software suite
CT =3.84 pF
LT = 780 nH
C1 = 14 pF
C2 = 41 pF
RG = 10KΩ
LD = 390 nH
CD = 188 pF
Oscillation
Frequency
96.7 MHz
Cree SiC MESFET model
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
Oscillator Design
50 100 150 200 250 300 350 400 4500 500
0
5
10
15
20
25
-5
30
freq, MHz
dB
m(V
ou
t1)
Circuit Simulations
96.7 MHz1st
HarmonicHarmonic Balance
Simulation
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
Oscillator Design
Circuit SimulationsTo achieve oscillation stability
1) Phase must be zero at fo2) Loop gain must be greater than unity at fo
Zero Phase at
96.7 MHz Greater than
unity
at 96.7 MHz
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
Oscillator Design
Circuit Simulations
Harmonic
Balance
Simulation
P = 0 psi f = 96.7 MHz
P = 50 psi f = 99.2 MHz
P =100 psi f = 102.8 MHz
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
Engine Testing
Packaged wired prototype has the following characteristics
• Unpackaged Sensor System Size: 8 x 40 x 4 mm3
(including on-board DC bias circuits)
• Form Factor: Packaged sensor equipped with
borescope adaptor for a borescope plug on engine
• Maximum Operational Temperature: 500°C for 1
hour at tip of borescope adaptor
• Maximum Vibration: 5.3 Grms along X-, Y- and Z-
axis for 20 min
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
Pressure Sensor System ChChipEntire circuit assembled on a single alumina substrate
(6 x 35 x 2 mm3)
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
Pressure Sensor System
Packaged Sensor System Assembly
Key Features
• Stainless steal packaging
• Thermo couples
• Custom connector/cable
from package to facilitate
input power and output signal
• Borescope plug adaptor
• Size: 30 x 150 mm
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
Pressure Sensor System
Bench-Top Acceptance Testing
• Custom-in-house pressurized
fixture
• Packaged sensor is attached to
quasi-borescope adaptor
• Thermocouple inside fixture to
emulate inner engine
temperature
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
Bench-Top Packaged System Characterization
Pressure Sensor System
To emulate actual jet turbofan
engine conditions the packaged
sensor was heated to over 500°C
and the pressure was increased
from 0 to 300 psi.
Note: The temperature recorded
on the metal sleeve was ≈ 400°C,
which is assumed to be the
steady-state temperature of the
system
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
Bench-Top Packaged System Characterization
Pressure Sensor System
0 psi → 96.88 MHz
100 psi → 102.79 MHz
200 psi → 109.54 MHz
300 psi → 116.77 MHz
350 psi → 119.86 MHz
Note: Simulated and measured
response at 0 and 100 psi are virtually
identical: Incredibly accurate circuit model
6.57 x 10 -2 ∆f/∆P MHz/psi
Percent difference = 21.2%
Spectrum response of packaged
pressure sensor from 0 to 350
psi at 25°C
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
Pressure Sensor System
Bench-Top System Characterization
The temperature at the tip of the
sensor inside the pressurized is
fixture is 540°C
(≈ 400°C at the sleeve)
0 psi → 96.3 MHz
320 psi → 117.8 MHz
6.8 x 10 -2 ∆f/∆P MHz/psi
Percent difference = 20 %
∆f = 21.5 MHz
The change in frequency
at 25 and 540°C at 0 psi is
less 1%
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
Pressure Sensor System
Bench-Top Packaged System Characterization
Structural Dynamic Testing
• Emulate on engine testing
• Sine wave sweeps
• Random vibration
• Maximum vibration 5.3 Grms
• X-, Y- and Z-axis testing
• Resonate frequency recorded
at the beginning and end
of each axis test. NO change!!
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
Pressure Sensor System
Bench-Top Packaged System Characterization
The packaged sensor system
was again measured after
structural dynamic testing.
0 psi → 25°C → 97.3 MHz
0 psi → 520°C → 96.5 MHz
342 psi → 520°C → 118.1 MHz
The change in frequency at 25
and 540°C at 0 psi is less 1%
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
Vehicle Integrated Propulsion (VIPR)
VIPR was a series of ground-based on-
wing engine demonstrations to mature
aircraft engine health management
technologies
Test vehicle was a U.S. Air Force C-17
aircraft equipped with Pratt & Whitney
F117 engines
VIPR partners include NASA, U.S. Air
Force, Pratt & Whitney, GE, Rolls
Royce, Boeing, FAA, USGS, and other
external organizations
Boeing C-17 Globemaster III
Pratt & Whitney F117 Turbofan Engine
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
VIPR3
Self Diagnostic
Accelerometer
Pressure Sensors
Emissions
Sensor
Fiber Optic
Temperature
Sensors
Model-based gas path diagnostic architecture
Microwave Tip
Clearance Sensor
Thin Film
Sensor
Test Objectives:
Demonstrate capability of advanced
health management technologies for
detecting and diagnosing incipient
engine faults before they become a
safety impact and to minimize loss
of capability
Approach:
Perform on wing engine ground tests
• Normal engine operations
• Seeded mechanical faults
• Seeded gas path faults
• Accelerated engine life degradation
through volcanic ash ingestion testing
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
VIPR3
600 feed thru
PHM
RACK
110” x 80”
ESS RIG
OPERATO
R
ESS
MAKEL
SDA
MWBTC
RH MLG W/W
window
FS 980 wire FEED
THRU
BOEING
COMMERCI
AL
AIRCRAFTAUBURN
UNIVERSIT
Y
KANSA
S
STATE
U
SHM
SPORIA
N AH
M
BORESCO
PE
VADR
For EHM:
GPD
For VAE: HM
P&W
OPERABILIT
Y
INSTRUMENTATIO
N
NAS
A PI
AFTC PalletTab
le
#1
OPs
ENG
For VAE: PI
For EHM:
PDM
SAFE
MON
PDPP & W
Comm. port I/F
at ~690
Table
#4Table #3Table
#2
SHM
PDU
XAFTC
Discipline
Engr.
AFT
C SI
15Klbs.
Pallet of
Concret
e
10Klbs.
Pallet
of
Concret
e
9Klbs.
Pallet
of
Concret
e
15Klbs.
Pallet of
Concret
e
MWBTC
Rack 1MWBTC
Rack 2
Overhead hatch
*****Equipment positions are Approximate*****
For VAE: PDM
For EHM: VAE
PI
CST Aircraft / Communication Layout
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
VIPR3
Aircraft Research Station Layout
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
VIPR3
Aircraft Research Station Layout
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
VIPR3
Measurement setup in fuselage to sensor
on the engine attached to the wing
• Spectrum analyzer
• Power supply
• Laptop
• Labview program to record measurements
• 200 ft cable going from equipment to sensor on engine
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
Vehicle Integrated Propulsion (VIPR)
Sensed Pressure Locations
P25 Ps3
AP7 AP7:
High temp capacitive pressure sensor system
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
Packaged Sensor On-Engine
Environmental Health Monitoring Test
Baseline Engine
Test ProfileSensor Output Data
5.55 5.6 5.65 5.7 5.75 5.8 5.85
x 104Time (seconds past midnight)
Pre
ssu
re
BLD14 Failed Open Baseline Run
P25
Ps3
Sporian
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
Packaged Sensor On-Engine
Environmental Health Monitoring Test
Transient Engine Test Profile
PowerSetting
Time
Transient Run
Idle
RPM
Ramp
Sensor Output Data
5.87 5.88 5.89 5.9 5.91 5.92 5.93
x 104Time (seconds past midnight)
Pre
ssu
re
BLD14 Failed Open During Ramp Accel
P25
Ps3
Sporian
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
Packaged Sensor On-Engine
Environmental Health Monitoring Test
Steady-State Engine
Test Profile Sensor output data
6.46 6.48 6.5 6.52 6.54 6.56
x 104Time (seconds past midnight)
Pre
ssu
re
BLD25 Failed Open at Steady-State
P25
Ps3
Sporian
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
Packaged Sensor On-Engine
Volcanic Ash Testing1st day of low flow volcanic ash
ingestion testing3rd day of low flow volcanic ash
ingestion testing
14 hours low rate
ash testing 1 mg/cu meter
5.5 6 6.5 7 7.5
x 104Time (seconds past midnight)
Pre
ssu
re
1st day of volcanic ash ingestion testing
Ps3
Sporian
5 5.5 6 6.5 7 7.5 8
x 104Time (seconds past midnight)
Pre
ssu
re
3rd day of volcanic ash ingestion testing
Ps3
Sporian
Sensor/cable
failure starts
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
Summary
• Simulated Clapp-type oscillator to prove concept
• Developed a packaged pressure sensor system
• Demonstrated accuracy of simulations vs. measured
• Performed pressure, temperature and vibration acceptance testing
• Successfully demonstrated sensor system tracking engine performance
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
Acknowledgements
NASA Glenn Research CenterRoger Meredith, Elizabeth Mcquaid Jennifer Jordan, Nick Varaljay, Robert Butler, Glenn Beheim and Gary Hunter
Sporian MicrosystemsKeven Harsh, Evan Pilant and Mike Usrey
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
Thank you
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
Appendix Slides
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
Pressure Sensor System
Bench-Top Packaged System CharacterizationStructural Dynamic Testing
5 200010 100 1000
4.0
0.1
1.0
Frequency (Hz)
Accele
ration (
G p
eak)
Acceleration Profile
Demand
M4X
Frequency 453.6 Hz
Demand 0.25 G
M4X 1.782 G
Frequency 551.2 Hz
Demand 0.25 G
M4X 3.585 G1.4 g
sinusoidal
sweep
profile
IEEE Sensors 2016 –Orlando, FL USA October 30 to November 2, 2016Distribution A - Approved for Public Release (88ABW-2016)
Pressure Sensor System
Bench-Top Packaged System Characterization
Structural Dynamic Testing
20 2000100 1000
-41x10
-31x10
-21x10
-11x10
Frequency (Hz)
Accele
ration S
pectr
al D
ensity (
G²/
Hz)
Acceleration Spectral Density
Demand
M6Z
Frequency 15 - 2000 Hz
Demand 5.261 G RMS
M6Z 5.799 G RMS5.3 Grms
random
vibration
profile