outer barrel hybrid integrated circuit cosimo pastore, its-mft mini-week, 12 march 2014
TRANSCRIPT
Outer BarrelHybrid Integrated
Circuit
Cosimo Pastore, ITS-MFT mini-week, 12 March 2014
OUTLINE
• OB Module assembly
• Ongoing activitiestools for:- modules pre-alignment and shipping- laser soldering test with 1 and 14 chips- pALPIDE_fs chip
• Summary
Cosimo Pastore, ITS-MFT mini-week, 12 March 2014 2
• 50 µm thick• size 15 mm x 30 mm
FPC layer stack up Cover-sheet 25
µmCopper 50 µm
Copper 50 µmKapton 25 µm
First version of FPC
OB Module assembly: material
6 modules have been produced - 1 with carbon plate - 5 without carbon plate
210,6 mm
30
,1 m
m
Dummy FPC
• designed as in TDR1 to accommodate 7 x 2 chips• holes metalized• no coverlay at the bottom• produced by Nuova Eurotar
Dummy chip
3Cosimo Pastore, ITS-MFT mini-week, 12 March 2014
C
1
2-5
4
AB
AB
3
4Cosimo Pastore, ITS-MFT mini-week, 12 March 2014
OB Module assembly
A
Accuracy of chips x,y position: < 8 um (average)
OB Module assembly
2 modules already shipped to Cagliari
Front view
Back viewCarbon plate K13D2U 75gsm (≈ 40µ) Thickness 0,11-0,12mm Weight
1,22g
Modules with carbon plate
Chip: 15 mm x 30 mm300 um thick
Front view
Back view
Modules without carbon plate
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• Time manufacturing: 2 hours + curing time
• Tools developed and assembly procedures: accuracy of chips x,y position < 5 um (average)
Production of 10 dummy modules (without carbon plate) for development of the stave assembly procedure is on going as scheduled:• 4 modules already shipped to Torino• 6 modules completed by the end of March: 64 dummy chips needed
Weight 4,4 g
6Cosimo Pastore, ITS-MFT mini-week, 12 March 2014
OB Module assembly
the pick up tool must be used for all modules handling
operations
Ongoing activities: tools for modules prealignment and shipping
Next 6 modules will be shipped by end of
March
by Silvia
Module box
references holes for Module box
dummy module
Pins for module pre alignment
Conductive carrying case for
shipping half stave modules
12
34
56
7
Half stave modules
foam
Alignment
station
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1
2
3 4
Ongoing activities: tools for laser soldering test
Daisy chain FPC in copper
Macor grid
Vacuum tool
Ball pick up tool
Preparation of two single chip assemblies with glue and adhesive tape in order to define the procedure for a fully equipped dummy modules to solder at CERN
Mechanical screwsfor chip-fpc alignment
8Cosimo Pastore, ITS-MFT mini-week, 12 March 2014
Quartz window
1
3
2
4
Ongoing activities: tools for HIC laser
soldering test
1
3
2
4
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Reference pins
The pre-fixed module is then placed on the tool for
the laser soldering interconnections
Ongoing activities: production of the new FPC
The production of the dummy FPCs for 14 chips was commissioned to Nuova Eurotar company.
M. Sacchetti
FPC elaborated on the layout design for the IB module
10Cosimo Pastore, ITS-MFT mini-week, 12 March 2014
220,4 mm
30
,1 m
m
FPC layer stack up Cover-sheet 25
µmCopper 50 µm
Copper 50 µmKapton 25 µm
Ongoing activities: ball pick up tool for pALPIDE_fs chip
11Cosimo Pastore, ITS-MFT mini-week, 12 March 2014
Third ball pick up tool designed
SUMMARY
• 6 modules have been produced: 2 to develop the jig to pick up the module and 4 for development of the stave assembly procedure. Next step is to produce 6 modules by the end of March.
• The modules prealigned will be shipped to Torino by mean an ad hoc tool which will be ready by the end of March.
• As soon as possible the solder test with 1 chip will be done.• The production of the dummy FPCs for 14 chips was
commissioned to Nuova Eurotar company.• The ball pick up tool for the pALPIDE chip will be ready by the
end of March.
12Cosimo Pastore, ITS-MFT mini-week, 12 March 2014
Back slide
13
14
Nominal Measured
X 210,6 210,6030
Y 30,1 30,1270
L 180,6 180,6744
Distance (i) i = 1,…,6 30,1 30,116730,113130,115530,106930,107930,1145
Metalized hole diameter i = 1,…,7
0,21 0,26290,26590,26730,26610,26340,26460,2632
i1 i4 i5 i6
L
XY
i2 i3
i1
i1
CHIP 2CHIP 1
CHIP 8
CHIP 2CHIP 1
Measures in mm
1515
Module assembly procedure Gluing procedure to fix the FPC on the chips
Adhesive mask89
10 11
16
Module assembly procedure
Modules without carbon plate
Modules with carbon plate
FPCFPC 150 µm thickChip 50 µm thickCarbon plate 120 µm thickGlue: Ecobond 40 µm thick
Does the module plate help for handling and testing? 17