on-chip scanning confocal microscope with 3d mems scanner and vcsel feedback detection
DESCRIPTION
ON-CHIP SCANNING CONFOCAL MICROSCOPE WITH 3D MEMS SCANNER AND VCSEL FEEDBACK DETECTION C. Gorecki , L. Nieradko et. al. Université de Franche-Comté, Besançon, FRANCE Wroclaw University of Technology, Wroclaw, Poland Transducers 07’ p 2561~2564. Reported by: Institute : 奈微所 - PowerPoint PPT PresentationTRANSCRIPT
Date: 2007/11/21 1
Reported by:Institute : 奈微所Name : 楊志誠 Student ID : d9635804
VCSEL (Vertical Cavity Surface Emitting Lasers)
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Outline
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1665虎克發明光學顯微鏡
1886
蔡司改良鏡片技術光學顯微鏡從此
性能高強價格低廉
1981~1986賓尼等人發明 STM, AFM
2007
Now
MEMS
Microscope History
1950 年代 TEM SEM
1957 Marvin 發明 Confocal
TEM的電子束要能穿透切成薄片的標本，
通常用來研究細胞內部的超顯微結構
SEM 標本的表面先鍍上薄薄的一層黃金，
再用電子束掃瞄其表面，適合用來研究標本表面的微細結構
，通常可以拍攝同一細胞表面的 3D 立體結構
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Scanning Confocal Microscope
http://www.microscopyu.com
Widely used in biomedicine, living cell
Three-dimensional (3-D) image
Non-invasive imaging of transparent samples
1.Reject light from out-of-focus planes
2.Provide clear in-focus image of a thin
cross section
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ARCHITECTURE OF CHIP-SCALE CONFOCAL MICROSCOPE
Laser microscope on-chip
silicon-based MEMS
Glass micro lenses
.
3 layers structure
Comb-drive actuators (Z and X-Y)
100 μm for Vertical motion (Z)
50 μm in both directions by
actuating of micro lens by x-y-axis
scanner
.VCSELs (Vertical Cavity Surface Emitting Lasers)
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Fabrication process of glass microlens. [ Method 1]
Isentropic Etching Glass reflow DRIE
Date: 2007/11/21 8Single-mask microfabrication of aspherical optics using KOH anisotropic etching of Si
Fabrication process of glass microlens [ Method 2]
single-mask process
KOH water solution<111> <100>
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ANSYS Simulation
[ High Displacement & Lower voltage ][ High Displacement & Lower voltage ]
[Higher Rigidity & Higher voltage ] for lens D > 300 μm[Higher Rigidity & Higher voltage ] for lens D > 300 μm
Different shape design to investigate their performance
Frequency and vibration
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The silicon mould having depth from 46 μm to 90 μm
Etch depth is non-linear function of mask diameter
Etch rate 1.0-2.0 μm/min
The silicon mould having depth from 46 μm to 90 μm
Etch depth is non-linear function of mask diameter
Etch rate 1.0-2.0 μm/min
Mask Diameter & Mould Diameter are linear
larger Microlens focal length
Increased Etched time
Silicon Nitride thicker
Mask Diameter & Mould Diameter are linear
larger Microlens focal length
Increased Etched time
Silicon Nitride thicker
Glass microlens fabrication
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Conclusion
Precise positioning and focal tuning of micro lens
— 2-3μm resolution
— penetration depth down to 30 μ m
Achieved high-resolution positioning control without need
for large numbers of electrodes
— 50 μm (X,Y)
— 100 μm (Z)
500 times smaller than anything in this class
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Discussion
Wavelength of light used is major factor in resolution
shorter wavelength greater resolution
Rayleigh criteria refractive wavelength shorter ， the penetration depth will be shallow 。
Cell Damage : Cell damage and death for laser light
Bleach ： Most specimen without fluorescent ， so adding dyes are necessary 。
Laser light will bleach the dyes in the period of lighting 。
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Thank you for your attention!
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Reference[1] .Magnetically Actuated Scanning Microlens for NIR Raman Spectroscope , Chin-Pang-
Billy Siu et al, MEMS 2007, Kobe , Japan, pp 735-738[2]. S. Kwon and L.P. Lee, “Micromachined transmissive scanning confocal icroscope”,
Optics Lett, vol. 29, pp. 706-709, 2004.
[3] S Bargiel, L Nieradko, M Józwik, C Gorecki, J.A Dziuban, “New generation of fully
integrated optical microscopes on-chip: application to confocal microscope“, Proc.
SPIE, vol. 6186, 2006.
[4] D. Heinis, C. Gorecki, “Feedback-induced voltage change of Vertical Cavity Surface
Emitting Laser as an active detection system for miniature optical scanning probe
microscopes”, Optics Express, vol. 14, pp. 3396-3405, 2006.
[5] R. Carrasco, J.A. Dziuban, I. Moreno, C. Gorecki, R. Walczak, M. Kopytko, L. Nieradko,
M. Józwik, “Optical microlenses for MOEMS” Proc. SPIE, vol. 5836, pp. 657-666, 2005.
[6]. http://www.cyto.purdue.edu/flowcyt/educate/pptslide.htm
[7]. www.cs.uky.edu/~jzhang/CS689/chapter7.pdf
[8]. http://www.ntrc.itri.org.tw/dict/content.jsp
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Vertical cavity surface emitted laser
面射型雷射二極體為一新型發光元件，此元件與傳統雷射二極體基本的差別在於
共振腔 磊晶層相對位置之不同；傳統雷射二極體的共振腔與磊晶層平行，反射面
係利用晶體自然斷裂面形成而與磊晶層垂直，雷射光由側面發出，故又稱邊射型雷射
(Edge-emitting laser) ，而本元件的共振腔與磊晶層垂直，反射面係由磊晶層或表層
介電質薄膜組成，雷射光由正面發出，故稱為垂直共振腔面射型雷射。
邊射型雷射於晶片製程結束後須將晶片劈裂成晶條，並進行端面鍍膜，此製程複雜
耗時且為影響製程良率之關鍵。面射型雷射因非利用晶體自然斷裂面作為反射面，故
無須利用劈裂或進行端面鍍膜，可節省可觀之製程時間並避免因此而影響製程良率。
另於晶片製程結束後即可於晶片上直接進行元件量測 (on wafer testing) ，可節省量測
成本及時間。
預期面射型雷射可能之應用方向有下列各項：‧光數據鏈路傳輸 (Serial Optical Data Links) 目前已有 HP 、 Motorola 、 Honeywell 、
IBM 、 Vixel 等公司投入
‧雷射列印 (Laser Printing): 利用面射型雷射則可同時二維列印，加快列印時間，
目前 Xerox 已投入此方面研究。 [ 工 業技術研究院 奈米科技研發中心 ]
http://www.ntrc.itri.org.tw/dict/content.jsp
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Definitions
Acceptance angle θ Numerical Aperture
NA = n sinθ Rayleigh resolution criterion for
a circular aperture Δx = 0.61 λ/NA
Highest Typical Resolution
Optical Microscope ~200 nm
Electron Microscope ~0.1 nm
Rayleigh Criterion
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objAiry NAr 05.0
20
min )(
**2
objNAz
Confocal Characteristics
objAiry NAr 061.0
共焦掃描顯微鏡僅對在聚焦面上形成清晰的影像，若我們逐步移動聚焦面，則可取得觀測樣品其深淺有序的斷面，將這些斷面的影像經由電腦處理，即可重組出相對應的三度空間影像。
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Zeiss 510
Zeiss Confocal Microscope
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Numerical Aperture
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Monochromatic Aberrations– Spherical aberration
– Coma
– Astigmatism
– Flatness of field
– Distortion
Chromatic Aberrations– Longitudinal aberration
– Lateral aberration
Images reproduced from:
http://micro.magnet.fsu.edu/
Sources of Aberrations