october 23-27, 2011 advance program · 2014-11-08 · he co-authored, along with professor charles...

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Advance Program

30th

Congress general Chair:Kunihiko Washio, Paradigm Laser Research Limited, Tokyo, Japan

laser Materials ProCessing ConferenCe Chair:Stefan Kaierle, Fraunhofer ILT, Aachen, Germany

laser MiCroProCessing ConferenCe Chair:Henrikki Pantsar, Cencorp Corporation, Canton, MI, USA

nanoManufaCturing ConferenCe Co-Chairs: Yongfeng Lu, University of Nebraska-Lincoln, Lincoln, Nebraska, USAXianfan Xu, Purdue University, West Lafayette, IN, USA

laser solutions short Courses Chair: Silke Pflueger, Laserline, Inc., Santa Clara, CA, USA

Business foruM & Panel DisCussion Co-Chairs:Neil Ball, Directed Light Inc., San Jose, CA, USASri Venkat, Coherent Inc., Santa Clara, CA, USA

Presented by:

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October 23-27, 2011Hilton located in the Walt Disney WorlD® resort | orlando, Fl, Usa

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Congress General Chair WelcomeKunihiko Washio, Paradigm Laser Research Limited, tokyo, Japan

HELLO And WELCOmE! The 30th International Congress on Applications of Lasers & Electro-Optics (ICALEO® 2011) returns again to Orlando, Florida, the home base of the Laser Institute of America. Continuing the tradition that began 29 years ago, the ICALEO Program Committee has put together yet another strong program with a high number of contributions from researchers from both academic and industries all over the world in areas of traditional and emerging laser applications. Don’t miss this unique opportunity to present and hear the latest advances in the field of laser applications, meet old and new colleagues and friends, and exchange results and ideas. One of the

key benefits ICALEO offers has always been the great social atmosphere and networking opportunities for the attendees. This will prove particularly helpful in these turbulent times brought on by factors that have nothing to do with lasers! ICALEO 2011 will offer three conferences covering an expanding array of laser applications. The Laser Materials Processing Conference (LMP), organized by Stefan Kaierle, continues its theme on high speed and flexible macroscopic laser processing applications, equipment and systems. The progress in high brightness processes brought on by advances and improvements in high power fiber, disk and direct diode lasers will be prominently featured. The Laser Microprocessing Conference (LMF) will be chaired by Henrikki Pantsar and will cover processes and systems for microscopic applications, especially those that take advantage of the small feature sizes and high precision offered by picosecond and femtosecond ultrafast lasers and wavelength optimization. LMF will feature a variety of application-oriented sessions such as photovoltaics, thin film processing, medical devices and biomedical applications, etc., highlighting the versatility of laser microprocessing. Continuing a feature introduced two years ago here in Orlando, ICALEO 2011 will have a joint session again between LMP and LMF with contributions that will appeal to researchers in both areas. This year’s joint session will focus on strategies, limits and challenges for advanced laser processing. Yongfeng Lu and Xianfan Xu will co-chair the Nanomanufacturing Conference. The Conference will explore topics in the

still emerging, but rapidly advancing, field of nanotechnology and the role various lasers can play.

This year’s plenary session will feature topics on material nanoscience, photonics and technologies for evolutional innovation with a keynote given by Dr. Hongjie Dai, a professor at the Department of Chemistry and Laboratory for Materials, Stanford University. The title of the keynote is “The Story and Prospects of Carbon Nanoscience and Technologies for Future Exciting Applications.” The following presentations will cover fascinating topics on conversion of cement material to transparent metals and superconductors, quantum cascade lasers and their applications, as well as the magic of the dressed photons, and their applications such as nanofabrication. This year’s Business Forum and Panel Discussion, a popular feature at ICALEO, organized by Neil Ball and Sri Venkat, will focus on Photonics Markets, Opportunities and Trends in the rapidly growing economies of BRIC (Brazil, Russia, India and China) nations. The panel discussion portion will address what industries within these nations are embracing Industrial laser technology. The Laser Solutions Short Courses organized by Silke Pflueger are ideal for those who want to receive a complete overview on the state-of-the-art in specific areas of interest to participants. The Vendor Reception is another popular venue for attendees to learn about the latest products, meet the industry representatives who are working in the laser applications market and will be a valuable networking opportunity.

Orlando, the “City Beautiful,” is home to numerous attractions, including major theme parks such as Walt Disney World®, Universal Studios™ and SeaWorld®, excellent museums, over 170 golf courses, extensive shopping and dining options, and spectacular nighttime entertainment. Combine this with an enticing tropical climate and Orlando is clearly an ideal location to experience ICALEO and more with colleagues, friends and family. With all these great features and opportunities to offer, I would like to extend a warm invitation to all to come and take part in ICALEO 2011. See you in Orlando!

Orlando, Florida, USA

ICALEO Advance Program Table of Contents:

Plenary Session . . . . . . . . . . . . . . . . . . . . . . Page 05

Receptions & Special Events . . . . . . . . . . . . Page 05

LIA Annual Meeting & Awards Luncheon . . . Page 07

Laser Materials Processing Conference . . . . Page 08

Business Forum & Panel Discussion . . . . . . . Page 12

Laser Microprocessing Conference . . . . . . . . Page 13

Nanomanufacturing Conference . . . . . . . . . . Page 16

Poster Presentation Gallery . . . . . . . . . . . . . . Page 17

Student Paper Award Contest . . . . . . . . . . . Page 18

Laser Solutions Short Courses . . . . . . . . . . . Page 19About LIA . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 20

General Information . . . . . . . . . . . . . . . . . . . Page 21

Conference Agenda . . . . . . . . . . . . . . . . . . . Page 22

Congress General Chair: Kunihiko WashioLIA President: Stephen CappLIA Executive Director: Peter BakerLIA Director of Conferences: Gail Loiacono

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TRUMPF-TruDisk-Laser(LIA).indd 1 6/30/11 2:14:19 PM

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Plenary Session: Material Nanoscience, Photonics and Technologies for Revolutionary InnovationKunihiko Washio, Paradigm Laser Research Limited, Tokyo, Japan Monday, October 24 • 9:00am

Although incremental innovation within a known systematic framework is very important for steady technology progress, disruptive innovation is often desired to push the limits of the imaginable and to leap forward to attain revolutionary innovation. Materials science, particularly material nanoscience, is believed to be the treasure house of the seeds of desired disruptive innovations. The 2011 ICALEO Plenary Session is pleased to present a keynote speech by Dr. Hongjie Dai, a professor at the department of Chemistry and Laboratory of Materials, Stanford University. Dr. Dai’s talk is entitled “The Story and Prospects of Carbon Nanoscience and Technologies for Future Exciting Applications,” and will give an overview of graphene- and carbon-nanotube-based nanoscience and their evolutional future applications. Following Dr. Hongjie Dai’s keynote, Dr. Hideo Hosono, a professor of Frontier Research & Materials and Structures Laboratory of Tokyo Institute of Technology (Japan), will give a presentation on “Conversion of Cement Material to Transparent Metals and Superconductors: Power of Nanostructure” which will be of particular interest for researchers and application engineers such as for advanced flexible electronic devices and superconducting wires for industrial applications. Dr. Federico Capasso, the Robert L. Wallace Professor of Applied Physics Vinton Hayes Senior Research Fellow in Electrical Engineering, Harvard School of Engineering and Applied Sciences, Harvard University, will talk about progress in quantum cascade lasers and their industrial applications. Finally, Dr. Motoichi Ohtsu, a professor at the Department of Electrical Engineering and Information Systems, School of Engineering, the University of Tokyo and the Director, Nanophotonics Research Center, School of Engineering, the University of Tokyo (Japan) will introduce magical properties of dressed photons (i.e., photons carrying the material excitation in a nanometer space) and their applications to novel nanofabrication and energy conversion technologies. This is one session you should not miss!

Invited Plenary Speakers:Keynote Presentation: The Story and Prospects of Carbon Nanoscience and Technologies for Future Exciting Applications (OP1) Hongjie Dai, Stanford University, Stanford, CA, USA

Conversion of Cement Material to Transparent Metals and Superconductors - Power of Nanostructure (OP2) Hideo Hosono, Tokyo Institute of Technology, Yokohama, Japan

Quantum Cascade Lasers and Their Industrial Applications (OP3) Federico Capasso, Harvard School of Engineering and Applied Sciences, Harvard University, Cambridge, MA, USA

Magic of the Dressed Photon (OP4)Motoichi ohtsu, The University of Tokyo, Tokyo, Japan

Welcome CelebrationSunday, October 23 • 4:00pm

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Plan to arrive early and enjoy live entertainment provided by Beer's Law in a casual atmosphere. In addition, door prizes will be raffled! This event is a great opportunity for new attendees to meet 'old timers' and for everyone to socialize and interact.

President’s ReceptionHilton in the WALT DISNEY WORLD® ResortMonday, October 24 • 5:00pm

The opening day of ICALEO® features an evening reception hosted by LIA President Stephen Capp. Meet the LIA Executive Committee, Board of Directors, ICALEO General Chair Kunihiko Washio and Conference Chairs Stefan Kaierle, Henrikki Pantsar, Yongfeng Lu, Xianfan Xu, Silke Pflueger, Neil Ball and Sri Venkat. Join the LIA staff and mingle with old friends. This will be an exciting evening!

PLENARY SESSIONS & RECEPTIONS


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LIA Annual Meeting & Awards Luncheon featuring the Arthur L. Schawlow Award PresentationWednesday, October 26

Award Sponsored by:

The 2011 Arthur L. Schawlow Award is presented to: Professor Berthold LeibingerLaser Institute of America first presented the Arthur L. Schawlow Award in 1982 to recognize individuals who have made distinguished contributions to applications of lasers in science, industry or education. The Award presentation consists of a silver medal, a $2,000 cash award and a citation. Awardees become Lifetime Members of LIA.

About Arthur L. SchawlowProfessor Schawlow received a Nobel Prize for Physics in 1981 for “his contribution to the development of laser spectroscopy.” He co-authored, along with Professor Charles H. Townes, the book Microwave Spectroscopy, and the first paper describing optical masers. For this latter work, the pair were awarded the Stuart Ballantine Medal by the Franklin Institute (1962) and the Thomas Young Medal and Prize by the Physical Society and Institute of Physics (1963). Professor Schawlow was also awarded the Morris N. Liebmann Memorial Prize by the Institute of Electrical and Electronic Engineers (1964). As the first honoree in 1982 of this award, it is fitting that LIA’s highest achievement award is given in Professor Schawlow’s name.

Closing Plenary SessionJoint Session (LMP & LMF): Strategies, Limits and Challenges for Advanced Laser ProcessingThursday, October 27 • 1:30pm

Session Chair: Jyoti mazumder, CLAIm, The University of michigan, Ann Arbor, mI, USA

Sophisticated and strategic approaches in laser manufacturing and their industrial applications are becoming increasingly important, partly due to the rapid increase in the R&D frontiers and strong demands in low-energy-consumption “greener” processes and advanced resources. This LMP and LMF joint session features strategies, limits and challenges for advanced laser processing with two invited and three contributed presentations. Dr. Stefan Kaierle, Laser Materials Processing Conference Chair, will give the first invited presentation on “Strategies of R&D and International Networking Towards the Evolution of Future Laser Materials Processing.” Following this, a distinguished and veteran researcher, Prof. Minlin Zhong of Tsinghua University (China) will give the second invited presentation on “Vision on Frontiers of Laser Manufacturing Research.” The following three contributed presentations will discuss various approaches towards realizing higher-throughput and more efficient laser materials processing.

Strategies of R&D and International Networking Towards the Evolution of Future Laser Materials Processing (Invited Presentation – 40 minutes) (C101)Stefan Kaierle, Fraunhofer ILT, Aachen, GermanyVision on Frontiers of Laser Manufacturing Research (Invited Presentation – 40 minutes) (C102) Minlin Zhong, Laser Processing Research Center, Department of Mechanical Engineering, Tsinghua University, Beijing, People’s Republic of ChinaNovel Diffractive Beam Splitters with Efficiency Above 95% Enable Multiple Beam Parallel Processing with Highest Throughput (C103) Oliver Homburg, LIMO Lissotschenko Mikrooptik GmbH, Dortmund, GermanyMicro and Nano Structuring with High Power Ultra Short Pulsed Laser – Current Applications and Perspectives (C105) Jens Holtkamp, Fraunhofer ILT, Aachen, Germany 400W and 800µJ Picosecond Laser and Application Examples (C104) Keming Du, EdgeWave GmbH Innovative Laser Solutions, Wuerselen, Germany

PLENARY SESSIONS & RECEPTIONS

Special Thanks to the ICALEO International Advisory Board: david Belforte, industrial laser solutions, sturbridge, Ma, UsaEckhard Beyer, Fraunhofer IWS, Dresden, GermanyThomas Fehn, JENOPTIK Laser GmbH, Jena, GermanyPaul Hilton, TWI Ltd., Great Abington, Cambridge, Great BritainTony Hoult, iPG Photonics Corporation, West Coast operations,

santa Clara, Ca, UsaXinbing Liu, Panasonic Boston Laboratory, Newton, MA, USAKlaus Löffler, TRUMPF Laser and Systems GmbH, Ditzingen, GermanyYongfeng Lu, Univ. of Nebraska – Lincoln, Lincoln, NE, USAJyoti mazumder, CLAIM, The Univ. of Michigan, Ann Arbor, MI, USAAndreas Ostendorf, Ruhr-Univ. Bochum, Bochum, GermanyRajesh Patel, Spectra Physics, Division of Newport Corporation,

Mountain View, CA, USAKoji Sugioka, RIKEN, Saitama, JapanRongshi Xiao, Beijing Univ. of Technology, Beijing,

People’s Republic of Chinaminlin Zhong, Tsinghua Univ., Beijing, People’s Republic of China


LMP Session 1: Laser CuttingMonday, October 24 • 1:30pm Session Chair: Bo Gu, IPG Photonics Corporation, Oxford, MA, USALaser Cutting - From CO2 Laser To disc And Fiber Laser - Possiblities and Challenges - Invited Presentation (101)Flemming Olsen, IPU The Energetic Efficiency of Remote Cutting in Comparison to Conventional Fusion Cutting (102)Matthias Luetke, Jan Hauptmann, Andreas Wetzig, Eckhard Beyer, Fraunhofer IWSInfluence of Fiber Laser Cutting Parameters on the Subsequent Laser Welding of Ti6Al4V Sheets (103)Gianfranco Palumbo, Leonardo Daniele Scintilla, Donato Sorgente, Luigi Tricarico, Politecnico Di Bari, Dipartimento Di Ingegneria Meccanica E Gestionale - DIMEG; Marco Brandizzi, Annunziata Anna Satriano, Consorzio Calef Influence of Cut Front Temperature Profile on Cutting Process (104)Volkher Onuseit, Michael Jarwitz, Rudolf Weber, Thomas Graf, Institut Fuer Strahlwerkzeuge, Univ. of Stuttgart

Experimental Investigation on the Cut Front Geometry in the Inert Gas Laser Fusion Cutting with disk and Co2 Lasers (105)Leonardo Scintilla, Luigi Tricarico, Politecnico Di Bari, Dipartimento Di Ingegneria Meccanica E Gestionale - DIMEG; Achim Mahrle, Technische Universitaet Dresden, Institut fuer Oberflaechen- Und Fertigungstechnik Iof, Lehrstuhl fuer Laser- Und Oberflaechentechnik Lot; Eckhard Beyer, Technische Universitaet Dresden, Institut fuer Oberflaechen- Und Fertigungstechnik Iof, Lehrstuhl Fuer Laser- Und Oberflaechentechnik Lot., Fraunhofer IWS; Andreas Wetzig, Fraunhofer IWS Study on Striation Generation Process during Laser Cutting of Steel (106)Koji Hirano, Nippon Steel Corporation; Rémy Fabbro, Pimm Laboratory (Arts Et Metiers Paristech/Cnrs) numerical Studies of Laser Cutting on an Active Electrode material for Lithium-Ion Batteries (107)Dongkyoung Lee, Jyotirmoy Mazumder, CLAIM, The Univ. of MichiganEffect of Linear Cutting Energy on Coloration of Paper in Laser Cutting of Paper material (108)Heidi Piili, Lappeenranta Univ. of Technology, LUT Laser, Finland; Antti Salminen, Alexander Stepanov, Lappeenranta Univ. of Technology/Laser Processing Research Group; Esa Saukkonen, Lappeenranta Univ. of Technology/Paper Technology

LMP Session 2: Process Monitoring & Control IMonday, October 24 • 1:30pm Session Chair: Mariana Forrest, LASAP, Inc., Troy, MI, USAmodularity and Flexibility - Customized Laser Processing Heads Enter Industrial and Scientific Applications – Invited Presentation (201)Markus Kogel-Hollacher, Precitec Optronik GmbH/Precitec KG Camera-Based Laser Beam Welding Sensor in the nIR Spectral Range (202)Holger Braun, Friedhelm Dorsch, Steffen Kessler, Dieter Pfitzner, TRUMPF Werkzeugmaschinen GmbH + Co. KG; Volker Rominger, TRUMPF Laser- Und Systemtechnik GmbH Closed Loop Control of Laser Welding Using an Optical Spectroscopic Sensor for nd:Yag and CO2 Lasers (203)Ali Riza Konuk, R.G.K.M. Aarts, A.J. Huis in ‘T Veld, Univ. of Twente; A. Ancona, D. Rizzi, T. Sibillano, Cnr-Infm Regional Laboratory novel monitoring System for Spatially Resolved Topographical measurement of Laser-Based Processes (204)Jan-Philipp Weberpals, Peter Berger, Thomas Graf, IFSW; Johannes Trein, Holger Singpiel, Silicon Software GmbH Real-Time Process Control by machine Vision (205)Christoph Franz, Fraunhofer ILT

Laser Materials Processing ConferenceConference Chair: Stefan Kaierle, Fraunhofer ILT, Aachen, Germany

The economic crisis really seems to be over! New enthusiasm is spreading around and the companies in the laser field tell new success stories of growth and expansion. This appears to be a fantastic starting point for ICALEO’s 30th year.

Again, numerous researchers from all over the world have submitted their latest research results to be presented at ICALEO. The LMP conference program is full of excellent contributions covering 18 sessions in many different application fields. In particular, a large amount of abstracts have

been submitted to welding and rapid prototyping processes like selective laser melting and laser metal deposition. The understanding of processes in terms of modeling as well as quality monitoring and control are well covered.

The trend goes on that the application is driving the research – developments of applications, processes and laser beam sources go hand in hand today in order to reach new frontiers with laser based processes. The laser is a fundamental tool in today’s industrial production. Here at ICALEO you can experience and discuss the applications and trends of tomorrow. You are warmly welcomed to share this experience and opportunity with all other presenters and delegates.

Program Committee:

magdi Azer, Ge Global research, niskayuna, ny, Usamilan Brandt, RMIT Univ., Bundoora Victoria, AustraliaGabor Buza, Bay Zoltán Institute for Materials Science and

Technology, Budapest, HungaryPaul denney, Lincoln Electric, Cleveland, OH, USABo Gu, IPG Photonics Corporation, Oxford, MA, USASeiji Katayama, Osaka Univ., Osaka, JapanIngomar Kelbassa, RWTH Aachen Univ., Aachen, GermanyWolfgang Knapp, Coopération Laser Franco-Allemande (CLFA),

Paris, Francemarkus Kogel-Hollacher, Precitec Optronik GmbH/Precitec KG,

Rodgau, GermanyLin Li, The Univ. of Manchester, Manchester, Great BritainWilliam O’neill, Univ. of Cambridge, Cambridge, Great BritainJuan Pou, Univ. de Vigo, Vigo, Spainmichael Rethmeier, BAM, Berlin, GermanyAntti Salminen, Lappeenranta Univ. of Technology,

lappeenranta, FinlandRudolf Weber, IFSW Stuttgart, Stuttgart, Germany

LASER MATERIALS PROCESSINg CONFERENCE


Online measurement and Closed Loop Control of Penetration depth in Laser Welding Processes (206)Felix Abt, Rudolf Weber, Thomas Graf, IFSW; Harald Woelfelschneider, Claudia Baulig, Heinrich Hoefler, Fraunhofer IPMA Rapid Image Processing Algorithm for Structured Light Stripe Welding Seam Tracking in Laser Welding (207)Xian-feng Shen, Institute of Machinery Manufacturing Technology; Wenhua Teng, Institute of Machinery Manufacturing Technology, China Academy of Engineering Physics A Beam monitoring System for Large and Scanned Laser Spots - Lasmon (208)Jan Hannweber, Fraunhofer IWS

LMP Session 3: Welding ITuesday, October 25 • 8:30am Session Chair: Seiji Katayama, Osaka Univ., Ibaraki, Osaka, JapanAluminum Welding with High Brightness diode Lasers (301)Silke Pflueger, Laserline, Inc. new Type of Laser Welded Wall Panel of Train Coach (302)Ilpo Maaranen, Ville-Matti Nurmela, Jukka Siltanen, Rautaruukki Oyj Resistance Spot Welding Gun meets Fiber Laser - an Alternative to Remote Welding? (303)Klaus Krastel, IPG Laser GmbH Thin Section Welding with Controllable dimensions Using High Brightness Fiber Lasers (304)Andy Appleyard, Paul Harrison, SPI Lasers UK, Ltd. Laser narrow Gap Welding of Thick Carbon Steels Using High Brightness Laser with Beam Oscillation (305)Takeshi Tsukamoto, Hirotsugu Kawanaka, Yoshihisa Maeda, Hitachi, Ltd.Single mode Fiber Laser Welding with Superposed Beam Oscillation (306)Markus Schweier, Jens Hatwig, Michael F. Zaeh, Technische Universitaet Muenchen, Institute for Machine Tools and Industrial Management Comparison of Spatter Characteristics in Fiber and CO2 Laser Beam Welding of Aluminum Alloy (307)Hua Cai, Rongshi Xiao, Beijing Univ. of Technology Understanding the Influence of the Focal Position on Spatter Reduction (308)Jan-Philipp Weberpals, Philipp Krueger, Peter Berger, Thomas Graf, IFSWLaser Beam Welding with High-Frequency Beam Oscillation: Welding of dissimilar materials with Brilliant Fiber Lasers (309)Eckhardt Beyer, Berndt Brenner, Mathias Kraetzsch, Jens Standfuss, Fraunhofer IWS

LMP Session 4: Process Monitoring & Control IITuesday, October 25 • 8:30am Session Chair: Markus Kogel-Hollacher, Precitec Optronik GmbH/Precitec KG, Rodgau, GermanyX-Ray Videography for Investigation of Capillary and melt Pool dynamics in different materials (402)Felix Abt, Meiko Boley, Rudolf Weber, Thomas Graf, IFSW Effect of Process Parameters to monitoring of Laser Assisted Additive manufacturing of Alumina Ceramics (403)Heidi Piili, Lappeenranta Univ. of Technology, LUT Laser; Antti Lehti, Antti Salminen, Lappeenranta Univ. of Technology/Laser Processing Research Group; Olli Nyrhilä, EOS Finland; Bin Qian, James Shen, Stockholm Univ./Dept. of Materials and Environmental ChemistryCorrelation Between Pyrometer monitoring and Active Illumination Imaging of Laser Assisted Additive manufacturing of Stainless Steel (404)Antti Lehti, Antti Salminen, Lauri Taimisto, Lappeenranta Univ. of Technology/Laser Processing Research Group; Olli Nyrhilä, EOS Finland; Heidi Piili, Lappeenranta Univ. of Technology, LUT LaserImprovements in Laser Cladding Process Through an FPGA-Based Control System (405)Pablo Colodrón, Jose Luis Mato, M. Angeles Montealegre, Felix Vidal, Aimen- Technology Centre; Jose Fariña; Juan Jose Rodriguez-Andina, Univ. de Vigo

Automatic In-Process Control of Laser metal-Wire deposition Based on Sensor Feedback (406)Almir Heralic, Anna-Karin Christiansson, Univ. West High Speed Video Analysis of melt Flow Inside Fiber Laser Welding Keyholes (407)Ingemar Eriksson, Alexander Kaplan, Luleä Univ. of Technology; John Powell, Laser Expertise Ltd. defect detection and Sizing in Laser-Welded Aluminum Welds, Using Laser-Generated Ultrasounds (408)Gael Diot, Laurent Dubourg, Institut Maupertuis; Afia Kouadri-David, Sylvain Guegan, Eric Ragneau, Insa Rennes; Jihed Flifla, Ecam Rennes; Focal Spot monitoring of a High Power Fiber Laser (409)Michael Scaggs, Neoteric Concepts, LLC; Gilbert Haas, Haas Laser Technologis, Inc.

LMP Session 5: Laser Metal Deposition (LMD): Applications & SystemsTuesday, October 25 • 8:30am Session Chair: Ingomar Kelbassa, RWTH Aachen Univ., Aachen, GermanyLaser Cladding for Railway Repair and Preventative maintenance (501)Adam Clare, Peter Farayibi, Janet Folkes, Olusola Oyelola, Univ. of Nottingham Additive manufacturing of a Blade-Integrated disk by Laser metal deposition (Lmd) (502)Johannes Witzel, Johannes Schrage, RWTH Aachen Univ.; Andres Gasser, Fraunhofer ILT; Ingomar Kelbassa, Fraunhofer ILT / RWTH Aachen Univ. Potential Application and Certification of Laser Cladding Technology for Repair of Aging Aircraft Components (503)Qianchu Liu, Khan Sharp, Defence Science and Technology Organisation; Milan Brandt, School of Aerospace, Mechanical and Manufacturing Engineering, RMIT Univ. and Defence Materials Technology Centre; Madabhushi Janardhana, Aircraft Structural Integrity Section, Directorate General Technical Airworthiness (DGTA), Royal Australian Air Force (RAAF); Ryan Cottam, Faculty of Engineering and Industrial Sciences, Swinburne Univ. of Technology; Neil Matthews, Rosebank Engineering Effects of melt Pool Size on Transient and Residual Stress in direct metal deposition Process (504)Hyung Min Chae, CLAIM, The Univ. of Michigan development of a model for Prediction of material Properties of Laser Cladded Inconel 718 as Related to Void Size in the Bulk material (505)Johannes Witzel, Thomas Schopphoven, RWTH Aachen Univ.; Andres Gasser, Fraunhofer ILT; Ingomar Kelbassa, RWTH Aachen Univ. Induction Assisted Laser Cladding for Higher deposition Rates (506)Aravind Jonnalagadda, Tobias Weitzer, Craig Bratt, Fraunhofer USA, CCLA; Siegfried Scharek, Fraunhofer IWSAdvantages of Laser metal deposition by Using Zoom Optics and mWO (modular Welding Optics) (507)Chen Hong, Bernd Burbaum, Ingomar Kelbassa, Chair for Laser Technology RWTH Aachen; Andres Gasser, Fraunhofer ILTEffect of Power Adjustment in Laser Cladding with Scanning Optics (508)Veli Kujanpää, Iikka Pekkarinen, Lappeenranta Univ. of Technology Effect of Laser Beam Intensity in Laser Cladding with Scanning Optics (509)Veli Kujanpää, Iikka Pekkarinen, Lappeenranta Univ. of Technology

LMP Session 6: Processing of Dissimilar MaterialsTuesday, October 25 • 1:30pm Session Chair: Minlin Zhong, Tsinghua Univ., Beijing, People’s Republic of ChinaLaser Penetration Brazing of dissimilar Alloys (601)Rongshi Xiao, Peng Dong, Beijing Univ. of Technology




Laser Autogenous Brazing - A new method for Joining dissimilar metals (602)Gen Satoh, Y. Lawrence Yao, Columbia Univ. Study on Laser Brazing Characteristics of dissimilar metals (603)SookHwan Kim, Mokyoung Lee, RIST; Liqun Li, Harbin Institute of Technology; Y. Norman Zhou, Univ. of Waterloo Recent developments in Laser Joining of dissimilar materials (604)Claus Thomy, Frank Vollertsen, BIAS GmbH Application of Keyhole and Heat-Conduction modes to Laser dissimilar metals Welding of magnesium Alloy and Steel (605)Mohamed Wahba, Osaka Univ.; Yousuke Kawahito, Seiji Katayama, Joining and Welding Research Institutedissimilar metal Joining of magnesium Alloy to Zinc-Coated Steel by Laser Welding-Brazing Process (606)Caiwang Tan, Liqun Li, Yanbin Chen, Harbin Institute of Technology Laser Welding of dissimilar metals for the Radiation-Resistant L V d T Fabrication (607)Soo-Sung Kim, Chul-Yong Lee, Kee-Nam Choo, Korea Atomic Energy Research Institute

LMP Session 7: Modelling & SimulationTuesday, October 25 • 1:30pm Session Chair: Rudolf Weber, IFSW, Univ. of Stuttgart, Stuttgart, Germanymodeling of Real Temporally Variant Beam Shapes in Laser materials Processing (701)Jonathan Griffiths, Stuart Edwardson, Geoff Dearden, Ken Watkins, The Univ. of Liverpool numerical Simulation of Heat Transfer and Fluid Flow during Laser metal Wire deposition (702)Marcus Edstorp, Univ. West, Trollhättan, Sweden Estimation of Residual Stress in Laser Rapid manufactured Geometries using Finite Element modeling (703)Suyog Jhavar, Neelesh Jain, Dept. of Mechanical Engineering, Indian Institute of Technology; Christ P Paul, L M Kukreja, Laser Material Processing Division, Raja Ramanna Centre for Advanced Technology A Thermo-metallurgical model for Laser Surface Cladding Final Properties (704)Michael Vogel, Juansethi Ibarra-Medina, Andrew J. Pinkerton, Manufacturing and Management Group, School of Mechanical, Aerospace and Civil Engineering; Narcisse N`Dri, ESI GmbH Investigation of Pressure Effect on Welding defects (705)Seung Lee, CLAIM, The Univ. of Michigan Three-dimensional dynamic modeling of Keyhole and Plume during Pulse Laser Welding (706)Wenda Tan, Neil Bailey, Yung Shin, Purdue Univ. Contribution on modelling the Remote Ablation Cutting (707)Jan Musiol, IWB

LMP Session 8: Welding IIWednesday, October 26 • 8:30am Session Chair: Wolfgang Knapp, CLFA Fraunhofer ILT, Paris Cedex, FranceWelding at Bosch – Applications and new Studies with Green Lasers – Invited Presentation (801)Reiner Ramsayer, Robert Bosch GmbHStabilized Copper Welding by Using Power modulated Green and IR Laser Beams (802)Andreas Heider, Thomas Graf, Axel Hess, Rudolf Weber, Institut fuer Strahlwerkzeuge development of new Processes for Welding of Thermal Al-Cu Solar Absorbers using diode Lasers (803)Andre Springer, Peter Kallage, Michael Hustedt, Stephan Barcikowski, Volker Wesling, Heinz Haferkamp, Laser Zentrum Hannover e.V. modelled dependency of the direct Absorption on the Keyhole Wall Waviness during 1 micron- and 10 micron-Laser Welding (804)Alexander Kaplan, Luleä Univ. of Technology

dependence of Energy distribution in the Keyhole on Optical Parameters of the Focusing System in Laser Welding (805)Martin Sarbort, Simon Rerucha, Petr Jedlicka, Institute of Scientific instruments, AS CR; Libor Mrna, Dendera A.S.distortion Control during Laser Beam Welding of Shaft-Hub Joints Within a Process Chain (806)Frank Buschenhenke, BIAS - Bremer Institut fuer angewandte Strahltechnik

LMP Session 9: Laser Surface Modification IWednesday, October 26 • 8:30amSession Chair: Juan Pou, Univ. de Vigo, Vigo, SpainHard Facing Engineering Surfaces Using Supersonic Laser deposition of Stellite-6 (901)W. O’Neill, R. Lupoi, A. Cockburn, M. Sparkes, F. Luo, Centre for Industrial Photonics, Institute for Manufacturing, Dept. of Engineering, Univ. of Cambridge A Comparative Study of 3d Laser Surface modification and the Humping Phenomenon (902)Caroline Earl, Univ. of Cambridge; Paul Hilton, TWI LTD; Jon Blackburn, TWI LTD; Bill O’Neill, Univ. of Cambridge Importance of Processing Temperature Control in Laser Beam Hardening of Production dies (903)Hongping Gu, Magna International Thermal modification of Zinc-Aluminum Coated Steel Using Lasers (904)Remya Mathew, Yvonne Durandet, Swinburne Univ. of Technology, Cast Crc; Paul Stoddart, Swinburne Univ. of Technology; David Nolan, Bluescope Steel Research, Cast Crc Laser Heat Treatment with Latest System Components (905)Steffen Bonss, Fraunhofer IWS microstructural Evolution in Laser-deposited Al 4047 (906)Guru Dinda, Jamal Edwards, Ashish Dasgupta, Focus: Hope; Sudip Bhattacharya, Jyoti Mazumder, CLAIM, The Univ. of Michigan

LMP Session 10: Laser DrillingWednesday, October 26 • 10:50am Session Chair: Patricia Weber, Karlsruhe Institute of Technology (KIT), Karlsruhe, Germanydrilling with Fiber Lasers (1001)Christoph Blaesius, Stefan Brief, Jens Dietrich, Ingomar Kelbassa, Lehrstuhl fuer Lasertechnik Recoil Pressure and Surface Temperature in Laser drilling (1002)Matthieu Schneider, Arts et Métiers Paristech Parametric Study of a Laser-Based Hybrid drill for Concrete (1003)Shigeki Muto, Heizaburo Kato, Sankyo Seisakusho Co.; Kazuya Masuda, Kazuyoku Tei, Tokai Univ.; Tomoo Fujioka, Institute for Applied Optics

LMP Session 11: Laser Surface Modification IIWednesday, October 26 • 10:50am Session Chair: Filip Motmans, VITO, Mol, BelgiumLaser diffusion in metals for material modification (1101)Sen-Yong Chen, Aravinda Kar, CREOL, Univ. of Central Florida; Othmane Benafan, Rajan Vaidyanathan, Ampac, Mechanical, Materials, and Aerospace Engineering, Univ. of Central Florida Contribution of Laser-Beam Brightness when Surface Processing of a Silicon nitride Engineering Ceramic (1102)Pratik Shukla, Loughborough Univ. Formation of metal matrix Composites and Intermetallic Phases on Aluminum AA1200 during Laser Alloying (1103)Luyolo Mabhali, Sisa Pityana, Csir National Laser Centre; Natasha Sacks, Univ. of the Witwatersrand, Republic of South Africa Surface Glazing of Concrete Using Lasers for Protection and decommissioning (1104)Jonathan Lawrence, Univ. of Lincoln Formation of metallic Glass Coatings Via Laser deposition (1105)Hongqing Sun, Katharine Flores, Dept. of Materials Science and Engineering, The Ohio State Univ.

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LMP Session 12: Laser Processing of CFRPWednesday, October 26 • 10:50am Session Chair: Rongshi Xiao, Beijing Univ. of Technology, Beijing, People’s Republic of ChinaInvestigations in Remote Cutting of Carbon Fiber Composite materials (1201)Annett Klotzbach, Udo Klotzbach, Jan Hauptmann, Fraunhofer IWS; Pierpaolo Vessio, Polytechnico Di BariAn Investigation into Laser Cutting Strategies for Carbon Fibre Reinforced Plastics (1202)Paul French, Gareth Bradley, Lee Boyle, Stephen Ebbrell, Liverpool John Moores Univ.; Mohammed Naeem, Jk Lasers; Alexander Wolynski, Photonik-Zentrum Kaiserslautern e.V.; Darren Hughes, Wmg, Iarc Laser Surface Pre-Treatment of CFRP in Consideration of the Absorption Behaviour (1203)Fabian Fischer, Peter Jaeschke, Uwe Stute, Dietmar Kracht, Laser Zentrum Hannover e.V. The Wavelength as a Laser Transmission Welding Influence Factor for Fibre Reinforced Thermoplastic materials (1204)Verena Wippo, Peter Jaeschke, Fabian Fischer, Uwe Stute, Dietmar Kracht, Laser Zentrum Hannover e.V. Analysis of Thermal damage in Laser Processing of CFRP (1205)Rudolf Weber, Margit Hafner, Andreas Michalowksi, Thomas Graf, IFSW, Univ. of Stuttgart

LMP Session 13: Welding IIIWednesday, October 26 • 3:00pm Session Chair: Tony Hoult, IPG Photonics Corporation, Santa Clara, CA, USAExperimental and numerical Investigation of Laser-Welding of Long Fiber Thermoplastic Composites (1301)Sebastien Clement, Wolfgang Knapp, CLFA Fraunhofer ILT; Dominique Jeulin, Mamane Oumaroua, Jacques Renard, Mines ParistechWelding with High Energy Pulsed Fiber Lasers (1302)Tony Hoult, Jeffrey Kabahit, Oleg Shkurikhin, IPG Photonics Corporation Effect of Combination of a Low Energy diode Laser with a Pulsed Solid State Laser for Welding of Aluminum Alloys (1303)Jean Pierre Bergmann, Franziska Petzold, Univ. of Technology Ilmenau; Andreas Patschger, Univ. of Applied Science Jena Pulsed Laser net-Shaped Welding of Thin Hastelloy C-276 (1304)Dongming Guo, Yuquan Guo, Guangyi Ma, Dongjiang Wu, Dalian Univ. of Technology Influence of Shielding Gas on mechanical Properties of High-Brightness Laser Welds (1305)Brad Nagy, Brian Victor, EWI The Effect of Adhesive Properties on Laser Spot Weld Bonding (1306)Wang Tao, Yinan Ma, Mingmao Wang, Liqun Li, Yanbin Chen, Harbin Institute of Technology

LMP Session 14: Laser Metal Deposition (LMD): Process IWednesday, October 26 • 3:00pm Session Chair: Milan Brandt, RMIT Univ., Bundoora Victoria, AustraliaCharacterization of micro/macrostructure of Laser Cladded Inconel 718 with Increased deposition Rates as Related to the mechanical Properties (1401)Johannes Witzel, Andres Gasser, Ingomar Kelbassa, Fraunhofer ILT; Salay Stannard, Joining Technologies, Inc. Laser net Shape manufacturing of Ti6Al4V - distortion Analysis and Improvement (1402)Yanmin Li, Yong Liu, Peng Hu, Guoshuang Cai, Xiaobin Chen, Henry Peng, GE (China) Research & Development Co. Ltd. Wear Behaviour of Laser Cladded Ti-6Al-4V Alloy Containing Tungsten Carbide Particles (1403)Filip Motmans, Marleen Rombouts, Rosita Persoons, Eric Geerinckx, Vito

Influence of Process Parameters and Energy density on the microstructure of Ti-6Al-4V Wire/Wc Powder Cladding (1404)Peter Farayibi, Janet Folkes, Adam Clare, Graham McCartney, The Univ. of Nottingham Surface Improvement of Laser net Shape manufacturing of Ti6Al4V (1405)Yong Liu, Yanmin Li, Xiaobin Chen, Henry Peng, GE (China) Research & Development Co. Ltd. Laser-Based Repairing of Turbine Airfoils and its Economical and Environmental Impact Analysis (1406)J. Michael Wilson, Cycil Piya, Yung Shin, Karthik Ramani, Vance Murray, Fu Zhao, Purdue Univ.

LMP Session 15: Hybrid & Combination ProcessesWednesday, October 26 • 3:00pm Session Chair: Paul Denney, Lincoln Electric, Cleveland, OH, USAHybrid Welding with Controlled Short Arcs - a Variation of the Reduction of the Energy-Per-Unit Length - (1501)Michael Mavany, Simon Olschok, Uwe Reisgen, RWTH Aachen Univ., ISF Laser-GmA Hybrid Welding of 960 mpa Steels (1502)Ulf Jasnau, Andre Sumpf, Slv Mecklenburg-Vorpommern Gmbh; Risto Laitinen, Jukka Siltanen, Sakari Tihinen, Rautaruukki Oyj Weldability and mechanical Characterization of CO2 Laser - mig Hybrid Welded Joints of Ti6Al4V Titanium Alloy (1503)Gianfranco Palumbo, Leonardo Daniele Scintilla, Donato Sorgente, Luigi Tricarico, Marco Brandizzi, Politecnico Di Bari; Annunziata Anna Satriano, Consorzio Calef Effect of Arc Parameters in High Brightness Hybrid Laser Arc Welding of Low Alloyed Steel (1504)Esa Lappalainen, Tuomas Purtonen, Antti Salminen, Lappeenranta Univ. of Technology Bifocal Hybrid Laser Welding - Laser Beam Welding of Aluminum (1505)M. Kronthaler, M. F. Zaeh, Institute of Machine Tools and Industrial Management Orbital Cutting and Orbital Tube to Tube Welding of Stainless Steel Tubes with a Single Fibre Laser (1506)Tuomas Purtonen, Antti Salminen, Mikko Vänskä, Lappeenranta Univ. of Technology

LMP Session 16: Welding IVThursday, October 27 • 8:30am Session Chair: Antti Salminen, Lappeenranta Univ. of Technology, Lappeenranta, FinlandRemote Laser Welding In Automotive Seat Production - Invited Presentation (1601)Geert Verhaeghe, TWI Ltd. deep Penetration Welds and Welding Phenomena with Combined disk Lasers (1611)Seiji Katayama, Masahiro Hirayama, Masami Mizutani, Yousuke Kawahito, JWRI, Osaka Univ. Laser Welding of Aluminium Alloys (1603)Mohammed Naeem, GSI Group, Inc. - Laser Division Influence of Ambient Pressure on Spattering and Weld Seam Quality in Laser Beam Welding with the Solid-State Laser (1604)Christian Boerner, Kai Noack, Klaus Dilger, Tu Braunschweig; Volker Rominger, Thomas Harrer, TRUMPF Laser- Und Systemtechnik GmbH; Thomas Kruessel, Thorsten Loewer, Pro-Beam Ag & Co. Kgaa Characteristics of microstructures and mechanical Properties of Laser Welded Api X-100 Steel for Line Pipe (1605)Mok-Young Lee, RIST; Hyun-Byung Chai, Posco Experimental Investigation of the Laser-Plume Interaction during High Power Fiber Laser Welding (1606)Pavel Shcheglov, Andrey Gumenyuk, Igor Gornushkin, Michael Rethmeier, Federal Institute for Materials Research and Testing Fiber Laser dC TIG Aluminium Hybrid Welding (1612)Giuseppe Casalino, DIMeG - Politecnico di Bari Weld Strength for Laser Welding of Hot Press Forming Steel (1608)Minjung Kang, Cheolhee Kim, KITECH



Business Forum & Panel DiscussionBusiness Forum & Panel Discusison Co-Chairs:

Neil Ball, Directed Light Inc., San Jose, CA, USA & Sri Venkat, Coherent Inc., Santa Clara, CA, USA

Tuesday, October 25 • 1:30pm

This year’s Business Forum & Panel Discussion will focus on Photonics Markets, Opportunities and Trends in the rapidly growing economies of BRIC

(Brazil, Russia, India, and China) nations. Our distinguished panel will address what industries within these nations are embracing industrial laser technology. Our panel will discuss what applications have gained acceptance and what the future holds for the expansion of laser technology in their regions. In addition, they will provide insight with regard to regulatory issues such as government funding and policy towards the photonics industry. An overview of educational institutions and research centers will also be addressed.

Experimental Investigation on Az31 magnesium Alloy Thin Sheets Butt Welded by nd:YAG Laser (1609)Gianfranco Palumbo, Leonardo Daniele Scintilla, Donato Sorgente, Luigi Tricarico, Politecnico Di Bari; Marco Brandizzi, Annunziata Anna Satriano, Consorzio Calef Preliminary Investigation on Hybrid Welding of Selective Laser molten Parts (1610)Sabina Luisa Campanelli, Andrea Angelastro, Giuseppe Casalino, Nicola Contuzzi, Antonio Domenico Ludovico, Politecnico of Bari

LMP Session 17: Laser Metal Deposition (LMD): Process IIThursday, October 27 • 8:30am Session Chair: Lin Li, The Univ. of Manchester, Manchester, Great BritainLaser Cladding of metal-Ceramic-nanocomposite Layers for Cutting Applications (1701)Sabine Claussen, Albert Grueninger, Michael Hustedt, Stephan Barcikowski, Albert Grueninger, Volker Wesling, Heinz Haferkamp, Laser Zentrum Hannover e.V. Effect of C:Ti Atomic Ratio on TiC morphology deposted by Laser Cladding Process (1702)Ali Emamian, Amir Khajepour, Univ. of Waterloo; Stepehen F. Corbin, Dalhousie Study on Effect of TiC morphology on Wear Behaviour of In-Situ Fe-TiC deposited by Laser Cladding (1703)Ali Emamian, Amir Khajepour, Univ. of Waterloo; Stepehen F. Corbin, Dalhousie Effect of Element Yttrium Addition on High-Entropy Alloy AlxFeConiCuCr Coating by Laser Cladding (1704)Mingxing Ma, Xiaoyang Ye, Qiwen Wu, Minlin Zhong, Wenjin Liu, Tsinghua Univ. Origin of deleterious Surface Finishes of metallic Parts Obtained with the direct metal deposition Technique (1705)Myriam Gharbi, Patrice Peyre, Cyril Gorny, Rémy Fabbro, Ensam, Pimm Laboratory; Simon Morville, Muriel Carin, Limatb, Université De Bretagne-Sud material-Efficient Laser Cladding for Corrosion Resistance (1706)Khalid Mahmood, Laser Processing Research Centre, School of Mechanical, Aerospace and Civil Eng.; Nicholas Stevens, Andrew J. Pinkerton, The Univ. of Manchester; Waheed Ul Haq Syed, National Univ. of Sciences and Technology (NUST) Laser direct deposition of nickel-Based metal matrix Composite (1707)Kevin Schoeffel, Purdue Univ.; Yung Shin, Purdue Univ.

Laser Cladding of Zr60Ti6Cu19Fe5Al10 Amorphous Alloy on Az31B magnesium Alloy (1708)Xue Liu, Sen Yang, Nanjing Univ. of Science and Technology Influence of Powder Characteristics in Additive Laser manufacturing of Ss316L metallic Parts. (1709)Didier Boisselier, Simon Sankaré, IREPA Laser

LMP Session 18: High Brightness Laser ChallengesThursday, October 27 • 8:30am Session Chair: Thomas Fehn, JENOPTIK Laser GmbH, Jena, Germanydual Core delivery Fibers for 1µm High Power Lasers Increase the Flexibility in Applications (1801)Klaus Loeffler, TRUMPF Laser & Systems GmbH Reference Process for determination of Thermal Focus Shift (1802)Axel Hess, Marcel Schaefer, Christiane Thiel, Rudolf Weber, Thomas Graf, IFSW Thermal management to Reduce Focus Shift Using Zns ms Optics (1803)Stephen Rummel, Gary Herrit, Alan Hedges, Fred Kropf, II-VI Inc.Focus Control for Fiber Laser material Processing Applications (1804)Mohammed Naeem, GSI Group, Inc. - Laser Division Thermal Lensing measurement of a Thermal Lens Compensation High Power Laser Objective (1805)Gilbert Haas, Haas Laser Technologies, Inc.; Michael Scaggs, Neoteric Concepts High-Power Reflective Focusing Optics for High-Brightness Solid State Lasers (1806)Brian Victor, Stan Ream, EWI High Power disk Lasers - Advances & Applications (1807)David Havrilla, Tracey Ryba, TRUMPF Inc.; Marco Holzer, TRUMPF Laser- Und Systemtechnik GmbH Wavelength dependency in High Power Laser Cutting & Welding (1808)David Havrilla, Stephan Ziermann, TRUMPF Inc. An Efficient method for Enhancing the Filling Factor of the Aperture for Coherent-Beaming-Combining (CBC) Using Thin-Film Coated Glass (1809)Si-si Zhao, Zheng-Yu Ye, Deng-Cai Yang, Zhi-Yong Wang, Beijing Univ. of Technology


Laser Microprocessing ConferenceConference Chair: Henrikki Pantsar, Cencorp Corporation, Canton, MI The 30th ICALEO is taking place at an era when companies all over the globe are experiencing rapid growth. In times like these the focus is shifting towards emerging technologies. As the overall economical setting is improving, more efforts are being directed towards research and development to discover future possibilities and maintain growth through innovation. As always, ICALEO is the laser conference to attend and to experience the state of the art in applied research. For many years trends that are visible in the conference have turned out to be great business opportunities during the successive years. I expect this year to follow the pattern.

The Laser Microprocessing Conference comprises more than 80 technical papers and seven invited papers, featuring a wide spectrum of applications and innovative equipment from biomedical applications to photovoltaics. Trends emanating this year include laser surface modification, structuring, processing of transparent materials and different micro deposition processes. general aspects of micromachining and ablation are well represented as well as thin film processing, photovoltaics, drilling, new optical concepts and laser sources, and many others. The presentations introduce the latest and greatest advancements in their respective fields, presented by world’s leading companies and research organizations.

2011 will evidently be an excellent year for the laser community and this will set the stage for an exciting ICALEO congress, full of enthusiasm, leading edge technology and networking.

Program Committee: neil Ball, Directed Light Inc., San Jose, CA, USA masayuki Fujita, institute for laser technology, osaka, JapanJack Gabzdyl, SPI Lasers, Southhampton, Great BritainSami Hendow, Multiwave Photonics, San Jose, CA, USAAravinda Kar, Creol, the College of optics and Photonics,

Univ. of Central Florida, Orlando, FL, USAnam Seong Kim, EO Technics, Anyang, South KoreaKlaus Kleine, Laserline, Inc., santa Clara, Ca, UsaRainer Kling, Laser Zentrum Hannover e.V., Hannover, GermanyPetri Laakso, VTT Technical Research Centre of Finland, Lappeenranta, Finlandmichael mielke, Raydiance, Inc., Petaluma, CA, USAEtsuji Ohmura, Osaka Univ., Suita, Osaka, JapanAlexander Olowinsky, Fraunhofer ILT, Aachen, GermanyYasu Osako, esi, Portland, or, Usamichael Schmidt, Bayerisches Laserzentrum GmbH, Erlangen, GermanyJuergen Stollhof, TRUMPF Inc., Plymouth Township, MI, USAXiaoyan Zeng, Huazhong Univ. of Science & Technology, Wuhan, People’s

republic of China

LASER MICROPROCESSINg CONFERENCE

LMF Session 1: Drilling & Micromachining IMonday, October 24 • 1:30pm Session Chair: Yasu Osako, ESI, Portland, OR, USAEffects of Peak Power and multipulsing on drilling and marking with ns Pulses – Invited Presentation (m101)Sami Hendow, Multiwave Photonics micro Processing of metals using a High Repetition Rate Femtosecond Laser: from Laser Process Parameter Study to machining Examples (m102)Horst Exner, Joerg Schille, Bernhard Steiger, Lutz Schneider, Udo Loeschner, Robby Ebert, Hochschule Mittweida; Nicholas Goddard, Patricia Scully, The Univ. of Manchester, CEASProcessing of Industrially Relevant non metals with Laser Pulses in the Range Between 10ps and 50ps (m103)Beat Neuenschwander, Beat Jaeggi, Marc Schmid, Bern Univ. of Applied Sciences; Beat LüScher, Carmine Nocera, Univ. of Applied Sciences Northwestern SwitzerlandHigh Power Fiber Laser On-The-Fly drilling of Thin materials (m104)Arttu Jussila, Henrikki Pantsar, Hannu Väisänen, Mikko Laaksonen, Cencorp Corporation Engraving of Aluminium Alloys with Pulsed Fiber Lasers (m105)Jack Gabzdyl, Paul Harrison, SPI Lasers UK Ltd. Laser milling: Tool making Capabilities – Invited Presentation (m106)Stefan Dimov, Cardiff Univ.

LMF Session 2: MicrojoiningMonday, October 24 • 1:30pm Session Chair: Petri Laakso, VTT, Lappeenranta, FinlandLaser Polymer Welding: From Research to High Volume Industrial Applications - Invited Presentation (m201)Alexander Olowinsky, Fraunhofer ILT Flexible and Efficient Laser Remote Welding of Ultra-Thin metal Foils (m202)Andreas Patschger, Matthias Hild, Jenoptik Automatisierungstechnik GmbH; Jean Pierre Bergmann, Univ. of Technology Ilmenau; Jens Bliedtner, Univ. of Applied Science Jena Prospects of Welding Foils with Solid State Laser for Lithium Ion Batteries (m203)Eckhard Beyer, Bernd Brenner, Renald Schedewy, Jens Standfu, Fraunhofer IWS Laser Spot Welding of Thin 304 Stainless Foils with Low Power Fiber Lasers (m204)Mohammed Naeem, GSI Group, Inc. - Laser Division Welding Characteristics of Aluminum Alloy by Pulsed nd:Yag Laser with Pre- and Post-Irradiation of Superposed Continuous diode Laser (m205)Shin-ichi Nakashiba, Tomokazu Sakagawa, Kataoka Corporation; Yasuhiro Okamoto, Kazuya Miura, Akira Okada, Yoshiyuki Uno, Okayama Univ. Parameter Study on Laser Welding of nitinol Wire by Taguchi method (m206)C.W. Chan, H.C. Man, T.M. Yue, The Hong Kong Polytechnic Univ. Effect of Variable Power Control in Quasi-Simultaneous Fiber Laser Welding of Polymers (m207)Petri Laakso, Saara Ruotsalainen, VTT; Veli Kujanpaa, VTT, Lappeenranta Univ. of Technology; Tuomas Purtonen, Mikko Rikkonen, Antti Salminen, Lappeenranta Univ. of Technology

LMF Session 3: PhotovoltaicsTuesday, October 25 • 8:30am Session Chair: Corey Dunsky, Aeos Consulting, Inc., Los Gatos, CA, USAIndustrial Laser micro machining of Semiconductors and dielectrics - Invited Presentation (m301)Sascha Weiler, Paul Graham, TRUMPF, Inc. Back End monolithic Series Interconnection of a Thin Film PV module by Laser Scribing and Screen Printing (m302)Johan Bosman, Martijn De Keijzer, Corne De Kok, Jochen Löffler, Laurie Wipliez, ECNFemtosecond Laser delineation of Conductive Films for Solar Cell Applications (m303)Norman Chen, Ecole Mary Queen of Peace Es; Liqiu Men, Qiying Chen, Memorial Univ. of Newfoundland Laser Induced Backside Etching of Solar Glass by 1064nm Fiber Laser Irradiation (m304)Chao He, Jimin Chen, Beijing Univ. of Technology

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Effect of Temporal Pulse Shape on CdTe P1, P2 and P3 Scribes (m305)Richard Murison, Tullio Panarello, Esi-Pyrophotonics; Mathew Rekow, PyroPhotonics; Walajabad Sampath, Nsf I/Ucrc for Next Generation Photovoltaics, Colorado State Univ. Patterning and marking of Textured and Untextured Silicon Solar Cells Using a 532 nm Picosecond Fiber Laser (m306)Tim Gerke, Fianium Inc.; Brian Baird, Summit Photonics Femtosecond Laser Ablation of Al and mo Thin Film on Flexible Substrate for Fabrication of Thin Film Solar Cells (m307)Qiumei Bian, Xiaoming Yu, Baozhen Zhao, Shuting Lei, Kansas State Univ.; Zenghu Chang, Univ. of Central Florida Analysis of the Absorber Ablation for Thin-Film Silicon Solar modules (m308)Stefan Haas, Uwe Rau, Uwe Zastrow, Forschungszentrum Juelich

LMF Session 4: Laser Sources for MicroprocessingTuesday, October 25 • 1:30pm Session Chair: Michael Mielke, Raydiance, Inc., Petaluma, CA, USAUltrafast Laser with High Energy and High Average Power for Industrial micromachining: Comparison ps-fs (m401)John Lopez, Anne Lidolff, Alphanov; Martin Delaigue, Clemens Hoenninger, Eric Mottay, Amplitude SystemesHigh Energy Femtosecond Fiber Laser with Efficient Frequency Conversion (m402)Yoann Zaouter, Clemens Hoenninger, Rysvan Maleck, Franck Morin, Eric Mottay, Amplitude Systemes Flexible and Precise material Processing with Femtosecond disc Lasers (m403)Friedrich Dausinger, Dausinger + Giesen Gmbh; Steffen Sommer, Technologiegesellschaft fuer Strahlwerkzeuge GmbH Trends and Advances in UV-Laser microprocessing (m404)Ralph Delmdahl, Coherent GmbH micro Surface Structuring and Texturing of metals Using High Brightness Yb based Fiber Lasers (m405)G. Higgins, W. O’Neill, Centre for Industrial Photonics, Institute for Manufacturing, Dept. of Engineering, Univ. of Cambridge; J. Gabzdyl, SPI Lasers High-Gain Ytterbium-doped Large mode Area Photonic Crystal Fiber mode-Locked Laser (m406)Liu Zhi, Beijing Univ. Of Technology High Repetition Rate Fiber Lasers as Controlled Heat Sources for micro-Processing (m407)Tony Hoult, IPG Photonics Corporation

LMF Session 5: Drilling and Micromachining IITuesday, October 25 • 1:30pm Session Chair: Jack Gabzdyl, SPI Lasers, Southampton, Great BritainUltrafast Lasers in medical Applications - Invited Presentation (m501)Eric Mottay, Amplitude Systemes micromachining on Thermal Barrier Coated Supperalloy Using a nanosecond 532nm Fiber Laser (m502)Huan Qi, Shanghai Jiaotong Univ. Stability Limits of Laser drilled Holes on Large Areas (m503)Nelli Hambach, Claudia Hartmann, Jens Holtkamp, Arnold Gillner, Fraunhofer ILTStudy on Producing non-Tapered Holes with Adaptively Collimating High Peak Power Pulsed nd:Yag Laser (m504)Hong Lei, Yong-Ling Hui, Meng-Hua Jiang, Qiang Li, Jin-Guo Wang, Institute of Laser Engineering, Beijing Univ. of Technology Laser Ablation: Optimising material Removal Rate with Limited Oxidation for Ti6Al4V (m505)Samantha Davies, Karen Perkins, Swansea Univ.; Dragos Axinte, M. Carol Kong, The Univ. of Nottingham; James Kell, Rolls-Royce Plc A Study of Laser Ablation near the Critical Point (m506)Hyungson Ki, Ulsan National Institute of Science and Technology

LMF Session 6: Laser Optics and ApplicationsWednesday, October 26 • 8:30am Session Chair: Aravinda Kar, CREOL, Univ. of Central Florida, Orlando, FL, USAUltra-Short Pulse Laser micro-machining of metals with Radial and Azimuthal Polarization (m601)Olivier Allegre, The Univ. of Liverpool

Efficient Use of Short Pulse Width Laser for maximum material Removal Rate (m602)Ashwini Tamhankar, Rajesh Patel, Spectra-Physics, Newport Corporation Large-Area Production of dynamically Scaled microstructures Using diffractive Optical Elements (m603)Bodo Wojakowski, Ulrich Klug, Rainer Kling, Laser Zentrum Hannover e.V. Applying of Refractive Spatial Beam Shapers with Scanning Optics (m604)Alexander Laskin, Molecular Technology (MolTech) GmbH; Vadim Laskin, Adloptica Optical Systems GmbH On-Target Fluence Variation in a multi-magnification Laser Ablation System (m605)Chen-Hsiung Cheng, Sergey Broude, Resonetics A novel Laser Trepanning System for Research and Production (m606)David Ashkenasi, Tristan Kaszemeikat, Norbert Mueller, Richard Dietrich, Gerd Illing, LMTB; Daniel Jahns, Hawk - Hochschule Hildesheim/Holzminden/Göttingen; Hans Joachim Eichler, Technische Universität Berlin

LMF Session 7: Monitoring Detection and AdjustmentWednesday, October 26 • 8:30am Session Chair: Kevin Hartke, Mound Laser & Photonics Center, Inc., Miamisburg, OH, USALaser micro-Adjustment Using Ultra-Short Pulses (m701)Jonathan Griffiths, Stuart Edwardson, Geoff Dearden, Ken Watkins, The Univ. of Liverpool High Speed Spindle Balancing with Pulsed Fiber Lasers (m702)Marek Mamczur, Dynamic Laser Solutions LTD; Jack Gabzdyl, SPI Lasers Acoustical Focal Positioning for micromachining Using a Picosecond Pulsed UV-Laser (m703)Patricia Weber, Volker Schulze, Karlsruhe Institute of Technology (KIT), Wbk Institute of Production Science Characterisation of nanosecond Laser Ablation Events Using High Speed Pulsed digital Holography (m704)Bill O’Neill, Krste Pangovski, Institute for Manufacturing direct In-Situ measurement of the Ablation Rate in Short Pulse Laser Percussion drilling of metal Targets (m705)Gaetano Scamarcio, Pietro Mario Lugarä, Maurizio Dabbicco, Francesco De Lucia, Francesca Di Niso, Dipartimento Interateneo Di Fisica, Universitä Degli Studi and Politecnico Di Bari ; Teresa Sibillano, Antonio Ancona, Cnr-Ifn Uos Bari; Francesco Mezzapesa, Cnr-Ifn Uos Bari and Dipartimento Interateneo Di Fisica, Universitä Degli Studi and Politecnico Di BariPlasma Spectroscopy in Laser machining (m706)David Ashkenasi, LMTB; David Diego-Vallejo, Instituto Politécnico Nacional; Hans Joachim Eichler, Technische Universität Berlin

LMF Session 8: Laser Microdeposition ProcessesWednesday, October 26 • 10:50am Session Chair: Xiaoyan Zeng, Huazhong Univ. of Science & Technology, Wuhan, People's Republic of ChinaGrowing Electronic Circuits - the Production of 3d Polymer Structures with Embedded direct Written Circuits Using Holographic Beam manipulation (m801)Shuai Hou, John Tyrer, Loughborough Univ. development of non-Planar Interconnects for double-Sided Flexible Copper Substrates Using Laser Assisted maskless microdeposition Processes (m802)Steven Tong, Elahe Jabari, Hamidreza Alemohammad, Ehsan Toyserkani, Univ. of Waterloo novel method of Pulsed Laser deposition Using Liquid Flow Target (m803)Masahito Katto, Masanori Kaku, Shoichi Kubodera, Atushi Yokotani, Univ. of Miyazaki Laser-Based manufacturing of metallic Conducting Paths (m804)Christian Vedder, Norbert Pirch, Konrad Wissenbach, Fraunhofer ILT; Jochen Stollenwerk, Technology of Optical Systems Tos, RWTH Aachen Univ. Sensitivity Analysis of Fiber Bragg Grating Sensors Coated by metallic Films Produced by the Laser-Assisted maskless microdeposition Process (m805)Xixi Zhang, Hamidreza Alemohammad, Ehsan Toyserkani, Univ. of Waterloo



LMF Session 9: Thin Film ProcessingWednesday, October 26 • 10:50am Session Chair: Sascha Weiler, TRUMPF Inc., Farmington, CT, USAPatterning of Organic, Electronic devices Using a High Average Power Picosecond Laser (m901)Dimitris Karnakis, Oxford Lasers; Colin Moorhouse, Coherent Scotland, Glasgow, Great Britain The modification of ZnO Thin Films Induced by Excimer Laser Irradiation Under different Atmospheres (m902)Yong Zeng, Beijing Univ. of Technology Selective Removal of Transparent Conductive Oxide Layers with Ultrashort Laser Pulses: Front- Vs. Back-Side Ablation (m903)Victor Matylitsky, Heinz Huber, Daniel Kopf, High Q Laser Innovation GmbH Effect of Hydrogen on Surface Texturing and Crystallization of a-Si:H Thin Film Irradiated by Excimer Laser (m904)Hongliang Wang, Columbia Univ.; Fernando Lusquiños, Univ. of Vigo; Y. Lawrence Yao, Columbia Univ. Ultrafast Laser micromachining of metal Films on Thin Polymer membranes (m905)Tim Gerke, Fianium Inc.; Dylan Fast, Vladimir Kozlov, Microtech Instruments

LMF Session 10: Micromachining of Transparent MaterialsWednesday, October 26 • 3:00pm Session Chair: William O’Neill, Univ. of Cambridge, Cambridge, Great BritainCO2 Laser Cutting of Flexible Glass Substrates (m1001)Xinghua Li, Sean Garner, Corning Inc. Three-dimensional Analysis of Crack Propagation Phenomenon in Laser Scribing of Glass (m1002)Masanao Murakami, Seiji Shimizu, Mitsuboshi Diamond Industrial Co., Ltd.; Etsuji Ohmura, Keisuke Yahata, Osaka Univ. Pico-Second Laser machining of Fibre Based Sensing devices (m1003)Frank Albri, Mr. Junli, Robert R J Maier, William N Macpherson, Duncan P. Hand, Heriot-Watt Univ. Waveguides and markings Inside Transparent materials by fs-Laser Radiation (m1004)Dagmar Schaefer, Dennis Beckmann, Maren Hoerstmann-Jungemann, Ingomar Kelbassa, Chair for Laser Technology, Aachen, Germany Laser Glass machining for Consumer Electronic devices (m1005)Haibin Zhang, Glenn Simenson, Electro Scientific Industries, Investigations on microstructuring of Ferroelectric materials by Picosecond UV Laser Pulses (m1006)Mareike Stolze, Thomas Herrmann, Johannes L’Huillier, Photonik-Zentrum Kaiserslautern e.V.

LMF Session 11: Wavelength OptimizationWednesday, October 26 • 3:00pm Session Chair: Etsuji Ohmura, Osaka Univ., Suita, Osaka, JapanLaser micromachining of Transparent dielectric materials - Glass and Quartz (m1101)Shiva Gadag, RCAM Southern Methodist Univ. Picosecond Laser Ablation of Carbon Fibre Reinforced Plastics at different Wavelengths (m1102)Alexander Wolynski, Thomas Herrmann, Johannes L`Huillier, PZKL Photonik-Zentrum Kaiserslautern e.V.; Michael Schmidt, LPT Lehrstuhl fuer Photonische TechnologienLaser dressing of metal Bonded diamond Blades for Cutting of Hard Brittle materials (m1103)Philipp Von Witzendorff, Anas Moalem, Rainer Kling, Laser Zentrum Hannover e.V. Increasing Process Efficiency by Lasers with Tailored Wavelength and Beam Profile (m1104)Keming Du, EdgeWave GmbH Innovative Laser Solutions; Peng Shi, Edgewave GmbH Laser micromachining of Single Crystal Silicon Using IR 1064 nm and Green 532 nm Wavelengths of nanosecond Pulsed Laser (m1105)Shiva Gadag, RCAM Southern Methodist Univ.; Radovan Kovacevic, Southern Methodist Univ. 355nm dPSS UV Laser micromachining of Single-Crystal Silicon (m1106)Huan Yang, Jun Duan, Xiaoyan Zeng, Wuhan National Laboratory for Optoelectronics

LMF Session 12: Surface ModificationThursday, October 27 • 8:30am Session Chair: Nam Seong Kim, EO Technics, Anyang, South KoreaApplications of Surface Structuring with Lasers - Invited Presentation (m1201)Y. Lawrence Yao, Columbia Univ. Femtosecond Laser Irradiation-Induced Wettability modification of Electrospun Poly(Îµ-Caprolactone) Fibers (m1202)Lingna He, Jian Chen, Dave Farson, John Lannutti, Stan Rokhlin, The Ohio State Univ. Functionalization of Sapphire and Glass Surfaces Using fs-Laser Radiation and Selective Etching (m1203)Dagmar Esser, Maren Hoerstmann-Jungemann, Ingomar Kelbassa, Chair for Laser Technology, Aachen, Germany Generic Parameters Governing the Wettability Characteristics of Laser-modified nylon 6,6 (m1204)Jonathan Lawrence, David Waugh, Univ. of Lincoln Integration of a Picosecond Laser System into a machining Centre (m1205)Volker Schulze, Mateusz Chlipala, Ruediger Pabst, Karlsruhe Institute of Technology (KIT), WBK Institute of Production Science Applying Yagboss to micro-Sculpting of diffractive Scales on metal Surfaces for Optical Position Encoders (m1206)Stephanie Giet, Marcus Ardron, Frank Albri, Robert R. J. Maier, Duncan P. Hand, Heriot Watt Univ., Jonathan Shephard,; Matthew D. Kidd, Nick J. Weston, Renishaw Plc; Heriot Watt Univ.modifying Optical Properties and Tribological Properties of metals with nd:YAG Laser Pulses (m1207)Wenjun Wang, Xuesong Mei, Bing Liu, Xi’An Jiaotong Univ. Characterization of Sinusoidal Surface Texturing with a nanosecond mopa Pulsed Fiber Laser (m1208)Whitney Davis, Radovan Kovacevic, Southern Methodist Univ.; Sami T. Hendow, Multiwave Photonics Structural Evolution of TiO2 nanoparticle Under Laser Selective Irradiation (m1209)Ting Huang, Minlin Zhong, Tsinghua Univ.

LMF Session 13: Medical Devices and Biomedical ApplicationsThursday, October 27 • 8:30am Session Chair: Michael Schmidt, Bayerisches Laserzentrum GmbH, Erlangen, GermanyFrom CW to FS: Fiber Lasers in medical device manufacturing - Invited Presentation (m1301)Roland Mayerhofer, F&E Lasermaterialbearbeit modulation of Osteoblast Cell Response Through Laser Surface Processing of nylon 6,6 (m1302)Jonathan Lawrence, David Waugh, Univ. of Lincoln The Effects of Laser machining on Structure and mechanical Properties of 316 LVm Stainless Steel Wires (m1309)Hossein Lavvafi, Case Western Reserve Univ. Processing and Properties Evaluation of Laser Solid Forming Porous Titanium (m1304)Haiou Yang, Northwestern Polytechnical Univ. novel Cutting Strategies for medical devices Using Ultrashort-Pulsed Lasers (m1305)Christoph Ruettimann, LASAG AG Effect of Excimer Laser Irradiation of Biodegradable Polymer on its Chemical Binding (m1306)Shan-Ting Hsu, Y. Lawrence Yao, Columbia Univ. The Research of the Connection of Excimer Laser Zoom-Processing Condition to the PmmA micro-Channel’s Edge-Smoothness and Roughness (m1307)Zhengyang Xie, Tao Chen, Ning Liu, Xuefei Shen, Beijing Univ. of Technology Research of Zoom System Applied in Excimer Laser micromachining (m1308)Tao Chen, Zhen Wang, Zhengyang Xie, Beijing Univ. of Technology


Nanomanufacturing ConferenceConference Co-Chairs: Yongfeng Lu, University of Nebraska – Lincoln,

Lincoln, Nebraska, USA & Xianfan Xu, Purdue University, West Lafayette, Indiana, USA

The Nanomanufacturing Conference of ICALEO® consists of presentations on nanomanufacturing, which have relevance to laser technologies. Much progress has been achieved in laser direct writing for nano-machinning, nanofabrication

using femtosecond lasers, and laser-assisted growth of nanostructures. This conference will highlight research in emerging nanomanufacturing technologies in 3-D micro/nanomachining, 2-photon lithography, digital fabrication, nanoparticle formation, surface nanostructuring, and laser-assisted growth and expitaxy. These studies encompass a variety of applications, including photonic crystals, nanofluidic devices, opto-fluidic and nanoscale plasmonic structures.

Program Committee: Craig Arnold, Princeton Univ., Princeton, NJ, USAStephan Barcikowski, Univ. of Duisburg-Essen, Essen, GermanyKevin Chen, Beijing Golden Way Scientific Co. Ltd.,

People’s Republic of ChinaShaochen Chen, Univ. of Texas at Austin, Austin, TX, USASuman das, Georgia institute of technology, atlanta, Ga, UsaHaris doumanidis, Univ. of Cyprus, Nicosia, Cyprusnick Fang, Massachusetts Institute of Technology, Cambridge, MA, USACostas Grigoropoulos, Univ. of California - Berkeley, Berkeley, CA, USAChangzhi Gu, Institute of Physics, Chinese Academy

of Sciences, Beijing, People’s Republic of ChinaPeter Herman, Univ. of Toronto, Toronto, CanadaYoshiro Ito, Nagaoka Univ. of Technology, Nagaoka, Niigata, JapanSungho Jeong, Gwangju Institute of Science and Technology, Gwangju,

South KoreaLan Jiang, Beijing Institute of Technology, Beijing, People's Republic of ChinaYuankun Lin, Univ. of Texas-Pan American, Edinburg, TX, USAEtsuji Ohmura, Osaka Univ., Toyonaka, Osaka, JapanGenot Pomrenke, AFOSR, London, Great BritainAlberto Salleo, Stanford Univ., Stanford, CA, USAXinwei Wang, Iowa State Univ., Ames, IA, USAWeidong Zhou, Univ. of Texas at Arlington, Arlington, TX, USAYunshen Zhou, Univ. of Nebraska – Lincoln, Lincoln, NE, USA

NANOMANUFACTURINg CONFERENCE

Nanomanufacturing Session 1: Femtosecond Laser Nano-ProcessingMonday, October 24 • 1:30pm Session Co-Chairs: Yongfeng Lu, Univ. of Nebraska - Lincoln, Lincoln, NE, USA; Xianfan Xu, Purdue Univ., West Lafayette, IN, USAFemtosecond Laser micro/nanomachining of Glass materials for Optofluidic Applications and Beyond - Invited Presentation (n101)Ya Cheng, Shanghai Inst. of Opt. & Fine Mech.; Fei He, Yang Liao, Zhizhan Xu, Siom; Koji Sugioka, Katsumi Midorikawa, Riken non-Thermal Ablation of Graphite by Ultrashort Pulsed fs-Laser Radiation (n102)Martin Reininghaus, Chair for Laser Technology, RWTH Aachen Univ. Fabrication of Addressable Biological devices Using Femtosecond Laser machining (n103)Deepak Rajput, Lino Costa, Alexander Terekhov, Kathleen Lansford, William Hofmeister, Univ. of Tennessee Space Institute Plasmonic devices Fabricated by Femtosecond Laser nanowelding - Invited Presentation (n104)Anming Hu, Univ. of Waterloo Femtoprint: Toward a Femtosecond Laser Printer for micro- and nano-Scale Systems (n105)Eric Mottay, Amplitude Systemes; Yves Bellouard, M. Matteuci, A. Champion, Eindhoven Univ. of Technology; M. Gevincevicius, Martynas Beresna, Costantino Corbari, Peter Kazansky, Univ. of Southampton

micromachining of micropillar Array Chip on Pi and PmmA Substrate with Excimer Laser Ablation (n106)Xuefei Shen, Beijing Univ. of Technology

Nanomanufacturing Session 2: Two-Photon Laser NanolithographyTuesday, October 25 • 8:30am Session Co-Chairs: Alberto Pique, Naval Research Laboratory, Washington, DC, USA; Ya Cheng, Shanghai Inst. of Opt. & Fine Mech., Shanghai, People’s Republic of ChinaRecent developments in Two-Photon Lithography - Invited Presentation (n201)Tommaso Baldacchini, Newport Corporation novel Two-Photon Laser nanolithography for manufacturing Semiconductor nanodevices – Invited Presentation (n202)Xuan-Ming Duan, Technical Institute of Physics and Chemistry, CAS Analysis of nonlinear Absorption of Au@Cdse nano Coreshell (n203)Yehia Badr, Abeer Salah, Niles , Cairo Univ.; Salah Hassab Elnaby, Cairo Univ. Perspective Industrial Applications Promised by Laser nanofabrication – Invited Presentation (n204)Hongbo Sun, Jilin Univ. Laser-Power-Resolved Excitations of Ethylene molecules in Laser-Assisted Synthesis of diamond Films (n205)Z.Q. Xie, X.N. He, W. Hu, Y. Gao, T. Guillemet, J.B. Park, Y.S. Zhou, Yongfeng Lu, Univ. of Nebraska - LincolnSynthesis of nitrogen-doped diamond Films by Vibrational Excitation of Precursor molecules using CO2 Laser in a Combustion Flame Process (n206)L.S. Fan, Z.Q. Xie, J.B. Park, X.N. He, Y.S. Zhou, Yongfeng Lu, Univ. of Nebraska - Lincoln

Nanomanufacturing Session 3: Laser-Material Interaction at NanoscaleWednesday, October 26 • 8:30am Session Chair: Tommaso Baldacchini, Newport Corporation, Irvine, CA, USALaser Transfer Processes for digital microfabrication – Invited Presentation (n301)Alberto Pique, Ray Auyeung, Heungsoo Kim, Kristin Metkus, Nicholas Charipar, Andrew Birnbaum, Scott Mathews, Naval Research Laboratory Laser-Induced Growth of diameter-modulated Single-Walled Carbon nanotubes (n302)M. Mahjouri-Samani, Y.S. Zhou, W. Xiong, M. Mitchell, Yongfeng Lu, Univ. of Nebraska - Lincoln Fabrication and Characterization of nano mn Towel Gourd Fiber Structure by Laser deposition Hybrid Selective Electrochemical dealloying (n303)Yu Gu, Ting Huang, Minlin Zhong, Tsinghua Univ. Laser Processing of nanocomposite Rare Earth magnetic materials (n304)David Hopkinson, Andrew Cockburn, William O’Neill, Univ. of Cambridge TiO2 nanoparticles Produced by Laser Ablation (n305)Mohamed Boutinguiza, Benito Rodriguez-Gonzalez, Jesus Del Val, Rafael Comesaña, Fernando Lusquiños, Juan Pou, Univ. de Vigo


Poster Presentation GalleryTuesday, October 25 & Wednesday, October 26The Poster Presentation Gallery will be featured on Tuesday and Wednesday of the conference. Join presenters Wednesday morning for breakfast and sharing of ideas. Poster Presenters will be by their posters on Wednesday morning from 7:30am – 8:30am to answer questions. Poster presenters who submit a manuscript will be included in the ICALEO Proceedings.

Topography of Grain Boundaries Varied by Short Pulse Laser Irradiation for Controlling microstructures of metals (P101)Daisuke Tone, Graduate School of Engineering, Osaka Univ.; Masahiro Tsukamoto, Toshiya Shibayanagi, Nobuyuki Abe, Joining and Welding Research Institute, Osaka Univ.; Shinji Motokoshi, Institute for Laser Technology Femtosecond Laser microfabrication in Fused Silica for Opto-microfluidic Applications (P102)Daiying Zhang, Qiying Chen, Memorial Univ. of Newfoundland Formation of durable micro-Scale Structures by ns Fiber Laser Texturing to Improve the Tribological Properties of Engine Liners (P103)Peixun Fan, Minlin Zhong, Tsinghua Univ. Ultrashort Pulse Lasers - A Versatile Industrial Tool for new micromachining Applications (P105)Erwin Steiger, Erwin Steiger LaserService Oxide Growth and Color Formation of Stainless Steel and Titanium Using a mOPA Fiber Laser (P106)Sami Hendow, Rosa Romero, Multiwave Photonics Laser Phase Transformation Processing of nickel Aluminium Bronze to Reduce Selective Phase Corrosion (P107)Ryan Cottam, Swinburne Univ. of Technology; Milan Brandt, RMIT new Advances for Laser Adhesion Test (Lasat) (P108)Laurent Berthe, CNRS/Laboratoire Procédés et Inginièrie en matériaux et Mécanique; Michel Arrigoni, Laboratoire Brestois De MéCanique Et Des SystèMes Lbms (Ea 4325, Ensieta / Université De Brest / Enib) Ensieta – Msn; Michel Boustie, Jean-Paul Cuq-Lelandais, Pprime-Ensma – Université De Poitiers - Upr Cnrs 3346; Cédric Broussillou, Grégory Fabre, Vincent Guipont, Michel Jeandin, Mines Paristech, Centre Des Matériauxmicro-Laser-GmA Hybrid Welding - The Advancement from macro to micro Range (P109)Stefan Jakobs, Welding and Joining Institute, RWTH, Aachen Univ. Preparation of ni50Ti50 Shape memory Alloys by Selective Laser melting (P110)Zemin Wang, Kai Guan, Yu Cao, Xiaoyan Zeng, Huazhong Univ. of Science and Technology Laser Thermal Input Effects on deep Penetration CO2 Laser Welding of Carbon Steel (P111)Walid Hamoudi, Univ. of TechnologyOptical-Phased-Array-Based Laser Source Applied to Flexible manufacturing (P112)Zheng-Yu Ye, Si-Si Zhao, Zhi-Yong Wang, Institute of Laser Engineering, Beijing Univ. of Technology mechanisms of the Porosity Formation during the Fiber Laser Lap Welding of Al 5754 Sheets (P113)Jun Wang, Guozheng Wang, Xiyuan Hu, Chunming Wang, Shengfu Yu, Huazhong Univ. of Science and Technology; David Yang, Jing Zhang, GM China Science Lab Selective Laser Sintering of Tungsten-nickel Composite Powders (P114)Wen Tan, Rui Guo, Yanmin Li, General Electric

Self-nanocrystallation Investigation on the Titanium Surface Using Laser Shock Processing (P115)Zhigang Che, National Key Laboratory of Science and Technology on Power Beam Processing Techn Effect of Laser Shocking on Intergranular Corrosion Resistance of 304 Type Austenite Stainless Steel (P116)Sen Yang, Nanjing Univ. of Scinece and Technology Experimental Analysis of Automated Laser Forming for Shipbuilding Industry (P119)Rosa M. Arias, Nerea Otero, Victor Pintos, Pablo Romero, Aimen Technology Center Laser net-Shape Welding of Stainless Steel Sheets Using a 1 Kw Single mode Fibre Laser (P120)Ramadan Eghlio, Manchester Univ.Laser-Assisted manufacturing of Bioactive Glass Implants for Cranial defect Restoration (P121)Rafael Comesaña, Jesus Del Val, Fernando Lusquiños, Felix Quintero, Antonio Riveiro, Mohamed Boutinguiza, Juan Pou, Univ. de Vigo Cr-Crb2 Lisi Coatings As a Rail Protection Solution (P122)Lino Costa, Kathleen Lansford, Douglas Warnberg, William Hofmeister, Univ. of Tennessee Space Institute; Daniel Szablewski, Transportation Technology Center, Inc.; Richard Thoms, Cfd Research Corporationmicrostructure and mechanical Properties of Laser Forming Repaired 17-4Ph Stainless Steel (P123)Xin Lin, Wu Xiaoyu, Yang Haiou, Chen Jing, Huang Weidong, State Key Laboratory of Solidification Processing, Northwestern Polytechnical Univ. A Comparison Study of the Laser Bending by Raster Scanning of Aluminum and Stainless Steel Thin Sheets (P124)Jorge Ramos, Pontificia Univ. Catolica de Chile; Carlos Vasquez-Ojeda, Hatch; Daniel Garcia-Huidobro, CMPC 2-d Finite Element modeling of Heat Transfer and Fluid Flow during multi Layered dmd Laser Process (P125)Carron Denis, Carin Muriel, Le Masson Philippe, Morville Simon, Limatb Laboratory; Gharbi Myriam, Peyre Patrice, Fabbro Rémy, Pimm - Umr 8006 Cnrs - Arts Et Metiers Paristech Process migration of Resistance to Laser Spot Welding (P126)Danny MacCallum, Gerald Knorovsky, Louis Malizia, Sandia National Laboratories Progress in Laser Post-Treatments of Thermally Sprayed Coating (P127)Massimiliano Barletta, Annamaria Gisario, La Sapienza, Universitä Di Roma Laser Welding of Automotive Transmission Components (P129)Cheolhee Kim, Young-Nam Ahn, KITECH On-Line Acoustic monitoring of Laser Stripping Paint from Titanium Alloys (P130)Wei Guo, The Univ. of Manchester Fatigue Life Improvement of Steel Components by Surface diode Laser Treatments: Experimental and numerical modeling (P131)Stefano Guarino, Massimiliano Barletta, Univ. of Rome Tor Vergata A CFd model of Laser Cladding: from deposition Head to melt Pool dynamics (P132)Juansethi Ibarra-Medina, Michael Vogel, Narcisse Ndri, Esi GmbH; Andrew Pinkerton, The Univ. of Manchester

POSTER PRESENTATION gALLERY


Production of Aluminum Foams by Laser Cladding (P133)Jesus Del Val, Rafael Comesaña, Fernando Lusquiños, Felix Quintero, Juan Pou, Univ. de Vigo; Antonio Riveiro, Centro Universitario De La Defensa Femtosecond Laser machining of microfluidic devices for Cell Chemotaxis Imaging (P134)Lino Costa, Alexander Terekhov, William Hofmeister, Univ. of Tennessee Space Institute; Gus Wright, Dawit Jowhar, Chris Janetopoulos, Dept. of Biological Sciences, Vanderbilt Univ. Photonics in medicine - from diagnostics to Training (P135)Michael Schmidt, Maik Zimmermann, Bayerisches Laserzentrum GmbH; Jan Paulus, Martin Hohmann, Chair of Photonic Technologies Laser Overlap Welding of the Al-mg Alloy Using CW Waveform modulation (P136)Cheolhee Kim, Kibae Lee, KITECH; Do-Chang Ahn, LG Chem, Ltd. Femtosecond Laser direct Writing of Silicon nanowire Sensors (P137)James Mitchell, Woongsik Nam, Minghao Qi, Pornsak Srisungsitthisunti, Chookiat Tansarawiput, Xianfan Xu, Purdue Univ. direct Laser metal deposition of Tungsten Carbide-Cobalt-Chrome (Wc/Co/Cr) Powder (P141)Andrea Angelastro, Sabina L. Campanelli, Simone Ferrara, Antonio D. Ludovico, Polytechnic of Bari

Laser Annealing of Ito nanoparticles for Tco Films Using 1.5 µm Laser Radiation (P142)Costas Grigoropoulos, Daeho Lee, Heng Pan, UC-Berkeley; Tony Hoult, IPG Photonics; Hee Park, Appliflex Solid-State Laser Gas nitriding of Ti6Al4V for Improving Surface Hardness and Wear Resistance (P143)Hau-Chung Man, Hong Kong Polytechnic Univ.; M. Bai, Ft Cheng, Dept. of Industrial and Systems Engineering Ultra-High Speed Laser Cutting of CFRP, and Laser direct Joining of Pitch Type CFRP to Stainless Steel (P144)Kwang-Woon Jung, Osaka Univ.; Seiji Katayama, Yousuke Kawahito, Osaka Univ., Joining and Welding Research Institute deep Penetration Welding with High Power disk Lasers in Low Vacuum (P146)Seiji Katayama, Yohei Abe, Ryoji Ido, Masami Mizutani, Yousuke Kawahito, Osaka Univ., JWRISpectral Resolution Improvement in Laser-Induced Breakdown Spectroscopy Through Generation of High-Temperature and Low-density Plasmas (P147)X.N. He, W. Hu, Y.S. Zhou, C.M. Li, L.B. Guo, Yongfeng Lu, Univ. of Nebraska - Lincoln novel Inner diameter Laser Cladding Head (P148)E. Beyer, Ch. Leyens, F. Kubisch, S. Scharek, A. Techel, S. Nowothy, Fraunhofer IWS

Student Paper Award ContestAnnouncing the 13th Annual ICALEO Student Paper Award! LIA appreciates the importance of student contributions to ICALEO by offering the opportunity to have their work recognized with this award. Students with accepted papers will be judged by an international panel on the following criteria: Originality of Topic/Material presented, Scientific and Technical Merit and Presentation Quality. Professors do not judge their own student’s papers. Prize winners will be notified after the conclusion of ICALEO and will be announced through an article in the LIA TODAY newsletter featuring conference highlights.

Cash awards will be presented to 1st, 2nd, 3rd place winners. 1st place paper will be published in the Journal of Laser Applications® (paper will go through the peer review process).

Sponsored by:

POSTER PRESENTATION gALLERY

This unique workshop will bring together industry specialists from around the world with the goal of applying this state-of-the-art process (cladding & rapid manufacturing) to today’s manufacturing challenges.

SAVE the DATEFebruary 29 – March 1, 2012

Sheraton North Houston George Bush Intercontinental | Houston, TX, USA

www.lia.org/LAM • +1.407.380.1553 • [email protected]

Presented by:

LAMLASER ADDITIVE MANUFACTURING

W O R K S H O P

General Chair: Paul Denney, Lincoln Electric

www.lia.org/LAM • +1.407.380.1553 • [email protected]

General Chair: Paul Denney, Lincoln Electric

LAM_HalfPgAd_12.indd 1 7/11/11 10:17:43 PM


Laser Solutions Short CoursesShort Course Chair: Silke Pflueger, Laserline, Inc., Santa Clara, CA, USA

The success of the 2010 Laser Solutions Short Courses on Sunday has encouraged us to again have the day before the main conference dedicated to short courses, enabling all attendees to participate without time restrictions during the technical sessions. The short courses have been selected to complement the papers offered at ICALEO by offering fundamentals and in-depth information on measurement techniques, systems and processes. They are taught by industrial photonics experts, and offer ICALEO attendees valuable insight into details not usually covered by the latest results presented in the technical papers – for no additional fee.

We look forward for you to join us for a day of learning and discussions in Orlando!

Course 1: Beam Diagnostics - Technology, Algorithms and Applications

Sunday, October 23 • 9:00amVolker Brandl, GSI PRIMES GmbH, Pfungstadt, GermanyParticipants will learn about the fundamental beam parameters characterizing the optical performance of a laser. We will discuss detection methods and calculation algorithms for the most relevant beam parameters. The influence of these beam parameters, e.g. spot diameter, laser power, M2 and polarization, on some laser processes will be discussed. Examples will be presented that allow to find a link between alterations seen in the measurement data and the kind of error that occurred in the laser, beam path, or focussing optics. Applications and future developments of laser beam analysis are outlined.The objectives for this course are:1) Quality assurance at laser systems.2) Beam parameters – theory and practical measurements.3) Comparing results – beam diameter definitions and algorithms.4) The impact of optical element aging/strain on measurement data.5) Industrial applications and integration of beam analysis.Course level: Beginner to Intermediate

Course 2: Founding and Operating a High Tech CompanySunday, October 23 • 10:45amRonald D. Schaeffer, PhotoMachining, Inc., Pelham, New Hampshire, USAThis Course will discuss technical, administrative, personnel and legal issues involved in starting and operating a small high-tech business. Discussion involves how to write a business plan, find investment money, hire the right people, market your product/service and deal with everyday business life. Examples will be given and discussed as well as common pitfalls to be avoided.What you will learn:1) Reasons why to start your own business.2) How to start your own business.3) Hiring the right people - when, who, how many, etc…4) Running the organization, managing people and Programs.5) Growth considerations.6) Exit strategy.Who should attend:1) Would be entrepreneurs.2) Those about to start a small business.3) Anyone studying small business modes.4) Small business owners.5) Anyone managing a team of people (you don’t need

to be an owner to benefit from this course!).Course level: Beginner

Course 3: Laser Heat Treating Fundamentals and PracticeSunday, October 23 • 11:30amJoel DeKock, Preco Inc., Somerset, WI, USAThis short is an introduction to the commercial use of laser technology for the heat treatment of common metallic materials. It is intended to provide a beginner/intermediate level of instruction for those considering the implementation of this technology on the shop floor.

The objectives for this course are:1) To provide a review of available laser sources and their benefits.2) To present various options for delivery of laser light to the work.3) To discuss options available for process control.4) To review material commonly treated, and other potential options.5) To present case studies that illustrate the application of this

technology.Course level: Beginner to Intermediate

Course 4: Laser Additive ManufacturingSunday, October 23 • 1:30pmAravind Jonnalagadda, Fraunhofer USA, CCLA, Plymouth, MI, USA; Siegfried Scharek, Fraunhofer IWS, Dresden, GermanyThis short course introduces listeners to the basics of laser additive manufacturing, their benefits and applications in the industry.The objectives for this course are:1) Fundamentals of laser cladding. 2) Laser cladding vs. other coating techniques.3) Equipment setup.4) Applications.5) Coating types.6) Metallurgical review.Course level: Beginner

Course 5: Introduction to Laser MachiningSunday, October 23 • 2:15pmRichard Press, LPL Systems, Inc., Scotts Valley, CA, USAThis is an introductory talk on laser machining. It is intended to expose the audience to the basics of lasers, machine tools, laser based machine tools, and laser applications.This course will cover the following topics: 1) The advantages of laser machining as compared to conventional

machining. 2) Basic laser theory. 3) Description of the standard types of machine tools. 4) Description of laser based machine tools. 5) Overview of laser applications. 6) An example of a high-precision laser machining operation using

stent cutting as an example. The objectives for this course are:1) A basic understanding of laser theory.2) A description of the advantages of laser machining over

conventional machining.3) An understanding of the design and functions of machine tools.4) A basic understanding of the most common laser applicationsCourse level: Beginner to Intermediate

LASER SOLUTIONS SHORT COURSES


Laser Industry Vendor Reception & Tabletop DisplayTuesday, October 25 • 4:00pmSharing Ideas. discovering Solutions.As the world’s premier conference on laser materials interaction, ICALEO attracts over 200 companies and organizations from more than 30 countries. The Laser Industry Vendor Program gives vendors and conference attendees the opportunity to discuss equipment and applications in a relaxed setting. After completion of the technical sessions, enjoy drinks and hors d'oeuvres while sharing product ideas with your colleagues and suppliers! This is the only scheduled event for the evening, allowing participants access to the full attention of attendees. For information about participating as an ICALEO Sponsor or Vendor, please e-mail [email protected].

Thank you to the ICALEO Media Partners & Cooperating Societies

Sponsors and Vendors registered as of June 8:AdlOptics gmbH Aerotech, Inc.Altos Photonics, Inc.Amplitude SystemesAndrews Glass Co., Inc. Cambridge Technology, Inc.CLAIm, The University of michiganClark-MXR, Inc. Coherent, Inc.CVI Melles griotDirected Light, Inc.EdgeWave GmbH Innovative Laser SolutionsElectro-Optics Technology, Inc.Fianium, Inc. Fraunhofer Institute for Laser Technology ILTFraunhofer USA, Center for Coatings & Laser ApplicationsHaas Laser Technologies, Inc.High Q Laser (US), Inc.HIgHYAg Lasertechnologie gmbHII-VI InfraredInnovative Laser Technologies, Inc.IPG PhotonicsJDSU

Kugler of America, Ltd. Laser Mechanisms, Inc.Laserline Inc.Lee Laser, Inc.Mound Laser & Photonics Center, Inc.national Science Foundation (nSF)newport CorporationNoIR Laser CompanyNorthrop Grumman Cutting Edge OptronicsNufernOZ Optics LTD.onefive gmbHPanasonic Boston LaboratoryPhotonics Industries International, Inc.Precitec, Inc.RPMC Lasers, Inc.SCANLAB America, Inc.SPI LasersTime-Bandwidth Products Inc.TRUmPF, Inc.Univ of Central FL; CREOL, The College of Optics and Photonics Vytran Corporation

*sponsors highlighted in bold*

About LIALaser Institute of America (LIA), founded in 1968, is the international society dedicated to fostering lasers, laser applications and laser safety worldwide. LIA has grown to represent hundreds of corporate and thousands of individual members in the laser industry.

Visit www.LIA.org for more information!

Join the LIA!To take advantage of member registration rates, please go to the LIA website at www.LIA.org for membership information and an application, or call 800.34LASER or +1.407.380.1553.


Conference RegistrationgENERAL INFORMATION

Registration can be completed online or by downloading a PDF registration form from www.ICALEO.org. Full conference registration includes admission to all technical sessions, the Plenary Sessions, Laser Solutions Short Courses, Receptions (Welcome Celebration, President’s Reception and Vendor Reception), Awards Luncheon and a technical digest. Student registration includes admission to all technical sessions, the Plenary Sessions, Laser Solutions Short Courses, Receptions (Welcome Celebration, President’s Reception and Vendor Reception), Awards Luncheon and a technical digest. Valid student ID is required to process registration. Student registration will not be accepted on-site; students must be pre-registered by September 28th.One-day registration includes admission to technical sessions and receptions on that day only, and a technical digest. Guests may attend the Awards Luncheon and all receptions by purchasing tickets. Please pre-register your guest so we may prepare a nametag. Early Bird registrants must be paid in full by September 1st. Visa, MasterCard and American Express will be accepted. You may send a check (US funds only, drawn on a US bank) payable to Laser Institute of America. Purchase orders must be paid in full by September 1st to qualify for discount.

On-site Registration TimesSunday, October 23 8:00am – 4:00pmMonday, October 24 7:00am – 5:00pmTuesday, October 25 7:30am – 4:00pmWednesday, October 26 7:30am – 5:00pmThursday, October 27 7:30am – 12:00pm

Hotel Accommodations

Hilton located in the Walt Disney WorlD® resort1751 Hotel Plaza BoulevardLake Buena Vista, FL 32830Phone: +1.407.827.4000 • Fax: +1.407.827.3890The Hilton, located in the WALT DISNEY WORLD Resort, is an official hotel of Walt Disney World in Lake Buena Vista, Florida. Hotel guests will enjoy exceptional facilities at this Four Star, Four Diamond resort. Take a refreshing dip in either of the two swimming pools, enjoy a workout in the health club, play golf at one of the five Walt Disney World championship courses and savor a variety of cuisines at the seven restaurants and lounges. Book your hotel reservations online through the ICALEO website www.ICALEO.org. Please note: Hotel Early Bird Pricing deadline: Sunday, August 28, 2011 – $149Hotel Reservations Deadline: Thursday, September 29, 2011

ProceedingsCD-Rom Proceedings will be available on-site (they will not be shipped to you). It includes all submitted papers from ICALEO – Laser Materials Processing, Laser Microprocessing, Nanomanufacturing and Poster Manuscripts.$145* .....Member$170* .....Non-Member* Please note: State and Local Sales Tax NOT includedSpecial needsIf you have any special needs that we can address to make your participation more enjoyable, please contact LIA by phone: +1.407.380.1553, Fax: +1.407.380.5588 or email: [email protected].

TransportationMears Transportation provides shuttle service to and from the Hilton located in the WALT DISNEY WORLD Resort. Make your reservations in advance and avoid the line by going to www.mearstransportation.com. Transportation from the Orlando Airport to the Hilton resort is $34 round trip. You may go to www.ICALEO.org to print a coupon to save $4 off your round trip transportation.Taxi Cab ServiceTaxi Cab Service is available at Level 2 (baggage claim) of the Orlando International Airport. Transportation to and from the resort is approximately $50 to $60 per direction.

Rental CarsCall Avis Rental Car at 800.331.1600 and mention AVIS worldwide discount number J093783 or to reserve online visit https://www.avis.com/car-rental/reservation/initialize-reservation.ac?&AWd_nUmBER=J093783Average October Temperatures:84° F / 29°C High65°F / 18°C Low

Join the LIA!To take advantage of member registration rates, please go to the LIA website at www.LIA.org for membership information and an application, or call +1.407.380.1553

Register Online and Save $25!

www.ICALEO.org

Substitutions and CancellationsWe understand that circumstances may occur to prevent you from attending the conference. If you find that you are unable to attend ICALEO, you have several options:1. Send a substitute. Substitutions can be made at any time – even on-site at the conference. (Please have the substitute bring your letter of confirmation to the registration desk)2. Refund of monies. Requests for refunds must be made in writing and received on or before September 1.There is a $75 processing fee applied to all refunds. All refunds will be processed after the conference. No refund requests will be accepted after September 1st. guest Tickets, Proceedings & LIA Membership Dues are all non-refundable.

FEES

Full Conference RegistrationEarly Bird (payment received by September 1)$725..........Member$725..........Cooperating Society$840..........Non-Member $390..........Student$425..........Retired LIA Member(September 2 – September 28)$775..........Member$775..........Cooperating Society$890..........Non-Member $460..........Student$475..........Retired LIA Member

(September 29 – On-site)$825..........Member$940..........Non-MemberOnsite registration not available for Cooperating Society, Student or Retired LIA Member

One day Conference RegistrationEarly Bird (payment received by September 1)$295..........Member$325..........Non-Member

(September 2 – September 28)$325..........Member$355..........Non-Member

(September 29 – On-site)$360..........Member$390..........Non-Member

Laser Solutions Short Course RegistrationEarly Bird (payment received by September 1)$295..........Member$325..........Non-Member

(September 2 – September 28)$325..........Member$355..........Non-Member

(September 29 – On-site)$360..........Member$390..........Non-Member

* Purchase orders will not be accepted for on-site registration.


Sunday, October 238:00am ICALEO Registration Desk & LIA Bookstore Open9:00am Laser Solutions Short Courses11:30am LIA Board of Directors Meeting4:00pm Welcome Celebration

Monday, October 247:00am ICALEO Registration Desk & LIA Bookstore Open8:00am Attendee Continental Breakfast9:00am Plenary Session: Material Nanoscience, Photonics,

and Technologies for Revolutionary Innovation10:10am Morning BreakLunch on own1:30pm LMP 1: Laser Cutting LMP 2: Process Monitoring and Control I LMF 1: Drilling and Micromachining I LMF 2: Microjoining Nano 1: Femtosecond Laser Nano-Processing2:50pm Afternoon Break5:00pm President’s Reception

Tuesday, October 257:30am ICALEO Registration Desk & LIA Bookstore Open Poster Presentation Gallery8:00am Attendee Continental Breakfast8:30am LMP 3: Welding I LMP 4: Process Monitoring and Control II LMP 5: Laser Metal Deposition (LMD): Applications

and Systems LMF 3: Photovoltaics Nano 2: Two-Photon Laser Nanolithography10:10am Morning BreakLunch on own1:30pm LMP 6: Processing of Dissimilar Materials LMP 7: Modelling and Simulation LMF 4: Laser Sources for Microprocessing LMF 5: Drilling and Micromachining II Business Forum & Panel Discussion4:00pm Laser Industry Vendor Reception

& Tabletop Display

Wednesday, October 267:30am ICALEO Registration Desk & LIA Bookstore Open7:30am Attendee Breakfast/Poster Presentation gallery

Q & A8:30am LMP 8: Welding II LMP 9: Laser Surface Modification I LMF 6: Laser Optics and Applications LMF 7: Monitoring Detection and Adjustment Nano 3: Laser-Materials Interaction at Nanoscale10:30am Morning Break10:50am LMP 10: Laser Drilling LMP 11: Laser Surface Modification II LMP 12: Laser Processing of CFRP LMF 8: Laser Microdeposition Processes LMF 9: Thin Film ProcessingLIA Annual meeting & Awards Luncheon3:00pm LMP 13: Welding III LMP 14: Laser Metal Deposition (LMD): Process I LMP 15: Hybrid and Combination Processes LMF 10: Micromachining of Transparent Materials LMF 11: Wavelength Optimization5:00pm Afternoon Break

Thursday, October 277:30am ICALEO Registration Desk & LIA Bookstore Open8:00am Attendee Continental Breakfast8:30am LMP 16: Welding IV LMP 17: Laser Metal Deposition (LMD): Process II LMP 18: High Brightness Laser Challenges LMF 12: Surface Modification LMF 13: Medical Devices and Biomedical

Applications10:10am Morning BreakLunch on own1:30pm Closing Plenary Session: Joint Session

(LMP & LMF) Strategies, Limits and Challenges for Advanced Laser Processing

3:50pm Farewell Break

ICALEO® 2011 CONFERENCE AGENDA*

* Program subject to minor changes


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SILVER LEVEL SPONSORS

BRONZE LEVEL SPONSORS

october 23-27, 2011 advance program · 2014-11-08 · he co-authored, along with professor charles...

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