Company Public – NXP, the NXP logo, and NXP secure connections for a smarter world are trademarks of NXP

B.V. All other product or service names are the property of their respective owners. © 2019 NXP B.V.

Presenter title goes here

Second line title goes here

Eduardo Montanez | Omar Cruz

NXP Powerhouse MCU Portfolio

September 2019 | Session #AMF-SMH-T3512

COMPANY PUBLIC 1COMPANY PUBLIC 1

• Broadest Arm-based MCU Portfolio

• Ease-of-Use Enablement

• Product Spotlights

• Summary

Agenda

COMPANY PUBLIC 2

Broadest Arm-based MCU

Portfolio

COMPANY PUBLIC 3

Technology

InsightsLearning from our 26,000+ end customers

across thousands of diverse applications

Expansive

EcosystemCommon software platform combined with

large partner network

Broad

PortfolioHigh-performance crossover processors to

Low-power secure and connected MCUs

PUBLIC

Industrial & IoT Microcontrollers

COMPANY PUBLIC 4

Commitment to MCU Innovation & Market Leadership

Source: IC Insights

First to license

Arm Core for

MCUs (2002)

First Arm®

Cortex®-M4-

based MCU

Introduce M0,

M0+ and 5V

World’s smallest

Arm-based

MCU at 1.6mmx

2mm

First Cortex-

M7 based MCU

targeting motor control

Launch of new

integrated TSI

solution

Introducing i.MX RT Series 1st

600MHz general purpose

MCU

1st to introduce flash-based M33 in 40nm

Sampling 1st

28nm FDSOI MCU

2010 2011-

20132014 2015 2016 2017 2018 2019

• Technology & IP

sharing to unify

roadmap

• Maximize

developer re-use

NXP+FSL

ranked #1 in

MCUs*

COMPANY PUBLIC 5

NXP’s Scalable Edge Computing ContinuumMarket need for differentiated platforms to address broad range of requirements

Functional Integration

Perf

orm

ance

Purpose-built, dedicated

SoC platforms

• Enhanced Embedded Security by Design

• Development Simplicity & Compatibility

i.MX RT Series

COMPANY PUBLIC 6

Look Ahead NXP’s Arm® Cortex®-M Portfolio EvolutionIntroducing i.MX RT for Ultimate Performance & Extensibility

• 600 MHz with advanced HMI and real-time control

• Highest Performance (3020 CoreMark/ 1284 DMIPs) ; Cortex-M7 M33

• From 128KB to 5MB SRAM with unlimited extensibility (Quad/Octal SPI flash)

Coming next

From $1 to 1GHz

• i.MX RT1010 <$1

• i.MX RT1170 1GHz

Available Q2 ‘19

• i.MXRT1060 1st AVS certified

MCU

Introducing LPC5500 for Unrivaled Compute Efficiency

• ≥ 100 MHz, Cortex-M33, TrustZone, & DSP acceleration

• enhanced security & accelerators

• Balance power & performance (150-500 DMIPs) Cortex-M33

Coming next

• Path to lower cost

• Increased MIPS

• More integration (Memory,

analog, graphic eng.,

CAN)

Available Q2 ‘19

• LPC55S6x, first Cortex-M33 to

market, based on cost &

performance efficient 40nm

technology

Introducing K32 L for Extended Battery Life

• < 100 MHz, fast wake-up, security, & high-precision analog

• Target low leakage across operating range (40-120 DMIPs) ; Cortex-M4 & M0+

• From 32KB to 1MB internal flash and 4-8:1 Flash to SRAM ratio

Coming next

• Path to lower cost with

scalable L2 family

based on Cortex-M0+

Available Q3 ‘19

• Introduced first L3 power

optimized, dual-core

superset

Introducing LPC800 for 8-bit Alternative

• ≤ 30 MHz with range of features & package options

• High power efficiency (10-50 DMIPs) Cortex-M0+

• From 8KB to 64KB internal flash and 4-8:1 Flash to SRAM ratio

Introducing KE/KV/KM & S32K for their Target markets

• KE: 5V/Robust/Touch/CAN

• KV: High Performance Control

• KM: Metering & Metrology

Performance &

Integration

Mainstream

Efficiency

Ultra-low

Power

Value

Vertical Focus

Coming next

• Looking at expansion

options for memory,

security and analog

Available Q2 ’19

• LPC84x, LPC82x, LPC81x,

LPC80x all MP

• Added WLCSP (LPC802 and

LPC804)

Coming next

• Increasing memory on KM

Available Q2 ‘19

• Introduced 32 – 64KB KE

version with CAN & Touch

• KE, KV, KM in many different

variants

COMPANY PUBLIC 7

Consumer

Smart watches

Headphones

Gaming Accessory

Home & Building

Automation

Thermostats

Door locks

Lighting

Industrial & Control Systems

Sensing

Agriculture

Building Control

HVAC

Motors, Drives, Power

Drones, UAVs

Industrial Robotics

Circuit breakers

Power Tools

Solar/Inverters

Home appliances

Cookers

Refrigerators

Washers & dryers

Small Appliance

Secure Transactions &

Access, Payment & Metering

Mobile POS reader

PIN pads

Scale with Online & Local Communities + Accessibility through Distribution/E-shop

Enabling Breadth of Industrial & IoT market applications General purpose MCUs + Domain Expertise + Support

COMPANY PUBLIC 8

Strength in Product Longevity

• NXP has a longstanding track record of providing long-term production support for our products

• NXP has a formal product longevity program for the market segments we serve

– For the automotive, medical segments and 99% of the Kinetis MCU portfolio, NXP will make a broad range of solutions available for a minimum of 15 years

– For all other market segments in which NXP participates, NXP will make a broad range of solutions available for a minimum of 10 years

– Life cycles begin at the time of launch

– Includes NXP’s standard end-of-life notification policy

• For a complete list of participating products, visit, nxp.com/productlongevity

COMPANY PUBLIC 9

Commitment to Product SupportOnline Technical Support Platform with 24/7 Access to Information & Expertise

Visit us https://nxp.com/MCU

https://community.nxp.com

COMPANY PUBLIC 10

NXP MCU Software and Enablement Overview

Connectivity Solutions

Evaluation Kits:

Comprehensive frameworks

and solutions for low-power,

connected, and secure

embedded systems

Runtime Software

Industry leading IDE support

and intuitive software

configuration tools to

accelerate application

development

Software

Development Tools

Low cost hardware platforms

for evaluation and application

development. Partner

solutions for hardware

debugging solutions

Hardware

Development Tools

Software frameworks and

development tools for targeted

applications and certified

connectivity solutions

Application Specific

Get started quickly and

get the support you

need, when you need it

Support

NXP Solutions: IDE / Toolchains:

• OOB Walkthroughs

• NXP Community

• Solution Designs

• Application Notes

• Schematics

RTOS, Middleware Partners:Partner Solutions

• Graphics• Cloud Connectivity• Voice activation• USB Audio• Touch HMI• Camera interface• ML/AI

802.15.4

Broad Market:

• Professional Support

• Professional Services

High Touch:

COMPANY PUBLIC 11

MCUXpresso SW and Tool Release Overview

• Dec 2018 Release:

SDK v2.5.0

• Support for current Kinetis, LPC,

i.MX RT, and i.MX (Cortex M)

devices

• New device support released

throughout year as required to

support device availability.

• Major semi-annual releases

include updated drivers,

middleware releases, and

improvements

• Comprised of three primary tools:

SDK, IDE,

and Config Tools

• Current release

Dec 2018

• Major releases targeted for

twice a year

(typically Q2 / Q4)

• Next major release date

scheduled for

Jun 2019

• Dec 2018 Release:

Config Tool v5.0

• Includes configuration for Pins,

Clocks, and Peripherals

• New device data and peripheral

support released throughout

year, tool will update when

connected online

• Major semi-annual releases

include new features, additional

peripheral support, and workflow

improvements

• Feb 2019 Release:

IDE v10.3.1

• Support for current Kinetis,

LPC, and i.MX RT devices

• Additional support for legacy

LPC devices

• Device support is included via

SDK releases.

• Major semi-annual releases

include updated eclipse

framework, compiler versions,

and performance

improvements

COMPANY PUBLIC 12

MCUXpresso Software and ToolsAdditional Resources

Web pages

• MCUXpresso Software and Tools – www.nxp.com/mcuxpresso

– MCUXpresso SDK: www.nxp.com/mcuxpresso/sdk

– MCUXpresso IDE: www.nxp.com/mcuxpresso/ide

– MCUXpresso Config Tools: www.nxp.com/mcuxpresso/config

Communities

• MCUXpresso Software and Tools – https://community.nxp.com/community/mcuxpresso

– MCUXpresso SDK: https://community.nxp.com/community/mcuxpresso/mcuxpresso-sdk

– MCUXpresso IDE: https://community.nxp.com/community/mcuxpresso/mcuxpresso-ide

– MCUXpresso Config Tools: https://community.nxp.com/community/mcuxpresso/mcuxpresso-config

Supported Devices

• Supported Devices Table (Community Doc)

COMPANY PUBLIC 13

Enabling the next wave of

Industrial & IoT applications

13

LPC5500

MCU Series

COMPANY PUBLIC 14

NXP’s LPC55S6x MCU Family

Single & Dual-core Arm Cortex-M33 MCU Series with TrustZone

and 40nm flash technology

• Ultra-efficient processing:

– As High as 755 CoreMarks1 and as low as 32uA/MHz2

– 10x improvement for signal processing & cryptography

• Numerous interfaces to sense, connect, control

• Enhanced safety and security

• MCUXpresso developer ecosystem

1: 2xCM33 @ 100MHz, 2: 1xCM33 @ 100MHz

COMPANY PUBLIC 15

Key Features and Comparisons

• Nearly 20% performance improvement over Cortex-M3 based MCUs

(over 60% vs Cortex-M0) with redesigned pipeline - up to two

instructions per clock cycle

• TrustZone for system-wide, secure resource isolation enabling

trusted runtime execution and physical protection in embedded MCU

applications

• Tightly coupled accelerators with coprocessor interface & extensions

(Arm’s single precision FPU along with NXP accelerators)

Cortex-M0+ Cortex-M23 Cortex-M3 Cortex-M4 Cortex-M33

DMIPS/MHz 0.95 0.98 1.25 1.25 1.50

CoreMark®/MHz 2.46 2.50 3.32 3.40 4.02

Prelim. Data from Arm for Cortex-M33 implementation at 40LP (9-track, typical 1.1v, 25°C)

NXP LPC5500 MCU Series

Industry’s ONLY Full ArmV8-M Implementation

COMPANY PUBLIC 16

NXP LPC5500 MCU Series

Leading Edge Performance Across Competing Solutions

• ’’Estimated by NXP

• ** source: http://www.eembc.org/coremark/index.php

0

1000

LPC55S6x STM32L5xx SAML11 STMF205xx'' STM32F405xx'' STM32L4xx

755**

100MHz†

32uA/MHz

84.54**

32MHz

25uA/MHz

557.76’’

168MHz

517uA/MHz

404.8**

120MHz

43uA/MHz

Coremark

Frequency

uA/MHz (Active)

427.25**

110MHz

60uA/MHz

398.4’’

120MHz

408uA/MHz

† Dual-core

Arm V8-M

Architecture

Cortex-M33

Cortex-M23

Cortex-M3

Cortex-M4

Core

Mark

s

COMPANY PUBLIC 17

HARDWARE PROTECTEDKEY STORE & DEVICE ID

SECURE BOOTMANAGER SECURE RUNTIME &

PHYSICAL PROTECTIONTRUSTZONE PROTECTED

RESOURCE ISOLATION PROTECTED DATAENCRYPTED FIRMWARE

SECURE DATAENCRYPTED COMMUNICATION

Ro

ot o

f T

rust

SECURE

DEBUGACCESS

CONTROL

Protecting end products from unexpected threats over their entire lifecycle

Expanding NXP’s MCUXpresso Software & Tools

• MCUXpresso Configuration Tools, now including TrustZone Configurator

• Flash programming command line tool (vcom/USB HID) including SRAM PUF key provisioning

(Blhost for Linux/Mac/Windows)

• Host-side command line/GUI tool to create and sign a secure flash image (elf2sb)

• Secure debug authentication & debug credential certificate generator tool

Third-Party Ecosystem to Reinforce Product Accessibility

• From Secure Product Development/Mastering/Provisioning to Programming/Deployment/Management

NXP LPC5500 MCU Series

NXP‘s Secure Execution Environment

COMPANY PUBLIC 18

LPC55S6x Product Block Diagram

ADC 16b 1MSPS

Arm Cortex-M33Up to 100 MHz

Secure DMA0Up to 22ch

SCTimer/PWM

RTC

5 x 32b Timers

Windowed WDTMulti-Rate Timer

Micro Timer

Clock Generation UnitOSCs, System PLL, USB PLL, Clock Out

Power ControlSingle Vdd power supply, POR, BOD,

reduced power modes – DCDC converter

AES-256FLASH

Up to 640KB

Programmable Logic Unit

6 input, 8 output

Arm Cortex-M33 Up to 100 MHz

TrustZone, MPU, FPU, SIMD

Core Platform

System Control

Secure DMA1Up to 10ch

Timers

Memory

RAMUp to 320KB

ROMBoot code

DSP

AcceleratorCrypto Engine

8 x FlexcommSupports UART, SPI, I2C, I2S

Interfaces

HS LSPI

HS USB + PHY

SDIO

FS USB + PHY

Analog

ACMP

Temp Sensor

Security

SHA-2

SRAM PUF PRINCE

RNG

PFR UID

Programmable Features

Secure Debug Auth.

Back to Roadmap

• High Efficiency

• Dual Core + Accelerators

• Advanced Security

• 10K RSL - $2.05- $2.69

Core Platform

• Up to 100MHz Cortex-M33

- TrustZone, MPU, FPU, SIMD

• Up to 100MHz Cortex-M33

• Coprocessors

- DSP Accelerator

- Crypto Engine

• Multilayer Bus Matrix

Memory

• Up to 640KB FLASH

• Up to 320KB RAM

• 128KB ROM

Timers

• 5 x 32b Timers

• SCTimer/PWM

• Muiti-Rate Timer

• Windowed Watchdog Timer

• RTC

• Micro Timer

Interfaces

• USB High-speed (H/D) w/ on-chip HS PHY

• USB Full-speed (H/D), Crystal-less

• SDIO, Support 2 cards

• 1 x High-Speed SPI up to 50MHz

• 8 x Flexcomms support up to 8x SPI, 8x I2C,

8x UART, 4x I2S channels (total 8 instances)

Advanced Security

• Protected Flash Region (PFR)

• AES-256 HW Encryption/Decryption

Engine

• SHA-2

• SRAM PUF for Key Generation

support

• PRINCE – Real-time

Encrypt/Decrypt for flash data

• Secure debug authentication

• RNG

Analog

• 2x 16b ADC, 16ch, 1MSPS

• Analog Comparator

• Temperature Sensor

Packages

• LQFP100, 14x14mm

• VFBGA98, 6x6mm

• LQFP64 or QFN64

Other

• Programmable Logic Unit

• Buck DC-DC

• Operating voltage: 1.8 to 3.6V

• Temperature range: -40 to 105 C

Subject to Change, NDA Required

COMPANY PUBLIC 19

LPC552x/S2x Product Overview

Subject to Change, NDA Required

• High Efficiency Cortex-M33

• Advanced Security

• Rich Integration

• 10K RSL - $1.63 - $2.21

ADC 16b 1MSPS

Arm Cortex-M33Up to 200 MHz

DMA0Up to 22ch

SCTimer/PWM

RTC

5 x 32b Timers

Windowed WDTMulti-Rate Timer

Micro Timer

Clock Generation UnitOSCs, System PLL, USB PLL, Clock Out

Power ControlSingle Vdd power supply, POR, BOD,

reduced power modes – DCDC converter

FLASHUp to 512KB

FPU, SIMD

Core Platform

System Control

DMA1Up to 10ch

Timers

Memory

RAMUp to 256KB

ROM (128KB)Boot code + USB driver

8 x FlexcommSupports UART, SPI, I2C, I2S

Interfaces

HS LSPI

HS USB + PHY(not on the smallest

device)

SDIO (not on the smallestt device)

FS USB + PHY

Analog

ACMP

Temp Sensor

Security

SRAM PUF PRINCE

eCRP RNG

PFR UID

Crypto Engine

Core Platform

• Up to 100MHz Cortex-M33

• Multilayer Bus Matrix

Memory

• Up to 512KB FLASH

• Up to 256KB RAM

• 128KB ROM

Timers

• 5 x 32b Timers

• SCTimer/PWM

• Muiti-Rate Timer

• Windowed Watchdog Timer

• RTC

• Micro Timer

Interfaces

• USB High-speed (H/D) w/ on-chip HS PHY

(not in the 128k version)

• USB Full-speed (H/D), Crystal-less

• SDIO, Support 2 cards (not in the 128k

version)

• 1 x High-Speed SPI up to 50MHz

• 8 x Flexcomms support up to 8x SPI, 8x

I2C, 8x UART, 4x I2S channels (total 8

instances)

Advanced Security

• Protected Flash Region (PFR)

• AES-256 HW Encryption/Decryption

Engine

• SHA-2

• SRAM PUF for Key Generation support

• PRINCE – Real-time Encrypt/Decrypt for

flash data

• Secure debug authentication

• RNG

Analog

• 16b ADC, 16ch, 1MSPS

• Analog Comparator

• Temperature Sensor

Packages

• LQFP100

• VFBGA98

• LQFP64

Other

• Buck DC-DC

• Operating voltage: 1.8 to 3.6V

• Temperature range: -40 to 105 C

COMPANY PUBLIC 20

NXP LPC5500 MCU Series

Roadmap

2018 2019 2020

COMMON PLATFORM ARCHITECTURE FOR COMPLETE SCALABILITY

AREA & PERFORMANCE EFFICIENT

100 MHz Cortex-M33

Up to 512KB Flash/256KB SRAM

SDIO

Security (‘S’ version)

Execution

Production

Proposal

Product

Samples

Planning

LPC55S6x

LPC55S1x/1x

100 MHz Cortex-M33

Up to 256KB Flash/96KB SRAM

Single CAN-FD

Trust Zone & Security (‘S’ version)

100 MHz Cortex-M33 (dual, PQ)

Up to 640KB Flash/320KB SRAM

SDIO

Trust Zone & Security (‘S’ version)

LPC55S2x/2x

Advanced

Efficiency &

Integration

Balanced

Entry

10Ku S/R is budgetary range; will vary for specific package/memory variants

Large Memory & Graphics

Analog & Motor Control

ArmCM7

ArmCM4

ArmCM33

ArmCM0+

COMPANY PUBLIC 21

NXP LPC5500 MCU Series

MCUXpresso Software & Tools EcosystemComplimentary with Extensive Support

Hardware Platform for Ease of Development

• On-board debug circuit

• PCB Layout, Schematic and Board Files Available

Simplify secure embedded development; Reduce time to market.

LPC5500 MCU Series

LPC55S69-EVK

COMPANY PUBLIC 22

NXP LPC5500 MCU Series

Highlights

Main Highlights of LPC5500

• World’s First General Purpose Cortex-M33 based MCU in the market Today

• Leading Performance Efficiency with 32uA/MHz in Active Mode

• PowerQuad DSP for math intensive functions

• Advanced security featuring TrustZone, SRAM PUF, real-time encryption/decryption, etc

• Pin and Software Compatibility across the LPC5500 MCU Series

• Robust Enablement with MCUXpresso Software & Tools

Start your Development Now! www.nxp.com/LPC55S69-EVK

COMPANY PUBLIC 23

Product Spotlight: i.MX RT Series

COMPANY PUBLIC 24

Ultra-low Power

Dynamic & Static

ARM v8/v8m + GPU/DSP

ARM v7/v7m + 2D/3D

ARM v7m + Audio

i.MX 6UL/ULL

i.MX 6DQ+

i.MX 8

i.MX 8M

i.MX 8X

i.MX RT

i.MX 7ULP

Scalability of Embedded Processing: The New Normal

COMPANY PUBLIC 25

• ARM Cortex-A class

and Cortex-M cores

• 600 MHz to 2 GHz performance

• Rich HMI experience

• Full open-source OS platforms

APPLICATIONS PROCESSORS

i.MX

MCUs

KINETIS & LPC

• ARM Cortex-M cores

• Performance

up to 300 MHz

• Embedded memory

• Easy to use tools

• RTOS support

Best of

Both Worlds

COMPANY PUBLIC 26

CROSSOVER PROCESSORS

i.MX RT

• Arm Cortex-M cores (v7m/v8m)

• Up to GHz performance

• DSP & Co-processor Acceleration

• High integration

• Deterministic instructions

• Short latency

• Easy to use tools

• RTOS support

26

COMPANY PUBLIC 27

i.MX RT Series Key Highlights

High Performance

Real-time Processing• Cortex-M7 up to 1GHz (RT1xxx)

(50% faster than current existing M7 products)

• Cortex-M33 up to 275MHz with Trust Zone

(RT6xx/5xx)

• Up to 600MHz DSP and other co-processor

accelerators (RT6xx/5xx)

• Up to 5MB On Chip SRAM

High Level

of Integration

• High Security enabled by AES-256, HAB and

On-the-fly QSPI Flash Decryption

• 2D graphics acceleration engine with Parallel &

MIPI DSI/CSI

• LCD display controller up to WXGA (1366x768)

• Digital microphone and I2S interfaces for

multichannel, high performance audio and voice

• Up to 3x Ethernet and 3x CANFD

Low BOM Cost

• Competitive Pricing

– starting @ $0.99 100K RSL

• Fully integrated PMIC with DC-DC

• Low cost packages enabling 4 layer (BGA) & 2 layer

(LQFP) PCB design

• Quad/Octal Serial and SDRAM interface

Easy to Use• MCU customers can leveraging their current

toolchain (MCUXpresso, IAR, Keil)

• Rapid and easy prototyping and development with

NXP FreeRTOS, SDK, ARM mbed and the

global ARM ecosystem

• Single voltage input simplifies power circuit design

• Scalability to LPC, Kinetis & i.MX products

COMPANY PUBLIC 282017 2018 2019

1MB

512KB

256KB

600MHz Cortex-M7, 32K/32K L18/16-bit EMI (SDRAM/SRAM)

LCD / CSI / 2D acceleration

Standard Security

i.MX RT1050

LQFP144 LQFP100

BGA196

Arm

CM7

Arm

CM3

3

VFBGA

176

>250 MHz Cortex-M33 with TrustZoneAdvanced Audio Integration

Advanced Security, SRAM PUF, root of trust

4…5MB SRAM for IoT Stacks and Algorithms

2MB

3 – 5

MB

Inte

gra

ted

SR

AM

Execution

Production

Proposal

Product

Samples

Planning

i.MXRT600General-

purpose

MCUsP

erf

orm

an

ce

600MHz Cortex-M7, 32K/32K L18/16-bit EMI (SDRAM/SRAM)

LCD / CSI / 2D acceleration

Standard Security

i.MX RT1060 i.MX RT1064

i.MX RT1020

Cortex-M7, 16K/16K L1

256KB SRAM, 16-bit EMI (SDRAM/SRAM)

Standard Security

LQFP100

i.MX RT1010

LQFP80

BGA196

Cortex-M7, 32K/32K L11MB SRAM, 4MB Flash

8/16-bit EMI (SDRAM/SRAM)

LCD / CSI / 2D acceleration

Standard Security

Cortex-M7, 16K/16K L1128KB SRAM, 1x QSPI

Standard Security

Cortex-M7, 16K/16K L1128KB SRAM, 1x QSPI

Standard Security

800MHz Cortex-M7, 32K/32K L18/16-bit EMI (SDRAM/SRAM)

2D graphics acceleration, MIPI DSI/CSI

Automotive, TSN, Security

i.MX RT1170

BGA289

i.MX RT1015

NXP 32-bit Arm based MCUs

i.MX Series MCU Roadmap | High Performance

COMPANY PUBLIC 29

Arm® Cortex®-M7

Security

Secure JTAG

PLL, OSC

FPU

6 x GP Timer

4 x FlexPWM

ADC / DAC

2 x ADC (16-ch.)

eDMA

512KB TCM/OCRAM

32 KB D-cache

Connectivity

2 x eMMC 4.5/SD 3.0

8 x UART

Power Mgmt

4 x Watch Dog

Temp Monitor

NVIC

32 KB I-cache

External Memory

2 x Dual-Channel Quad-SPI

with Bus Encryption Engine

4 x I2C

S/PDIF Tx/Rx

3 x I2S/SAI

2 x FlexIO

2 x 10/100 ENET

with IEEE 1588

2 x USB2.0 OTG

with PHY

2 x FlexCAN + CANFD

4 x SPI

8 x 8 Keypad

MPU

Internal Memory

96KB ROM

512 KB SRAM

4 x ACMP

DCDC & LDO

4 x QuadTimer

4 x Quadrature ENC

External Memory Controller

8/16-bit SDRAM

Parallel NOR Flash

NAND Flash

System Control Main CPU Platform

Core

IOMUX

HABCiphers & RNG Secure RTC eFuse

Multimedia

8-/16-bit Parallel Camera Interface

24-bit Parallel LCD (RGB)

Pixel Processing Pipeline (PXP)

2D Graphics Acceleration

Resize, CSC, Overlay, Rotation

HS_GPIO FlexIO

Available on certain product families

High Performance Real Time system

• Cortex-M7 up to 600MHz , 50% faster than any other existing M7 products

• 20ns interrupt latency, a TRUE Real time processor

• 512KB SRAM + 512KB TCM/OCRAM

Rich Peripheral

• Motor Control: Flex PWM X 4, Quad Timer X 4, ENC X 4

• 2x USB, 2x SDIO, 2x CAN + 1x CANFD, 2x ENET with 1588, 8xUART, 4x SPI, 4X I2C

• 8/16-bit CSI interface and 8/16/24-bit LCD interface

• 2x Qual-SPI interface, with Bus Encryption Engine

• Audio interface: 3x SAI/ SPDIF RX & TX/ 1x ESAI

Security

• TRNG&PRNG(NIST SP 800-90 Certified)

• 128-AES cryptography

• Bus Encryption Engine: Protect QSPI Flash Content

Specifications

• Package: MAPBGA196 | 10x10mm^2, 0.65mm pitch (130 GPIOs)

MAPBGA196 | 12x12mm^2, 0.8mm pitch

• Temp / Qual: -40 to 105°C (Tj) Industrial / 0 to 95°C (Tj) Consumer

Ease of Use

• MCUXpresso with SDK, IAR, Keil

• FreeRTOS

• Comprehensive ecosystem

Low BOM Cost

• Competitive Price

• Fully integrated PMIC with DC-DC

• QSPi and SDRAM interface

NXP 32-bit Arm based MCUs – High Performance

i.MX RT1060: Block Diagram

COMPANY PUBLIC 30

i.MX RT1010: The Most Cost Efficient Crossover Processor

✓1/2 of the competitors Cost, and even less− $0.99 for volume production

✓2x of the competitors Performance, and even more− Up to 500MHz frequency

− 128KB SRAM/TCM

− HS USB OTG, I2S, FlexPWM, etc

✓Feature Improvement− OTFAD for high performance on-the-fly decryption

− Bug fixes

Breaks the $1 barrier, enables RT series to compete in the main stream low

cost MCU market.

NDA REQUIRED, SUBJECT TO CHANGE

COMPANY PUBLIC 31

High Performance and Integration

• Cortex-M7 up to 500MHz with 16KB/8KB I/D cache

• High Speed USB with PHY

• Security (On-The-Fly FlexSPI decryption)

• Rich Audio features

Low cost and easy to develop

• Starting from $0.99 @ 100Ku

• LQFP Packages enable low cost 2-layer PCB design

• Integrated power management module reduces complexity of external power supply

• FreeRTOS with SDK

• MCUXpresso / Keil / IAR

Specifications• Package: 80LQFP, 12x12, 0.5p• Temp / Qual: -40 to 105°C (Tj) Industrial

0 to 95°C (Tj) Consumer

Arm® Cortex®-M7

Security

Secure JTAG

PLL, OSC

FPU

3 x GP Timer

1 x FlexPWM

ADC

1 x ADC (15-ch.)

eDMA

Up to 128KB TCM

8 KB D-cache

Connectivity

4 x UART

Power Mgmt

4 x Watch Dog

Temp Monitor

NVIC

16 KB I-cache

External Memory

Dual-Channel Quad-SPI

with On-The-Fly Decryption

2 x I2C

S/PDIF Tx/Rx

2 x I2S/SAI

FlexIO

USB2.0 OTG

with PHY

2 x SPI

4 x 4 Keypad

MPU

Internal Memory

64KB ROM

128KB SRAM/TCM DCDC & LDO

System Control Main CPU Platform

Core

IOMUX

Ciphers & RNG Secure RTC eFuse HAB

NDA REQUIRED, SUBJECT TO CHANGE

NXP 32-BIT ARM BASED MCUS – HIGH PERFORMANCE

i.MX RT1010: Block Diagram

COMPANY PUBLIC 32

i.MX RT1170 Key Differentiation

1GHz Cortex-M7

with 512KB TCM

Over 5000 Coremark

28nm FD-SOI Process

Optimized for both active

power & leakage power

High Performance

High-Performance Crypto

Tamper Detection

On-The-Fly Memory

Encryption & Decryption

Secure Boot

Up to 2MB SRAM

High-speed ADC, DAC

1Gbps Ethernet

MIPI CSI / DSI

Advanced Security Rich Feature Set Low Power

COMPANY PUBLIC 33

i.MX RT1170: The State-of-Art Implementation of Cortex-M7

World’s Fastest Cortex-M7

• Up to 1GHz frequency

• 2080 DMIPS, 5033 Coremark

Fast Interrupt

• 12nm interrupt latency

• Up to 220 interrupt sources

• Up to 4 interrupt level

Best Power Efficiency

• Less than 100uA/MHz power consumption

• DVFS support for low power operation

Highly Reliable

• ECC support on L1 Cache

• ECC support on TCM

Large L1 Cache

• 32KB I-Cache

• 32KB D-Cache

Configurable TCM

• 512KB TCM, configurable as ITCM or DTCM

• Zero-Wait-Cycle Access

Floating Point

• Support single- and double-precision FPU

• VFPv5 architecture

MPU

• Up to 16 regions

COMPANY PUBLIC 34

** source: http://www.eembc.org/coremark/index.php* see manufacturer’s website for pricing

0

1000

2000

3000

4000

5000

6000

i.MX RT1170 i.MX RT1050 STM32H7* STM32F7* SAM70* PIC32MZ*

2.5x – 7x better than competition

5033†

1GHz

2020**

400MHz

1082**

300MHz

1500**

300MHz

710**

200MHz

Coremark

Frequency

3020†

600MHz

† NXP calculation

Comparing Leading MCUs for Coremark

NXP MCUs

COMPANY PUBLIC 35

Specifications• Process: SEC 28FD-SOI

• Core Voltage: 1.0V

• Package: MAPBGA289, 14x14mm, 0.8mm pitch

• Temperature: -40C to 125C (Tj)

Key Features and Advantages• ARM Cortex-M7 processor, 1 GHz, 32KB/32KB L1 Cache, 512KB TCM

• ARM Cortex-M4 processor, 400MHz, 16KB/16KB L1 Cache, 256KB TCM

• 2MB on-chip SRAM (including TCM for CPU core)

• Parallel LCD Display up to WXGA (1280x800)

• 8/16-bit Parallel Camera Sensor Interface

• 2-lane MIPI CSI and 2-lane MIPI DSI

• 2D Graphics Acceleration & OpenVG Acceleration

• 8/16/32-bit SDRAM controller up to 200MHz

• 8/16-bit Parallel NOR FLASH / NAND FLASH / PSRAM

• 2x QSPI NOR FLASH / HyperRAM / HyperFLASH Interface

• 2x eMMC 5.0/SD 3.0/SDIO Port

• 2x USB 2.0 OTG, HS/FS, Device or Host with PHY

• Audio: 4x I2S/SAI, 1x S/PDIF Tx/Rx, ASRC, digital microphone input

• 3x ENET: 10/100 ENET w/ IEEE 1588 + 1Gbps ENET w/ AVB + 1Gbps ENET w/ TSN

• 2x 12-bit ADC, 2Msample/s, up to 20 input channels total

• 4x Analog comparator, 1x DAC

• Full PMU Integration, DCDC+LDOs

• Secure Boot, TRNG, RSA4096, Tamper Detection, Secure Key Storage

Enablement• MCUXpresso, FreeRTOS with SDK

i.MX RT1170

Secondary CPU Platform

System Control

ARM Cortex-M4

Security

Secure JTAG

PLL, OSC

FPU

High Resolution Timer

GP Timer x6

FlexPWM x4

ADC / DAC

HSADC x2 (20-ch)

eDMA x2

256 KB TCM

16 KB D-cache

Multimedia

Connectivity

eMMC 5.0 / SD 3.0 x2

UART x12

Power Mgmt

Watch Dog x4

Temp Monitor

NVIC

16 KB I-cache

External Memory

Parallel LCD

Parallel CSI

I2C x6

ASRC

S/PDIF Tx/Rx

1Gbps ENET x1

w/ TSN

USB2.0 OTG

w/ PHY x2

CAN-FD x3

I2S/SAI x4

Secure RTCTRNG HABeFuse

MPU

Internal Memory

256KB ROM

2MB SRAM/TCM

ACMP x4, DAC x1

2D Graphics Acceleration (PXP)

Resize, CSC, Overlay, Rotation

DCDC & LDO

QuadTimer x4

Quadrature ENC x4

AES-128/256RSA4096 Tamper DetectionDES/3DES

10/100 ENET x1

w/ IEEE 1588

Dual Channel QSPI FLASH x2HyperRAM / HyperFLASH

External Memory Controller8/16/32-bit SDRAM

NAND/Parallel NOR Flash

MIPI DSI

MIPI CSI

SDIO Slave

SPI x6

Main CPU Platform

ARM Cortex-M7

FPU

512KB TCM

32 KB D-cache

NVIC

32 KB I-cache

MPU

EMVSIM x2

OpenVG 1.1 Acceleration

1Gbps ENET x1

w/ AVB

8-ch Digital Mic Input

8x8 Keypad

Subject to Change, NDA Required

NXP 32-BIT ARM BASED MCUS – HIGH PERFORMANCE

i.MX RT1170: Block Diagram

COMPANY PUBLIC 36

NXP MCUs Optimized for Graphical Interfaces

i.MX RT1050Cortex-M7

512KB SRAM

8/16-bit EMI (SDRAM/SRAM)

LCD Interface and 2D acceleration engine

LPC546xxCortex-M4

200KB SRAM, 512KB Flash

Up to 32-bit EMI

LCD Interface

LPC540xx/S0xxCortex-M4

360KB SRAM

Up to 32-bit EMI

LCD Interface

K27/K28Cortex-M4

1MB SRAM, 2MB Flash

32-bit SDRAM controller

4x SPI / 32-ch FlexIO

* Recommended platforms for graphics applications – does not include all device families that are enabled for graphics applications

LPC5411xCortex-M4

192KB SRAM, 256KB Flash

Low-Power Flexcomm Interface

Entry Level UI Advanced UI

Low

Co

st M

CU

Hig

h P

erf

orm

ance

MC

UM

ain

str

eam

MC

Ui.MX RT106x

Cortex-M7

1MB SRAM + 4MB Flash on RT1064

8/16-bit EMI (SDRAM/SRAM)

LCD Interface and 2D acceleration engine

COMPANY PUBLIC 37

i.MX RT Graphics Software SolutionsL

ow

Cost

MC

UH

igh

Pe

rfo

rma

nce

MC

UM

ain

str

ea

m M

CU

NXP emWin

Entry Level UI Advanced UI

COMPANY PUBLIC 38

NXP i.MX RT MCU Alexa Voice Service (AVS) Solution

• First MCU-based AVS development kit

• Targets smart home for Alexa built-in

• Enables significantly lower cost

• Turnkey design shortens time-to-market

• Availability − Now (limited access)www.nxp.com/mcu-avs

COMPANY PUBLIC 39

Alexa Voice Service Features ComparisonFeature AVS (MCU) AVS (MPU) AVS Multimodal

Dialogs (inc. multiturn) ✓ ✓ ✓

Alerts ✓ ✓ ✓

Skills & 3rd Party Skills ✓ ✓ ✓

Kindle ✓ ✓ ✓

Audible ✓ ✓ ✓

Notifications ✓ ✓ ✓

Routines ✓ ✓ ✓

Shopping ✓ ✓ ✓

Alexa announce 1Q19 ✓ ✓

Alexa messaging 1Q19 ✓ ✓

Alexa Calling 2Q19 ✓ ✓

Video calling X X ✓

Amazon Music 64 kbps 256 kbps 256 kbps

iHeart Radio, Pandora, TuneIn 1Q19 ✓ ✓

Spotify X ✓ ✓

Multiroom music & Bluetooth sync X ✓ ✓

Basic GUI X X ✓

Rich Interactive GUI X X ✓

Amazon Video X X ✓

$ $$ $$$

NXP AVS for MCU

Solution on i.MX RT106A

NXP i.MX 8M

Development Kit for AVS

NXP Smart Display Solution

on i.MX 8M Mini for

AVS Multimodal with

Facial Recognition

COMPANY PUBLIC 40

What is eIQ?

eIQ is a software platform for NXP microprocessors and microcontrollers to do inference of

models on embedded systems

• Tools currently under development include:

− Inference engines: Arm NN, OpenCV, Arm CMSIS-NN, TensorFlow Lite, and more

▪ May require converting a pre-trained model into a format that eIQ supports

− End-to-end example applications demonstrating typical customer use-cases (e.g. camera inference

engine)

− Support for emerging neural net compilers like GLOW

− Suite of classical ML algorithms such as support vector machine (SVM) and random forest

− Supported tools and application examples will differ between i.MX apps and i.MXRT

• eIQ will eventually be integrated as middleware into standard NXP Yocto and MCUXpresso SDK releases

• End goal is to enable customers to develop embedded applications that can utilize machine learning models

COMPANY PUBLIC 41

Inference Engines Middleware

ML Platform:

Hardware Abstraction Layer

OpenCLArm® Compute Library Custom API

ML Platform

Direct

Interface NN Compiler Technology

GLOW

eIQ Application Examples

Facial

Recognition

Voice

RecognitionObject

Detection

Open Source Inference

OpenCV/DNN Arm NN

Android NN TensorFlow LiteCMSIS-

NN

Tensorflow

Open VX

Anomaly

Detection

eIQ Machine Learning Software Development Environment

Cortex®-M Cortex®-A GPU DSP ML Accelerators

Hardware Layer

Available Today Planned

COMPANY PUBLIC 42

Product Spotlight: K32 MCU

Series

COMPANY PUBLIC 43

Introducing K32 MCU Series

Secure, Low-power edge/end nodes

based on Arm® Cortex®-M combining

Low Power Optimizations

• Exceptional Sleep Currents

• Fast Wake-up

High Performance Mixed-Signal

• Power Optimized Analog Integration

Advanced Security & Protection

• Physical Tamper

• Authenticate Boot

• Crypto Acceleration

COMPANY PUBLIC 44

NXP Ultra-low Power Roadmap/Evolution/Ambition

Roadmap plans subject to change

K & KL MCUs

NOW

K32 L2/L3 MCUs

2H 2019

K32 L4 MCUs

2021

• 90nm Kinetis K & KL MCUs (+KE/KV/KM)

• Broad scalable solutions

• Optimized for higher performance

• Flexible Power Modes

• Rich Analogue Integration

• Scalable Security

Plus

• Reduced run current by 50%

• Flexible Data Retention in stop modes

• Lower Power Analogue

Plus

• Higher density memories @

optimized price points

• Best in class Run Time current

consumption & improved leakage

• Optional Sentinel Security Black Box

• Extended Analogue Integration

COMPANY PUBLIC 45

K32 L4

2019

Execution

Production

Proposal

Product

Samples

Planning

2020

K32 L3 A60

K32 L2 A31/A41

NXP K32 L MCU Series

Roadmap

72 MHz Cortex-M4

Dual Core with 72 MHz Cortex-M0+

1.25MB Flash, 384KB SRAM

Enhanced Security

96 - 128

KB

16 – 32

KB

256

KB

384

KB

Inte

gra

ted S

RA

M

Po

we

r O

pti

miz

ed

72 MHz Cortex-M4

512KB-1MB Flash, 256KB SRAM

Enhanced Security

72 MHz Cortex-M0+

256-512KB Flash, 128KB SRAM

Baseline Security

48 MHz Cortex-M0+

64-256KB Flash, 32KB SRAM

Standard Protection

96 MHz Cortex-M33

1MB Flash, 256KB SRAM

Advanced Security w/ TZ

K32 L3 B50

72 MHz Cortex-M0+ Dual Core

256-512KB Flash, 128KB SRAM

Baseline Security

ArmCM7

ArmCM4

ArmCM33

ArmCM0+

K32 L2 B11K32 L2 B21

K32 L2 A40

K32 L2 B31

COMPANY PUBLIC 46

K32 L2Cortex-M0+

K32 L3Cortex-M4

K32 L4Cortex-M33

MemoryFrom 64KB to 512KB Flash

16KB to 128KB SRAM

From (512KB) to 1.25MB Flash

(256KB) to 384KB

1MB Flash; 256KB

(planning expansion)

Analog Advanced Power Optimized Advanced

Power Mgmt. Internal LDO Internal LDO & DC-DC Internal LDO & DC-DC

Second Core /

Core Ind.

Peripheral

Cortex-M0+;

FlexIO

Cortex-M0+;

FlexIO

N/A;

FlexIO

Security Standard/Baseline EnhancedAdvanced with

Secure Enclave

K32 L Series Overview

(planning expansion)

Continuous Improvement in Power/Leakage & Security

COMPANY PUBLIC 47

K32 L3 SeriesNXP’s Most Energy Efficient Cortex-M4 and optional Cortex-M0+ MCU with

Advanced Security

• 50% decrease in run current and 80% decrease in

wake-up time from deep sleep over 2nd generation of

Kinetis

• Choice M4/M0+ dual core or M4 only to optimize low

power use cases

• Improved security with advanced crypto, secure boot

and update capability, plus physical tamper

• MCUXpresso Ecosystem with HW & SW scalability

COMPANY PUBLIC 48

Mode DescriptionK22F

90nm

K32 L3

90nm

LPC 55

40nm

Active2 All units are active and powered218.75 uA/MHz

(LDO)

72.90 uA/MHz(DCDC)

32.40 uA/MHz(DCDC)

Sleep (Wait) CPU clock is halted but logic is still powered 9,300 uA 2,103 uA -

Deep Sleep (LLS) All SRAM available3 3.8 uA(128K)

3.85 uA(384K)

110 uA(320K)

Power Down (VLLS2/3) Full SRAM retention3 2.8 uA(128K)

3.68 uA(384K)

15.4 uA(320K)

Deep Power Down (VLLS2/3)

With RTC running and part of SRAM retained4 2.26 uA(32K)

3.18 uA(8K)

0.790 uA(4K)

Deep Power Down(VLLS2/3)

All peripherals off, part of SRAM retained4 1.90 uA(32K)

2.37 uA(8K)

0.590 uA(4K)

NXP K32 L3 SERIES

Continuous Improvement in Energy Efficiency

COMPANY PUBLIC 49

Mode DescriptionK22F

90mm

K32 L3

90nm

LPC 55

40nm

Deep Sleep (LLS) All SRAM available3 6 us(128K)

7.2 us(384K)

100 us(320K)

Power Down

(VLLS2/3) Full SRAM retention3 80 us(128K)

13.1 us(384K)

325 us(320K)

Deep Power Down

(VLLS2/3)

With RTC running and part of SRAM

retained4

80 us(32K)

13.1 us(8K)

15,000 us(4K)

Deep Power Down

(VLLS2/3)

All peripherals off and part of SRAM

retained4

80 us(32K)

13.1 us(8K)

15,000 us(4K)

1. STM32L5 DS is not available now. 2. K22F and STM32L5 are powered by on chip LDO. K32L3, LPC5500 and K32L4 are powered by on chip DCDC.3. 128 KB for K22F,384KB for K32L3, 320KB for LPC5500. 256KB for K32L4,256KB for STM32L54. 32 KB for K22F, 8KB for K32 L3, 4KB for LPC5500, no RAM for K32L4 and STM32L55. STM32L5 Stop2 mode is close to K32L4 deep sleep mode, and Standby mode is close to K32L4 deep power down mode. 6. 32K OSC and 32K FRO power consumption is 200nA. The power can be saved when RTC is disabled.7. K32L4 wake up time from Power Down and Deep Power Down mode doesn’t include ROM boot time.

NXP K32 L3 SERIES

Comparison of Wake Up Times

COMPANY PUBLIC 50

• Authenticated Boot

• Authenticated and Encrypted Firmware Update

• “Root of Trust” with RSA 2048/4096-bit public key signed certificates that can be revoked

• One Time Programmable (OTP) public key hash

Trust

The assurance that the device is authentic and remains

uncompromised

• Symmetric - AES128/192/256, DES/3DES

• Asymmetric - RSA and ECC,

• Hashing - SHA 256

• True Random Number Generator with 512bits of entropy

• Encrypted Key BLOB function for persistent key storage

Crypto

The science of keeping communications and data

confidential

• Crypto secure memory and keys are wiped on “Tamper Event”

-> external switches or protection mesh tripped

-> debug is attempted

-> clock stuck high or low

-> software initiated

Physical Tamper

The proactive monitoring of physical attacks on the device

NXP K32 L3 SERIES

Continuous Improvement in Security

COMPANY PUBLIC 51

K32 L3 Series OverviewCore Platform

• Cortex-M4F core up to 72 MHz

• Cortex-M0+ core up to 72 MHz (optional)

Memory

• Up to 1.25 MB FLASH

• Up to 320 kB RAM

• 48 kB ROM

High Security (optional on M4 only version)

• Cryptographic Acceleration Engine– Secure Key Storage

– Public Key (ECC)

– Symmetric (AES)

– Hashing (SHA-256)

• Standalone True Random Number Generator

• Resource Domain Controller (dual core only)

• Built-in Secure Boot

• Up to 4 x Tamper pins

Interfaces

• USB 2.0 Full-speed controller and transceiver

• 1 x 32ch FlexIO supporting emulation of UART, I2C, SPI,

I2S, Camera IF, LCD RGB, PWM/Waveform generation

• Up to 4 x low power UART

• Up to 4 x low power I2C

• Up to 4 x 16-bit low power SPI

• 1 x EMVSIM module supporting the ISO-7816

• 1 x Serial Audio Interface (SAI)

• 1 x Secure Digital Hardware Control (SDHC)

• Parallel External FlexBus Interface (RAM, ROM, simple

slave devices)

Analog

• 1 x 12-bit ADC

• Up to 2 x Low power comparator with 6-bit DAC

• 1 x 12-bit low power DAC

• Dual output DC/DC Convertor

• 1.2V / 2.1V dual-range voltage reference

Timers

• Up to 2 x 6 ch., 2 x 2 ch. Timer/PWM Modules

• Up to 2 x 4 ch. Low Power Programmable

Interrupt Timer

• Up to 3 x Low Power Timers

• Real Time Clock (RTC)

• 1 x 56-bit Timestamp

Packages

• 176 VFBGA, 9mm x 9mm x 0.86mm, 0.5mm

pitch (K32L3A60VPJ1A)

LP ADC

(12-bit)

Arm Cortex-M4FUp to 72 MHz

External

Watchdog

LPIT 2x

(4 Channel)

Flash Access

ControlFLASH

Up to 1.25MB

DSP, sFPU, NVIC, SysTick

Core Platform

System

Watchdog

Timers

Memory

RAMUp to 384kB

Boot ROM48 kB

Communication and HMI

InterfacesEMVSIM External Bus

Analog

LP CMP 2x

Security

Clocks

Arm Cortex-M0+Up to 72 MHz

Division, Square Root, NVIC, Systick

System PWR

Management

Low-Leakage

Wake-Up

System CLK

Generator

Peripheral

CLK CTRL

DMATrigger

Multiplexer

Random NUM

Generator

CAE Tamper

CRCResource

Domain CTRL

LPTMR 3x

(32-bit)

TPM 2x

(6 Channel)

TPM 2x

(2 Channel)

Time Stamp

TimerReal-Time Clock

FlexIO GPIO

LP I2C 4x SAI

SDHC LP SPI 4x

LP UART 4x USB

DAC

(12-bit)

Dual Output

DC/DC

Battery MonitorTemperature

SensorLP RTC OSC32.768 kHz

IRC48 MHz

IRC 8 / 2 MHz

LP FLL (120 / 96 / 72/ 48 MHz)

OSC 26 / 32 MHz

Optional

• Low-Power & Low-Leakage

• Cortex-M4 + Cortex-M0

• Improved Security

COMPANY PUBLIC 52

Summary

COMPANY PUBLIC 53

NXP 32-bit Arm Cortex

MCUs

• Leading MCU supplier with 1000+ Arm-based MCUs

• Scalable portfolio ranging in performance, power, memory size, and packaging options

• Targeted solutions for key vertical markets

• Unified software with MCUXpressoand broad ecosystem support for easy development

• Best-in-class commitment to product longevity

COMPANY PUBLIC 54

Together With Our Valued Customers,

We Are Creating Secure Connections for a Smarter World

Contactless

Transport Card

Access Solutions

Micro-payments

Enhanced Security

Mesh Connectivity

Sensors

Smart LED Lighting

Gateway & Cyber Security

Access

Manufacturing Automation

Temperature Monitoring

Machine Diagnosis & Control

Remote Asset Control

Fleet TrackingSmart Parking

Smart Roads

Traffic Congestion

Smart Lighting

Waste Management

Cloud Computing

Gateways

Routers & Switches

Security Appliances

Wireless Base Stations

Smartphones

Smart Watch

Activity Tracking

Smart Glass

Hospital & at-home Patient Monitoring

Fall Detection

Personal Health & Fitness Monitoring

Distribution

Energy Consumption & Monitoring

Water Pressure Measurement

e-passport

Smart eID

Health Card

Car Entertainment

In-vehicle Networking

Car Access

Car2X and Radar

Secure Bank Cards

Mobile Transactions

Loyalty- Reward

RFID Tags/Labels

Supply Chain Monitoring

NFC Readers

NXP and the NXP logo are trademarks of NXP B.V. All other product or service names are the property of their respective owners. © 2019 NXP B.V.