AMICRA follows a policy of continuous product improvement. Specifications are subject to change without notice.Version July 2017

NANO Technical Information

0.1mm to 25mm, larger component size possiblesilicon die, laser diode, VCSEL, optical lens, etc.wafer film frame, hoop/grip ring, waffle packs, GelPaks, custom traysvery small submounts to 300mm wafer substrate silicon die, AIN, ceramic, laminate, PCB, wafers, custom fixtures, etc.die Sort, Epoxy, In-situ Eutectic, Mass Reflow FC, In-situ FC, In-situ UV, C2W, C2C, C2S, etcfully automatic with manual load and unload of components and substrates

component size range component typescomponent presentation typessubstrate size rangesubstrate types

bond processes

automated operation

function

X axis positioning

Z axis

XY axis

range of XY axis

XY axisrange of XY axis

function

rotation axisbond force

touch sensor

needle systems

ejection needle type

ejection heightejection speed

base machine construction

ESDclean room inside

moves bond head from source side (component presentation) to destination side (bond station)linear motor driven, high velocity & acceleration; non-contact linear encoder, resolution 0.1µmAC servo drive, noncontact linear encoder, resolution 0.1µm

granite base, linear motor drive, open-frame design

300 x 300 mm (up to 12 inch wafer)

AC motor driven, open-frame design 300 x 300 mm (up to 12 inch wafer)

design for dynamic component positioning;high accuracy positioning; bond force control360°, resolution 0.001°programmable, 3g up to 2000g based on tool holder designdetermines first mechanical contact between chip and substrate

single or multi-needle system according to component size and wafer typesupport piercing and non-piercing needles, other needle configurations are available upon requestprogrammable height and delaysprogrammable

granite construction mounted on a steel frame with integrated vibration damping systemintegrated ionizers and basic ESD design practicesintegrated HEPA fi ltering system

BOND HEAD TRANSFER SYSTEM

BOND STATION

COMPONENT PRESENTATION

BOND HEAD

EJECTION SYSTEMS

size (WxDxH), weightvacuumcompressed airprocess gaselectrical power ratingsambient temperaturerelative humidity

1690 x 1430 x 2040mm (+384 sig. tower), 2000 kgnegative 0.8 bar5.5 bar dry and oil-free clean airair, nitrogen, forming gasstandard voltage: 400 V, will accommodate other voltage per facility18 to 25 ˚C; non-condensing

various tooling for substrate and component presentationUV cure unit located at bondwafer heatersprocess gasceramic heatersheated bond toolfl ip chip unitautomatic substrate loader for waferswafer and substrate mapping optionsbar code, 2D code scanners and OCRsingle component tracking

function

technique

max. output power

temperature

pulse time

for fast eutectic bonding with closed-loop controlled heat profilesfiber-coupled high power laser-diode with focusing optics and integrated pyrometer 100 W custom power available upon request

programmable range: up to 450° C depending on the substrate materialseasy programmable profile controlled by power, temperature and time

ENABLING THE DIGITAL WORLD

ASM AMICRA‘s die bonding technology was specifi cally designed to serve the photonic assembly market by providing the ultimate placement accuracy while supporting a high speed AuSn eutectic bonding process. ASM AMICRA has been perfecting this technology for almost 20 years, developing high resolution imaging systems to support the dynamic alignment system, implementing a fi ber laser to be used as the primary heat source for AuSn eutectic bonding, high resolution motion control systems mounted on a granite structure with a special vibration damping system. The principle design of this vision driven die bonder is to mount all 4x imaging systems in fi xed positions, mounted to granite, while all other motion control systems move around the vision cameras. This fundamental design concept produces the highest precision placement accuracy die bonder in the industry today.

18 seconds depending on configuration and application±0.3µm @ 3sigma depending on configuration, application and material quality. Verifiable via Cmk glass board test>95% uptime

general cycle time placement accuracy

machine availability

OTHER

vision enginefour imaging systems

component placementfocusingrecognition methods

pattern/recognition

COGNEXcomponent presentation station, bond station, downward looking and upward lookingpre-bond, bond and post bondprogrammable and automaticstandard vision tools, special filters for micro struc-tures, access to COGNEX library of vision algorithmsprogrammable windows and models. High level of flexibility to allow the customer to create custom vision solutions programmable LED, RGB, and white light illumination

dispensing pump function

dispensing pump options

dispensing technique

additional supported dispensing processes

located at bond, substrate height is determined by the vision system, auto needle off-set adjustment, pre-dispense stage, etctime-pressure-vacuum, Musashi time-pressure-vacuum, Techcon auger/spindle pump, jet pump

programmable operation from dots to complete snow flake patterns including UV dispensedie dipping, pin transfer, stamping, flux dipping

controloperating systemprogrammingoperator interfacedata transfer

multi axis controllerwindows 7keyboard & graphic display/touch displaygraphic menu driven, EnglishEthernet TCP/IP, electronic connection: 10 Base T, 10-Mbit/s

ENABLING THE DIGITAL WORLD

Overview

Performance

Equipment

Laser Soldering System

Image Recognition

Other Available Options (not limited to this list)

Man Machine Interface/GUI

Dimensions/ Power ratings

Dispensing Systems

ASM AMICRA Microtechnologies GmbHMarie-Curie-Str. 693055 Regensburg, GermanyTel. +49 941 208 209 0 (Global/Europe) +1 678 431 7021 (North America- East) +1 714 873 4155 (North America- West) + 65 9030 9738 (Asia)Fax +49 941 208 209 999sales.amicra@asmpt.com

www.amicra.asmpt.com

ENABLING THE DIGITAL WORLD

NANOUltra PrecisionDie & Flip Chip Bonder

ASM AMICRA Microtechnologies follows a policy of continuous product improvement.Specifi cations are subject to change without notice.Version June 2018

• Localized heating• Adjustable temperature profiles supporting high soldering temperatures (up to 600°)• Shortest soldering time (<1s)• Laser soldering produces the best first past yield• Heated Bond tool (up to 350°C)

Laser Eutectic Soldering

• Dynamically aligns the component via stationary high resolution imaging system

• Able to control the component position during alignment and bonding process

• Align component fiducial marks (front facet and ridge) to V-groove or waveguide of the submount potentially

eliminating the need for the coupling optics• Vibration is minimized via a granite base and granite

bonding stage with high resolution linear motors

Highest Placement Accuracy

• Vibration damping due to granite base design• High precision stages driven by linear motors• Precision vision system with high resolution CCD-cameras• High accuracy bond head• Flip chip unit• Wafer Film Frame, Hoop Ring, Waffle Pack, Gel-Pak ®

Precision Components

ENABLING THE DIGITAL WORLD

HIGHEST PLACEMENT ACCURACY IN ITS CLASS

• Supports ± 0.3µm @ 3s placement accuracy

• Supports all die attach and flip chip applications

• High precision alignment optics

• Vibration damping system

• Automatic placement offset tuning system

• High resolution 300mm bonding station

• Dynamic alignment system

• Quantitative parallelism calibration

• In-situ eutectic bonding capability

• 3x different heated options incl. laser soldering system

• Active bond force control form 0.1 to 20N

• Epoxy stamping and dispensing capability

• UV Curing capability at the bond station

• Post-bond inspection and wafer mapping software

• Clean room inside with HEPA filter and ionizer

• Modular machine concept

NANO

Modular machine concept

± 0.3µmPlacement Accuracy

NANO CMK• Cmk Test does not include bonding processes where Cpk includes bonding processes• USL/LSL set to ±0.3μm resulting in placement accuracy of Cmk > 1.33• Cmk Test measures the absolute effective resolution of the machine• Cmk Test quantifies the fundamental placement capability of the machine