AMICRA follows a policy of continuous product improvement. Specifications are subject to change without notice.Version July 2017
NANO Technical Information
0.1mm to 25mm, larger component size possiblesilicon die, laser diode, VCSEL, optical lens, etc.wafer film frame, hoop/grip ring, waffle packs, GelPaks, custom traysvery small submounts to 300mm wafer substrate silicon die, AIN, ceramic, laminate, PCB, wafers, custom fixtures, etc.die Sort, Epoxy, In-situ Eutectic, Mass Reflow FC, In-situ FC, In-situ UV, C2W, C2C, C2S, etcfully automatic with manual load and unload of components and substrates
component size range component typescomponent presentation typessubstrate size rangesubstrate types
bond processes
automated operation
function
X axis positioning
Z axis
XY axis
range of XY axis
XY axisrange of XY axis
function
rotation axisbond force
touch sensor
needle systems
ejection needle type
ejection heightejection speed
base machine construction
ESDclean room inside
moves bond head from source side (component presentation) to destination side (bond station)linear motor driven, high velocity & acceleration; non-contact linear encoder, resolution 0.1µmAC servo drive, noncontact linear encoder, resolution 0.1µm
granite base, linear motor drive, open-frame design
300 x 300 mm (up to 12 inch wafer)
AC motor driven, open-frame design 300 x 300 mm (up to 12 inch wafer)
design for dynamic component positioning;high accuracy positioning; bond force control360°, resolution 0.001°programmable, 3g up to 2000g based on tool holder designdetermines first mechanical contact between chip and substrate
single or multi-needle system according to component size and wafer typesupport piercing and non-piercing needles, other needle configurations are available upon requestprogrammable height and delaysprogrammable
granite construction mounted on a steel frame with integrated vibration damping systemintegrated ionizers and basic ESD design practicesintegrated HEPA fi ltering system
BOND HEAD TRANSFER SYSTEM
BOND STATION
COMPONENT PRESENTATION
BOND HEAD
EJECTION SYSTEMS
size (WxDxH), weightvacuumcompressed airprocess gaselectrical power ratingsambient temperaturerelative humidity
1690 x 1430 x 2040mm (+384 sig. tower), 2000 kgnegative 0.8 bar5.5 bar dry and oil-free clean airair, nitrogen, forming gasstandard voltage: 400 V, will accommodate other voltage per facility18 to 25 ˚C; non-condensing
various tooling for substrate and component presentationUV cure unit located at bondwafer heatersprocess gasceramic heatersheated bond toolfl ip chip unitautomatic substrate loader for waferswafer and substrate mapping optionsbar code, 2D code scanners and OCRsingle component tracking
function
technique
max. output power
temperature
pulse time
for fast eutectic bonding with closed-loop controlled heat profilesfiber-coupled high power laser-diode with focusing optics and integrated pyrometer 100 W custom power available upon request
programmable range: up to 450° C depending on the substrate materialseasy programmable profile controlled by power, temperature and time
ENABLING THE DIGITAL WORLD
ASM AMICRA‘s die bonding technology was specifi cally designed to serve the photonic assembly market by providing the ultimate placement accuracy while supporting a high speed AuSn eutectic bonding process. ASM AMICRA has been perfecting this technology for almost 20 years, developing high resolution imaging systems to support the dynamic alignment system, implementing a fi ber laser to be used as the primary heat source for AuSn eutectic bonding, high resolution motion control systems mounted on a granite structure with a special vibration damping system. The principle design of this vision driven die bonder is to mount all 4x imaging systems in fi xed positions, mounted to granite, while all other motion control systems move around the vision cameras. This fundamental design concept produces the highest precision placement accuracy die bonder in the industry today.
18 seconds depending on configuration and application±0.3µm @ 3sigma depending on configuration, application and material quality. Verifiable via Cmk glass board test>95% uptime
general cycle time placement accuracy
machine availability
OTHER
vision enginefour imaging systems
component placementfocusingrecognition methods
pattern/recognition
COGNEXcomponent presentation station, bond station, downward looking and upward lookingpre-bond, bond and post bondprogrammable and automaticstandard vision tools, special filters for micro struc-tures, access to COGNEX library of vision algorithmsprogrammable windows and models. High level of flexibility to allow the customer to create custom vision solutions programmable LED, RGB, and white light illumination
dispensing pump function
dispensing pump options
dispensing technique
additional supported dispensing processes
located at bond, substrate height is determined by the vision system, auto needle off-set adjustment, pre-dispense stage, etctime-pressure-vacuum, Musashi time-pressure-vacuum, Techcon auger/spindle pump, jet pump
programmable operation from dots to complete snow flake patterns including UV dispensedie dipping, pin transfer, stamping, flux dipping
controloperating systemprogrammingoperator interfacedata transfer
multi axis controllerwindows 7keyboard & graphic display/touch displaygraphic menu driven, EnglishEthernet TCP/IP, electronic connection: 10 Base T, 10-Mbit/s
ENABLING THE DIGITAL WORLD
Overview
Performance
Equipment
Laser Soldering System
Image Recognition
Other Available Options (not limited to this list)
Man Machine Interface/GUI
Dimensions/ Power ratings
Dispensing Systems
ASM AMICRA Microtechnologies GmbHMarie-Curie-Str. 693055 Regensburg, GermanyTel. +49 941 208 209 0 (Global/Europe) +1 678 431 7021 (North America- East) +1 714 873 4155 (North America- West) + 65 9030 9738 (Asia)Fax +49 941 208 209 [email protected]
www.amicra.asmpt.com
ENABLING THE DIGITAL WORLD
NANOUltra PrecisionDie & Flip Chip Bonder
ASM AMICRA Microtechnologies follows a policy of continuous product improvement.Specifi cations are subject to change without notice.Version June 2018
• Localized heating• Adjustable temperature profiles supporting high soldering temperatures (up to 600°)• Shortest soldering time (<1s)• Laser soldering produces the best first past yield• Heated Bond tool (up to 350°C)
Laser Eutectic Soldering
• Dynamically aligns the component via stationary high resolution imaging system
• Able to control the component position during alignment and bonding process
• Align component fiducial marks (front facet and ridge) to V-groove or waveguide of the submount potentially
eliminating the need for the coupling optics• Vibration is minimized via a granite base and granite
bonding stage with high resolution linear motors
Highest Placement Accuracy
• Vibration damping due to granite base design• High precision stages driven by linear motors• Precision vision system with high resolution CCD-cameras• High accuracy bond head• Flip chip unit• Wafer Film Frame, Hoop Ring, Waffle Pack, Gel-Pak ®
Precision Components
ENABLING THE DIGITAL WORLD
HIGHEST PLACEMENT ACCURACY IN ITS CLASS
• Supports ± 0.3µm @ 3s placement accuracy
• Supports all die attach and flip chip applications
• High precision alignment optics
• Vibration damping system
• Automatic placement offset tuning system
• High resolution 300mm bonding station
• Dynamic alignment system
• Quantitative parallelism calibration
• In-situ eutectic bonding capability
• 3x different heated options incl. laser soldering system
• Active bond force control form 0.1 to 20N
• Epoxy stamping and dispensing capability
• UV Curing capability at the bond station
• Post-bond inspection and wafer mapping software
• Clean room inside with HEPA filter and ionizer
• Modular machine concept
NANO
Modular machine concept
± 0.3µmPlacement Accuracy
NANO CMK• Cmk Test does not include bonding processes where Cpk includes bonding processes• USL/LSL set to ±0.3μm resulting in placement accuracy of Cmk > 1.33• Cmk Test measures the absolute effective resolution of the machine• Cmk Test quantifies the fundamental placement capability of the machine
