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Nano-Imprint Technology Trends for Semiconductor Applications 2019

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Biography & contact

Nano-Imprint Technology Trends for Semiconductor Applications 2019 | Sample | www.yole.fr | ©2019

ABOUT THE AUTHOR

Amandine PIZZAGALLI, Market & Technology Analyst, Equipment and Materials Manufacturing

Amandine Pizzagalli oversees the equipment and materials fields for the Advanced Packaging and Manufacturing team at Yole Développement. She

graduated as an engineer in Electronics, specializing in semiconductors and nanoelectronic technologies. Prior to Yole, Amandine worked for Air

Liquide, with an emphasis on CVD and ALD processes for semiconductor applications.

Contact: [email protected]

http://www.yole.fr/

http://www.yole.fr/

3

AMO, Akonia Holographics, AustriaMicrosystems, Canon, Dai Nippon Printing (DNP), Daqri, DELO, Digilens, Dispelix, EVG Group, Himax, IMS Chips, IQE, Luminit, Konica Minolta, Micro Resist Technology, NIL Technology,

Stensborg, SUSS MicroTec, MagicLeap, Microsoft, Obducat, Rockwell Collins, Sony, TOK, Toppan, Toshiba, TruLifeOptics, Trumpf, Viavi Solutions, Vuzix, WaveOptics and more…

COMPANIES CITED IN THIS REPORT


http://www.yole.fr/

http://www.yole.fr/

4Nano-Imprint Technology Trends for Semiconductor Applications 2019 | Sample | www.yole.fr | ©2019

TABLE OF CONTENTS


• TheThree-Pages Summary 6

• Executive Summary 10

• Introduction, Definition & Methodology 41

• Report objectives

• Report scope

• Who Should be interested in this report?

• Companies cited in this report

• Definitions, limitations & methodology

• Glossary

• NIL principle and technologies overview 50

• Introduction to Nano Imprint Lithography (NIL) technologies 55

• NIL definition & principle

• NIL technologies classification

• Consumables in the NIL process

• NIL market drivers 58

• NIL technologies - benefits and drivers

• SWOT analysis

• NIL market segment and applications 91

• NIL at a glance

• NIL applicability in the semiconductor field

• NIL drivers per end application

• SWOT analysis of the NIL technology per application

• Competitive solutions to NIL 119

• 2018 - 2024 NIL equipment Market Forecast 129

• NIL equipment market forecast breakdown, by end-application

• NIL Suppliers: Competitive Landscape 139

• NIL equipment suppliers in the field of semiconductor

• NIL equipment positioning, by application

• 2018 NIL equipment players’ market share and revenue

In-depth analysis of NIL technologies, by end application

• NIL for Optical Photonics Elements 148

• NIL for Augmented Reality (AR) 157

• Introduction to AR

• Type of optical elements applied for AR

• NIL functionalities

• NIL benefits for AR

• Benchmark of nanostructures vs alternative solutions

• Players identified using NIL in AR

• NIL Equipment Market forecast in wafers and in units

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TABLE OF CONTENTS


• NIL for 3D Sensing 172• Introduction to 3D sensing

• Type of optical elements applied for 3D sensing


• NIL benefits for 3D Sensing


• Players indentified using NIL in 3D Sensing

• NIL Equipment Market forecast in revenue and in units

• NIL for Datacom/Telecom 183• Introduction to Data center

• Type of optical elements applied for Data center/Telecommunication


• NIL benefits for Data center


• Players indentified using NIL in Data center

• NIL Equipment Market forecast in wafers and in units

• Major NIL equipment suppliers involved in Data center

• NIL for BioChips 201

• Introduction to Life Science

• Type of Life Science devices using NIL technology today and thatcould use NIL in the future

• Benchmark of lithography process vs alternative solutions

• Players indentified using NIL in the Life Science

• Market forecast in revenue and unit

• NIL for LED devices 216• Introduction to Life Science

• Type of Life Science devices using NIL technology today and thatcould use NIL in the future

• Benchmark of lithography process vs alternative solutions

• Players indentified using NIL in the Life Science

• Market forecast in revenue and unit

• Conclusions & Perspectives 223

• Appendix 231

• Company Presentation

http://www.yole.fr/

http://www.yole.fr/


OBJECTIVES OF THE REPORT

This report represents the first research into NanoImprint Lithography (NIL) technologies in the semiconductor field

This report aims to give an in-depth understanding of NIL technology, current status and prospects, roadblocks and key suppliers / players.

Provide detailed information on which applications NIL technology could address in the semiconductor field:

• Comprehensive analysis of the major applications currently using NIL methods, and potential/attractive applications that could require the use of NIL technology in the future

• How disruptive NIL technology is for established and emerging applications

• Discuss technology processes, specifications and value chain

• NIL process applications roadmap

Describe the key benefits and added-value of NIL materials in the semiconductor field:

• What is NIL? What are its added values/benefits over alternative solutions? How does NIL differ from other lithography technologies?

• How does NIL differ from alternative technologies?

Present the current status of NIL technologies:

• What are the remaining roadblocks?

• Discuss the remaining challenges facing NIL technology’s implementation in the semiconductor field

• Summarize current adoption status of NIL technology and the various NIL types available on the market

• Provide a NIL roadmap by semiconductor application and SWOT analysis

Furnish an overview of NIL’s technological trends

Provide market metrics at NIL-equipment and NIL-source level for semiconductor applications (2019 - 2024)

• Evaluate market developments in terms of market size (volume, value) and semiconductor process step

Describe the competitive landscape and identify key players in technology development and manufacturing:

• Review the key NIL equipment suppliers and position them by application, NIL type, and process step

• Provide a picture of the resin, mold/stamp suppliers involved in the NIL process

http://www.yole.fr/

http://www.yole.fr/


METHODOLOGIES & DEFINITIONS

Market

Volume (in Munits)

ASP (in $)

Revenue (in $M)

Yole’s market forecast model is based on the matching of several sources:

Information

Aggregation

Preexisting

information

http://www.yole.fr/

http://www.yole.fr/


LITHOGRAPHY RESOLUTION REQUIREMENTS (NON-EXHAUSTIVE LIST)

Ap

plicati

on

s

Devic

es

/

Packages

Patt

ern

ing

solu

tio

n

2 µm 8 µm 20 µm 100 µm0.3 µm

Stepper

(DUV, EUV)Nanoimprint

Advanced

substrates PCB

Mask aligner

Stepper

Projection

scanner

HB LED

Refurbished

stepper

LED PSS microLEDIGBT

MOSFET

MEMS

2.5D

interposer

3D TSV

FO WLP

WLCSP FC BGA/FC CSPLED NPSS RF

Photonic

CIS

Life science

Point of care

DNA

sequencing

Waveguides

AR/VR

Mobile

Mobile

WLOptics

Laser direct imaging

MobileAutomotive

Memory

and logic

Report scope

http://www.yole.fr/

http://www.yole.fr/


NANOIMPRINT PROCESS

• Nanoimprint lithography is a cost-effective fabrication technique for creating uniformly imprinted micro- and nano- scaledevices in a single patterning step

• NanoImprint process is a solution to transfer of patterns in the micrometer to nanometer range.

Nanostructure

< 1µm

Microstructure

>1 µm

1 µm

Equipment type

Feature size

NanoImprint process

Interference lithography

Stepper

NanoImprint process

Hot embossing Injection Molding

Mask aligner

Laser direct imaging

http://www.yole.fr/

http://www.yole.fr/


NIL KEY MARKET DRIVERS

Over alternative solutions

• Three main drivers combined in NIL’s favor:

• Complex patterning capabilities

• High resolution manufacturing tool

• Cost effective process

FRONT-END STEPPER

(EXTREME UV

LITHOGRAPHY)

MASK ALIGNER, LASER

ABLATION, LASER

DIRECT IMAGING

COMPLEX NANOPATTERNING

PROCESS

HIGH RESOLUTION

CAPABILITIES

(<50NM)

COST EFFECTIVE SOLUTION

NIL optimum market

access conditions

* NIL : Nano-Imprint lithography

http://www.yole.fr/

http://www.yole.fr/


CAPITAL EQUIPMENT COMPARISON

Cost

Feature size capabilities

100 µm50 µm100nm 1 µm500 nm

Dry Etching

Wet Etching

UV NIL

Thermal NIL

Injection molding

Photolithography: Stepper

Power blasting

Replication technology

Exposure technology

Removal technology

Laser ablation

E-Beam

Mask Aligner

http://www.yole.fr/

http://www.yole.fr/


MORE SLIDES EXTRACTS

Understand Nano-Imprint

Lithography (NIL)

technologies, their drivers, main

challenges as well as competitive

solutions

Technical description of the

equipment and consumables

associated with NIL

technology

http://www.yole.fr/

http://www.yole.fr/


NIL TECHNOLOGIES - OVERVIEW

• There are two fundamentals NIL technologies: Thermal NIL and UV NIL which differ from the type of resin used and the pressureconditions

• The last NIL Micro Contact Printing (Soft Lithography) method is currently at the R&D phase.

There are three types of NIL

NIL Technologies

Hot Embossing

Hard StampPolymer Soft

Stamp

UV Nanoimprint

Transparent Hard Stamp

Polymer Soft Stamp

Micro Contact Printing (Soft Lithography)

Polymer Soft Stamp

http://www.yole.fr/

http://www.yole.fr/


Telecommunication

NIL AT A GLANCE: APPLICATION MARKETS

Lifescience

Point-of-care

Diagnostics

DNA sequencing

Consumer electronic

devices

Augmented reality

3D sensing

Data center storage

Optical communications

StorageOrgans-On-Chips

BioChips Optical photonic elements

Front- End Memories

End-markets

Elements

integrated

End-applications

http://www.yole.fr/

http://www.yole.fr/


NIL APPLICABILITY

End Market End application Potential device Function Elements integrated

Life Science

Consumer

Datacom/Telecom

DNA Sequencing

Point of Care

(PoC)

Organs-On-

Chips (OOC)

Source: MBEL

Flow cells

Diagnostic

devicesNanocells

Optical

communication DFB laser

diode

Light

Shaping

Nanophotonic

crystals

Source: EVG

Augmented

Reality (AR)

3D Sensing

Storage

memory

AR heads-up

VCSEL

3D NAND

Waveguide

Beam splitter

Time-Of-Flight

Optical gratings

(Surface Relief Gratings)

DiffuserMicro-Lens-Array

Nanopattern

Optical gratings

Storage memory

(SSD) 3D NAND Nanopattern

http://www.yole.fr/

http://www.yole.fr/


NIL APPLICABILITY

By elements integrated in end-applications

Three main market segments could requirethe use of NIL in the semiconductorarea

• Microfluidic chips

• Lab-on-chips

• Chips with photonic structure

• DNA sequencing

Biochips

• Optoelectronic

• Optical components

• DOE

• Diffuser

• Augmented Reality Waveguides

Optical photonic elements

• 3D NAND memory

• DRAM

Front-end memory

NIL DRIVERS BiocompatibilityComplex patterningCost advantage solution

http://www.yole.fr/

http://www.yole.fr/


NIL ATTRIBUTES VS. APPLICATION REQUIREMENTS

BioChips Photonics Front-end memory

Feature size / Resolution

Functionality /

Compatibility

Complex patterning shape

Cost-effective

Application

Driver

1 2 4

1

3

2

31

4

4

2

31

4

2

Strong differentiator Very important Not very important or

differentiating

3 Less critical

http://www.yole.fr/

http://www.yole.fr/


WHERE NANOIMPRINT COULD BE APPLIED?

ROE DOE

Nanophotonics

Lens Fresnel lensMicrolens

Array

Optical gratings

SRG/Beam splitter

Focusing, CollimationMicrostructure

(not nanostructure)

Microstructure

(not nanostructure)

Light shapingMicrostructure

(not nanostructure)

Pattern generator

(Dot projector)

Waveguide

Diffuser (Flood

illuminator)

Use or could use nanoimprint

Optical element

Function type

microstructure nanostructure

http://www.yole.fr/

http://www.yole.fr/


NIL APPLICATION ROADMAP – TIME TO MARKET

Bio chips

Storage

memory

Optical

photonic

elements

2018 2021 2023 2025 >2025

Point of care

DNA Sequencing

Organ-on-chip

SRG

Optical Waveguides

HOE

MLA for diffuser

Microscale

3D NAND

?

http://www.yole.fr/

http://www.yole.fr/


MORE SLIDES EXTRACTS: NIL APPLICATIONS

Understand in what

applications NIL are

used…

And where NIL is

emerging

http://www.yole.fr/

http://www.yole.fr/


2018 - 2024 NANO-IMPRINT LITHOGRAPHY EQUIPMENT MARKET SIZE

Total Nano-Imprint Lithography equipment market for Semiconductor applications *

BioChips

Photonics elements (diffractive optical elements, refractive optical elements)

3D NAND memories – market segment developed after 2018

~$90MCAGR +19%

>$145MCAGR >20%

~$28M

$10M

~$38M

2018

2024

CAGR2018-2024: >+20%

>$27M

~$28MCAGR +22%

*Pilot or production tools (excluding R&D tools)

http://www.yole.fr/

http://www.yole.fr/


Master supplierStamp

supplierResin

supplierEquipment supplier

Users

NIL SUPPLY CHAIN

http://www.yole.fr/

http://www.yole.fr/


MORE SLIDES EXTRACTS

Nano-Imprint Lithography market size

Nil equipment and material forecasts by

market segments

As well as NIL equipment market

share by market

http://www.yole.fr/

http://www.yole.fr/

24

Contact our

Sales Team

for more

information


3D Imaging & Sensing2018

Displays & Optical Vision Systems for VR, AR & MR

2018

Bonding and Lithography Equipment Market for More

than Moore Devices

Status of the Camera Module Industry 2019 – Focus on

Wafer Level Optics

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Nano-Imprint Lithography (NIL) has already been implemented for some non-semiconductor applications, mostly at the research level.

Semiconductor devices mostly require photolithography technology. However, the emergence of new semiconductor devices demands tighter nanoscale resolution, complex shapes and more cost-effective lithography solutions. This has triggered the need for new patterning processes.

Producers are therefore regaining interest in NIL, which is based on mechanical replication. The technology is especially relevant to photonic elements, biochips and front-end 3D NAND memory, as it enables nanoscale structures below 20 nm over large surfaces and provides complex patterning capabilities.

On the photonics side, NIL technology realizes complex pattern shapes in a periodic way. For life science, the same technology ensures

biocompatibility and solves the challenges of increasing complexity of biotechnology devices while enabling finer feature sizes. In the memory business, NIL could represent a cost-effective solution to achieving high-resolution feature sizes.

However, there are still some big barriers that prevent NIL from entering mass production. Generally speaking, the master fabrication process appears to be a critical step that increases the Cost of Ownership (CoO) of the NIL process. Additionally, stamp lifetime and finding a trade-off between overlay, defect levels and throughput are issues that are holding back of NIL in high volume manufacturing.

Solving all these limitations could be a game-changer for NIL in the semiconductor industry. This report offers a technical description of the different NIL technologies, their drivers and main challenges.

NANO-IMPRINT TECHNOLOGY TRENDS FOR SEMICONDUCTOR APPLICATIONS 2019Market & Technology Report - June 2019

Nano-Imprint Lithography is revived by photonics and biochips as well as front-end memory applications.

REPORT KEY FEATURES • Detailed analysis of NIL

technologies in three major semiconductor applications: photonics, biochips and front-end memories (3D NAND)

• Key players and supply chain • 2018-2024 NIL equipment market

forecast: breakdown by device type and end-application segment

• 2018 global NIL equipment market share in the semiconductor applications

• 2018 NIL equipment suppliers by device type

• Overview of the players using NIL technology, by device and end-applications

• Roadmap for NIL technology adoption by semiconductor device

(Yole Développement, June 2019)

2018 - 2024 Nano-Imprint Lithography (NIL) equipment market size

NIL’S BENEFITS COULD DISRUPT SEMICONDUCTOR APPLICATIONS

Total Nano-Imprint Lithography equipment marketfor semiconductor applications *

BioChips

Photonics elements (diffractive optical elements, refractive optical elements)

3D NAND memories - Market segment developed after 2018

$90M+CAGR +19%

~$146M

~$28M

$10M

~$38M2018

2024

CAGR2018-2024: ~24%>$27M

~$28MCAGR +22%

*Pilot or production tools (excluding R&D tools)

Excitement about NIL technologies has grown exponentially since 2014, when Canon completed its acquisition of Molecular Imprints, a start-up provider of nano-patterning systems for the hard disk drive and semiconductor sector.

Numerous companies with different business models have now invested in NIL technology. They include photonic element manufacturers, epi-house foundries, microfluidic foundries or integrated device manufacturers. Their applications span augmented reality, 3D sensing and datacom/telecommunications. This paves the way for a significant boost to NIL.

Increasing demand for lower cost lithography solutions, integration of complex shapes and patterns and nanoscale structures is expected to offer many opportunities for NIL technologies. This will drive the NIL equipment market in the next few years.

Although the NIL equipment business is still a niche market for semiconductor applications, it is expected to explode. Its revenue compound annual growth rate from 2018-2024 (CAGR2018-2024) will reach an impressive 24% from, making the market worth $146M by 2024.

Now the questions are: “Which semiconductor devices will revive NIL into the next-game

SEMICONDUCTOR MANUFACTURING COMPLEXITY BRINGS NEW BUSINESS OPPORTUNITIES IN THE NIL EQUIPMENT MARKET

NANO-IMPRINT TECHNOLOGY TRENDS FOR SEMICONDUCTOR APPLICATIONS 2019

Nano-Imprint Lithography (NIL) technology: key market drivers


changer?” and “For which applications will NIL be used?” Currently, the real boost for the NIL equipment market is expected in photonic elements, driven by Augmented Reality (AR), 3D sensing as well as datacom/telecommunication. NIL offers the ability to imprint diffractive optical elements (DOEs) in the nanoscale. This includes optical gratings and photonic

crystals to create waveguides, light shaping elements and pattern generators.

Specific to biochips for the life science space, NIL technology has already been implemented for imprinting DNA sequencing devices in the nanoscale regime. Yole Développement (Yole) forecasts further investment in NIL from different players involved in DNA sequencing. Yole also anticipates the breakthrough of NIL processes for point of care and organs-on-chips in the next three years. This is led by a strong trend towards miniaturization and controlled systems delivery with respect to transport and manipulation of biological fluids.

Last but not least, NIL equipment from Canon has been evaluated by Toshiba to replace steppers for the next generation of 3D NAND memories and potentially other front-end memories in a longer term. It would enable a cost-effective process at higher resolution feature size, and is currently in a R&D phase.

This report provides the NIL equipment market forecast for three large-application semiconductor markets: photonics, biochips and 3D NAND memory. In addition, it outlines Yole’s understanding of current market dynamics and outlook on the future evolution of NIL technologies.


Master supplier Stampsupplier

Resinsupplier

Equipment supplier Users

*Non-exhaustive list of companies

Nano-Imprint Lithography (NIL) supply chain*

The NIL market is fragmented into different business models and numerous players.

From the equipment perspective, the NIL equipment market for optical photonic elements driven by augmented reality, 3D sensing and datacom applications is highly diversified. This sector is fragmented, with equipment suppliers including EV Group (EVG), SUSS MicroTec and Obducat. By contrast, the biochip and memories markets are effectively monopolies, with EVG and Canon respectively active in those markets. Most companies have developed expertise in optical photonic elements or biochips, but not all of them. Canon is the only system vendor that has developed expertise in the storage memory space.

For each feature size range, there is a clear leading NIL supplier. In the nanometer range EVG is dominant, especially in DOEs. SUSS MicroTec has a strong market share in the micrometer range.

A few material suppliers officially provide resin materials specific to NIL processes, such as Micro Resist Technology and DiC Color & Comfort. However, some vendors come from a different material industry, such as providing temporary bonding material or photoresist. They are currently leveraging their knowledge and capabilities to expand their product portfolios towards NIL materials.

Manufacturers of NIL equipment, materials or processes use different strategies to drive forward in the NIL market for semiconductor applications:

NIL TECHNOLOGY’S BENEFITS WILL ATTRACT MORE MANUFACTURING PLAYERS

Front-end stepper(extreme UVlithography)

Laser interferometry

Electron-beam lith

ography

Mask aligner,laser ablation,

laser direct imaging

Injection molding

COMPLEX NANOPATTERNING

PROCESS

HIGH RESOLUTION CAPABILITIES

(<50NM)

COST EFFECTIVE SOLUTION

NIL* optimum market access conditions

*NIL : Nano-Imprint Lithography

MARKET & TECHNOLOGY REPORT

COMPANIES CITED IN THE REPORT (non exhaustive list)

AMO, Akonia Holographics, AustriaMicrosystems, Canon, Dai Nippon Printing (DNP), Daqri, DELO, Digilens, Dispelix, EVG Group, Himax, IMS Chips, IQE, Luminit, Konica Minolta, Micro Resist Technology, NIL Technology, Stensborg, SUSS MicroTec, MagicLeap, Microsoft, Obducat, Rockwell Collins, Sony, TOK, Toppan,Toshiba, TruLifeOptics, Trumpf, Viavi Solutions, Vuzix, WaveOptics and more…

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AUTHOR

TABLE OF CONTENTS (complete content on i-Micronews.com)

Introduction, definition and methodology 7Executive summary 17

> Introduction to Nano-Imprint Lithography (NIL) technologies

> Lithography technologies - overview> NIL definition > NIL principle> NIL technologies classification> Consumables in the NIL process > NIL technologies - benefits and drivers> SWOT analysis

NIL market segment and applications 58> NIL at a glance> NIL applicability in the semiconductor field> NIL drivers by end application> SWOT analysis of the NIL technology by

application

NIL suppliers: competitive landscape 78> Overview of the major NIL semiconductor

equipment suppliers

> NIL equipment positioning, by application> NIL equipment players’ market share and revenue> Master suppliers > Mold suppliers

2018 - 2024 NIL equipment market forecast 102

> NIL equipment market forecast breakdown, by end-application

In-depth analysis of NIL technologies, by end application 110

> NIL for optical photonics elements> NIL for Augmented Reality (AR)> NIL for 3D Sensing> NIL for datacom/telecom> NIL for biochips > NIL for LED

Conclusions and perspectives 223Appendix 231Company presentation 247

REPORT OBJECTIVES• Detailed analysis of NIL technologies for semiconductor applications • Give the current status of NIL adoption and the various technologies available on the

semiconductor market • Provide an overview of NIL technological trends for semiconductor applications • How does the NIL technique differ from the other lithography solutions?• What are the key NIL drivers for photonics, BioChips and front-end memories (3D NAND)• Understand what are the remaining challenges to implementation of NIL technology in the field of

semiconductor applications• Offer market metrics at NIL equipment market level for semiconductor applications from 2018-2024• Evaluate market developments in terms of market volume and value by semiconductor device and

end-application• Provide a competitive landscape by identifying key players in technology development and

manufacturing • Gives an overview of who is doing what, and specifics of each market

Amandine Pizzagalli is a Technology & Market Analyst, Equipment & Materials - Semiconductor Manufacturing, at Yole Développement (Yole). Amandine is part of the development of the Semiconductor & Software division of Yole with the production of reports and custom consulting projects. She is in charge of comprehensive analyses focused on semiconductor equipment, materials and manufacturing processes. Previously, Amandine worked as Process engineer on CVD and ALD processes for semiconductor applications at Air Liquide. Amandine was based in Japan during one year to manage these projects. Amandine graduated from the engineering school, CPE Lyon (France), with a technical expertise in Semiconductor & Nano-Electronics and holds an electronics engineering degree followed by a master’s in semiconductor manufacturing technology from KTH Royal institute of technology (Sweden). She has spoken in numerous international conferences and has authored or co-authored more than 10 papers.

• Seeking to evolve toward greater diversification, some NIL players have acquired other companies. Magic Leap’s acquisition of Molecular Imprint allowed it to explore NIL capabilities and leverage the technology in its products.

• In the hopes of acquiring market share in other regions, some vendors have developed turnkey cluster solutions, including coating and baking systems in NIL tools. Some suppliers have remodeled their wafer bonder tool to turn them into NIL systems.

• Other companies, like SCIL Nanoimprint Solutions, a Philips subsidiary, or Stensborg, provide an overall working solution to the NIL industry comprising the production tool, materials and the special stamp associated with the process.

The report quantifies and details the competitive landscape and major NIL equipment supplier market in both micro and nanoscale feature ranges.

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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole group of companies has expanded to include more than 80 collaborators worldwide covering MEMS and Image Sensors, Compound Semiconductors, RF Electronics, Solid-State Lighting, Displays, Software, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries & Energy Management.The “More than Moore” market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting, PISEO and KnowMade, support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to grow their business.

CONSULTING AND ANALYSIS• Market data & research, marketing analysis• Technology analysis• Strategy consulting• Reverse engineering & costing• Patent analysis• Design and characterization of innovative optical systems• Financial services (due diligence, M&A with our partner)More information on www.yole.fr

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CONTACTSFor more information about :• Consulting & Financial Services: Jean-Christophe Eloy ([email protected])• Reports: David Jourdan ([email protected]) Yole Group of Companies• Press Relations: Sandrine Leroy ([email protected])

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YOLE DEVELOPPEMENT – FIELDS OF EXPERTISE

Life Sciences

& Healthcare o Microfluidics

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o Inkjet and accurate dispensing

o Solid-State Medical Imaging & BioPhotonics

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& Wireless

o RF Devices & Technologies

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Semiconductor

& Software o Package,Assembly & Substrates

o Semiconductor Manufacturing

o Memory

o Software & Computing

Photonics,

Sensing & Display

o Solid-State Lighting

o Display

o MEMS, Sensors & Actuators

o Imaging

o Photonics & Optoelectronics

Semiconductor

& Software

Power & Wireless

Photonics,

Sensing

& Display

Life

Sciences &

Healthcare

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4 BUSINESS MODELS

o Consulting and Analysis

• Market data & research,

marketing analysis

• Technology analysis

• Strategy consulting

• Reverse engineering & costing

• Patent analysis

• Design and characterization

of innovative optical systems

• Financial services (due

diligence, M&A with our

partner)

www.yole.fr

o Syndicated reports

• Market & technology reports

• Patent investigation and patent

infringement risk analysis

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analysis

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www.i-Micronews.com/reports o Media

• i-Micronews.com website

• i-Micronews e-newsletter

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services

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www.i-Micronews.com

o Monitors

• Monthly and quarterly update

• Excel database covering supply,

demand, and technology

• Price, market, demand and

production forecasts

• Supplier market shares

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6 COMPANIES TO SERVE YOUR BUSINESS

Due diligence

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Manufacturing costs analysis

Teardown and reverse engineering

Cost simulation tools

www.systemplus.fr

Market, technology and strategy

consulting

www.yole.fr

IP analysis

Patent assessment

www.knowmade.fr

Innovation and business maker

www.bmorpho.com

Design and characterization of

innovative optical systems

www.piseo.fr

Yole Group of Companies


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OUR GLOBAL ACTIVITY

30%of our business

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ANALYSIS SERVICES - CONTENT COMPARISON

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SERVING THE ENTIRE SUPPLY CHAIN

Our analysts provide market analysis,

technology evaluation,

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Integrators, end-

users and software

developers

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SERVING MULTIPLE INDUSTRIAL FIELDS

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o Over the course of more than 20 years, Yole Développement has grown to become a group of companies. Together with System Plus Consulting and KnowMade, we now

provide marketing, technology and strategy consulting, media and corporate finance services, reverse costing, structure, process and cost analysis services and well as

intellectual property (IP) and patent analysis. Together, our group of companies is collaborating ever closer and therefore will offer, in 2019, a collection of over 125 reports,

10 new monitors and 120 teardowns. Combining respective expertise and methodologies from the three companies, they cover:

o If you are looking for:

• An analysis of your product market and technology

• A review of how your competitors are evolving

• An understanding of your manufacturing and production costs

• An understanding of your industry’s technology roadmap and related IPs

• A clear view supply chain evolution

Our reports and monitors are for you!

o Our team of over 70 analysts, including PhD and MBA qualified industry veterans from Yole Développement, System Plus Consulting and KnowMade, collect information,identify trends, challenges, emerging markets, and competitive environments. They turn that information into results and give you a complete picture of your industry’slandscape. In the past 20 years, we have worked on more than 2,000 projects, interacting with technology professionals and high-level opinion makers from the mainplayers of their industries and realized more than 5,000 interviews per year.

WHAT TO EXPECT IN 2019?In 2019 we will extend our offering with a new ‘monitor’ product which provides more updates on your industry during the year. The Yole Group of Companies is also buildingon and expanding its investigations of the memory industry. Moreover, in parallel, the Yole Group reaffirms its commitment to a new collection of reports mixing software andhardware and is increasing its involvement in displays, radio-frequency (RF) technology, advanced substrates, batteries and compound semiconductors. Last but not least,System Plus Consulting is developing its teardowns service providing 120+ offers related to phones, smart home, wearables and connected devices. Discover our 2019program right now, and ensure you get a true vision of the industry. Stay tuned!

REPORTS COLLECTION

www.i-Micronews.com

• MEMS & Sensors

• RF devices & technologies

• Medical technologies

• Semiconductor Manufacturing

• Advanced packaging

• Memory

• Batteries and energy management

• Power electronics

• Compound semiconductors

• Solid state lighting

• Displays

• Software

• Imaging

• Photonics


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OUR 2019 REPORTS COLLECTION (1/4)

18 fields of excellence combined with six markets to provide a complete picture of your industry landscape

Market –Technology – Strategy – by Yole DéveloppementYole Développement (Yole) offers market reports including quantitative market forecasts,

technology trends, company strategy evaluation and indepth application analyses. Yole will

publish more than 55 reports in 2019, with our partner PISEO contributing to some of

the lighting reports.

Reverse Costing® – Structure, Process and Cost Analysis – by

System Plus ConsultingThe Reverse Costing® report developed by System Plus Consulting provides full

teardowns, including detailed photos, precise measurements, material analyses,

manufacturing process flows, supply chain evaluations, manufacturing cost analyses and

selling price estimations. The reports listed below are comparisons of several analyzed

components from System Plus Consulting. More reports are however available, and over

60 reports will be released in 2019.The complete list is available at www.systemplus.fr.

Patent Reports – by KnowMadeMore than describing the status of the IP situation, these analyses provide a missing link

between patented technologies and market, technological and business trends. They offer

an understanding of the competitive landscape and technology developments from a

patent perspective. They include key insights into key IP players, key patents and future

technology trends. For 2019 KnowMade will release over 15 reports.

The markets targeted are :

• Mobile & Consumer

• Automotive & Transportation

• Medical

• Industrial

• Telecom & Infrastructure

• Defense & Aerospace

• Linked reports are dealing with the same topic to provide

• a more detailed analysis.


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OUR 2019 REPORTS COLLECTION (1/5)18 fields of excellence combined with six markets to provide a complete picture of your industry landscape

MEMS & SENSORS

o MARKET AND TECHNOLOGY REPORT

• Status of the MEMS Industry 2019 - Update

• Status of the Audio Industry 2019 - New

• Uncooled Infrared Imagers and Detectors 2019 – Update

• Consumer Biometrics:Technologies and Market Trends 2018

• MEMS Pressure Sensor Market and Technologies 2018

• Gas & Particle Sensors 2018

o STRUCTURE, PROCESS & COST REPORT

• MEMS & Sensors Comparison 2019

• MEMS Pressure Sensor Comparison 2018

• Particle Sensors Comparison 2019

• Miniaturized Gas Sensors Comparison 2018

o PATENT REPORT

• MEMS Foundry Business Portfolio 2019 - New

• Miniaturized Gas Sensors 2019 - New

PHOTONIC AND OPTOELECTRONICS

o MARKET ANDTECHNOLOGY REPORT

• Silicon Photonics and Photonic Integrated Circuits 2019

• LiDARs for Automotive and Industrial Applications 2019 - Update

o PATENT REPORT

• Silicon Photonics for Data Centers: Optical Transceiver 2019 - New

• LiDAR for Automotive 2018

RF DEVICES AND TECHNOLOGIES


• RF GaN Market: Applications, Players, Technology,

and Substrates 2019 - Update

• 5G’s Impact on RF Front-End Module and Connectivity

for Cell Phones 2019 – Update

• 5G Impact on Telecom Infrastructure 2019 - New

• Radar and Wireless for Automotive: Market and Technology

Trends 2019 - Update

• Advanced RF Antenna Market & Technology 2019 - New

• RF Standards and Technologies for Connected Objects 2018


• RF Front-End Module Comparison 2019 - Update

• Automotive Radar RF Chipset Comparison 2018

o PATENT REPORT

• Antenna for 5G Wireless Communications 2019 - New

• RF Front End Modules for Cellphones 2018

• RF Filter for 5G Wireless Communications: Materials and Technologies 2019

• RF GaN 2019 – Patent Landscape Analysis

Update : 2018 version still available About Yole Développement | www.yole.fr | ©2019

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IMAGING


• Status of the CIS Industry 2019: Technology

and Foundry Business - Update

• Imaging for Automotive 2019 - Update

• Neuromorphic Technologies for Sensing 2019 - Update

• Status of the CCM and WLO Industry 2019 – Update

• 3D Imaging & Sensing 2018

• MachineVision for Industry and Automation 2018

• Sensors for Robotic Vehicles 2018


• Compact Camera Modules Comparison 2019

• CMOS Image Sensors Comparison 2019

o PATENT REPORT

• Facial & Gesture Recognition Technlogies in Mobile Devices 2019 - New

• Apple iPhone X Proximity Sensor & Flood Illuminator 2018

MEDICAL IMAGING AND BIOPHOTONICS


• X-Ray Detectors for Medical, Industrial

and Security Applications 2019- New

• Microscopy Life Science Cameras: Market and Technology Analysis 2019

• Ultrasound technologies for Medical, Industrial

and Consumer Applications 2018

o PATENT REPORT

• Optical Coherence Tomography Medical Imaging 2018

MICROFLUIDICS


• Status of the Microfluidics Industry 2019 - Update

• Next Generation Sequencing & DNA Synthesis - Technology,

Consumables Manufacturing and Market Trends 2019 - New

• Organ-on-a-Chip Market & Technology Landscape 2019 - Update

• Point-of-Need Testing Application of Microfluidic Technologies 2018

• Liquid Biopsy: from Isolation to Downstream Applications 2018

• Chinese Microfluidics Industry 2018

o PATENT REPORT

• Microfluidic Manufacturing Technologies 2019 – New

• Nanopore Sequencing 2019 - New

INKJET AND ACCURATE DISPENSING


• Inkjet Printheads - Dispensing Technologies

& Market Landscape 2019 - Update

• Emerging Printing Technologies

for Microsystem Manufacturing 2019 - New

• Piezoelectric Devices from Bulk to Thin Film 2019 - New

• Inkjet Functional and Additive Manufacturing for Electronics 2018


• Piezoelectric Materials from Bulk to Thin Film Comparison 2019


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BIOTECHNOLOGIES


• CRISPR-Cas9 Technology: From Lab to Industries 2018

o PATENT REPORT

• Personalized Medicine 2019 – New

BIOMEMS & MEDICAL MICROSYSTEMS


• Medical Wearables: Market & Technology Analysis 2019 - New

• Neurotechnologies and Brain Computer Interface 2018

• BioMEMS & Non-Invasive Sensors: Microsystems for Life Sciences

& Healthcare 2018

o PATENT REPORT

• 3D Cell Printing 2019 - New

• Circulating Tumor Cells Isolation 2019 - New

SOFTWARE AND COMPUTING


• Artificial Intelligence Computing For Automotive 2019 - New

• Hardware and Software for Artificial Intelligence (AI)

in Consumer Applications 2019 - Update

• Image Signal Processor and Vision Processor Market

and Technology Trends 2019

• xPU (Processing Units) for Cryptocurrency, Blockchain, HPC

and Gaming 2019 – New

o PATENT REPORT

• Artificial Intelligence for Medical Diagnostics - New

MEMORY


• Status of the Memory Industry 2019 - New

• MRAM Technology and Business 2019 - New

• Emerging NonVolatile Memory 2018


• Memory Comparison 2019

o PATENT REPORT

• Magnetoresistive Random-Access Memory (MRAM) 2019 - New

• 3D Non-Volatile Memory 2018

ADVANCED PACKAGING


• Fan Out Packaging Technologies and Market Trends 2019 - Update

• 3D TSV Integration and Monolithic Business Update 2019 - Update

• Advanced RF SiP for Cellphones 2019 - Update

• Status of Advanced Packaging Industry 2019 - Update

• Status of Advanced Substrates 2019 - Update

• Panel Level Packaging Trends 2019 - Update

• Automotive Packaging 2019 - New

• Trends in Automotive Packaging 2018

• Thin-Film Integrated Passive Devices 2018


• Advanced RF SiP for Cellphones Comparison 2019


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SEMICONDUCTOR MANUFACTURING


• Nano Imprint Lithography 2019 - New

• Equipment and Materials for Fan Out Packaging 2019 - Update

• Equipment for More than Moore: Thin Film Deposition

& Etching 2019 - New

• Wafer Starts for More Than Moore Applications 2018

• Polymeric Materials at Wafer-Level

for Advanced Packaging 2018

• Bonding and Lithography Equipment Market

for More than Moore Devices 2018


• Wafer Bonding Comparison 2018

o PATENT REPORT

• Hybrid Bonding for 3D Stack 2019 – New

SOLID STATE LIGHTING


• Status of the Solid State Light Source Industry 2019 - New

• Edge Emitting Lasers (EELS) 2019 - New

• Light Shaping Technologies 2019 - New

• Automotive Advanced Front Lighting Systems 2019 - New

• VCSELs - Technology, Industry and Market Trends 2019 - Update

• IR LEDs and Laser Diodes – Technology, Applications,

and Industry Trends 2018

• Automotive Lighting 2018: Technology, Industry and Market Trends

• UV LEDs - Technology, Manufacturing and Application Trends 2018

• LiFi: Technology, Industry and Market Trends 2018


• VCSEL Comparison 2019

o PATENT REPORT

• VCSELs 2018

DISPLAY


• Next Generation 3D Display 2019 - New

• Next Generation Human Machine Interaction (HMI)in Displays 2019 - New

• Micro-and Mini-LED Displays 2019 - Update

• Technologies And Markets for Next Generation Televisions

• Displays & Optical Vision Systems for VR, AR & MR 2018

o PATENT REPORT

• MicroLED Displays : Intellectual Property Landscape 2018


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POWER ELECTRONICS


• Power SiC: Materials, Devices and Applications 2019 - Update

• Power Electronics for EV/HEV and e-mobility:

Market, Innovations and Trends 2019 - Update

• Status of the Power Electronics Industry 2019 - Update

• Discrete Power Packaging : Material Market

and Technology Trends 2019 - New

• Status of the Power ICs Industry 2019 - Update

• Status of the Passive Components for the Power Electronics

Industry 2019 - Update

• Status of the Inverter Industry 2019 - Update

• Status of the Power Module Packaging Industry 2019 - Update

• Wireless Charging Market Expectations

and Technology Trends 2018

• Power GaN 2018: Epitaxy, Devices, Applications

and Technology Trends


• Automotive Power Module Packaging Comparison 2018

• GaN-on-Silicon Transistor Comparison 2019

• SiC Transistor Comparison 2019

o PATENT REPORT

• Power SiC : Materials, Devices and Modules 2019 - New

• Power GaN : Materials, Devices and Modules 2019 – Update

BATTERY & ENERGY MANAGEMENT


• Status of the Rechargeable Li-ion Battery Industry 2019 - New

• Li-ion Battery Packs for Automotive and Stationary Storage

Applications 2019 - Update

o PATENT REPORT

• Battery Energy Density Increase: Materials

and Emerging Technologies 2019 - New

• Solid-State Batteries 2019 - New

• Status of the Battery Patents 2018

COMPOUND SEMI.


• Emerging Semiconductor Substrates:

Market & Technology Trends 2019- New

• Status of the Compound Semiconductor Industry 2019 - New

• InP Materials, Devices and Applications 2019 - New

• GaAs Wafer and Epiwafer Market: RF, Photonics,

LED and PV Applications 2018

o PATENT REPORT

• GaN-on-Silicon Substrate: Materials, Devices

and Applications 2019 - Update


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OUR 2019 MONITORS COLLECTION (1/2)

Get the most updated overview of your market to monitor your strategy

Yole Développement, System Plus Consulting and KnowMade, all part of the Yole Group of Companies, are launching a collection of 10 monitors in 2019. The monitors aim to

provide updated market, technology and patent data as well dedicated quarterly analyses of the evolution in your industry over the previous 12 months. Furthermore, you can

benefit from direct access to the analyst for an on-demand Q&A and discussion session regarding trend analyses, forecasts and breaking news.

Topics covered will be compact camera modules (CCMs), advanced packaging, compound semiconductors, microfluidics, batteries, RF and memory.

MARKET MONITOR byYole Développement

A FULL PACKAGE:The monitors will provide the evolution of the market in units, wafer area and revenues.They will also offer insights into what is driving the business and a close look at what ishappening will also be covered in it.

The following deliverables will be included in the monitors:

• An Excel database with all historical and forecast data

• A PDF slide deck with graphs and comments/analyses covering the expected

evolutions

o ADVANCED PACKAGING – NEWThis monitor will provide the evolution of the advanced packaging platforms. It willcover Fan-Out Wafer Level Packaging (WLP), Fan-Out Panel Level Packaging (PLP),Wafer-Level Chip Scale Packaging (WLCSP), Flip Chip packaging platforms, and 2.5Dand 3D Through Silicon Via (TSV) integration. Frequency: Quarterly, starting from Q32019

o COMPOUND SEMI. – NEWThis monitor will describe how the compound semiconductor industry is evolving. Itwill offer a close look at GaAs, InP, SiC, GaN and other compounds of interestproviding wafer volumes, revenues, application breakdowns and momentum.Frequency: Quarterly, starting from Q3 2019

o CAMERA MODULE – NEWThis monitor will provide the evolution of the imaging industry, with a close look atimage sensor, camera module, lens and VCM. Volumes, revenues and momentum ofcompanies like Sony, Samsung, Omnivision and OnSemi will thus be analysed.Frequency: Quarterly, starting from Q3 2019

o MEMORY – UPDATEFor the memory industry you can have access to a quaterly monitor, as well as anadditional service, a monthly pricing. Both services can be bought seprately:

• DRAM Service: Including a quarterly monitor and monthly pricing.

• NAND Service: Including a quarterly monitor and monthly pricing.

REVERSETECHNOLOGY MONITOR by System Plus Consulting

o SMARTPHONES – NEWTo stay updated on the latest components, packaging and silicon chip choices of the smartphone makers, System Plus Consulting has created its first Smartphone ReverseTechnology monitor. This year, get access to the packaging and silicon content database of at least 20 different flagship smartphones – more than five per quarter. Starting at thebeginning of 2019, the monitor will include an Excel database report for each phone and a quarterly comparison.


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42

OUR 2019 MONITORS COLLECTION (2/2)

Get the most updated overview of your market to monitor your strategy

PATENT MONITOR by KnowMade

A FULL PACKAGE:Starting at the beginning of the year, the KnowMade monitors include the following deliverables:

• An Excel file including the monthly IP database of:

• New patent applications

• Newly granted patents

• Expired or abandoned patents

• Transfer of IP rights through re-assignment and licensing

• Patent litigation and opposition

• Quarterly report including a PDF slide deck with the key facts & figures of thequarter: IP trends over the three last months, with a close look to key IP players andkey patented technologies.

o GaN for Power & RF ElectronicsWafers and epiwafers, GaN-on-SiC, silicon, sapphire or diamond, semiconductordevices such as transistors, and diodes, devices and applications including converters,rectifiers, switches, amplifiers, filters, and Monolothic Microwave Integrated Circuits(MMICs), packaging, modules and systems.

o GaN for Optoelectronics & PhotonicsWafers and epiwafers, GaN-on-sapphire, SiC or silicon; semiconductor devices suchas LEDs and lasers; and applications including lighting, display, visible communication,photonics, packaging, modules and systems.

o Li-ion BatteriesAnodes made of lithium metal, silicon, and lithium titanate (LTO); cathodes made ofLithium Iron Phosphate (LFP), Nickel-Manganese-Cobalt (NMC), Lithium NickelCobalt Aluminium Oxide (NCA), Lithium Nickel Metal Dioxide (LiNiMO2), LithiumMetal Phosphate (LiMPO4), and Lithium Metal Tetroxide (LiMO4); electrolytesincluding liquid, polymer/gel, and solid inorganics; ceramic and other separators;battery cells including thin film/microbattery, flexible, cylindrical and prismatic; andbattery packs and systems.

o Post Li-ion BatteriesBattery technologies including redox-flow batteries, sodium-ion, lithiumsulfur, lithium-air, and magnesium-ion, and their supply chains, including electrodes, electrolytes,battery cells and battery packs/systems.

o Solid-State BatteriesSupply chain including electrodes, battery cells, battery packs/systems andelectrolytes, including polymer, inorganic and inorganic/polymer, inorganic materials,including argyrodites, LIthium Super Ionic CONductor, (LISICONs), Thio-LISICONs,sulfide glasses, oxide glasses, perovskites, anti-perovskites and garnets.

o RF Acoustic Wave FiltersIncluding Surface Acoustic Wave (SAW), Temperature Compensated (TC)- SAW, BulkAcoustic Wave- Free-standing Bulk Acoustic Resonator (BAWFBAR), BAW-Solidly-Mounted Resonator (BAW-SMR), and Packaging.

o RF Power AmplifiersIncluding Low Noise Amplifiers, Doherty Amplifiers, Packaging, and Millimeter-Wavetechnology.

o RF Front-End Modules

o MicrofluidicsFrom components to chips and systems, including all applications.


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I-MICRONEWS MEDIA

To meet the growing demand for market,

technological and business information,

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able to reach each individual contact within its

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Contact: Camille Veyrier ([email protected]), Marketing & Communication Director


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mailto:[email protected]

44

CONTACT INFORMATION

o CONSULTING AND SPECIFIC ANALYSIS, REPORT BUSINESS

• North America:

• Steve LaFerriere, Senior Sales Director for Western US & Canada

Email: [email protected] – + 1 310 600-8267

• Chris Youman, Senior Sales Director for Eastern US & Canada

Email: [email protected] – +1 919 607 9839

• Japan & Rest of Asia:

• Takashi Onozawa, General Manager, Asia Business Development

(India & ROA)

Email: [email protected] - +81 34405-9204

• Miho Ohtake, Account Manager (Japan)

Email: [email protected] - +81 3 4405 9204

• Itsuyo Oshiba, Account Manager (Japan & Singapore)

Email: [email protected] - +81-80-3577-3042

• Korea: Peter Ok, Business Development Director


• Greater China: Mavis Wang, Director of Greater China Business

Development


• Europe: Lizzie Levenez, EMEA Business Development Manager

Email: [email protected] - +49 15 123 544 182

• RoW: Jean-Christophe Eloy, CEO & President, Yole Développement

Email [email protected] - +33 4 72 83 01 80

o FINANCIAL SERVICES (in partnership with Woodside Capital

Partners)

• Jean-Christophe Eloy, CEO & President

Email: [email protected] - +33 4 72 83 01 80

• Ivan Donaldson, VP of Financial Market Development


o CUSTOM PROJECT SERVICES

• Jérome Azémar, Technical Project Development Director

Email: [email protected] - +33 6 27 68 69 33

o GENERAL

• Camille Veyrier, Director, Marketing & Communication

Email: [email protected] - +33 472 83 01 01

• Sandrine Leroy, Director, Public Relations

Email: [email protected] - +33 4 72 83 01 89 / +33 6 33 11 61 55

• Email: [email protected] - +33 4 72 83 01 80

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