multichannel readout system of inner tracker for nica-mpd rogov victor afi, jinr, dubna afi.jinr.ru
TRANSCRIPT
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Multichannel readout system of inner tracker for NICA-MPD
Rogov VictorAFI, JINR, Dubna
Afi.jinr.ru
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Short data about NICA/MPD
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Short data about Inner Tracker
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The work purpose• The development of a prototype of front-end-
electronics for readout information from CBM01-B2 board
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Collaboration– Scientific Research Technological Institute of
Instrument Engineering (SE SRTIIE Ukraine) – Helmholtz Centre for Heavy Ion Research (GSI
Germany) – Joint institute for nuclear research (JINR Russia)
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Problems• The analysis of the existing multichannel
chargesensetive preamplifiers for experiments of physics (JINR);
• The analysis of main principles and methods of development of chips-adapters for open-frame installation of multichannel preamplifiers (JINR- SE SRTIIE);
• Research of technological parameters, development and manufacture of chip-adapter (SE SRTIIE);
• PCB layout development (JINR);• Assembling and testing sample modules of
front-end-electronics (JINR);Afi.jinr.ru
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The base readout system
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The sensor board СВМ01В2
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Key Features• mixed signal chip, 128 channels,1 test channel with
analogue diagnostic output, available for positive and negative signals
• self triggered, data driven de-randomizing, readout at 32 MHz
• digital time stamp output, analogue peak hight output
• analogue pile-up registry, programmable dead time, local threshold adjustment, dynamic Range: 120000 e
• Shaping time and noise performance:• 18 ns fast shaper at 30 pF input, 850 enc for
positive signals, 1000 enc for negative signals• 140 ns slow shaper at 30 pF input, 600 enc• Timing resolution ~ 2-3 ns, time stamp resolution 1
ns
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The problems of existing FEB’s
-three layer pads
-small pitch of pads – 50 uM-A considerable quantity of bonding points - Low mechanical durability-Possibility of short circuit of donding
conductors
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The offered solutions • For decrease in probability of short circuit at bonding
point’s, augmentations of a conductors pitch, total reduction of bonding point’s on PCB, augmentations of mechanical strength, a possibility of testing n-Xyter before bonding on pcb, suggested to develop the chip-adapter, which:
• Increases pitch of tab bonding point’s with 100 to 300 microns for entrance pad’s, and 100 microns to 400 for out pad’s;
• Provides installation of the chip-adapter with a microcircuit at one layer of PCB.
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TAB Bonding point’s of chip-adapter with PCB
Chip-cableAfi.jinr.ru
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The design sketch
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3D model and manufactured FEB
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Chip-adapter with n-Xyter
Input’s
Output&CTRLCTRL(i2c)
ADC
DCinput
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Evolution of system with chip adapters
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Conclusions–The first prototype and tests of FEB ware made
–Research of testing with senson board СВМ01В2
–New FEB with new n-Xyter
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Thank you
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0.60
0.65
0.70
0.75
0.80
0.85
0.90
0.95
1.00
220 230 240 250 260 270 280 290
время формирования маски, с
тол
щи
на
мас
ки,
мкм
20
25
30
35
40
45
50
4 5 6 7 8 9 10время экпонирования, с
ши
ри
на, м
км
ширина проводника по фоторезистивной маске
ширина проводника после травления
Research of a photoresistive maskthickness (250 seconds are chosen)
Research of exhibiting time of a photoresistive mask from a conductive layer(7 seconds are chosen)
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0
5
10
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25
30
35
40
0.0 0.2 0.4 0.6 0.8 1.0 1.2содержание ПАВ, %
ши
ри
на п
ро
во
дни
ка/к
ли
н тр
авл
ени
я, м
км
ширина основания проводникаширина вершины проводникаклин тавления (на две стороны)
25
27
29
31
33
35
37
39
41
43
45
55 60 65 70 75 80 85время травления, с
ши
ри
на п
ро
во
дни
ка,м
км
Research of influence the maintenance of SAS in etchant at etching of aluminium layer on a etching wedge (0,7 %)
Research of etching time of a conductive layer of aluminium (75 seconds chosen)
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10
15
20
25
30
35
40
45
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60 65 70 75 80 85температура травления, град
ши
ри
на п
ро
во
дни
ка/к
ли
н тр
авл
ени
я,м
км
ширина проводника в зоне травления
клин травления окна в полиимиде (на две стороны)
10
15
20
25
30
35
40
10 20 30 40 50 60 70время травления, с
шир
ина
пров
одни
ка, м
кмResearch of temperature effect of etchant on dielectric layer.(75 degrees)
Research of polyimide layer etching time (40 seconds are chosen)
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