mtt presentation - abstract / introductionsapps.richardsonrfpd.com/mktg/pdfs/empower-2014ims.pdf ·...

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Slide 1

MTT Presentation - Abstract / Introductions

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Slide 2

Agenda and Key Questions - to keep us on track

A brief introduction Who is this Company – Empower RF Systems? What’s the connection with Arrow RF & Power?

“Size Matters” product and technology information What is it? Where does it go? Why should I care?

Summary Comments / Q & A What else is new?

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Slide 3

Company Introduction

Founded in 1999 Private equity investment in 2006 Headquarters, fully equipped R&D and in-house manufacturing located in Inglewood, CA East Coast design center and sales office in Holbrook, New York - additional design partnership in South Korea CM partnerships to handle both small and large scale requirements. Fully credentialed, ITAR registered and ISO 9001:2008 certified, U.S. based, small business

Product configurations - base modules - multi-function modules - rack mount integration Frequency coverage to 6 GHz Output power levels 10’s of Watts, 100’s of Watts Up to Multi-kW

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Slide 4

Value Proposition

We provide broadband, high power amplifier solutions to OEM systems designers and end users who build on the performance of our units for their own solutions in electronic attack (jammers), communications, radar / avionics, and test and measurement applications

What do we deliver - competitively and/or better than anyone else?

- broadband and band specific, solid state power amplifiers - device agnostic designs (LDMOS, GaN, etc) - thermal management and frequency coverage in lower bands and up to 6 GHz - demonstrated “power density” with new hardware architecture is unrivaled, at present - emergence of our monitoring and control architecture - embedded web server, internal network - global reach, impressive customer list, and unique (among competitors) inventory program

Other headlines

Next generation, “Size Matters” 1 kW product platform selected as an Editor’s Choice and Top Technology product - additional recognition via product features and industry notes from an array of media sources.

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Slide 5

Product Portfolio

Broadband and band specific, power amplifier solutions, 6 GHz and below

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Slide 6

Markets of Focus and Importance

Electronic Attack

Test & Measurement

Communications

Radar

SatCom

Wireless Infrastructure

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Slide 7

Unique program and partnership with Arrow RF & Power

A selection of “best choice” building block modules are always available from stock

high power, rack mount promotion also

featured and units also available from stock

“live” updates on stock status viewable from our website

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Slide 8

Agenda and Key Questions - to keep us on track

A brief introduction Who is this Company – Empower RF Systems? What’s the connection with Arrow RF & Power?

“Size Matters” product and technology information What is it? Where does it go? Why should I care?

Summary Comments / Q & A What else is new?

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Slide 9 Slide 9

size / weight / power is unprecedented

Legacy Platforms Next Generation

“Size Matters” high power amplifier platforms

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Slide 10

Standard Hardware Architecture

1 kW PA platforms

single 5U chassis, rack mount PA significant size reduction (up to 75%)

power density improvements (up to 8X) est 80% common parts re-use, manufacturing efficiencies

DSA1193 Driver Amplifier

CONN: TYPE N – FEMALE50 OHM

Nominal Input: +0dBm

4-Way0º

Splitter

+V

6

CPUSTANDBY CONTROL

TRANSMIT / RECEIVE CONTROLFORWARD POWER MONITORREVERSE POWER MONITOR

TEMPERATURE MON.FAULT MONITORING

FAN CONTROL

A1

FWD

REFDetector

DetectorTPS_PA1

Fault_PA1

TPS_PA2

Fault_PA2

TPS_PA3

Fault_PA3

VCNTRL_1

Control System & Power Distribution

EXT FAN CONTROL

DB-9 -Female

+3.3V +V

Polarity Inverting

Converter

-8V

Post Regulator

+8V

USBVVA_CNTRL

RELAY_CNTRL_1

RELAY_CNTRL_2

SPARE

SPARE

INTE

RFA

CE

BO

AR

D

ETHERNET

RS485

Q1

Q2

2:12:1

Power Amplifier

Q3

Q4

BA

LUN

BA

LUN

BA

LUN

BA

LUN

4

SPI/I2C4

µCmemory

TempCurrent/EnableAlarm

I2C /SPI Temp sense

I2C /SPI ADC’s

I2C /SPI DAC’s

RS485

Q1

Q2

2:12:1

Power Amplifier

Q3

Q4

BA

LUN

BA

LUN

BA

LUN

BA

LUN

4

SPI/I2C4

µCmemory


I2C /SPI Temp sense

I2C /SPI ADC’s

I2C /SPI DAC’s

RS485

Q1

Q2

2:12:1

Power Amplifier

Q3

Q4

BA

LUN

BA

LUN

BA

LUN

BA

LUN

4

SPI/I2C4

µCmemory


I2C /SPI Temp sense

I2C /SPI ADC’s

I2C /SPI DAC’s

RS485

Q1

Q2

2:12:1

Power Amplifier

Q3

Q4

BA

LUN

BA

LUN

BA

LUN

BA

LUN

4

SPI/I2C4

µCmemory


I2C /SPI Temp sense

I2C /SPI ADC’s

I2C /SPI DAC’s

memory

I2C /SPI Temp sense

I2C /SPI ADC’s

I2C /SPI DAC’s

RS485

4

SPI/I2C4

TempCurrent/EnableAlarm µC

AC

Circuit Breaker3-pole ganged

SSR

AC/DC1500W

L1

L2

V+

V-

I2C

AC/DC1500W

L1

L2

V+

V-

I2C

AC/DC1500W

L1

L2

V+

V-

I2CAC/DC12V-15W

L1

L2

V+

V-

Con

trol

I2 C

RS232/RS422

RS-485 Remote Bus

SYS I/O

Serial Coms Interface

Ethernet Interface

USB Interface

RS-485 (expansion bus)

CPU(ARM) memory

System I/O

SPI

I/O

Limiter

Phase Shifter VVA

Small Sig Processing

Touchscreen LCD

Freq comp

Network

RMS/ENV DetectorAD5511

RF SWITCHFreq comp

NetworkLPF

CONN: TYPE SC – FEMALE

50 OHM

Nominal Output: +60dBm /1000W

4-Way0º

Combiner

20-1000MHz1500W

Dual Directional

Coupler

-50dB

-50dB

-0.2dB

Nominal Output: +10dBm

CONN: TYPE SMA – FEMALE50 OHM

REF OUTPUT



FWD OUTPUT



SAMPLE OUTPUT

patent pending

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Slide 11

Standard Hardware Architecture 500W PA platforms

single 3U chassis, rack mount PA leveraging the same HW and SW architecture

size reduction and power density improvements est 80% common parts re-use, manufacturing efficiencies

DSA1193 Driver Amplifier

CONN: TYPE N – FEMALE50 OHM

Nominal Input: +0dBm

4-Way0º

Splitter

+V

6

CPUSTANDBY CONTROL

TRANSMIT / RECEIVE CONTROLFORWARD POWER MONITORREVERSE POWER MONITOR

TEMPERATURE MON.FAULT MONITORING

FAN CONTROL

A1

FWD

REFDetector

DetectorTPS_PA1

Fault_PA1

TPS_PA2

Fault_PA2

TPS_PA3

Fault_PA3

VCNTRL_1

Control System & Power Distribution

EXT FAN CONTROL

DB-9 -Female

+3.3V +V

Polarity Inverting

Converter

-8V

Post Regulator

+8V

USBVVA_CNTRL

RELAY_CNTRL_1

RELAY_CNTRL_2

SPARE

SPARE

INTE

RFA

CE

BO

AR

D

ETHERNET

RS485

Q1

Q2

2:12:1

Power Amplifier

Q3

Q4

BA

LUN

BA

LUN

BA

LUN

BA

LUN

4

SPI/I2C4

µCmemory


I2C /SPI Temp sense

I2C /SPI ADC’s

I2C /SPI DAC’s

RS485

Q1

Q2

2:12:1

Power Amplifier

Q3

Q4

BA

LUN

BA

LUN

BA

LUN

BA

LUN

4

SPI/I2C4

µCmemory


I2C /SPI Temp sense

I2C /SPI ADC’s

I2C /SPI DAC’s

RS485

Q1

Q2

2:12:1

Power Amplifier

Q3

Q4

BA

LUN

BA

LUN

BA

LUN

BA

LUN

4

SPI/I2C4

µCmemory


I2C /SPI Temp sense

I2C /SPI ADC’s

I2C /SPI DAC’s

RS485

Q1

Q2

2:12:1

Power Amplifier

Q3

Q4

BA

LUN

BA

LUN

BA

LUN

BA

LUN

4

SPI/I2C4

µCmemory


I2C /SPI Temp sense

I2C /SPI ADC’s

I2C /SPI DAC’s

memory

I2C /SPI Temp sense

I2C /SPI ADC’s

I2C /SPI DAC’s

RS485

4

SPI/I2C4

TempCurrent/EnableAlarm µC

AC

Circuit Breaker3-pole ganged

SSR

AC/DC1500W

L1

L2

V+

V-

I2C

AC/DC1500W

L1

L2

V+

V-

I2C

AC/DC1500W

L1

L2

V+

V-

I2CAC/DC12V-15W

L1

L2

V+

V-

Con

trol

I2 C

RS232/RS422

RS-485 Remote Bus

SYS I/O

Serial Coms Interface

Ethernet Interface

USB Interface

RS-485 (expansion bus)

CPU(ARM) memory

System I/O

SPI

I/O

Limiter

Phase Shifter VVA

Small Sig Processing

Touchscreen LCD

Freq comp

Network

RMS/ENV DetectorAD5511

RF SWITCHFreq comp

NetworkLPF

CONN: TYPE SC – FEMALE

50 OHM

Nominal Output: +60dBm /1000W

4-Way0º

Combiner

20-1000MHz1500W

Dual Directional

Coupler

-50dB

-50dB

-0.2dB



REF OUTPUT



FWD OUTPUT



SAMPLE OUTPUT

Eliminate two pallets modify the combiner shorten heatsink fins

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Slide 12

Standard Software / Firmware Architecture

Control System

ARM microprocessorFPGA

LCD DisplayFront Panel Fans

Rear Panel Fans and Connectivity Interface

RF ModulesRS 485

Power Supply

Front Panel LCDsimplified, single screen format

Front Panel LCDsimplified, single screen format

Remote GUI (via laptop)detailed, “drill down” diagnostics

and control / configuration

Remote GUI (via laptop)detailed, “drill down” diagnostics

and control / configuration

DSP

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Slide 13

Standard Architecture - Power Supply Configuration

AC Distribution

System

PS140 to 48Vdc

PS240 to 48Vdc

PS340 to 48Vdc

AuxiliaryPower Supply

24Vdc, 12Vdc, 5Vdc

I2C

80% commonality of parts across multiple platforms is a manufacturing and design advantage Power Supplies also tied to the monitoring and control architecture via RS485 Standard power supply architecture is configurable (per customer requirements) to be either mono-phase, Bi-phase, or three phase

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Slide 14

Leveraging the architecture - variations on the common platform Product

2066500 to 1000 MHz, 1 kW in 5UIKS incl SP2T switch and filter assy

212620 to 500 MHz, 1 kW in 5UIKS incl SP8T switch and filter assy

60123100 to 3500 MHz, 1.3 kW pulse in 3U

216220 to 1000 MHz, 1 kW in 5U

2164200 to 1000 MHz, 1 kW pulse in 3U

21631000 to 1500 MHz, 3 kW pulse in 3U

21671500 to 1700 MHz, 2 kW CW, 8U + Encl

21682000 to 2500 MHz, 800W P1dB, 5U + Encl

21712000 to 2160 MHz, 1 kW P1dB, 5U + Encl

217520 to 1000 MHz, 500W in 3U

21701000 to 3000 MHz, 1 kW in 5U L-Band – 2 kW S-Band - 800W P1dB

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Slide 15

An Illustration - Dual Deck Design - L-Band, 2 kW

“back to back” RF decks in 5U chassis - power supplies and control (not shown) in 3U chassis

Rear Panel

+V

BU

S B

AR

4-Way0º

Combiner

Nominal Input:

+0dBm

4-Way0º

Splitter

RS4852

Phase Shifter VVA

Small Signal Processing

RS485


RS485


4-Way0º

Combiner4-Way

0ºSplitter

RS4852

2-WaySplitter

CPUSTANDBY CONTROLTEMPERATURE MON.FAULT MONITORING

FAN CONTROL

A1

DB-9 -Female

USB

ETHERNET

RS232/RS422

RS-485 Remote Bus

SYS I/OCPU(ARM) memory

2-WayCombiner / Directional

Coupler


2µC

memor

y I2C /SPI

Temp sense

I2C /SPI

ADC’s

I2C /SPI

DAC’s

1.5 to 1.7GHzGain ~ 15dB

2µC

memor

y I2C /SPI

Temp sense

I2C /SPI

ADC’s

I2C /SPI

DAC’s

1.5 to 1.7GHzGain ~ 15dBRS485


RS485


2µC

memor

y I2C /SPI

Temp sense

I2C /SPI

ADC’s

I2C /SPI

DAC’s


2µC

memor

y I2C /SPI

Temp sense

I2C /SPI

ADC’s

I2C /SPI

DAC’s


+V

BU

S B

AR

RS485


RS485


2µC

memor

y I2C /SPI

Temp sense

I2C /SPI

ADC’s

I2C /SPI

DAC’s


2µC

memor

y I2C /SPI

Temp sense

I2C /SPI

ADC’s

I2C /SPI

DAC’s

1.5 to 1.7GHzGain ~ 15dBRS485


RS485


2µC

memor

y I2C /SPI

Temp sense

I2C /SPI

ADC’s

I2C /SPI

DAC’s


2µC

memor

y I2C /SPI

Temp sense

I2C /SPI

ADC’s

I2C /SPI

DAC’s


1199 – Driver Amplifier

G~55dBmemory

I2C /SPI Tem

p sens

e

I2C /SPI

ADC’s

I2C /SPI

DAC’s

TempCurrent/EnableAlarm µ

C

1199 – Driver Amplifier

G~55dBmemory

I2C /SPI Tem

p sens

e

I2C /SPI

ADC’s

I2C /SPI

DAC’s

TempCurrent/EnableAlarm µ

C

Small Signal Processing

Fan Distribution

2167 – 2000W 1.5 to 1.7 GHz

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Slide 16

Streamlined design - mechanical and electrical

legacy design (obsolete)

………….. Next generation designs …………

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Slide 17

20 to 520 MHz PA Module 125W P3dB, minimum – full bandwidth

required, consistent placement of inputs / outputs, digital controls, devices, and thermal

management materials

High Performance Modules – example of the driver layout

pictured here model 1163

20 to 520 MHz

20 to 1000 MHz PA Module 100W P3dB, minimum – full bandwidth

2500 to 6000 MHz PA Module 100W Psat, minimum – full bandwidth

1000 to 3000 MHz PA Module 100W Psat, minimum – full bandwidth

pictured here model 1199

1000 to 3000 MHz

Circuit / devices not shown in detail

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Slide 18

Design Example - output pallet footprint and layout required

4”

8”

4 x 8” footprint required, consistent placement of key inputs / outputs, digital control, devices, and thermal management materials

Circuit / devices not shown in detail

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Slide 19

The focus of our efforts - near term

Requested next platforms - 1 to 3 GHz, 1 kW, 5U platform (underway)

- Lower power (2 pallet) versions of GCA in 3U

- Customer specific, and complimentary fan outs

- 10 kHz to 230 MHz, max power in 5U chassis

- 2 to 6 GHz TWT replacement in 4U chassis

- Scalable power solution for 2.0 blocks

FWD REV

Scalable, Building Block ConfigurationCombining and Control Using Standard Components to Maximize Flexibility

Laptop

Stan

dard

Com

bine

r ("N

" w

ay a

s req

'd)

Coupler

Standard Power Meter

Exci

ter /

Sig

nal S

ourc

e

Stan

dard

Div

ider

("N

" w

ay a

s req

'd)

1 kW "size matters" HPA(standard building block)




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Slide 20 Slide 20

Summary Comments / Q&A

Come See for Yourself Live Demo - Booth #523

also on display

building block modules system control software design partner products

mtt presentation - abstract / introductionsapps.richardsonrfpd.com/mktg/pdfs/empower-2014ims.pdf ·...

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