mstp+ product overview v200r011-20101110-a

8/10/2019 MSTP+ Product Overview V200R011-20101110-A

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HUAWEI ConfidentialHUAWEI TECHNOLOGIES Co., Ltd.

01/18/15

MSTP+ ProductOverview

MST !od"#t Tea$, Net%o!&!od"#t Se!'i#e (e)t.


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HUAWEI TECHNOLOGIES CO., LT(. a*e +

Wit NG-S(H 00 011 a t e $ain 'e! ion,t e MST 2 )!od"#t )!o'ide t e )a#&et

%it# in* feat"!e and "))o!t t e $oot")*!ade f!o$ MST e3"i)$ent to MST 2e3"i)$ent.


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HUAWEI TECHNOLOGIES CO., LT(. a*e 4

Guidanceefo!e ta&in* t i #o"! e, 6o" o"ld a'e t e

follo%in* &no%led*e7a i# on S(H, Et e!net, and M LSelated &no%led*e on MST )!od"#t


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Ob ectivesU)on #o$)letin* t i #o"! e, 6o" o"ld $eet t e follo%in*o 9e#ti'e 7

e fa$ilia! %it o!ientation and feat"!e of t e MST 2)!od"#t .Unde! tand net%o!&in* a))li#ation #ena!io and e!'i#efeat"!e of t e MST 2 )!od"#t .Unde! tand t e a!d%a!e feat"!e of t e MST 2 )!od"#t .


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HUAWEI TECHNOLOGIES CO., LT(. a*e :

a!t I ;eat"!e of MST 2 !od"#ta!t I ;eat"!e of MST 2 !od"#t

a!t II A))li#ation S#ena!io of MST 2 !od"#t

a!t III ;eat"!e of MST 2 !od"#t


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7/83HUAWEI TECHNOLOGIES CO., LT(. a*e 8

0alues o# MSTP+ Products

> Provides and o$timi1es the IP 23" solution.

? I o!iented to !oad and on $o ile net%o!& .

> T!an )o!t data e!'i#e , % i# !e3"i!e i* and%idt , %it lo% #o t .

> eali@e #a!!ie!-#la t!an )o!t on $o ile net%o!& in a )e#t "# a #lo#& and oS.

> In e!it 6ea! of $aintenan#e e=)e!ien#e of #a!!ie! net%o!& .

? eali@e e'ol"tion of #a!!ie! net%o!& to%a!d All-I and a# ie'e a!in* of B0 of G, +G,

and LTE ite .

> eali@e e'ol"tion to%a!d All-I t !o"* t e MST e3"i)$ent in la!*e- #ale de)lo6$ent

and )!ote#t e=i tin* in'e t$ent.

> W at a!# ite#t"!e o"ld t e MST )!od"#t to e )"!# a ed a'e to "))o!t e'ol"tion to

All-I D

> Inte%rates the PT" #eatures on the traditional MSTP $roducts to su$$ort smooth

evolution o# MSTP $roducts.


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Nati'e )a#&etNati'e T(M

End-to-end $ana*e$ent and #ont!ol

Lo% TCO in t e enti!e life #6#le

("al #o!e T(M and )a#&etF

S"))o!t $oot ")*!adeI #o$)ati le %it MST

End-to-end $ana*e$ent T(M do$ain and

)a#&et do$ainUnified #ont!ol )latfo!$ a ed on GM LSUnified NMS

PT" #eatureso# MSTP +

Co$)letel6 #o$)ati le %it NG-S(H, e$ edded$i#!o%a'e, and e$ edded W(M

S$oot ")*!ade

A )a#&et #o!e i added on t e a i of t eo!i*inal T(M #o!e. T e fo!$e! #an )!o#e

)a#&et e!'i#e a ed on M LS.T e T(M and )a#&et e!'i#e #an e *!oo$edt !o"* eit e! #o!e.

S"))o!t nati'e ;E/ GE/10GE.S"))o!t M LS and i$)!o'e effi#ien#6 6 )a#&ett!an )o!t.S"))o!t t e )a#&et 6n# !oni@ation #lo#& ol"tion.

A# ie'e t e e t #o t-effe#ti'ene of )a#&et t!an )o!t.

S"))o!t nati'e E1, T1, STM-1, STM-4,STM-1:, and STM-:4

A# ie'e t e lo%e t TCO fo! T(M t!an )o!t

3rchitecture o# MSTP+ $roducts

PT" #eatures o# MSTP+ $roducts:T(M/)a#&et d"al #!o -#onne#t $at!i=eUnified )latfo!$, 6n# !oni@ation of d"al #lo#& , anda##e of $"lti)le #lo#&End-to-end ASON/GM LS

4eatures o# the MSTP+ Products

TDM+packetswtich

P( 5

3TM6 OS

thernet

T*M3TM6 OS


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"GS*7 0829 ; Plans #or MSTP $roducts ? NG-S(H ? Met!o 1000

> Planned 0ersions

? NG-S(H> 1 BC0+---OSN 1500, OSN +500

> 1 BC05---OSN +500, OSN


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Smooth volution - @am$le: O$tiA OS" 5?;;/

T(M

T(MT T

GS

GS

8 OS

G 44G8;G8;G

S

SM32T

8

PIU

PIU

3UA

(P(P

G

8 ; G .

Ste$ 8 e)la#e t e tand 6 T(M #!o -#onne#t oa!d%it a d"al-#o!e #!o -#onne#t oa!d. T en, %it# t e

e!'i#e f!o$ t e a#ti'e T(M #!o -#onne#t oa!d to t ed"al-#o!e #!o -#onne#t oa!d.

Ste$ < e)la#e t e a#ti'e T(M #!o -#onne#t oa!d %it a d"al-#o!e #!o -#onne#t oa!d. T en, %it# t e e!'i#ef!o$ t e tand 6 d"al-#o!e #!o -#onne#t

oa!d to t e a#ti'e d"al-#o!e #!o -#onne#toa!d. T e %it# in* ti$e i le t an 50

$ .

W en #onfi*"!ed %it TN e!'i#e)!o#e in* oa!d , t e e3"i)$ent #an e" ed to "ild a TN net%o!& %it o"t an6i$)a#t on t e e=i tin* T(M e!'i#e .

STM&n

STM&n

SM32T

8

STM&n

STM&86B

S T M & 8 > 6 > B

8. 4or 0


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HUAWEI TECHNOLOGIES CO., LT(. a*e 1+

a!t I ;eat"!e of MST 2 !od"#t

a!t II A))li#ation S#ena!io of MST 2 !od"#ta!t II A ))li#ation S#ena!io of MST 2 !od"#t

a!t III ;eat"!e of MST 2 !od"#t


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Overview o# MSTP+ "etwor,in% & oe@istence o#T*M and Pac,et *omains

8;G

STM&8>6>B

STM&86B

CTS

8

OS" 5?;; OS" 5?;;

W en I -o!ientation of t e enti!e net%o!& i #o$)lete, t e MSTe3"i)$ent #an e f"!t e! t!an fo!$ed into )a#&et-onl6 e3"i)$ent to$eet t e t!an )o!t !e3"i!e$ent of ne% e!'i#e .

3%%re%ation node

O$tiA OS" 5?;;68?;;6M8;;;

Pac,et A

T*M A

STM&86B6IM3 86"ative 8

STM&8>6>B

G 68;G

T*MD$ac,et dual&domaincross&connect board

4 6G

OS" 8?;;Metro8;;;

OS" 8?;;Metro8;;;

"odeC

4

G 2in%

2" CS

CTS 8

"odeC4

" o d e C

4 .

2 " :

Ne% )a#&et e!'i#e !ai e ne% !e3"i!e$ent on t e t!an )o!t net%o!&%it !e )e#t to and%idt "tili@ation, e!'i#e $ana*e$ent, )!ote#tion,and e3"i)$ent $aintenan#e. Hen#e, t e t!aditional net%o!& a to e!e#on t!"#ted fo! )a#&et e!'i#e .

;o! #oe=i ten#e of ne% and old e!'i#e , t e MST e3"i)$ent on t eli'e net%o!& o"ld e ")*!aded to t e MST 2 e3"i)$ent %it d"aldo$ain . T en, t e S(H e!'i#e on t e li'e net%o!& a!e not affe#tedand a ette! ea!e! #an e )!o'ided to t e ne% )a#&et e!'i#e .


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If #e!tain e3"i)$ent on t e li'e net%o!& i not"ita le fo! ")*!ade, t e ot e! e3"i)$ent #an e

")*!aded fo! 6 !id net%o!&in* %it TN)!od"#t .

At t e a**!e*ation la6e!, t e e3"i)$ent #an

e ")*!aded to MST 2 e3"i)$ent and t e#a)a#it6 #an e e=)anded 6 " in* 10GEoa!d . T en, t e e3"i)$ent #an e

net%o!&ed %it t e O)ti TN +B00 to "ild a10GE !in* net%o!&.

At t e a##e la6e!, t e O)ti OSN 1500 o!O)ti Met!o 1000 #an e net%o!&ed %it t eO)ti TN B10/B50/1B00 to "ild a GE !in*

net%o!&, % i# i #onne#ted to t ea**!e*ation la6e!.

T e T 000 #an $ana*e ot t e TN andMST 2 )!od"#t .

MSTP+ Product "etwor,in% E 7ybrid"etwor,in% with PT" Products

8;G

STM&86B

STM&8>6>B

CTS

8

G 2in%

"odeC

4

OS"5?;;

PT" 59;;

"odeC

4

OS" 8?;;Metro8;;;

PT" 9?;689;;

PT" 98;69?;689;;;

2" CS

OS"5?;;OS" 8?;;

Metro8;;;

CTS

8

NMS/T 000

"odeC

4

OS" 8?;;Metro8;;;


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HUAWEI TECHNOLOGIES CO., LT(. a*e 1:

a!t I ;eat"!e of MST 2 !od"#t

a!t II A))li#ation S#ena!io of MST 2 !od"#t

a!t III ;eat"!e of MST 2 !od"#ta!t III ;eat"!e of MST 2 !od"#t


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HUAWEI TECHNOLOGIES CO., LT(. a*e 1 board


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HUAWEI TECHNOLOGIES CO., LT(. a*e F = 88 8< 85 8B 8? 8> 8F 8=


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S$eci#ications o# the *ual&*omain ross&onnect Coard on the OS" 5?;;

Main s$eci#ications

? e!fo!$ 00 G it/ C-4 i* e! o!de! #!o -#onne#tion , 0 G it/ C-+/ C-1lo%e! o!de! #!o -#onne#tion ,and 100 G it/ )a#&et #!o -#onne#tion .

? S"))o!t 6n# !ono" Et e!net #lo#& .

? S"))o!t 121 ot a#&").

? S"))o!t IEEE 1588 ' #lo#& .

? S"))o!t a $a=i$"$ )o%e! #on "$)tion of 80 W.

4or smooth evolution o# the OS" 5?;; e'ui$ment the ori%inal cross&connect

board needs to be re$laced.

? ;o! detail on t e !e t!i#tion , ee t e lide of MSTP+ Smooth Evolution .

" F = 88 8< 85 8B 8? 8> 8F

T*Mca$acity 5G 5G 5G 5G

10G

10G

0G

0G

0G

0G

10G

10G

10G 5G

10G

Pac,etca$acity

.5G

.5G

.5G 5G 5G 5G

10G

0G

0G

10G 5G 5G 5G

.5G


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HUAWEI TECHNOLOGIES CO., LT(. a*e B

7i%h&Per#ormance S Coard -"B6">GS /

Main s$eci#icationsP(6Tunnel "BGS L


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HUAWEI TECHNOLOGIES CO., LT(. a*e +0

S$eci#ications o# the SS"


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HUAWEI TECHNOLOGIES CO., LT(. a*e +1

S$eci#ications o# the SS"8P A< Coard

Main s$eci#ications

? !o'ide =10GE o)ti#al inte!fa#e , % i# #an e #olo!ed o)ti#al inte!fa#e and

#an a##e and )!o#e =10GE e!'i#e .

? S"))o!t M LS t"nnel/ W A S, and LAG *!o") .

? S"))o!t E-Line and E-LAN e!'i#e .

? S"))o!t 6n# !ono" Et e!net and IEEE 1588 ' .

? S"))o!t ETH OAM, M LS OAM, and H- oS.

? S"))o!t 0 G it/ e!'i#e in f"ll d")le= $ode.Slot restrictions:

OS"

5?;;

0alid Slot Candwidth OS"

F?;;

0alid Slot Candwidth

Slot 1-+, and 1: .5 G it/ Slot 1- 4, 15-18, and :- B : G it/

Slot 4-:, and 1+ -15 5 G it/ Slot 5-8, 11-14, +0, and +1 10 G it/

Slot < and 1 10 G it/

Slot 8 and 11 0 G it/

"8P AP AL"

Inter#ace slot

OS" 8?;;C

OS" 8?;;3

Lar%e service slot A la!*e lot #an edi'ided into t%o

$all lot .>P GSP AL"

Lar%e service slot A la!*e lot #an edi'ided into t%o

$all lot .>P GS thernet a%%re%ation service: &3%%r service

&3%%r service: a multi$oint&to&$oint -MP


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HUAWEI TECHNOLOGIES CO., LT(. a*e :0

PS"

thernet Service arrier Modes on PS"s

> On a PS" thernet services can be carried by $orts P(s or HinH lin,s.> The #ollowin% #i%ure shows how thernet services are carried by P(s.

MPLS tunnel

W1

W

Port

MPLS tunnel

P( Mbit6sI2 ! > Mbit6s

UserLAN

CIII2 ! ?8< ,bit6s

PI2 ! 8> Mbit6s

I2 ! < Mbit6sPI2 ! < Mbit6s G

8;GS*7OT"

Voice (COS = EF)

Video (COS = AF4)

Data (COS = BE)

UNI: H-QoS NNI: DS-TE

PT"

"odeC

CTSPT"

S2

2"

MS Gey account customers


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HUAWEI TECHNOLOGIES CO., LT(. a*e : nd&to&end monitorin% by layer ensures #ast #ault locatin%.> The hardware&based O3M #eature - PU not involved/ avoids so#tware

$er#ormance de%rade when the amount o# O3M services increases.

Service&layer O3M -U"I to U"I/

I =;


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HUAWEI TECHNOLOGIES CO., LT(. a*e :8

loc,6Time Synchroni1ation Solutions

> The cloc,6time synchroni1ation solutions are as #ollows:

? Clo#& i*nal a!e t!an $itted 'ia t e IEEE 1588 )!oto#ol. T e IEEE 1588 #lo#& o)e!ate at t e a$e f!e3"en#6 and in

t e a$e ) a e, and !e3"i!e t e "))o!t f!o$ all t e t!a'e! in* node .

? Clo#& i*nal a!e t!an $itted o'e! t e 6n# !ono" Et e!net. T e 6n# !ono" Et e!net #lo#& i i$ila! to t e S(H #lo#&. To e

)e#ifi#, t e 6n# !ono" Et e!net #lo#& o)e!ate at t e a$e f!e3"en#6, feat"!e i* ta ilit6, and !e3"i!e t e "))o!t f!o$

all t e t!a'e! in* node .

;E/GE

GE/;E

Node

2"

PT"Node

;E/GE

;E/GE ITS


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HUAWEI TECHNOLOGIES CO., LT(. a*e :B

Pac,etcore

T*Mcore

E( 41oa!d

a#&etoa!d

STM&86Brin%

8;G 6Grin%

o* Scenario 8

oS si%nals are received at the S*7 $ort o# the *HB8 board and then sent

to the $ac,et domain a#ter bein% $rocessed by the *HB8 board.


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mstp+ product overview v200r011-20101110-a

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