mos
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MIS Diode (MOS capacitor) – Ideal
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EC
EF
EV
Ei
Ideal MIS Diode n-type, Vappl=0
Assume Flat-band at equilibrium
qS
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ECE 663
Ideal MIS Diode p-type, Vappl=0
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ECE 663
Band bending due to work function difference
msFBV
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ECE 663
Accumulation
Pulling in majority carriers at surface
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ECE 663
Depletion
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ECE 663
Need CB to dip below EF. Once below by B, minority carrier density trumps the intrinsic density. Once below by 2B, it trumps the major carrier density (doping) !
Inversion
B
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Some important equations in the inversion regime (Depth direction)
VT = ms + 2B + ox
Wdm = [2S(2B)/qNA]
Qinv = Cox(VG - VT)
ox = Qs/Cox
Qs = qNAWdm
VT = ms + 2B + ([4SBqNA] - Qf + Qm + Qot)/Cox
Substrate
Channel Drain
InsulatorGate
Source
x
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ECE 663
P-type semiconductor Vappl0
Convention for p-type: positive if bands bend down
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ECE 663
Substrate
Drain
InsulatorGate
Source Channel
Substrate
InsulatorGate
Channel
MOScap MOSFET
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Operation of a transistorVSG > 0 n type operation
Positive gate bias attracts electrons into channelChannel now becomes more conductive
Substrate
Channel Drain
InsulatorGate
Source
VSD
VSG
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Substrate
Channel Drain
InsulatorGate
Operation of a transistor
Transistor turns on at high gate voltageTransistor current saturates at high drain bias
Source
VSD
VSG
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Saturation Regionoccurs at large VDS
pn+n+
metal
sourceS
gateG
drainD
bodyB
oxide
+-
+++
++++++
VDS large
As the drain voltage increases, the difference in voltage between the drain and the gate becomes smaller. At some point, the difference is too small to maintain the channel near the drain pinch-off
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Simplified MOSFET I-V EquationsCut-off: VGS< VT
ID = IS = 0
Active: VGS>VT and VDS < VGS-VT
ID = kn’(W/L)[(VGS-VT)VDS - 1/2VDS
2]
Saturation: VGS>VT and VDS > VGS-VT
ID = 1/2kn’(W/L)(VGS-VT)2