m. alfonsi lnf/infn cagliari 5 may 2006 m1r1 mechanical requirements space constraint frame and...

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M. Alfonsi LNF/INFN Cagliari 5 May 2006 M1R1 mechanical requirements Space constraint Frame and pannel Pads readout and trigger sectors Gas inlet and outlet Low material budget Gem foils Honeycomb technology

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M. Alfonsi LNF/INFN Cagliari 5 May 2006

M1R1 mechanical requirements

Space constraint Frame and pannel Pads readout and trigger sectors Gas inlet and outlet

Low material budget Gem foils Honeycomb technology

M. Alfonsi LNF/INFN Cagliari 5 May 2006

Beam Pipe

The space around the beam pipe is the major constraint for the panel dimension

and electronics construction

M. Alfonsi LNF/INFN Cagliari 5 May 2006

Honeycomb gas outlet

Cathode Panel

gas fitting

HV Panel

GEM Chamber side view

GEM Chamber top view

G1G2G3

PADs Panelgas inlet

7 mm

GEM Chamber Layout

M. Alfonsi LNF/INFN Cagliari 5 May 2006

Mechanical detector design

The cross section of a GEM Chamber Module

Pads PCBCathods PCB

bushing

M. Alfonsi LNF/INFN Cagliari 5 May 2006

G10 FRAMES

M. Alfonsi LNF/INFN Cagliari 5 May 2006

Frames layout Active area -Frame

3 mm - 7 mm

Frame Width 18 mm – 30 mm

Frame Thickness 1mm 2mm 3mm

6 holes for decoupling resistors

4 hole pins

Two glue roads(1 per size)

Glue road wide 6 mm

M. Alfonsi LNF/INFN Cagliari 5 May 2006

Position

Frame Thickness

Frame+glue

Thickness x

1 2,99 3,02 0,03

2 2,99 3,08 0,09

3 2,99 3,00 0,01

4 2,92 2,96 0,04

5 2,95 2,98 0,03

6 2,98 2,99 0,01

7 3,00 3,04 0,04

8 3,04 3,05 0,01

9 2,96 2,98 0,02

10 2,96 3,00 0,04

11 2,95 2,97 0,02

12 2.96 2.98 0.02

mm 2.98±0.03 3.00±0.04 0.03±0.02

1 2 3

4

5

6

789

10

11

12

Glued-Frame Planarity

Glue thickness 20 m

Frame thickness rms 30 m

M. Alfonsi LNF/INFN Cagliari 5 May 2006

GEM FOILS

M. Alfonsi LNF/INFN Cagliari 5 May 2006

The GEM Foil layout

200 mm

240 mm

34 mm

Holes for SMD decoupling resistor

G10 Frame

M. Alfonsi LNF/INFN Cagliari 5 May 2006

Gem Layout G1

Three different type of GEM foils

Difference only for final HV electrodes

6 sectors for a totalactive area of 200 x 240 mm2

M. Alfonsi LNF/INFN Cagliari 5 May 2006

Gem Layout G2

The sectors towards the cathode

M. Alfonsi LNF/INFN Cagliari 5 May 2006

Gem Layout G3

References for frame gluing

M. Alfonsi LNF/INFN Cagliari 5 May 2006

Sag measurements

Different loads on the 40x40 cm2

GEM foils have been applied :

80 g , 160 g , 240 g

Measurements on 25 points

30 Kg/side30 Kg/side

M. Alfonsi LNF/INFN Cagliari 5 May 2006

GEM sag measurements

The GEM foil with a stretching of 30 Kg per side (~1Kg/cm) shows a bending of 100 m

on central region when a distributed load of 100 g is applied, equivalent to a pressure of 0.1 mbar.

The electric field producea load of ~ 0.01 mbar.

The total bending due to an electrostatic load should be of the order 10m.

The LHCb triple GEM detector is built without spacers

80g 160 g

240g 0 g

M. Alfonsi LNF/INFN Cagliari 5 May 2006

Kapton Radiation Hardness

C= 251 pF C= 277 pF

C= 234 pF C= 266 pF

C = 32 pFd>= 120 m

After Aging

C = 26 pFd>= 94 m

Before Aging

After aging a sag increase of 30 m corresponding to3 m in normal condition after 4 LHCb years

Mechanical load 10 times the electrostatic pressure

M. Alfonsi LNF/INFN Cagliari 5 May 2006

HONEYCOMB PANELS

M. Alfonsi LNF/INFN Cagliari 5 May 2006

Honeycomb Panels

Pad Panel

Cathode Panel

192 pads192 pads

Gas outlet

Gas inlet

M. Alfonsi LNF/INFN Cagliari 5 May 2006

machined reference ALCOA plane

Honeycomb panel technology

back-plane: (1 mm) FR4 – single side (12 m) Cu

vacuum bag3M–epoxy film

Cathode/Pad-PCB: (1 mm) FR4

gas insert

8 mm NOMEX honeycomb

M. Alfonsi LNF/INFN Cagliari 5 May 2006

PCB and 3M filmThe PCB are prepared :

Cathod PCB Cathod PCB Pads PCBPads PCB

appling the 3M film after

gluing the gas inserts on PCB before

M. Alfonsi LNF/INFN Cagliari 5 May 2006

HoneycombThe honeycomb is placed on top of 3M film cutting the nomex in corrispondance of gas insert and pins

Gas insert :Stesalite and alluminum

Alcoa frames

Pins

The backplane with a 3M film is put on top of Nomexand everything is put in a oven at 80°C

M. Alfonsi LNF/INFN Cagliari 5 May 2006

All panels will be checked for planarity with a 3-D machine at LNF. The measurements will be performed on a grid of 35 points.

3-D machine

5 10 15 20 25 30 35

4 9 14 19 24 29 34

3 8 13 18 23 28 33

2 7 12 17 22 27 32

1 6 11 16 21 26 31

Panel Planarity Measurements

Measurement points

M. Alfonsi LNF/INFN Cagliari 5 May 2006

3 Pad panels 3 Cathode panels

Panel Measurement

Thickness rms 35 m Thickness rms 23 m

M. Alfonsi LNF/INFN Cagliari 5 May 2006

Pads layout Trigger sector

M. Alfonsi LNF/INFN Cagliari 5 May 2006

Detector (“single gap”) performances with ground lines between pads are better than those obtained

0.6 mm 0.4 mm

Pad-PCB layout

No Aging effect on pads !

M. Alfonsi LNF/INFN Cagliari 5 May 2006

Detail on GEM Chamber

M. Alfonsi LNF/INFN Cagliari 5 May 2006

PAD -> 36 μm Cu 1.43 cm 0.25 % 2 mm G10 19.4 cm 1.03 %18 μm Cu 1.43 cm 0.13 % 1.42% X° 1 μm Ni 1.42 cm 0.007 % 0.15 μm Au 0.33 cm 0.005 %

GEM -> 10 μm Cu x3 1.43 cm 0.21 % 0.26% X°

50 μm kapton x3 28.6 cm 0.05 %

CAT -> 0.15 μm Au 0.33 cm 0.005 % 1 μm Ni 1.42 cm 0.007 %18 μm Cu 1.43 cm 0.13 % 1.42%

X° 2 mm G10 19.4 cm 1.03 %36 μm Cu 1.43 cm 0.25 %

3.10%Globally 3.1 x 2 (ch.s) = 6.2 % + 1% (FEE uniformely spread ) = 7.2%

Detector Material Budget