low power transforming mobile pc industry - samsung us€¦ · low power transforming mobile pc...
TRANSCRIPT
2 / 16
1
10
1,000
100
10,000
100,000
1960 1970 1980 1990 2000 2010 2020
1M+ Units
10M+ Units
100M+
Units
1B+
Units
>10B
Units
Mainframe
Minicomputer
PC
Wired
Internet
Mobile
Internet
Computing Growth Drivers Over TimeUnits, M
Increasing IntegrationStand-Alone Wired Seamless/Cloud
Back-end Infrastructure:
Cloud Computing
Mobile Internet will be 10x Desktop Internet
Source: Morgan Stanley
CE Devices:
Beyond Phones
3 / 16
We‟re Going Mobile!
291
464
2010 2011 2012 2013 2014 2015
In 2011, Smartphone shipments are expected to overtake PC shipments
Fast-growing Smartphone market vs. Sluggish PC market
This gap will continue to widen over time
With the inclusion of Tablets, Mobile shipments nearly Double that of PCs, by 2015!
Source: Market Estimates,
Samsung Marketing, 3Q11
Market Forecast
4 / 16
What Users want
User Experience is driving new paradigm
Always On Instant ON
Always Connected
Mobility
TM
5 / 16
UltrabookTM
Samsung Welcomes Intel’s Vision for Notebook Paradigm Shift
PC Mobile transition as “thin and light” becomes mainstream
Product Transitions to Enable Optimized Ultrabook
Response Time and Battery Life are key performance factors
Main Memory: DDR3/4 LPDDR3 (Lower Standby Current)
Storage: HDD NAND Based Storage
Industry focusing towards a Mobile-Centric Eco-System
Next Steps: How to Roll out to OEMs / Eco-System Collaboration (OS)
6 / 16
Ultrabook: How to get there
Commodity, Bulky, Heavy
Optimal Ultrabook User Experience Different components
Performance Longer Battery LifeThin & Light
Low Power, Small, Thin & Light, Customized
x64
x64
Thin - Wide Battery
Solder Down DRAM
SSDThin Fan
Ultrabook („13)Conventional Notebook („11)
x64
x64
HDDThick
BatteryFan
SODIMM
ODD
7 / 16
Ultrabook: Time to Change!
Cannot offer a new user experience by applying old PC mindset
Challenges- LPDDR3 soldered down on Motherboard (No Module flexibility)
- LPDDR3+SSD price vs DDR3+HDD
• Lack of a module CTO “Good, Better Best”Less end user flexibility
• SSD: Standardize thin form factors
Market Dynamics- Achieves “Always On”, “Always Connected”, several weeks standby
- High Desirability: Cool & Sleek products
• High Value mobile products are not as price sensitive
• > $1,000 US PC grew by 27% in 2011; vs. overall US PC market grew by single digit %
8 / 16
Memory devices for Ultrabook
Memory Properties required by new transition
Thickness
Battery
40-50mm20-30mm
<10mm13-17mm
Storage HDD SSD Small F/F SSD
MemoryOn boardModule
3 hr5-6 hr
8-9 hr >12 hr
(1 or 2 chip)On board
Mobility Thin/LightSolder-down
orSmall F/F
Always-onAlways-connected
Instant-on
Low PowerFast Responsiveness
Mobile DRAMFlash Storage
9 / 16
Memory solutions for Ultrabook
Samsung is investigating memory configurations for Ultrabook
• 4Gb would be a best-fit in „12~‟13 timeframe in capacity, power consumption, smaller board area, price, etc.
‟11 ‟12 & beyond System config.
Mobile DRAM
2GB
4GB
8GB
EDP DRAM
2GB
4GB
8GB
x32
4Gb x324Gb DDP based 8Gb x64 Comp. 2ea
4Gb QDP based 16Gb x64 Comp. 2ea
x32
8Gb x328Gb DDP based 16Gb x64 Comp. 2ea
x32x32
x324Gb x32
2Gb Comp.8ea
4Gb QDP based 16Gb x32 Comp. 4eax32
x32x32
4Gb x168Gb QDP based 32Gb x64 Comp. 2ea
x328Gb x32x32
8Gb x32
2Gb x8
4Gb x84Gb Comp.8ea
4Gb x164Gb x16
4Gb Comp.16ea
4Gb x16
4Gb x16
4Gb x164Gb
4Gb x8
4Gb x164Gb x16
4Gb x164Gb
4Gb Comp.4ea
4Gb DDP based8Gb x32 Comp. 4ea
4Gb Comp.8ea
4Gb DDP based 8Gb x16Comp. 4ea
4Gb DDP based8Gb x32 Comp. 8ea
4Gb DDP based 8Gb x16Comp. 8ea
CPU
x64 x64
CS0 CS1 CS2 CS3
128bit System2ch x64
10 / 16
LPDDR2 LPDDR3 DDR3L
Performance
Speed 1066Mbps 1600Mbps 1600Mbps ~
B/W 8.5GB/s 12.8GB/s 12.8GB/s ~
PowerConsumption
Sleep(mW) 1.0X 1.0X 8.8X
Operating(mW) 1.0X 1.5X1.8X*
(ODT power not included)
PKG Type Discrete/POP/eMCP Discrete Discrete/POP/eMCP Discrete Discrete
Power Comparison - LP3/LP2 vs. DDR3L
Condition for Power Consumption :• Current : Real measurement value@DDR3L&LPDDR2 , DDR3L ODT off case, prediction value@LPDDR3• Power : 2GB (16Gb QDP) composition, 2chip(operating)/2chip(IDD2P), Channel efficiency 100% assumption @LPDDR2/3
2GB(4Gb 4pcs) composition, 4chip(operating), Channel efficiency 100% assumption, ODT Off case @DDR3L
• Temperature : Room temp.
LPDDRx can be an attractive memory solution for low power appl.
• LPDDRx can provide power reduction with reasonable performance
8.8X
1.2X
11 / 16
Conventional PC vs. on-board Mobile & Ultrabook
Conventional PC On-board
Simple Verification
Ref. Board + Module
Easy Going Test
Board & Component Feasibility Check
PKG size, SI condition change
Key differences
• “Replaceability” / PKG configuration / SI condition
Considerations for on-board implementation
Module Case (As is) On-board case (To be)
• Upgradable for adopted module• Expandable for empty socket Flexibility • No room for upgrade and extension
• Easy change of module with socket• Small Q‟ty boards can cover Validation
Validation
• Strict restriction for comp change from board• Many boards requirement for validation
• Easy regression test using current board by replacing module
Technology migration
• Need to consider changes in SI/PI characteristics
12 / 16
0%
20%
40%
60%
80%
100%
2011 2012 2013 2014 2015
LPDDRx, penetrate into notebook market
LPDDR3 adoption planned in Mobile & Ultra Thin from „13
DRAM technology transition
Source: SEC Marketing 2Q’11, ULT portion estimation by Intel
Intel RHT
Server
Desktop
Notebook
Ultra Thin(ULT)
Tablet
S. Phone
DR
AM
Po
rtio
n b
y S
eg
me
nt
ULT (<12.7mm)-On-Board-LPDDR3/DDR3L-Instant-On- Low power
LPDDRx
DDR3/4
LP/DDR3
13 / 16
Low Power DRAM Long Term
’10 ’11 2012 & beyond
Mobile DRAM
InterfaceVDD/VDDQ
Speed*1
Density
PKG*2
LPDDR2 1.2V/1.2V LPDDR3 1.2V/1.2V
2Gb 4Gb 8Gb
Up to 4 die stacks : 1.0 mm 0.9mm and below
6.4GB/s 8.5GB/s 12.8GB/s
Post-LPDDR3
25.6GB/s+
Samsung develops Low Power DRAM solution for ULT platform
• ‘12, LPDDR3(12.8GB/s, 1.2V) ‘14, LPDDR4(25.6GB/s+, ~1.2V)
• 4GB package solution available from ‘13 with 8Gb mono die
1. Based on 2-Ch(x64) configuration2. Assume maximum 4-die stacks in one package
14 / 16
Interface: Move to PCIe for Highest throughput & lowest latency
Form Factor: Get smaller and thinner, with even higher capacity
NAND: 2xnm 2ynm 1xnm Tech. for wider SSD adoption
Items 2011 2012 2013 2014 2015
OS
Interface
Form Factor
SSD trend for Ultrabook
2.5” 7mmT
mSATA 3.8mmT
eSSD1.4mmT
SATA 2.6(SATA 3Gb/s)
SATA 3.0 (SATA 6Gb/s)
NVMe(PCIe 3.0 8.0Gb/s)
NewULT FF
<3mmT(Single)
Form Factor Conversed
SATAe(PCIe 3.0 8.0Gb/s)
Windows8 Windows9Windows7
15 / 16
SSD form factor solution
Samsung looking to providing Small Form Factor solution in 2012
Target MarketPlatform
ThicknessForm Factor CTRL NAND
Performance HaloHigh perf. Content-creation PC
<25mm• 2.5” • mSATA• ULT FF • 2~8ch/8way
• DRAM*
• AES engine
• SLP <10mW(@DEVSLP)
• 2ynm/1xnm Tech
• 400Mbps
• Ext. Vpp 12V
Ultra Thin Thin & lightLong battery lifeOn the go PC
<18mm (2012)<12mm (2013)
• mSATA• ULT FF• eSSD
Thin BasicCost effective high value platform for basic usages
<25mm
• 2.5”• mSATA• ULT FF• eSSD
New
New
New
* eSSD DRAM is optional