light peak(2)

8/6/2019 Light Peak(2)

1/23

LIGHT PEAKRef : Optical Technologies and Applications

Intel Technology Journal January 2010

By Jason Ziller, Victor Krutul

Presented By:DeepakBabu.K

S7RRoll No : 23

Seminar-20101


2/23

CONTENTS

INTRODUCTION

FEATURES

TODAYS CHALLENGES

LIGHT PEAK VS USB 3.0 COMPONENT OVERVIEW

VCSEL

OPTICAL MODULE

CONTROLLER CHIP

ADVANTAGES

CONCLUSION

REFEREN

CES 2


3/23

INTRODUCTION

Light peak is the code name for the high

speed optical cable technology

It connects electronic devices to each other

Delivers bandwidth of 10Gb/s with a potentialto scale to 100Gb/s.

3


4/23

Features

y Provide a standard low cost optical based

interconnect

- support for key existing protocols(USB, HDMI, DP, PCIe , etc)

- scalable bandwidth, cost, power to support broad base for10+years

- support wide range of devices(handhelds , laptop , pcs)

Common optical i/o architecture for the next

decade and more- single flexible cable that can carry any platform i/o

- economies of scale from a single optical solution

4


5/23

Todays Challenges

Electrical i/o nearing practical limits

- speed & distance limited

Devices getting smaller,thinner, and lighter

Too many different

connectors and cables

5


6/23

6


7/23

LIGHT PEAK VS USB 3.0

4 Optical Fibre Cable

Speed-10 Gb/sec

Universal Max Cable Length-100m

9 Copper Wires

Speed-3 Gb/sec

Only Usb Protocol Max Cable Length-9m

7


8/23

8


9/23

MAJOR COMPONENTS

OPTICAL MODULE

VCSEL

CONTROLLER CHIP

9


10/23

OPTICAL MODULE

Two way chip

Consists of photo detectors and miniature

lasers(VCSEL)

Does conversion from Light to Electricity Vice-Versa

10


11/23

OPTICAL MODULE

11


12/23

12


13/23

A simplified schematic illustration of a vertical cavitysurface emitting laser (VCSEL).

Contact

Surface emission

Dielectric mirror

Contact

Substrate

P/4n1

Active layer

P/4n2 Dielectric mirror

1999 S.O. Kasap, Optoelectronics (Prentice Hall)

VCSEL

13


14/23

VCSEL

The geometry of the dielectric mirrors providewavelength

Thickness of alternating layers d1 and d2 withrefractive indices of n1 and n2 if the following

equation is satisfied:

n1d1 + n2d2 = 1/2

14


15/23

CONTROLLER CHIP

Manages multiple protocol

It Identifies which protocol is to betransmitted

API helps to determine the different protocols

API places the FIS packets in memory.

15


16/23

Controller chip access the FIS packets from

memory

sends these Packets to destination over

Optical link

16


17/23

Future Client Usage Models

Fast external storage

SSD or HDD arrays transferring at 10Gbs and faster

Advanced docking

High-performance docks, With a single cable,

connect to dock with:

PC-to-PC high-speed connection

Transfer files, PC migration, etc

Simplified home connectivity

Connect multiple PCs and portable CE devices

17


18/23

ADVANTAGES

10 Gbit/s over optical cable (up to 100 metres

in length)

Connect to multiple devices at the same time

Multiple protocols

Bi-Directional transfer

Quality of service implementation Hot Pluggable

18


19/23

Industry Perspective

Sony is excited about the potential for Light Peaktechnology that has been developing, and believeit could enable a new generation of high-speed

device connectivity.

Nokia believes that Light Peak technologyenables new wired connectivity solutions for

Mobile Computers and Smart phones, and looksforward to working to create a global standardbased on Light Peak technology.

19


20/23

CONCLUSION

LIGHT PEAK is an high speed optical i/o

architecture for the next decade and beyond

20


21/23

References

www.intel.com/go/lightpeak

en.wikipedia.org/wiki/Light_Peak techresearch.intel.com

blogs.intel.com/research

Intel Technology Journal

21


22/23

QUESTIONS

?

22


23/23

23

THANK YOU

light peak(2)

Documents