2007-1017.light peak tech

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LIGHT PEAK

TECHNOLOGY

LIGHT PEAK

TECHNOLOGYINTELS HIGH-SPEED DEVICE

CONNECTIVITY

Presented By :

Apurba Kumar Mandal

Computer Science & Engg.

Roll no :- 2007 - 1017

University Institute of Technology

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� INTRODUCTION

� FEATURES

� TODAYS CHALLENGES

� LIGHT PEAK VS USB 3.0

� COMPONENT OVERVIEW

� OPTICAL MODULE

� CONTROLLER CHIP

� ADVANTAGES

� FUTURE SCOPE

CONTENTS

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� Light peak is the code name for the highspeed optical cable technology.

� It connects electronic devices to eachother.

� Delivers bandwidth of 10Gb/s with a potential to scale to 100Gb/s.

INTRODUCTIO

N

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�

Provide a standard low cost optical based interconnect- support for key existing protocols(USB, HDMI, DP,

PCIe , etc)

- scalable bandwidth, cost, power to support broad

base for 10+years

- support wide range of devices(handhelds, laptop, pc¶s)

� Common optical i/o architecture for the next decade and

more- single flexible cable that can carry any platform i/o

- economies of scale from a single optical solution

FEATURES

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Limitations of Electrical Cable

Technology :

� Reached its practical limit for speed & length� Gets distorted due to Electro-Magnetic

Interference(EMI)

�Cables are becoming costly

TODAY¶S

CHALLENGES

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� Needs different cable

for running different protocols simultaneously

� Too many different connectors and cables

�

Devices getting smaller, thinner and lighter

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� 4 Optical Fibre

Cable

� Speed-10 Gb/sec

� Universal

� Max Cable

Length-100m

� 9 Copper Wires

� Speed-3 Gb/sec

� Only Usb Protocol

� Max Cable

Length-9m

LIGHT PEAK VS USB

3.0

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� OPTICAL MODULE

� CONTROLLER CHIP

MAJOR

COMPONENTS

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� Two way chip

� Consists of photo detectors and miniaturelasers

� Does conversion from Light to Electricity

Vice-Versa

OPTICAL

MODULE

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� Manages multiple protocol

� It Identifies which protocol is to be transmitted

� API helps to determine the different protocols

� API places the FIS packets in memory.

� sends these Packets to destination over Opticallink

CONTROLLER

CHIP

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� 10 Gbit/s over optical cable (up to 100 metres

in length)

� Connect to multiple devices at the same time

� Multiple protocols

�

Bi-Directional transfer

� Quality of service implementation

� Works on existing I/O standards

ADVANTAGE

S

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� Fast external storage

-> SSD or HDD arrays transferring at

10Gbs and faster.

� PC-to-PC high-speed connection-> Transfer files, PC migration, etc.

� Simplified home connectivity

-> Connect multiple PCs and portableconsumer electronics (CE) devices.

� Sony & Nokia are working with Intel

FUTURE

SCOPE

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Thank You !!!

2007-1017.light peak tech

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