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LIFE PURE XL Service

Manual

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CONTENT

1 OUTLINE ................................................................................................................................ 3

1.1 MOBILE PHONE INTRODUCTION ................................................................................. 3

1.2 MAINBOARD COMPONENTS DISTRIBUTION ........................................................................... 5

2 SIGNAL FLOW AND FAULT ANALYSIS ................................................................................. 7

2.1 RF PART ............................................................................................................................ 7

2.1.1 Block Diagram of the RF Section .............................................................................. 7

2.1.2 Signal Flow OF the RF Transmitting Part ................................................................. 9

2.1.2.1 Receiving and Transmit Path ............................................................................. 9

2.1.2.2 Maintenance Procedures of the Transmitting Part ........................................... 10

2.1.3 Signal Flow of the Receiving Part ............................................................................ 11

2.1.3.1 Maintenance Procedures of the Receiving Part ........................................... 11

2.2 BASEBAND PART .............................................................................................................. 12

2.2.1 Block Diagram of the Baseband Part ...................................................................... 12

2.2.2 Power Management Part ........................................................................................ 13

2.2.2.1 The Whole Power Supply System ................................................................... 14

2.2.3 Audio Part................................................................................................................ 18

2.2.3.1 Audio CODEC Circuit ....................................................................................... 18

2.2.3.2 MIC and RECEIVER LOOP ............................................................................. 20

2.2.3.3 HEADSET LOOP ............................................................................................. 21

2.2.3.4 Speaker part ..................................................................................................... 21

2.2.4 NFC PART .............................................................................................................. 20

2.2.5 Linear motor .......................................................................................................... 21

2.2.6 Analysis of the Display Module circrit ..................................................................... 21

2.2.7 FM/ WIFI / Bluetooth Module .............................................................................. 23

2.2.8 Camera Module ................................................................................................... 25

2.2.9 IO Interface ......................................................................................................... 27

2.2.11 OTG Circuitt....................................................................................................... 28

2.2.12 GPS Circuit ....................................................................................................... 28

2.2.13 M-sensor Circuit ................................................................................................ 30

2.2.14 G-sensor Circuit ................................................................................................ 31

2.2.15 IR-sensor Circuit ............................................................................................... 30

2.2.16 pressure Circuit ................................................................................................. 30

3 SERVICE TOOLS .............................................................................................................. 30

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1 Outline

1.1 MOBILE PHONE INTRODUCTION

Product Hardware Introduction

Base Chip Set

BB MSM8274

PMIC PM8941(primary) and PM8841(sub)

Transceiver WTR1605

Camera DSP/MMP Build in MSM8274

RFPA SKY77629

FM WCN3680

BT WCN3680

Audio CODEC&PA WCD9320

Memory Samsung K3QF7F70DM-QGCE

TP IC S3202 (COF)

Peripheral Configuration

LCD R63417

Backlight Driver LM3630

CAMERA OV16825

Memory Card SAMSUNG KLMBG4GEAC-B001

Antenna IFA

Basic Performance Indicators

Leakage current ≤ 150uA

Standby current ≤ 8mA

Call current as maximum power GSM-280mA/WCDMA-480mA

Board-level power

EGSM 32.5dBm

GSM850 32.5 dBm

DCS 29.3dbm

PCS 29.5dbm

Band1 23dbm

Band8 23dbm

Board-level receiver sensitivity

EGSM -108dbm

GSM850 -108 dbm

DCS -107 dbm

PCS -107 dbm

Band 1 -108.5 dbm

Band 8 -108.5 dbm

TRP

EGSM 26.5dbm

GSM850 26.5 dbm

DCS 26.0dbm

PCS 26.0dbm

Band 1 20.0dbm

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Band 8 20.0dbm

TIS

EGSM -105dbm

GSM850 -105dbm

DCS -106dbm

PCS -106dbm

Band 1 -102.5dbm

Band 8 -102.5dbm

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System Block Diagram

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1.2 Motherboard Components Distribution

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2 Signal Flow And Fault Analysis

2.1 RF Part

2.1.1 Block Diagram of the RF Section

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RF part Diagram

RF and BB interface Diagram

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2.1.2 Signal Flow OF the RF Transmitting Part

2.1.2.1 Receiving and Transmit Path

Receiving

Transmit

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2.1.2.2 Maintenance Procedures of the Transmitting Part

（NO launch） Connect the PC and the phone with maintenance line,

then making the phone into the RF state with QRCT software

Check Transceiver to

see if IO signals exist.

Check the PA output to

see if there is RF signal

Y

Check CPU N

Check RF coaxial

switch or matching

network.

Y Check the

Transceiver to see if

there is RF signal

N

Check U2101-VPA

have the correct

Replace PA

Y

Check CPU

Y

Check Transceiver if

SSBI,GP_DATA,power

have the correct

N

N

N

N Y

Replace Transceiver

Check RFFE

signal have

the correct

N

Check

U2101

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2.1.3 Signal Flow of the Receiving Part

2.1.3.1 Maintenance Procedures of the Receiving Part

No receiving

Start the META software to connect the PC and the phone，making the phone into the receiving state.

Signal generator is also adjusted to the correspond CH. And signal lines connected to the phone.

Transceiver has Check CPU Y

Transceiver has received

signal?

N

Check Transceiver SSBI,

GP_DATA are correct ?

Check CPU

N

Whether the voltage

of the transceiver is

normal? Whether

19.2MHZ is normal?

Y

Check the

corresponding power

supply and 19.2MHZ

resulting circuit

N

Replace transceiver

Y

Filter or duplex

has received

signal?

N

Check to see if there has

signal in the matching circuit

between fiter/duplex and ANT

N

Check to see if there has

signal in the matching

circuit between PA and

transceiver

Y

Y

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2.2 Baseband Part

2.2.1 Block Diagram of the Baseband Part

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2.2.2 Power Management Part

The power management Part use the special PMU IC : PM8941(primary)-U101 and

PM8841(SUB)-U301. And for low battery voltage IR drop by big current

application,add the DC-DC FAN48630UC315X (U102) with bypass mode and the

LDO(U103) RP115L211B,when the battery voltage is below 3.33V,the DCDC

FAN48630UC315X can keep Outputting 3.3V ,so the module which request the hign

supply voltage can strady operation,but when the battery is higner than 3.33V,this

DC-DC output is in bybass mode and the output voltage is same as VBAT.

The LDO- RP115L211B-E2(U103) which can supply the big current when the

PMIC8941 DC-DC S2A can not provide enough current when the battery voltage is

below 2.7V.

The U2609-NCP6343 supply the RAM(LPDDR3) power with PMIC8941 LDO1 at the

same voltage 1.2V.

PM8941 Support 5-ways of DC-DC and 22-ways of LDO output, with RGB LED

driver ,FLASH LED driver,keypad-LED , Switch charging circuit and so on.the

PMIC8941 functional block diagram as following:

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The SUB PMIC 8841 support 8-ways of DC-DC, power the platform big current

module, such as: Quad-Krait applications processor system, the PMIC8841

functional block diagram as following:

2.2.2.1 The Whole Power Supply System

PMIC8941 DC-DC list:

PMIC8841 DC-DC list:

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PMIC8941 LDO list：

Schematic Diagram

U102 DC-DC- FAN48630UC315X with bypass mode schematic：

U103 LDO- RP115L211B-E2 with bypass mode schematic：

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U2609 DC-DC-NCP6343 schematic：

PMIC8941 DC-DC-output part schematic：

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PMIC8941 LCD backlight driver(Not used,this phone used external LCD

backlight driver for better performance),RGB-LED driver and camera FLAH

LED driver schematic：

PMIC8841 DC-DC-output part schematic：

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PMIC8941 LDO-output part schematic：

2.2.3 Audio Part

2.2.3.1 Audio CODEC Circuit

The phone has used a special CODEC chip—WCD9320.In addition, It has use a

unique chip—ES325.The ES325 chip which is produced by Audience company have

strong effect in decrease noise. If you meet some problem about Audio Part, you can

check audio device like Mic, Speaker, Receiver firstly. Then you can find CODEC chip

problem. Finally, you can check CPU problem.

Audio system circuit:

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Es325：

Use YDA168 for audio PA

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2.2.3.2 MIC, RECEIVER LOOP

MIC Audio channel is shown below: All MICS which are used in this phone are digit MICs .

The Mic_Bias power supply voltage is 1.8V-2V. When MIC is in good condition but loop

MIC has no echo, firstly you need to check the basic bias voltage signal of the Mic_Bias

voltage. Then you can measure the signal of CLK

And Data.

Digit mic circuit

Main MIC is placed in Sub board

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Receiver units

2.2.3.3 HEADSET LOOP

Headset loop units are placed on FPC, the Motherboard headset LOOP drive the FPC

directly through CN1501.Filter and ESD protected network, are also placed on FPC.

When headset is abnormal, you can check headset problem, FPC connector, and codec,

cpu chip As shown below:

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2.2.3..4 Speaker part

The speaker part is placed on sub board. Main board using CN1401 connect with sub

board. The chip IC-YDA168 is used to drive Speaker for strong effect. If you some

problem about speaker, firstly you should check speak, FPC connector problems. Then

check chip problems like YDA168, CODEC and CPU.

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2.2.4 NFC part

This phone had used BCM20793M chip for NFC function. NFC circuit as shown below:

If you meet some problems on NFC part , you can check NFC antenna, BCM20793M and

CPU chip

2.2.5 Linear motor

The Motor part is placed on sub board. Main board using CN1401 connect with sub board.

The ISA1200 chip is used to drive motor for strong effect.

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2.2.6 Analysis of the Display Module circuit

Display module use the 5.5"TN LCD, which including 4 pairs MIPI differential bus mode.

All of commend and data go through the MIPI differential bus mode except the reset

signal.

The LED Backlight driver use LM3630 IC, the circuit as shown below:

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For the screen problem you should first use the alternative method to search out whether

the problem is in the motherboard or the LCD. Focus on examining the LCM connector

and EMI filter welding.. The backlight signal is completed by the LED driver chip LM3630.

Generally, measure the input voltage VBAT and the enable control signal.

2.2.7 FM/ WIFI / Bluetooth Module

The phone use a special IC—WCN3680 to integrate FM/WIFI/Bluetooth function. the

circuit as shown below:

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If You want to resolve FM problem you can check the headphone circuit firstly, then

check WCN3680,CPU circuit. WIFI and Bluetooth use a same antenna.

2.2.8 Camera Module

The module uses 16 million pixel AF camera as the main camera, 8 million pixel camera

as the sub camera. Through the connector and the baseband chip (the main camera

series EMI devices) directly connected.

The Camera Interface Circuit as show below:

The Camera Power Supply Circuit

The DOVDD supply 1.8V to Camera IO interface voltage, AVDD supply 2.8V analog

voltage. DVDD supply 1.2V for core voltage ,VAF supply 2.8v for motor voltage.

Flash driver use PMIC8941

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2.2.9 IO Interface

IO applies 5pin standard interface，which realize the functions of USB, charging and

download. It is SMT in a sub-board, and contact with main-board with a FPC. If there is

not charging situation, check the connector of the FPC.

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2.2.10 SIM Card Circuit

This phone can use only one SIM card, it supports hot plug function. As show below:

If you check SIM card problem, you should check SIM CARD firstly. then check QCN data,

or download right SW file.

2.2.11 OTG Circuit

The phone support OTG function. The phone distinguish USB or OTG by detect

USB1_HS_ID_PMIC.

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2.2.12 GPS Circuit

The GPS circuit is integrated in transceiver IC WTR1605 . The GPS’S RF interface is

connected with external antenna. The ANT is receiving GPS satellite signal to achieve

positioning. GPS circuit as shown below.

2.2.13 M-Sensor Circuit

AKM8963 IC is used for M-Sensor function. The M-Sensor is electronic compass. It

support X,Y,Z axis. It communicate with CPU by I2C interface. Circuit as shown below:

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2.2.14 G-Sensor/Gyroscope circuit

The phone use one chip LSM330DLC to integrate G-Sensor and Gyroscope function. It

communicate with CPU by I2C interface. Circuit as shown below:

2.2.15 IR-sensor Circuit

IR-SENSOR is light &distance sensor. It induces current the environment which include

the brightness and Perceived distance between the human face and the calling

phone .IR-SENSOR uses I2C to connect CPU interface, in order to transmit directives

and data, also we need an INT give CPU a trigger signal. It is SMT on a FPC, and

connect by cn1501

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2.2.16 pressure Circuit

The lps331ap IC is a pressure sensor. It can detect absolute value of atmospheric

pressure. Then the phone can get the above sea level by SW algorithm. It can be use for

navigation. The sensor communicate with CPU by I2C interface.

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3. Disassembly and assembly service Tools

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