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Franjo Josipovic Head of Application Martin GmbH Lead Less Rework of Components

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Page 1: Lead Less Rework of Components - fhi.nl · Franjo Josipovic Head of Application Martin GmbH Lead Less Rework of Components •

Franjo JosipovicHead of ApplicationMartin GmbH

Lead Less Rework of Components

Page 2: Lead Less Rework of Components - fhi.nl · Franjo Josipovic Head of Application Martin GmbH Lead Less Rework of Components •

• Outline shape of lead less components

• Rework procedure for lead less components

• LED Rework

• Connector

• Martin Rework Systems

Agenda

Page 3: Lead Less Rework of Components - fhi.nl · Franjo Josipovic Head of Application Martin GmbH Lead Less Rework of Components •

1. Rework Challenges:

- MLP/QFNMicro Lead frame packageQuad flat package no lead

- DFNDual flat no lead

- LEDLight-Emitting-Diode

- Fusion Quad

Page 4: Lead Less Rework of Components - fhi.nl · Franjo Josipovic Head of Application Martin GmbH Lead Less Rework of Components •

1. Rework Challenges :

- MLP/QFNMicro Lead frame packageQuad flat package no lead

- DFNDual flat no lead

- LEDLight-Emitting-Diode

- Fusion Quad

Page 5: Lead Less Rework of Components - fhi.nl · Franjo Josipovic Head of Application Martin GmbH Lead Less Rework of Components •

1. Rework Challenges :

- MLP/QFNMicro Lead frame packageQuad flat package no lead

- DFNDual flat no lead

- LEDLight-Emitting-Diode

- Fusion Quad

Page 6: Lead Less Rework of Components - fhi.nl · Franjo Josipovic Head of Application Martin GmbH Lead Less Rework of Components •

1. Rework Challenges :

- MLP/QFNMicro Lead frame packageQuad flat package no lead

- DFNDual flat no lead

- LEDLight-Emitting-Diode

- Fusion Quad

Page 7: Lead Less Rework of Components - fhi.nl · Franjo Josipovic Head of Application Martin GmbH Lead Less Rework of Components •

Advantage of QFN components?

• Space-saving

• Robust

• Good heat dissipation

• Large numbers of contact pads

• Suitable for power electronics

Page 8: Lead Less Rework of Components - fhi.nl · Franjo Josipovic Head of Application Martin GmbH Lead Less Rework of Components •

MINIOVEN 05

• Standard masks

• Customized masks

• Nitrogen connection

• Reflow environment through convection

• Very low invest

• Masks and stencil from 1 x 1mm body size

• Multiprebumping and Reballing masks

• Solder paste / solder balls (leaded and lead free)

Page 9: Lead Less Rework of Components - fhi.nl · Franjo Josipovic Head of Application Martin GmbH Lead Less Rework of Components •

1. Apply Flux to clean contact pads and avoid oxidation.

Page 10: Lead Less Rework of Components - fhi.nl · Franjo Josipovic Head of Application Martin GmbH Lead Less Rework of Components •

2. Place the dedicated mask and belonging frame into the Prebumping fixture and place the component face down into the frame.

Page 11: Lead Less Rework of Components - fhi.nl · Franjo Josipovic Head of Application Martin GmbH Lead Less Rework of Components •

3. Close fixture and turn around.

Page 12: Lead Less Rework of Components - fhi.nl · Franjo Josipovic Head of Application Martin GmbH Lead Less Rework of Components •

4. Place the solder paste beside the apertures.

5. Print solder paste with squeegee and remove residual solder paste.

Page 13: Lead Less Rework of Components - fhi.nl · Franjo Josipovic Head of Application Martin GmbH Lead Less Rework of Components •

Printing

C = 0.66 x B

Page 14: Lead Less Rework of Components - fhi.nl · Franjo Josipovic Head of Application Martin GmbH Lead Less Rework of Components •

Printing

Page 15: Lead Less Rework of Components - fhi.nl · Franjo Josipovic Head of Application Martin GmbH Lead Less Rework of Components •

Printing

Page 16: Lead Less Rework of Components - fhi.nl · Franjo Josipovic Head of Application Martin GmbH Lead Less Rework of Components •

Too much solder paste.No air extraction canals

Perfect solder paste print

Page 17: Lead Less Rework of Components - fhi.nl · Franjo Josipovic Head of Application Martin GmbH Lead Less Rework of Components •

Important Parameter forSolder paste printing.

• Precise distribution of Solder paste on Heat Sinks.

• Reduction of apertures according data sheet.

• Appropriate use of solder paste Type 4

Page 18: Lead Less Rework of Components - fhi.nl · Franjo Josipovic Head of Application Martin GmbH Lead Less Rework of Components •

HOTBEAM Family

HOTBEAM 04HOTBEAM 05

EXPERT Rework Family

EXPERT 05.6 IXHEXPERT 10.6 HV /HXV

Page 19: Lead Less Rework of Components - fhi.nl · Franjo Josipovic Head of Application Martin GmbH Lead Less Rework of Components •

Thank you for your attention

Franjo Josipovic

Martin GmbH

See you at booth 7A073