lamination to ultralam3000 › ultralam 3000 surface treatment for bonding.pdfeht = 10.00 w 21 mm...

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Lamination to Ultralam 3000 Surface treatments Vs Surface Roughness

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Page 1: Lamination to Ultralam3000 › Ultralam 3000 Surface Treatment for Bonding.pdfEHT = 10.00 W 21 mm Signal A SEI Date Feb 2005 Photo No. = 835 Time . Signal A = SEI Date Mar 2005 EHT=

Lamination to Ultralam 3000

Surface treatments Vs Surface

Roughness

Page 2: Lamination to Ultralam3000 › Ultralam 3000 Surface Treatment for Bonding.pdfEHT = 10.00 W 21 mm Signal A SEI Date Feb 2005 Photo No. = 835 Time . Signal A = SEI Date Mar 2005 EHT=

Options

• Providing surface area for bonding is

critical.

• The imprint left by our laminated copper

foils is best for bonding.

• There are two recommended surface

treatment options.

• In all cases, the surfaces will become

more wettable.

Page 3: Lamination to Ultralam3000 › Ultralam 3000 Surface Treatment for Bonding.pdfEHT = 10.00 W 21 mm Signal A SEI Date Feb 2005 Photo No. = 835 Time . Signal A = SEI Date Mar 2005 EHT=

Untreated Ultralam 3800 Dielectric

Film Surface

(5000X)

Page 4: Lamination to Ultralam3000 › Ultralam 3000 Surface Treatment for Bonding.pdfEHT = 10.00 W 21 mm Signal A SEI Date Feb 2005 Photo No. = 835 Time . Signal A = SEI Date Mar 2005 EHT=

KOH Treated Ultralam 3800

Dielectric Film - Good -

35%, 90C, 2-3 minutes(5000X)

Page 5: Lamination to Ultralam3000 › Ultralam 3000 Surface Treatment for Bonding.pdfEHT = 10.00 W 21 mm Signal A SEI Date Feb 2005 Photo No. = 835 Time . Signal A = SEI Date Mar 2005 EHT=

Plasma Treated Ultralam 3800

Dielectric Film – Better -

We recommend CF4/O2 (10%/90%) followed by H2/N2 (10%/90%)

(5000X)

Page 6: Lamination to Ultralam3000 › Ultralam 3000 Surface Treatment for Bonding.pdfEHT = 10.00 W 21 mm Signal A SEI Date Feb 2005 Photo No. = 835 Time . Signal A = SEI Date Mar 2005 EHT=

Etched Ultralam 3850 Laminate (Copper clad removed) - Best -

(5000X)