july 2011 doc.: ieee 802.15/0491 project: ieee … · notice: this document has been prepared to...

doc.: IEEE 802.15/0491July 2011

Project: IEEE P802.15 Working Group for Wireless Personal Area Networks (WPANs)Project: IEEE P802.15 Working Group for Wireless Personal Area Networks (WPANs)Project: IEEE P802.15 Working Group for Wireless Personal Area Networks (WPANs)Project: IEEE P802.15 Working Group for Wireless Personal Area Networks (WPANs)

Submission Title: The road map of THz wireless communications systems for JapanDate Submitted: 21 July, 2011”Source: Iwao Hosako Company: National Institute of Information and Communications TechnologyAddress 4-2-1, Nukuikita, Koganei, 184-8795, Tokyo, JapanVoice:+81-42-327-6508 FAX: +81-42-327-6961, E-Mail:[email protected]: N/ARe: N/A

Abstract: Results of investigative researches on THz tech (especially on wireless comm.) are described.

Purpose: To activate general discussions in P802 15 about THz-wireless-communication technologyPurpose: To activate general discussions in P802.15 about THz wireless communication technology.Notice: This document has been prepared to assist the IEEE P802.15. It is offered as a basis for discussion and is not binding on the contributing individual(s) or organization(s). The material in this document is subject to change in form and content after further study. The contributor(s) reserve(s) the right j g y ( ) ( ) gto add, amend or withdraw material contained herein.Release: The contributor acknowledges and accepts that this contribution becomes the property of IEEE and may be made publicly available by P802.15.

Submission <author>, <company>Slide 1

doc.: IEEE 802.15/0491

Road map of THz wireless communicationsRoad map of THz wireless communications systems for Japan

Iwao HosakoNational Institute of Information and Communications Technology (NICT),

JAPANJAPAN

Submission

doc.: IEEE 802.15/0491

Acknowledgement• Members of

– Division of R&D, Bureau of International Strategy, Ministry of Internal Affairs and Communications (MIC)Ministry of Internal Affairs and Communications (MIC)

– Kinki Bureau of Telecommunications, MIC– Advanced ICT Device Group, NICTp,

• Committee members & lecturers of– Investigative research of Terahertz technology in

FY2008FY2008– Investigative research of High Speed ICT Devices in

FY2009– Investigative research of Terahertz technology for ICT

in FY2009 & FY2010

Submission

doc.: IEEE 802.15/0491

I ti ti R h f TH T h i J2004 2005 2006 2007 2008 2009 2010 2011 2012 FY

Investigative Researches of THz-Tech. in Japan

NICT’sMid-term plan

1st 2nd 3rd

Investigative Researches(Title,

THz-Tech, MIC THz-Tech, (Title,

Responsible Organization)

NICTHigh Speed ICT Devices, NICT

THz-Tech for ICT, Ki ki B f T l MICKinki Bureau of Telecomm., MIC

http://www.soumu.go.jp/soutsu/kinki/studygroup/2010/THz/index.htmlhttp://www.soumu.go.jp/soutsu/kinki/studygroup/2009/THz/report.htmlReports (in Japanese)

Submission4

p g jp yg p

doc.: IEEE 802.15/0491July 2011

Summary of the report in 2008

P f i l d C d

Summary of the report in 2008Expecting time-lines of R & D

a R

ate

40Gbps

100Gbps

Professional-uses are assumed(Network, Broadcasting, Medical)

Consumer uses are assumed(Interfaces, Proximity comm.)

２

Dat

a

10Gbps

p

2017 20182010 2011 2012 2013 2014 2015 2016 2019３

１

104

105

106

ffici

ent 7) 625 - 725 GHz

ASK:50 Gbit/sQPSK:100 Gbit/s

6) 455 - 525 GHzASK:50 Gbit/sQPSK:100 Gbit/s

5) 380 - 445 GHz 8) 780 - 910 GHz

4) 275 - 370 GHzASK:50 Gbit/s QPSK:100 Gbit/s

102

103

10

atio

n C

oef

(dB

/km

)

4) 5) 6) 7) 8)

100 dB/km -> 10 m


)ASK:70 Gbit/sQPSK:140 Gbit/s1) Up to 275GHz


3)2)２２

10-1

1

10

Atte

nua

2 dB/km -> 10 km1)

)

2) 275 - 320 GHzASK:20 Gbit/sQPSK:40 Gbit/s

)

10 dB/km -> 100 m3) 335 - 360 GHzASK:20 Gbit/sQPSK:40 Gbit/s

１

３

２２１

Submission

100 200 300 400 500 600 700 800 900 1000Frequency (GHz)

10 1

Iwao Hosako, NICTSlide 5

doc.: IEEE 802.15/0491

Summary of the report in 2009<month year>

Summary of the report in 2009THz-WL is useful for

+ Relieve bottlenecks of last-access(No speed difference between wired and wireless)(No speed difference between wired and wireless)

+ Realization of high speed wireless interface(Ultra-short range, instantaneous & intermittent, low energy consumption)

and for following usage scenes.Education & WorkReduce Cost of moving

and Energy consumptionCloud servers

Medical & Health

Office School

Hospital

ConferenceE-text High resolution images,

Data from medical sensors

Daily life & Environment

Super High Definition TV(> 24Gbit/s)

Relay

Optical NW

I t t DL

Robot for supportHealth-careinformation

Homepoint Instantaneous DL

Optical fibersNo leakage


Event site,Pickup (Broadcasting)

TV Broadcasting station,NW Center

TV, Telework,Health care

gto outside(THz-waves)

doc.: IEEE 802.15/0491July 2011

Contents of investigative research in FY2010

• Needs– Instantaneous data transfer– Instantaneous data transfer– From professional-use to mass-use

• Possible Contributions of THz-WL for– Energy Savinggy g– Human Life

F ll T h l i l t d f TH WL• Follow-up: Technological trends for THz-WL

Submission Iwao Hosako, NICTSlide 7

doc.: IEEE 802.15/0491

Needs of instantaneous data transferJuly 2011

Needs of instantaneous data transferNon-Contact IC Card

te)

Sharing of still images

Sharing of SD/HD/3D

movies

DL of SD/HD/3D

moviesE-field Communication

ata

(byt images movies Time of

transfer (sec)

nt o

f da

Micro wave

THz waveBilling & Settlement

THz WL

Am

oun

HF120GHz WL

A


Speed of transfer (bit/s)http://www.soumu.go.jp/soutsu/kinki/studygroup/2010/THz/index.html

doc.: IEEE 802.15/0491

T iti f dJuly 2011

Transition of needsfrom professional-use to mass-use

10kmuse

Material Transfer for BroadcastingTemporary use High quality & small productionProfessional-use

3D remote conferenceTelemedicine

100nce

of-d

oors

u

120GHz WL links+ 10~40 Gbit/s+ 100m~5km

Portable devices

Small-sized & Low-costMass production100m

fer

Dis

tan

out-o

+ 100m 5km

THz WL links

pConsumer-use

1m

Tran

s

ors

use + 40~100Gbit/s

+1cm~10m+ 0.3~1THz

1cmin-d

oo


2010 2015 2020 yearhttp://www.soumu.go.jp/soutsu/kinki/studygroup/2010/THz/index.html

doc.: IEEE 802.15/0491

T d f i i t i ti & TH d l<month year>

Trend of miniaturization & THz modules+Scaling of Wavelength

nsis

tor

rcui

t

Chi

p

(300 GHz ~ 1mm)+Natural integration of circuit & antenna+Simplified architecture (ASK d l ti t )

THz WL Modules

Tran Ci C (ASK modulation etc)

Transistor

o-te

ch

Moo

re’s

?

Circuit

Chip Age

of n

an

mita

tion

of

Law

? ?

Chip A

Lim

Submission <author>, <company>Slide 10http://www.soumu.go.jp/soutsu/kinki/studygroup/2010/THz/index.html

doc.: IEEE 802.15/0491July 2011






doc.: IEEE 802.15/0491July 2011

Possible Contributions for “Energy Saving”E i (ES) i i l li ti

Green of ICT

• Energy saving (ES) in wireless applications– Energy saving by speeding up of wireless applications– Merits of THz wireless

• ES by instant huge-data-transfer• ES by intermittent operationES by intermittent operation• ES by simple modulation format (use wider band)

• Energy saving by application of ICTGreen by ICT

gy g y pp– Spread use of teleworking– Reduction of moving (goods, human)g (g , )– Efficiency gain of production & consumption

Submission Iwao Hosako, NICTSlide 12http://www.soumu.go.jp/soutsu/kinki/studygroup/2010/THz/index.html

doc.: IEEE 802.15/0491

Trends of Information Explosion & Power Consumption in ICTTrends of Information Explosion & Power Consumption in ICT(METI, JAPAN, Oct. 2008)

Power C i 20% f T l P d i fConsumptionTW/h

InformationExplosion

5.2

20% of Total Production of Electricity I JAPAN

n N

etw

ork

2006

))

Explosion

3.5

nfor

mat

ion

onip

les:

1=(

FY2

1.3

2.1

n Vo

lum

e of

In(M

ult

Turn

2006 2010 2015 2020 2025Year

2006 2010 2015 2020 2025Year

Submission

doc.: IEEE 802.15/0491

P C ti /bit Bit tMBit/s nJ/Bit

Zi b (TYP) 0 25 580

Power Consumption/bit v.s. Bit rate

Zigbee (TYP) 0.25 580Bluetooth3.0+EDR (Planex) 2.1 170 Production BT-Micro3E2X

802.11b (TYP) 11 180802.11b (TYP) 11 180802.11b/g (iodata) 54 26 Production WN-G54/CB3L

UWBDice 10 3.2 R & D802.11b/g/n (iodata) 300 4.3 Production WN-G300U

802.11b GainSpan (Alps) 11 36 Evaluation kit

UGFZ1kit

WirelessHD SiBeam (Panasonic)

4000 2.5 Production TU-WH1

Optical transceiver 10GbE(SEI)

20000 0.05 Production SPP5000

Submission

By Dr. Tetsuya Kawanishi of NICThttp://www.soumu.go.jp/soutsu/kinki/studygroup/2010/THz/index.html

doc.: IEEE 802.15/0491

P C ti /bit Bit tFitted by Zigbee, Bluetooth, 802.11b(GainSpan), 802.11g, 802.11n, WirelessHD

248 0 613

Power Consumption/bit v.s. Bit rate

100

Bluetooth

[nJ/

bit]

Zigbee 802.11b

y=248x-0.613

10802.11b(GainSpan) 802.11g

mpt

ion

THz WL Comm.

1 UWB WirelessHD802.11n

cons

um

0.1

Pow

er

10GbE

0.1 1 10 100 1000 10000

P

Bitrate [Mbps]

Submission

By Dr. Tetsuya Kawanishi of NICThttp://www.soumu.go.jp/soutsu/kinki/studygroup/2010/THz/index.html

doc.: IEEE 802.15/0491July 2011

T d ff b t P C tiTrade-off between Power Consumption & Occupied Bandwidth

large

n

p+ Limited Bandwidth in MW band+ To realize high-speed comm.

sum

ptio

n

OFDM

QAM

wer

Con

s

QPSK

BPSK

+ Wide Bandwidth in THz band+ To realize low energy consumption & ultra-high-speed comm.

Pow

ASK

& ultra high speed comm.

small

narrow wide


Occupied Bandwidth

doc.: IEEE 802.15/0491July 2011






doc.: IEEE 802.15/0491July 2011

Possible Contributions for “Human life”• Medical• Medical

– Needs of advanced ICT at operation room and diagnosis sitediagnosis-site

– Realization of cable-less operation room High speed access to the medical information– High speed access to the medical information data-base(cloud) during operation and diagnosis

– Telemedicine system by SHD-image transfer– Telemedicine system by SHD-image transfer– Instant data transfer of medical images

Regional revitalization• Regional revitalization– Teleworking : Action for depopulation

R t d ti b 3D i t tSubmission Iwao Hosako, NICTSlide 18

– Remote education by 3D image contentshttp://www.soumu.go.jp/soutsu/kinki/studygroup/2010/THz/index.html

doc.: IEEE 802.15/0491<month year>

Entire picture of intelligent operationHQ: overall controlle

R l ti

Superimposed image (pre/pro-operative)Coordination (Robot & Navigation)

Visualization of tumorReal-time diagnosis

Real-timeSensing

Information Processing

M lti f ti lMulti functionalmanipulators

Operation cockpit

Training ManipulationVR training


http://app2.infoc.nedo.go.jp/kaisetsu/bio/bio02/p01.html

doc.: IEEE 802.15/0491July 2011

Open experiment: Bidirectional highOpen experiment: Bidirectional high speed line consisting of wired & wireless

JGN-II plusp(10 Gbit/s Ethernet)

THz-Wireless(10 Gbit/s)

Tokyo-Ohtemachi- 120 GHz

10 WTokyo-site(NICT Koganei)

Kyoto-site(NICT Keihanna)

- 10mW- 150m- bidirectional

Submission Iwao Hosako, NICTSlide 20http://www.soumu.go.jp/soutsu/kinki/studygroup/2010/THz/index.html

doc.: IEEE 802.15/0491

O i t Bidi ti l hi hJuly 2011

Open experiment: Bidirectional high speed line consisting of wired & wirelessp g

da Vinci system3D image from da Vinci system

OsiriX image manipulation g pat Kyoto


OsiriX image viewing at Tokyohttp://www.soumu.go.jp/soutsu/kinki/studygroup/2010/THz/index.html

doc.: IEEE 802.15/0491July 2011






doc.: IEEE 802.15/0491

S ll i i i (A Chi )Small size instrumentations (Antenna, Chip), Possible to install on the mobile terminals.

2.2 mm

Horn Antenna @ 300GHz Patch Antenna @ 380GHz Horn Antenna @ 600GHz

Further improvement on antenna is necessary

Submission

Further improvement on antenna is necessary(Needs 25dBi at least)

doc.: IEEE 802.15/0491

Hi h d l t i (MOS G N I PHigh speed electronics (MOS, GaN, InP, Vacuum) will be ready to use within 5/10 years) y y

100nm] 最小加工寸法最大動作周波数Minimum Fabrication Size

m)

Maximum Operation Freq.100

ピッチ

[n

Hz] 500

600700

高速

化

pitc

h (n

Spee

ding

U

p

ハーフピ

f max[GH

300

400

化

高

Hal

f-p

tion

S U

ック

M1ハ f T, f 300

微細

化

gic-

M1

Min

iatu

riza

t

1010 12 14 16 18 20

ロジッ

年

20010 12 14 16 18 20年

Log

Year 20XX Year 20XX

Submission

CMOS will reach over 600 GHz in near futurehttp://www.soumu.go.jp/soutsu/kinki/studygroup/2009/THz/report.html

doc.: IEEE 802.15/0491

RF CMOS for Optical Fiber CommunicarionRF-CMOS for Optical Fiber Communicarion(For low power consumption, downsizing, and low-cost)Kanda et al “A single-40Gb/s Dual-20Gb/s Serializer IC with SFI-5 2 Interface in 65nm CMOS ” IEEE ISSCC DigKanda et al., A single-40Gb/s Dual-20Gb/s Serializer IC with SFI-5.2 Interface in 65nm CMOS, IEEE ISSCC Dig. Tech. papers, February 2009, pp. 360-362.

Photo. of 40 Gbit/s Tx IC

Output waveform of 40 Gbit/s Tx IC(a) 20 Gbit/s×2、(b) 40 Gbit/s×1・65 nm CMOS

Chi 4 2×4 2 2

Submission

・Chip ：4.2×4.2 mm2

・Power Consumption：1.8 W

doc.: IEEE 802.15/0491

T d f III V HEMT & HBT SiG HBTTrends of III-V HEMT & HBT, SiGe HBTHEMT III-V HBT

HBT’s

SiGe HBT

State of the art III-V devices provide 300-GHz ICs.

Submission

http://www.soumu.go.jp/soutsu/kinki/studygroup/2009/THz/report.html

doc.: IEEE 802.15/0491

- Trend of Amplifiers & Oscillaters -

Submission

http://www.soumu.go.jp/soutsu/kinki/studygroup/2009/THz/report.html

doc.: IEEE 802.15/0491

‘A 0 38 THz Fully Integrated Transceiver Utilizing

2011 Symposia on VLSI Technology and Circuits

A 0.38 THz Fully Integrated Transceiver Utilizing Quadrature Push-Push Circuitry’ (Park, U.C. Berkeley)

– 130nm SiGe BiCMOS– 4 x LO (90 GHz) just in front of antenna

2011 Symposia on VLSI Technology and Circuits

– Push-Push structure for multiplier and mixer– On chip patch antenna– Chip size: 2.2mm x 1.9mm– Power consumption : 364mW– For FM-CW Rader

Submission 28

doc.: IEEE 802.15/0491

‘20 M t hi HEMT ith 660 GH f ’

IPRM2011 Tu 4 2 2 （by A Leuther et al ）

‘20 nm Metamorphic HEMT with 660 GHz fT’by A. Leuther et al. (Fraunhofer IAF, Germany)

IPRM2011 Tu-4.2.2 （by A. Leuther et al.）

Details of the HEMT with fT=660 GHz Metamorphic HEMT（mHEMT）（on GaAs）Metamorphic HEMT（mHEMT）（on GaAs）Channel： In0.8Ga0.2As （double doping）2DEG Density： 6.1×1012 cm-2

Lg=20 nm, Lsd=500 nmRs=0.1 mmWg=2×10 mgm_max=2.5 S/mm、fT=660 GHz (@Vd =1 V)fT 660 GHz (@Vds 1 V)

・4 stage LNA (SMMIC) (Sub-Millimeter-wave Monolithic Integrated Circuit)W 2 4 ( HEMT) G i 10 dB @ 500 GHWg=2×4 m (mHEMT), Gain = 10 dB @ 500 GHzand Gain > 8 dB @ 470～500 GHzcf. TMIC (Terahertz Monolithic Integrated Circuit)

Submission

doc.: IEEE 802.15/0491

‘N T h l i f W I AlN/G N T i t ’

ISCS2011 Mo-2B.5 （by D. S. Lee et al.）

‘New Technologies for mm-Wave InAlN/GaN Transistors’by D. S. Lee et al. (MIT, USA & IQE LLC, USA)

（ y ）

Tomas Palacios’s Group at MITR h hi h d G N HEMTResearch on high speed GaN-HEMT

InAlN/AlN/GaN(/AlGaN) HEMTLsd=1.3 msd Lg=30 nm, fT=270 GHz （AlGaN with back barrier）

→WR fTIon implantation → Rc=0.04 mm

cf. Invited Talk by HRL Group（K. Shinohara et al., Tu-2A.1）AlN/GaN/AlGaN HEMTLg=45 nm, fT=260 GHz、fmax=394 GHzOhmic n+-GaN re-growth by MBE→Rac=Rc+R2DEG=0.08 mm

Submission

doc.: IEEE 802.15/0491

Plenary Talk: Dr. John Booske (Univ. Wisconsin-Madison, USA“Vacuum Electronics Sources for High Power Terahertz-Regime Radiation”Regime Radiation

Programs in USAPrograms in USA+ Darpa: HiFIVE (EIK, BWO, TWT, Gyrotron, FEL)

Elemental Technologies+ MEMSX-ray LIGA, UV-LIGA, DRIE, EDM, Laser Ablation+ High Current Density CathodeDispenser, Reservoir, CNT, Spindt FEA,

Contributed talks- TWT AMP @220 GHz (NRL, USA)- TWT AMP @220 GHz (UCD, USA)- BWO @700 GHz(Istok, Russia)- THz AMP@0 3-2THz (FP7 OPTHER) Feasible: Watt-class output power around 300 GHz

Submission

- THz [email protected] (FP7 OPTHER)(Gain 10-20dB, Output: 10dBm)

eas b e: Watt c ass output powe a ou d 300 Gwith ‘Pass Port’-size volume within 3-5 years->>> Good for WLAN application!

doc.: IEEE 802.15/0491

Relieve bottlenecks of last-accessRelieve bottlenecks of last access(No speed difference between wired and wireless)

Compatibility with optical network (Digital Coherent, RoF)

Radio on Fiber systems

Submission

doc.: IEEE 802.15/0491

Recent Result at NICT (RoF)Recent Result at NICT (RoF)

Submission

doc.: IEEE 802.15/0491July 2011

Trends of Radio on Fiber Technology: Carrier FreqTrends of Radio on Fiber Technology: Carrier Freq. Freq.

1000

100

cy (GHz)

10

rFrequenc

Carrier

1985 1990 1995 2000 2005 2010 2015 2020

1


year

doc.: IEEE 802.15/0491July 2011

Trends of Radio on Fiber Technology: Data rateTrends of Radio on Fiber Technology: Data rate

1T

D ata rate

10G

100G

1T

100M

1G

10G

it/s)

1M

10M

100M

ata rate (b

10k

100k

1M

Da

1985 1990 1995 2000 2005 2010 2015 2020

1k

10k

year


year

doc.: IEEE 802.15/0491

Summary of DiscussionsP i t !Points !(1) Ultra-high speed >> 10 Gbit/s, (Potentially 100 - 400 Gbit/s (multilevel modulation))(2) Small size instrumentations (Antenna Chip) Possible to install on the(2) Small size instrumentations (Antenna, Chip), Possible to install on the mobile terminals.(3) High speed electronics (MOS, GaN, InP, Vacuum) will be ready to use within 5/10 years5/10 years(4) (Probably) Low power consumption / bit

BenefitsBenefits(1) Relieve bottlenecks of last-access (No speed difference between wired and wireless)(2) Realize easy access to the cloud ( ) y(3) Ultra-high speed wireless interfaces (Probably, reconfigurable) (4) Possible contributions to “Energy Saving” and “Human Life”

Submission

doc.: IEEE 802.15/0491

IEEE 802 Five Criteria

• Broad Market Potential• Compatibility• Distinct Identity• Distinct Identity• Technical Feasibility• Economic Feasibility

Submission

doc.: IEEE 802.15/0491

Thank you for your attention!

Submission

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