january 17, 2001john stafford, motorola ...thor.inemi.org › ... › presentations › apex ›...

John Stafford, MotorolaJanuary 17, 2001

2000 Technology Roadmap2000 Technology RoadmapOptoelectronicsOptoelectronics

Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain2

OptoelectronicOptoelectronic Roadmap Agenda Roadmap Agenda

• Optoelectronics Market Overview

• Optical Communications Roadmap

• Optical Communications Technology Roadmap

• Optical Switches

• Optical Amplifiers

• Substrates for Optical systems

• Packaging for Optical Components

• Image Sensors


Optoelectronic’sOptoelectronic’s??

Optoelectronics is aCombination of Technologiesthat Provide the Capacity to

Generate, Transport andManipulate Data at High

Rates.


Scenario Of Optical JoiningScenario Of Optical JoiningTechnologyTechnology


Examples Of Products Enabled By Examples Of Products Enabled ByOptoelectronics TechnologyOptoelectronics Technology

NEMI Product Sector Optoelectronics Products / Components Serving This Sector

Low Cost Optical fiber, LED lamps, laser pointers, low-speed optical data links, IRports for computers

Hand Held Night vision scope, head mounted display

Cost / Performance Laser printer, digital camera, high-speed optical data links, laser scanner,digital medical imaging, product defect sensors, camcorders

High Performance 10 Gb/s laser transmitter, optical amplifier, tunable laser, DWDMcomponents, optical switches, airborne and space: communications andradar

Harsh Environment IR camera, light-guided missile, automotive: communications, sensors andlighting; airborne data links


World Market For Fiber Optic Products InWorld Market For Fiber Optic Products InCommunication ApplicationsCommunication Applications

Market Segment Year Sales ($B)

Test Equipment

Optical Components

Optical System Equipment

2001

20002005

19992003

1.27

50.0095.00

31.0090.00


Predicted Annual Compound Growth of KeyPredicted Annual Compound Growth of KeyOptical ComponentsOptical Components

•

Component Annual Growth Rate in % (1999-2009)

Fibers 17

Lasers 15

LED’s 9

Detectors 15

Connectors and Couplers 16

Components for Amplifiers 21

Optical Swithching Components 67

WDM Components 34

Other Multiplexing Components 14


Optical CommunicationsOptical CommunicationsRoadmapRoadmap

Services /Networks

1995 2000 2005 2011

Services POTS

Data

Fax

Internet

CATV

High-speed Internet

Tele-working, tele-learning

Tele-medicine

Video On Demand

Interactive entertainment

PWB interconnects

Next-Generation Internet

(1Gb/s to the desktop)

Distributed Virtual Environments(joint working, learning, andplay)

CMOS VLSI interconnects

Core 2.5Gb/s point to point

8 wavelength WDM pt. to pt.

10 Gb/s 40Gb/s

OADM, OXC

~128 wavelength DWDM

100/160Gb/s

Fully reconfigurable OXC.

>800 wavelengths DWDM

400Gb/s

Access POTS, Modem, ISDN, HFC,Cellular, Broadcast Satellite

56kb/s, 144kb/s

ATM/PON (155/622Mb/s)

Cable Modems

2.5Gb/s-10Gb/s

2.5 - 10Gb/s DWDM

Premises 100Mb/s Ethernet 1 Gb Ethernet

10 Gb/s Trunks

10 Gb Ethernet

100Gb/s to 1Tb/s trunks

40 Gb

Board toBoard

Research demos, 0.1 - 1 Gb/s

(all numbers are aggregate)

0.1 - 1 Gb/s, Commercial 1 - 10Gb/s, massively parallel 10 – 100Gb/s

Chip to Chip Research demos, 0.1 - 1 Gb/s

(all numbers are aggregate)

0.1 - 1 Gb/s 1 - 10Gb/s, massively parallel 10 – 100Gb/s


Optical Communication Technology RoadmapOptical Communication Technology Roadmap(1 of 3)(1 of 3)

Technology / Components Commercial Availability

1998 2000 2003 2005 2011

Long Haul Bitrate: (TDM) (DWDM)

10 Gb/s 40 Gb/s 80/ 160 Gb/s 400 Gb/s Solitons 0.4 - 1.6Tb/s 3.2 Tb/s 10Tb/s Optical 3R Regenerators?

Access Bitrate (residential): 155 / 622 Mb/s 2.5 Gb/s 10 Gb/s ADSL, cable modem DWDM

1 Gb/s ethernet?

LAN (Premises) Bitrate 1Gb ethernet 10 Gb ethernet 40 Gb/s ethernet 10 Gb/s trunks 100 Gb/s trunks

Board to Board Bitrates 0.1 - 1 Gb/s 1-10 Gb/s 10-100 Gb/s (aggregrate) massively parallel

On Board/On Chip

Chip-to-Chip

100 Gb/s 1 TB/s

Node Capacity

Routing / Switching, Inc. O/E

80 Gb/s 2.4 Tb/s 5 Tb/s >100 Tb/s

No of WDM Channels

Channel Spacing

40 160 320 512 800-1024? Polarization Interleaving?

100/50GHz 25GHz (with bitrate limit!)

WDM Subsystems OADM, OXC Reconfigurable OXC All Optical Network?



Technology/Components Commercial Availability

1998 2000 2003 2005 2011

Laser Sources: edge-emitters

VCSELs

Single λ DFBs 40 Σ tunable 100 Σ tunable 1000 channels

850 nm discrete 850 nm arrays 1300/1550 nm discrete

Optical Detectors WDM detector w/ filter

Lower cost APDs

Organic Photodetectors

Transceivers packaging

LAN price

Discrete Components Hybrid Integration (with CMOS VLSI) Lower Cost, LSI OEICs

$ 25 LED datacom $15 LED datacom $75 VCSEL datacom $45 VCSEL datacom

$700 ONU $175 ONU $100 ONU?

$1 T/R for board to board links

Optical Amplifiers <80nm 100nm Ultra -wideband OAs, 80-345nm

EDFA/Raman hybrid Channel Gain Compens. Price <$1000?

Optical Switches

16 x 16 128 x 128 1024 x 1024 4096x4096

Optical Packet Switching


DispersionCompensators

Disp. comp.fiber Bragg grating devices Slope management Dynamic dispersion compensation? Dynamic PMD compensation

WavelengthConverters

Optoelectronic all-optical (transducers)

Connectors Single mode very low cost (Access and Datacom) Array large array (for ~100 channel DWDM, Routers, Switches)Multimode & POF very low cost for premises networks

Optical Fibers Dispersion flattened large core for DWDM ultra wideband (no OH peak @1385nm) ultra low loss, low cost/ high speed plastic optical fiber

Optical Packages and Assembly

Low cost packaging and fiber coupling Automated surface mount assembly


Technology/ComponentsCommercial Availability

1998 2000 2003 2005 2011


Key Optical Switch TechnologiesKey Optical Switch Technologies

• Optomechanical Devices

• Micro-Electro-MechanicalSystems

• Liquid Crystals

• “Champagne”/Bubble Switch

• Thermo-Optical Switch


Current Approaches to MEMS OpticalCurrent Approaches to MEMS OpticalSwitchesSwitches

Device #Optical Actuation Architecture

Elements Methods

Small < 20 Electrostatic, 2D Array

Fabric Thermal

Medium 64 - 1024 Electrostatic, 2D Array

Fabric Magnetic

Large > 256 Electrostatic, 3D Array

Fabric Magnetic


Technology Issues for Optical PowerTechnology Issues for Optical PowerAmplifiersAmplifiers

System Level• Operational Wavelength 1490 nm – 1610 nm

• Operating Temperature 0ϒϒϒϒC – 65ϒϒϒϒC

• Output Power 26 dBmW - 30 dBmW

• Linearity ±±±± 0.1 dB

• Noise Figure 5 dB

Sub-System Level

• Pump Wavelengths 980 nm802 nm

1480 nm

• Pump Power 180 mW – 300 mW

• Pump Laser Reliability 106 Hrs.


Technology Advancements Needed for OpticalTechnology Advancements Needed for OpticalPower AmplifiersPower Amplifiers

• Economic means for thermal management of packaged highpower amplifiers. This issue extends to other aspects of thephysical design, including the optoelectronic devices and opticalpassives, which must meet stringent alignment tolerances.

• It is expected that within two years, market demand will becentered at the 80 channel to 160 channel capacity per band.Means for controlling the gain flatness of PAs over the full rangeof S, C, and L band are needed. These solutions are likely toinvolve a combination of improved materials, circuit and softwaretechniques.

• PA noise figures need to be improved. Further development inthis area is needed.

• To serve the MAN/LAN markets, which are progressively highervolume, more cost sensitive markets, nearly an order of magnitudefurther cost reduction will be required.


Substrates for Optical SystemsSubstrates for Optical Systems

• As system signal bandwidth requirements have increased,the printed circuit board(PCB) substrate characteristics andfeatures have become an key part of the systemspecification and performance.

• Ultimately, the signal bandwidth will exceed the capability ofcopper (<~5 Gb/s) and ‘on-board’ optical transmission willbecome a necessity.

• As systems become more complex and the number of fibersincrease, it will become necessary to integrate the opticalpathway into the high layer count PCB backplane fabricationand SMT assembly processes.

• An optical waveguide can be created by lithographicprocessing of thin polymer films and patterned on thesurface of the PWB or be buried within the substrate bysubsequent lamination.


Rigid backplanes are expected to dominate, but flexible backplanes will have strong presencein the marketplace as optical substrates become more widely used.Source: Electronic Packaging and Production Publication, March 2000


Packaging and Assembly Technology IssuesPackaging and Assembly Technology Issues

• Need for faster, higher performance, miniaturizedpackages.

• Need to incorporate increased levels ofoptical/electrical integration into package.

• Need to incorporate features for cost effectiveassembly technologies.

• Innovate new materials, design technologies tosupport above items.

• Thermal solutions for 1 to 2+ Watt packagedLasers.


Image SensorsImage Sensors

• Imaging CMOS (IMOS) Technology isEmerging as a Strong Competitor forDigital Cameras.

• Low Cost Packaging is a CriticalIssue for the IMOS Technology to bedominant.


SummarySummary

» Optoelectronics is about bandwidth.The “Copper Crunch” has come.

» Technologies are available to meetbandwidth needs up to 10Gbps. Coretechnology and component needs havebeen identified for the next decade.

» Issues:

(a)Manufacturing capacity for components(ie emitters, detectors) and fiber.

(b) Low cost assembly processes and lowcost packages for optoelectroniccomponents.

(c)Ability for standard automated board assembly of all optoelectronic parts.

january 17, 2001john stafford, motorola ...thor.inemi.org › ... › presentations › apex ›...

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