iti mankampur training report
TRANSCRIPT
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BONAFIDE CERTIFICATE
This is to certify that this summer training report from ITI,Mankapur
submitted to United Institute of Technology Allahabad,is a bonafide
record of work done by Brijesh Kumar Maurya under my supervision
from 15.06.2012 to 14.07.2012
S.S.BISHT
MANAGER(HREDC)
ITI Ltd. MANKAPUR GONDA
Place - MANKAPUR
Date- 14.07.2012
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CONTENT
CMPANY PROFILE
GSM(GLOBAL SERVICE FOR MOBILE COMMUNICATION)
BTS(BASE TRANSCEIVER STATION)
SMT(SURFACE MOUNT TECHNOLOGY) PCB(PRINTED CIRCUIT BOARD)
SIX SIGMA
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COMPANY PROFILE
I.T.I Ltd is the first public sector under taking of government to provide
telecom services.
I.T.I Ltd was established in 1948 ever since as pioneering venture in the field
of telecommunication, it has contributed to 50% of the present national
telecom network.
The company offers a complete range telecom products and total solution
covering the whole spectrum of switching, transmission, access and subscriber
premises equipments.
I.T.I joined the league of world class vendors of global spectrum for mobile
communication(GSM) technology with the inauguration of mobile equipment
manufacturing facilities at its Mankapur and Raebareli Plants in 2005-06. This
ushered new era of indigenous mobile equipments production in the country.
The company is consolidating its diversification into information and
communication technology(ICT) to have its competitive edge in theconvergence market by developing its rich telecom expertise and vast
infrastructure.
Network management system, encryption and networking solution for internal
connectivity are some of the major initiatives taken by the company.
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It have six manufacturing units-
BANGALORE UNIT-
Bangalore unit is the first plant of I.T.I setup in1948 and got acceleration of
ISO 9001. The telecom products manufactured here are digital switches, digital
microwave equipment, optical fibre equipment, satellite communication
equipment, access products and terminal equipments.
NAINI ALLAHABAD UNIT-
This plant was setup in 1971 for the manufacture of transmission equipment.
The major products are optical fibre system of both PDH and SDH and
telephone equipment of various types. It has a R and D centre and modern
facility for assembly and testing with surface mount technology,
Environmental lab, metal parts manufacturing facilities and PCB plant area
are parts of modern infrastructure.
RAE-BARELI UNIT-
Rae-bareli manufacturing unit was setup in 1973 and boast a world class
infrastructure. Presently this unit manufactures GSM network equipments and
CDMA handsets. It has taken a leap to enter broad band equipments G-PON
and WIMAX.
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MANKAPUR UNIT-
Mankapur unit was established in 1983. The plant manufactures large digital
switches and digital trunk exchange in technical collaboration with M/S
ALCATEL. This unit also produces BTS. It has the most modern facility for
PCB manufacturing assembly and automatic testing facility with SMT line and
environmental test lab.
PALAKKAD UNIT-
Palakkad unit was established in 1976 as the national first electronics
switching system manufacturing unit to manufacture large digital switches and
digital trunk exchanges in collaboration with ALCATEL. The plant wasawarded with ISO 9001 and ISO 14000. With world class manufacturing
facilities and international quality standards enjoying self certification. I.T.I
Palakkad is ranked the best among the telecom field industries in india.
SRINAGAR UNIT-
Srinagar plant was setup in 1969 for the supply of components to main plant.
In the year 1981, the status of plant was upgraded to that of a manufacturing
plant for the manufacture of telephone instruments. Its main products are
handset, telephone set, and perform assembling of telephone set.
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MISSION-
The mission of ITI is to be a leader in domestic market. To retain leadership in
manufacturing and supplying of new technology telecom products and also to
regain status of top turn key solution provider.
ITI CUSTOMER-
Bharat Sanchar Nigam Limited(BSNL) Defence Railway Power sector Steel sector
ABOUT ITI Ltd MANKAPUR
It is known as digital city of india. Its construction started from 31st may 1983. Start of production in 1985. Total land ITI Mankapur is 352 acres. Factory covers area 77500 m square. AC space 44300 m square.
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Township of ITI Mankapur consists of 3000 residence, 3 intermediateschools,two banks(SBI and PNB),shopping complex, swimming pool,
auditorium, two clubs.
It has SEA Plant(Switching Exchange Assembly Plant) which is thelargest single root air condition area in Asia.
At starting there were 7088 trees but now there are approximately 35000trees.
Now ITI Mankapur has entered into non-communication field with hisnote counting machine.
Note counting machine, inverter etc are being manufactured. It is the first unit in India which got apparatus to manufacture the BTS in
year 2005.
PRODUCTION OF ITI MANKAPUR
E-10B Exchange. CSN-MM Business Exchange. GSM. SEA Division.
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GSM
Short for Global System forMobile Communications, one of the leading digital
cellular systems. GSM uses narrowband TDMA, which allows eight
simultaneous calls on the same radio frequency.
GSM was first introduced in 1991. As of the end of 1997, GSM service was
available in more than 100 countries and has become the de facto standard in
Europe and Asia.
GSM (Global System for Mobile Communications, originally Groupe
Spcial Mobile), is a standard set developed by the European
Telecommunications Standards Institute (ETSI) to describe protocols for
second generation (2G) digitalcellular networksused bymobile phones.
The GSM standard was developed as a replacement for first generation (1G)
analog cellular networks, and originally described a digital, circuit switched
network optimized for full duplex voice telephony. This was expanded over
time to include data communications, first by circuit switched transport, then
packet data transport via GPRS (General Packet Radio Services) and EDGE
(Enhanced Data rates for GSM Evolution or EGPRS).
Further improvements were made when the3GPPdeveloped third generation
(3G) UMTS standards followed by fourth generation (4G) LTE Advanced
standards.
http://www.webopedia.com/TERM/C/cellular.htmlhttp://www.webopedia.com/TERM/T/TDMA.htmlhttp://en.wikipedia.org/wiki/European_Telecommunications_Standards_Institutehttp://en.wikipedia.org/wiki/European_Telecommunications_Standards_Institutehttp://en.wikipedia.org/wiki/European_Telecommunications_Standards_Institutehttp://en.wikipedia.org/wiki/2Ghttp://en.wikipedia.org/wiki/2Ghttp://en.wikipedia.org/wiki/Cellular_networkhttp://en.wikipedia.org/wiki/Cellular_networkhttp://en.wikipedia.org/wiki/Cellular_networkhttp://en.wikipedia.org/wiki/Mobile_phonehttp://en.wikipedia.org/wiki/Mobile_phonehttp://en.wikipedia.org/wiki/Mobile_phonehttp://en.wikipedia.org/wiki/1Ghttp://en.wikipedia.org/wiki/Duplex_%28telecommunications%29#Full_duplexhttp://en.wikipedia.org/wiki/Duplex_%28telecommunications%29#Full_duplexhttp://en.wikipedia.org/wiki/Telephonyhttp://en.wikipedia.org/wiki/Telephonyhttp://en.wikipedia.org/wiki/GPRShttp://en.wikipedia.org/wiki/GPRShttp://en.wikipedia.org/wiki/EDGEhttp://en.wikipedia.org/wiki/EDGEhttp://en.wikipedia.org/wiki/3GPPhttp://en.wikipedia.org/wiki/3GPPhttp://en.wikipedia.org/wiki/3GPPhttp://en.wikipedia.org/wiki/3Ghttp://en.wikipedia.org/wiki/3Ghttp://en.wikipedia.org/wiki/3Ghttp://en.wikipedia.org/wiki/UMTShttp://en.wikipedia.org/wiki/UMTShttp://en.wikipedia.org/wiki/4Ghttp://en.wikipedia.org/wiki/4Ghttp://en.wikipedia.org/wiki/LTE_Advancedhttp://en.wikipedia.org/wiki/LTE_Advancedhttp://en.wikipedia.org/wiki/LTE_Advancedhttp://en.wikipedia.org/wiki/4Ghttp://en.wikipedia.org/wiki/UMTShttp://en.wikipedia.org/wiki/3Ghttp://en.wikipedia.org/wiki/3GPPhttp://en.wikipedia.org/wiki/EDGEhttp://en.wikipedia.org/wiki/GPRShttp://en.wikipedia.org/wiki/Telephonyhttp://en.wikipedia.org/wiki/Duplex_%28telecommunications%29#Full_duplexhttp://en.wikipedia.org/wiki/1Ghttp://en.wikipedia.org/wiki/Mobile_phonehttp://en.wikipedia.org/wiki/Cellular_networkhttp://en.wikipedia.org/wiki/2Ghttp://en.wikipedia.org/wiki/European_Telecommunications_Standards_Institutehttp://en.wikipedia.org/wiki/European_Telecommunications_Standards_Institutehttp://www.webopedia.com/TERM/T/TDMA.htmlhttp://www.webopedia.com/TERM/C/cellular.html -
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GSM carrier frequencies
Main article: GSM frequency bands
GSM networks operate in a number of different carrier frequency ranges
(separated into GSM frequency ranges for 2G and UMTS frequency bands for
3G), with most 2G GSM networks operating in the 900 MHz or 1800 MHz
bands. Where these bands were already allocated, the 850 MHz and 1900 MHz
bands were used instead (for example in Canada and the United States). In rare
cases the 400 and 450 MHz frequency bands are assigned in some countries
because they were previously used for first-generation systems.
GSM service security
See also:UMTS security
GSM was designed with a moderate level of service security. The system was
designed to authenticate the subscriber using apre-shared keyandchallenge-
response. Communications between the subscriber and the base station can be
encrypted. The development of UMTS introduces an optional UniversalSubscriber Identity Module (USIM), that uses a longer authentication key to
give greater security, as well as mutually authenticating the network and the
user whereas GSM only authenticates the user to the network (and not vice
versa). The security model therefore offers confidentiality and authentication,
but limited authorization capabilities, and nonon-repudiation.
http://en.wikipedia.org/wiki/GSM_frequency_bandshttp://en.wikipedia.org/wiki/GSM_frequency_rangeshttp://en.wikipedia.org/wiki/UMTS_frequency_bandshttp://en.wikipedia.org/wiki/2Ghttp://en.wikipedia.org/wiki/2Ghttp://en.wikipedia.org/wiki/UMTS_securityhttp://en.wikipedia.org/wiki/UMTS_securityhttp://en.wikipedia.org/wiki/UMTS_securityhttp://en.wikipedia.org/wiki/Pre-shared_keyhttp://en.wikipedia.org/wiki/Pre-shared_keyhttp://en.wikipedia.org/wiki/Pre-shared_keyhttp://en.wikipedia.org/wiki/Challenge-response_authenticationhttp://en.wikipedia.org/wiki/Challenge-response_authenticationhttp://en.wikipedia.org/wiki/Challenge-response_authenticationhttp://en.wikipedia.org/wiki/Challenge-response_authenticationhttp://en.wikipedia.org/wiki/Universal_Mobile_Telecommunications_Systemhttp://en.wikipedia.org/wiki/Universal_Mobile_Telecommunications_Systemhttp://en.wikipedia.org/wiki/Universal_Subscriber_Identity_Modulehttp://en.wikipedia.org/wiki/Universal_Subscriber_Identity_Modulehttp://en.wikipedia.org/wiki/Universal_Subscriber_Identity_Modulehttp://en.wikipedia.org/wiki/Non-repudiationhttp://en.wikipedia.org/wiki/Non-repudiationhttp://en.wikipedia.org/wiki/Non-repudiationhttp://en.wikipedia.org/wiki/Non-repudiationhttp://en.wikipedia.org/wiki/Universal_Subscriber_Identity_Modulehttp://en.wikipedia.org/wiki/Universal_Subscriber_Identity_Modulehttp://en.wikipedia.org/wiki/Universal_Mobile_Telecommunications_Systemhttp://en.wikipedia.org/wiki/Challenge-response_authenticationhttp://en.wikipedia.org/wiki/Challenge-response_authenticationhttp://en.wikipedia.org/wiki/Pre-shared_keyhttp://en.wikipedia.org/wiki/UMTS_securityhttp://en.wikipedia.org/wiki/2Ghttp://en.wikipedia.org/wiki/UMTS_frequency_bandshttp://en.wikipedia.org/wiki/GSM_frequency_rangeshttp://en.wikipedia.org/wiki/GSM_frequency_bands -
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GSM uses several cryptographic algorithms for security. The A5/1,A5/2and
A5/3stream ciphersare used for ensuring over-the-air voice privacy. A5/1 was
developed first and is a stronger algorithm used within Europe and the United
States; A5/2 is weaker and used in other countries. Serious weaknesses have
been found in both algorithms: it is possible to break A5/2 in real-time with a
ciphertext-only attack, and in January 2007, The Hacker's Choice started the
A5/1 cracking project with plans to use FPGAsthat allow A5/1 to be broken
with a rainbow table attack. The system supports multiple algorithms so
operators may replace that cipher with a stronger one.
GSM open-source software
Severalopen-sourcesoftware projects exist that provide certain GSM features:
gsmd daemon byOpenmoko OpenBTSdevelops aBase transceiver station The GSM Software Project aims to build a GSM analyzer for less than
$1000
OsmocomBB developers intend to replace the proprietary basebandGSM stack with a free software implementation
http://en.wikipedia.org/wiki/A5/1http://en.wikipedia.org/wiki/A5/1http://en.wikipedia.org/wiki/A5/2http://en.wikipedia.org/wiki/A5/2http://en.wikipedia.org/wiki/A5/3http://en.wikipedia.org/wiki/Stream_cipherhttp://en.wikipedia.org/wiki/Stream_cipherhttp://en.wikipedia.org/wiki/Stream_cipherhttp://en.wikipedia.org/wiki/Ciphertext-only_attackhttp://en.wikipedia.org/wiki/Ciphertext-only_attackhttp://en.wikipedia.org/wiki/The_Hacker%27s_Choicehttp://en.wikipedia.org/wiki/The_Hacker%27s_Choicehttp://en.wikipedia.org/wiki/FPGAhttp://en.wikipedia.org/wiki/FPGAhttp://en.wikipedia.org/wiki/Rainbow_tablehttp://en.wikipedia.org/wiki/Rainbow_tablehttp://en.wikipedia.org/wiki/Open_sourcehttp://en.wikipedia.org/wiki/Open_sourcehttp://en.wikipedia.org/wiki/Open_sourcehttp://en.wikipedia.org/wiki/Openmokohttp://en.wikipedia.org/wiki/Openmokohttp://en.wikipedia.org/wiki/Openmokohttp://en.wikipedia.org/wiki/OpenBTShttp://en.wikipedia.org/wiki/OpenBTShttp://en.wikipedia.org/wiki/Base_transceiver_stationhttp://en.wikipedia.org/wiki/Base_transceiver_stationhttp://en.wikipedia.org/wiki/Base_transceiver_stationhttp://en.wikipedia.org/wiki/Base_transceiver_stationhttp://en.wikipedia.org/wiki/OpenBTShttp://en.wikipedia.org/wiki/Openmokohttp://en.wikipedia.org/wiki/Open_sourcehttp://en.wikipedia.org/wiki/Rainbow_tablehttp://en.wikipedia.org/wiki/FPGAhttp://en.wikipedia.org/wiki/The_Hacker%27s_Choicehttp://en.wikipedia.org/wiki/Ciphertext-only_attackhttp://en.wikipedia.org/wiki/Stream_cipherhttp://en.wikipedia.org/wiki/A5/3http://en.wikipedia.org/wiki/A5/2http://en.wikipedia.org/wiki/A5/1 -
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EVOLUTION OF GSM STANDARD
1982 : Group special mobile developed GSM 1989 : GSM responsibility transferred to ETSI(European
Telecommunication Instandards Institute)
1990 : Phase 1 of GSM specification published 1991 : Commercial service started 1997 : Commercial services available in 110 countries
OBJECTIVE OF GSM
Good speech quality. Low terminal and service cost. Support for international roaming. Ability to support hand held terminals. Support for range of new services and facilities. ISDN compability. Spectral efficiency. ISDN caused the decline of E10B.
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BTS(BASE TRANSCEIVER STATION)
Base transceiver station(BTS) is the main part of mobile communication. BTS
consists of mainly three cards. Whole system of BTS consists-
Fan unit( it have 9 fans) Rack unit FACB( Fan Control Board)
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A typical BTS tower which holds the antenna. The tower is quite widely
misinterpreted as the BTS itself. The shelter which houses the actual BTS can
also be seen.
A mobile BTS
A BTS mounted on a building
http://en.wikipedia.org/wiki/File:Base_station_on_building.jpghttp://en.wikipedia.org/wiki/File:BaseGSM_Mobile.JPGhttp://en.wikipedia.org/wiki/File:BaseGSM_Mobile.JPGhttp://en.wikipedia.org/wiki/File:Base_station_on_building.jpghttp://en.wikipedia.org/wiki/File:BaseGSM_Mobile.JPGhttp://en.wikipedia.org/wiki/File:BaseGSM_Mobile.JPGhttp://en.wikipedia.org/wiki/File:Base_station_on_building.jpghttp://en.wikipedia.org/wiki/File:BaseGSM_Mobile.JPGhttp://en.wikipedia.org/wiki/File:BaseGSM_Mobile.JPG -
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A base transceiver station (BTS) is a piece of equipment that facilitates
wireless communication between user equipment (UE) and a network. UEs are
devices like mobile phones (handsets), WLL phones, computers with wireless
internet connectivity, WiFi and WiMAX devices and others. The network can
be that of any of the wireless communication technologies like GSM, CDMA,
Wireless local loop, WAN, WiFi, WiMAX, etc.
BTS is also referred to as the radio base station (RBS), node B (in 3G
Networks) or, simply, the base station (BS). For discussion of the LTE
standard the abbreviationeNBfor evolved node B is widely used.
Though the term BTS can be applicable to any of the wireless communication
standards, it is generally associated with mobile communication technologies
like GSM and CDMA. In this regard, a BTS forms part of the base station
subsystem (BSS) developments for system management. It may also have
equipment for encrypting and decrypting communications, spectrum filtering
tools (band pass filters), etc. antennas may also be considered as components
of BTS in general sense as they facilitate the functioning of BTS. Typically a
BTS will have several transceivers (TRXs) which allow it to serve several
different frequencies and different sectors of the cell (in the case of sectorised
base stations). A BTS is controlled by a parent base station controller via the
base station control function (BCF). The BCF is implemented as a discrete unit
or even incorporated in a TRX in compact base stations.
http://en.wikipedia.org/wiki/Wirelesshttp://en.wikipedia.org/wiki/User_equipmenthttp://en.wikipedia.org/wiki/Mobile_phonehttp://en.wikipedia.org/wiki/Wireless_local_loophttp://en.wikipedia.org/wiki/Computershttp://en.wikipedia.org/wiki/Wireless_internethttp://en.wikipedia.org/wiki/Wireless_internethttp://en.wikipedia.org/wiki/WiFihttp://en.wikipedia.org/wiki/WiMAXhttp://en.wikipedia.org/wiki/GSMhttp://en.wikipedia.org/wiki/CDMAhttp://en.wikipedia.org/wiki/Wireless_local_loophttp://en.wikipedia.org/wiki/Wide_area_networkhttp://en.wikipedia.org/wiki/WiFihttp://en.wikipedia.org/wiki/WiMAXhttp://en.wikipedia.org/wiki/Node_Bhttp://en.wikipedia.org/wiki/Node_Bhttp://en.wikipedia.org/wiki/3Ghttp://en.wikipedia.org/wiki/3GPP_Long_Term_Evolutionhttp://en.wikipedia.org/wiki/EnodeBhttp://en.wikipedia.org/wiki/EnodeBhttp://en.wikipedia.org/wiki/EnodeBhttp://en.wikipedia.org/wiki/Wireless_communicationhttp://en.wikipedia.org/wiki/GSMhttp://en.wikipedia.org/wiki/CDMAhttp://en.wikipedia.org/wiki/Base_station_subsystemhttp://en.wikipedia.org/wiki/Base_station_subsystemhttp://en.wikipedia.org/wiki/Encryptinghttp://en.wikipedia.org/wiki/Antennashttp://en.wikipedia.org/wiki/Base_station_controllerhttp://en.wikipedia.org/wiki/Base_station_controllerhttp://en.wikipedia.org/wiki/Antennashttp://en.wikipedia.org/wiki/Encryptinghttp://en.wikipedia.org/wiki/Base_station_subsystemhttp://en.wikipedia.org/wiki/Base_station_subsystemhttp://en.wikipedia.org/wiki/CDMAhttp://en.wikipedia.org/wiki/GSMhttp://en.wikipedia.org/wiki/Wireless_communicationhttp://en.wikipedia.org/wiki/EnodeBhttp://en.wikipedia.org/wiki/3GPP_Long_Term_Evolutionhttp://en.wikipedia.org/wiki/3Ghttp://en.wikipedia.org/wiki/Node_Bhttp://en.wikipedia.org/wiki/WiMAXhttp://en.wikipedia.org/wiki/WiFihttp://en.wikipedia.org/wiki/Wide_area_networkhttp://en.wikipedia.org/wiki/Wireless_local_loophttp://en.wikipedia.org/wiki/CDMAhttp://en.wikipedia.org/wiki/GSMhttp://en.wikipedia.org/wiki/WiMAXhttp://en.wikipedia.org/wiki/WiFihttp://en.wikipedia.org/wiki/Wireless_internethttp://en.wikipedia.org/wiki/Wireless_internethttp://en.wikipedia.org/wiki/Computershttp://en.wikipedia.org/wiki/Wireless_local_loophttp://en.wikipedia.org/wiki/Mobile_phonehttp://en.wikipedia.org/wiki/User_equipmenthttp://en.wikipedia.org/wiki/Wireless -
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General architecture
A BTS in general has the following parts:
Transceiver (TRX)
Quite widely referred to as the driver receiver (DRX), DRX are either in
the form of single (sTRU), double(dTRU) or a composite double radio
unit (DRU). It basically does transmission and reception of signals. It
also does sending and reception of signals to and from higher network
entities (like thebase station controllerin mobile telephony).
Power amplifier (PA)
Amplifies the signal from DRX for transmission through antenna; may
be integrated with DRX.
Combiner
Combines feeds from several DRXs so that they could be sent out
through a single antenna. Allows for a reduction in the number of
antenna used.
Duplexer
For separating sending and receiving signals to/from antenna. Does
sending and receiving signals through the same antenna ports (cables
to antenna).
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Antenna
This is the structure that lies underneath the BTS; it can be installed as
it is or disguised in some way (Concealed cell sites).
Alarm extension system
Collects working status alarms of various units in the BTS and extends
them to operations and maintenance (O&M) monitoring stations.
Control function
Controls and manages the various units of BTS, including any software.
On-the-spot configurations, status changes, software upgrades, etc. are
done through the control function.
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SURFACE-MOUNT TECHNOLOGY
Surface-mount technology (SMT) is a method for constructing electronic
circuits in which the components are mounted directly onto the surface of
printed circuit boards (PCBs). An electronic device so made is called a
surface-mount device (SMD). In the industry it has largely replaced the
through-hole technology construction method of fitting components with wire
leads into holes in the circuit board. Both technologies can be used on the same
board for components not suited to surface mounting such as transformers and
heat-sinked power semiconductors.
An SMT component is usually smaller than its through-hole counterpart
because it has either smaller leads or no leads at all. It may have short pins or
leads of various styles, flat contacts, a matrix of solder balls (BGAs), or
terminations on the body of the component.
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Assembly techniques
Assembly line with SMT placement machines,Where components are to be
placed, the printed circuit board normally has flat, usually tin-lead, silver, or
gold plated copper pads without holes, called solder pads. Solder paste, a
sticky mixture offlux and tiny solder particles, is first applied to all the solder
pads with a stainless steel or nickel stencil using a screen printing process. It
can also be applied by a jet-printing mechanism, similar to an inkjet printer.
After pasting, the boards then proceed to the pick-and-place machines, where
they are placed on a conveyor belt. The components to be placed on the
boards are usually delivered to the production line in either paper/plastic
tapes wound on reels or plastic tubes. Some large integrated circuits are
delivered in static-free trays. Numerical control pick-and-place machines
remove the parts from the tapes, tubes or trays and place them on the PCB.
http://en.wikipedia.org/wiki/Tinhttp://en.wikipedia.org/wiki/Copperhttp://en.wikipedia.org/wiki/Solder_pastehttp://en.wikipedia.org/wiki/Flux_%28metallurgy%29http://en.wikipedia.org/wiki/Screen_printinghttp://en.wikipedia.org/wiki/Inkjet_printerhttp://en.wikipedia.org/wiki/SMT_placement_equipmenthttp://en.wikipedia.org/wiki/Numerical_controlhttp://en.wikipedia.org/wiki/File:Juki_KE-2080L_by_Megger.jpghttp://en.wikipedia.org/wiki/Numerical_controlhttp://en.wikipedia.org/wiki/SMT_placement_equipmenthttp://en.wikipedia.org/wiki/Inkjet_printerhttp://en.wikipedia.org/wiki/Screen_printinghttp://en.wikipedia.org/wiki/Flux_%28metallurgy%29http://en.wikipedia.org/wiki/Solder_pastehttp://en.wikipedia.org/wiki/Copperhttp://en.wikipedia.org/wiki/Tin -
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Advantages
The main advantages of SMT over the older through-hole technique are:
Smaller components. As of 2012 smallest was 0.2 0.1 mm (0.01 in
0.005 in: 01005). Much higher component density (components per unit area) and many
more connections per component.
Lower initial cost and time of setting up for production. Fewer holes need to be drilled. Simpler and faster automated assembly. Some placement machines are
capable of placing more than 136,000 components per hour.* Small
errors in component placement are corrected automatically as the
surface tension of molten solder pulls components into alignment with
solder pads.
Components can be placed on both sides of the circuit board.
DISADVANTAGE OF SMT
More heat generation. Small clearance makes cleaning difficult. Visual inspection difficult. Air conditioned required.
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PRINTED CIRCUIT BOARD
A printed circuit board or PCB, is used to mechanically support and
electrically connect electronic components using conductive pathways, tracks
or signal traces etched from copper sheets laminated onto a non-conductive
substrate. It is also referred to as printed wiring board (PWB) or etched
wiring board. Printed circuit boards are used in virtually all but the simplest
commercially produced electronic devices.
A PCB populated with electronic components is called a printed circuit
assembly (PCA), printed circuit board assembly or PCB Assembly
(PCBA). In informal use the term "PCB" is used both for bare and assembled
boards, the context clarifying the meaning.
Alternatives to PCBs include wire wrap and point-to-point construction. PCBs
must initially be designed and laid out, but become cheaper, faster to make,
and potentially more reliable for high-volume production since production and
soldering of PCBs can be automated. Much of the electronics industry's PCB
design, assembly, and quality control needs are set by standards published by
the IPC organization.
http://en.wikipedia.org/wiki/Electronic_componenthttp://en.wikipedia.org/wiki/Electrical_conductorhttp://en.wikipedia.org/wiki/Industrial_etchinghttp://en.wikipedia.org/wiki/Copperhttp://en.wikipedia.org/wiki/Laminatedhttp://en.wikipedia.org/wiki/Substrate_%28electronics%29http://en.wikipedia.org/wiki/Wire_wraphttp://en.wikipedia.org/wiki/Point-to-point_constructionhttp://en.wikipedia.org/wiki/Mass_productionhttp://en.wikipedia.org/wiki/IPC_%28electronics%29http://en.wikipedia.org/wiki/IPC_%28electronics%29http://en.wikipedia.org/wiki/Mass_productionhttp://en.wikipedia.org/wiki/Point-to-point_constructionhttp://en.wikipedia.org/wiki/Wire_wraphttp://en.wikipedia.org/wiki/Substrate_%28electronics%29http://en.wikipedia.org/wiki/Laminatedhttp://en.wikipedia.org/wiki/Copperhttp://en.wikipedia.org/wiki/Industrial_etchinghttp://en.wikipedia.org/wiki/Electrical_conductorhttp://en.wikipedia.org/wiki/Electronic_component -
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Manufacturing
Materials
A PCB as a design on a computer (left) and realized
as a board assembly populated with components
(right). The board is double sided, with through-hole
plating, green solder resist, and white silkscreen
printing. Both surface mount and through-hole
components have been used.
http://en.wikipedia.org/wiki/File:Mouse_printed_circuit_board_both_sides_IMG_0959a.JPGhttp://en.wikipedia.org/wiki/File:PCB_design_and_realisation_smt_and_through_hole.pnghttp://en.wikipedia.org/wiki/File:Mouse_printed_circuit_board_both_sides_IMG_0959a.JPGhttp://en.wikipedia.org/wiki/File:PCB_design_and_realisation_smt_and_through_hole.png -
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A PCB in a computer mouse. The Component Side (left) and the printed side
(right).
The Component Side of a PCB in a computer mouse; some examples for
common components and their reference designations on the silk screen.
Component and solderside
Conducting layers are typically made of thin copper foil. Insulating layers
dielectric are typically laminated together with epoxy resin prepreg. The
board is typically coated with a solder mask that is green in color. Other colors
that are normally available are blue, black, white and red.
http://en.wikipedia.org/wiki/Electronic_symbols#Reference_designationshttp://en.wikipedia.org/wiki/Electronic_componenthttp://en.wikipedia.org/wiki/Solderhttp://en.wikipedia.org/wiki/Dielectrichttp://en.wikipedia.org/wiki/Epoxy_resinhttp://en.wikipedia.org/wiki/Prepreghttp://en.wikipedia.org/wiki/Solder_maskhttp://en.wikipedia.org/wiki/File:Splatine.jpghttp://en.wikipedia.org/wiki/File:Mouse_printed_circuit_board_component_side_IMG_0952_-_d.JPGhttp://en.wikipedia.org/wiki/File:Splatine.jpghttp://en.wikipedia.org/wiki/File:Mouse_printed_circuit_board_component_side_IMG_0952_-_d.JPGhttp://en.wikipedia.org/wiki/Solder_maskhttp://en.wikipedia.org/wiki/Prepreghttp://en.wikipedia.org/wiki/Epoxy_resinhttp://en.wikipedia.org/wiki/Dielectrichttp://en.wikipedia.org/wiki/Solderhttp://en.wikipedia.org/wiki/Electronic_componenthttp://en.wikipedia.org/wiki/Electronic_symbols#Reference_designations -
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There are quite a few different dielectrics that can be chosen to provide
different insulating values depending on the requirements of the circuit. Some
of these dielectrics are polytetrafluoroethylene (Teflon), FR-4, FR-1, CEM-1
or CEM-3.
Well known prepreg materials used in the PCB industry are FR-2 (Phenolic
cotton paper), FR-3 (Cotton paper and epoxy), FR-4 (Woven glass and epoxy),
FR-5 (Woven glass and epoxy), FR-6 (Matte glass and polyester), G-10
(Woven glass and epoxy), CEM-1 (Cotton paper and epoxy), CEM-2 (Cotton
paper and epoxy), CEM-3 (Non-woven glass and epoxy), CEM-4 (Woven
glass and epoxy), CEM-5 (Woven glass and polyester). Thermal expansion is
an important consideration especially with ball grid array (BGA) and naked die
technologies, and glass fiber offers the best dimensional stability.
FR-4 is by far the most common material used today. The board with copper
on it is called "copper-clad laminate".
http://en.wikipedia.org/wiki/Polytetrafluoroethylenehttp://en.wikipedia.org/wiki/FR-2http://en.wikipedia.org/wiki/FR-4http://en.wikipedia.org/wiki/Ball_grid_arrayhttp://en.wikipedia.org/wiki/Ball_grid_arrayhttp://en.wikipedia.org/wiki/FR-4http://en.wikipedia.org/wiki/FR-2http://en.wikipedia.org/wiki/Polytetrafluoroethylene -
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SIX SIGMA
Six Sigma is a business management strategy, originally developed by
Motorola in 1986.Six Sigma became well known after Jack Welch made it a
central focus of his business strategy at General Electric in 1995, and today it
is widely used in many sectors of industry.
Six Sigma seeks to improve the quality of process outputs by identifying and
removing the causes of defects (errors) and minimizing variability in
manufacturing and business processes. It uses a set of quality management
methods, including statistical methods, and creates a special infrastructure of
people within the organization ("Black Belts", "Green Belts", etc.) who areexperts in these methods. Each Six Sigma project carried out within an
organization follows a defined sequence of steps and has quantified financial
targets (cost reduction and/or profit increase).
Methods
Six Sigma projects follow two project methodologies inspired by Deming's
Plan-Do-Check-Act Cycle. These methodologies, composed of five phases
each, bear the acronyms DMAIC and DMADV.
AIC is used for projects aimed at improving an existing business process.
http://en.wikipedia.org/wiki/Strategic_managementhttp://en.wikipedia.org/wiki/Jack_Welchhttp://en.wikipedia.org/wiki/General_Electrichttp://en.wikipedia.org/wiki/Statistical_dispersionhttp://en.wikipedia.org/wiki/Manufacturinghttp://en.wikipedia.org/wiki/Business_processhttp://en.wikipedia.org/wiki/Quality_managementhttp://en.wikipedia.org/wiki/Statisticshttp://en.wikipedia.org/wiki/W._Edwards_Deminghttp://en.wikipedia.org/wiki/PDCAhttp://en.wikipedia.org/wiki/PDCAhttp://en.wikipedia.org/wiki/W._Edwards_Deminghttp://en.wikipedia.org/wiki/Statisticshttp://en.wikipedia.org/wiki/Quality_managementhttp://en.wikipedia.org/wiki/Business_processhttp://en.wikipedia.org/wiki/Manufacturinghttp://en.wikipedia.org/wiki/Statistical_dispersionhttp://en.wikipedia.org/wiki/General_Electrichttp://en.wikipedia.org/wiki/Jack_Welchhttp://en.wikipedia.org/wiki/Strategic_management -
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DMADV is used for projects aimed at creating new product or processdesigns.[15]DMADV is pronounced as "duh-mad-vee" ().
DMAIC
The DMAIC project methodology has five phases:
Define the problem, the voice of the customer, and the project goals,specifically.
Measure key aspects of the current process and collect relevant data. Analyze the data to investigate and verify cause-and-effect
relationships. Determine what the relationships are, and attempt to
ensure that all factors have been considered. Seek out root cause of the
defect under investigation.
Improve or optimize the current process based upon data analysis usingtechniques such as design of experiments, poka yoke or mistake
proofing, and standard work to create a new, future state process. Set
up pilot runs to establish process capability.
http://en.wikipedia.org/wiki/Six_Sigma#cite_note-juran-14http://en.wikipedia.org/wiki/Six_Sigma#cite_note-juran-14http://en.wikipedia.org/wiki/Six_Sigma#cite_note-juran-14http://en.wikipedia.org/wiki/Design_of_experimentshttp://en.wikipedia.org/wiki/Poka_yokehttp://en.wikipedia.org/wiki/Process_capabilityhttp://en.wikipedia.org/wiki/Process_capabilityhttp://en.wikipedia.org/wiki/Poka_yokehttp://en.wikipedia.org/wiki/Design_of_experimentshttp://en.wikipedia.org/wiki/Six_Sigma#cite_note-juran-14 -
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Origin and meaning of the term "six sigma process"
The term "six sigma process" comes from the notion that if one has six
standard deviations between the process mean and the nearest specification
limit, as shown in the graph, practically no items will fail to meet
specifications.This is based on the calculation method employed in process
capability studies.
Capability studies measure the number of standard deviations between the
process mean and the nearest specification limit in sigma units. As process
standard deviation goes up, or the mean of the process moves away from the
center of the tolerance, fewer standard deviations will fit between the mean and
the nearest specification limit, decreasing the sigma number and increasing the
likelihood of items outside specification.
http://en.wikipedia.org/wiki/Standard_deviationhttp://en.wikipedia.org/wiki/Meanhttp://en.wikipedia.org/wiki/Process_capabilityhttp://en.wikipedia.org/wiki/Process_capabilityhttp://en.wikipedia.org/w/index.php?title=File:6_Sigma_Normal_distribution.svg&page=1http://en.wikipedia.org/wiki/Process_capabilityhttp://en.wikipedia.org/wiki/Process_capabilityhttp://en.wikipedia.org/wiki/Meanhttp://en.wikipedia.org/wiki/Standard_deviation -
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OBJECTIVE OF SIX SIGMA
Six sigma as agoal. Six sigma as a bench mark. Six sigma as a vision. Six sigma as a philosophy. Six sigma as a business policy. Six sigma as a tool. Six sigma as a method. Six sigma as a strategy. Six sigma as a metric.
PRINCIPLE OF SIX SIGMA
Elinghtment. Acceptance. Tool. Development. Result. renewable.
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PROCESS ELEMENTS
Analysis of variation. Disciplined approach. Quantitative measures. Statistical methods. Process improvement.