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Single-Chip Voice Record/Playback Devices60-, 75-, 90-, and 120-Second Durations

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Figure i: ISD2560/75/90/120 Device Block Diagram

iISD—APRIL 1998

ISD2560/75/90/120 Products

FEATURES• Easy-to-use single-chip voice record/

playback solution

• High-quality, natural voice/audio reproduction

• Manual switch or microcontroller compatible playback can be edge- or level-activated

• Single-chip durations of 60, 75, 90, and 120 seconds

• Directly cascadable for longer durations

• Automatic Power-Down (Push-Button Mode)

– Standby current 1 µA (typical)

• Zero-power message storage

– Eliminates battery backup circuits

• Fully addressable to handle multiple messages

• 100-year message retention (typical)

• 100,000 record cycles (typical)

• On-chip clock source

• Programmer support for play-only applications

• Single +5 volt power supply

• Available in die form, DIP, SOIC, and TSOP packaging

Table i: ISD2560/75/90/120 Product Summary

PartNumber

Duration(Seconds)

Input SampleRate (KHz)

Typical Filter Pass Band (KHz)

ISD2560 60 8.0 3.4

ISD2575 75 6.4 2.7

ISD2590 90 5.3 2.3

ISD25120 120 4.0 1.7

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Figure 3: Playback

9ISD


1. Stresses above those listed may cause permanent damage to the device. Exposure to the absolute maximum ratings may affect device reliability. Functional operation is not implied at these conditions.

1. Case temperature.2. VCC = VCCA = VCCD.3. VSS = VSSA = VSSD. 4. Consult factory.

Table 4: Absolute Maximum Ratings (Packaged Parts)(1)

Condition Value

Junction temperature 150°C

Storage temperature range –65°C to +150°C

Voltage applied to any pin (VSS – 0.3 V) to (VCC + 0.3 V)

Voltage applied to any pin(Input current limited to ±20 mA)

(VSS – 1.0 V) to (VCC + 1.0 V)

Lead temperature (soldering – 10 seconds)

300°C

VCC – VSS –0.3 V to +7.0 V

Table 5: Operating Conditions (Packaged Parts)

Condition Value

Commercial operating temperature range(1)

0°C to +70°C

Industrial operating temperature range(1)

Supply voltage (VCC)(2) +4.5 V to +5.5 V

Ground voltage (VSS)(3) 0 V

Table 6: DC Parameters (Packaged Parts)

Symbol Parameters Min(2) Typ (1) Max(2) Units Conditions

VIL Input Low Voltage 0.8 V

VIH Input High Voltage 2.0 V

VOL Output Low Voltage 0.4 V IOL = 4.0 mA

VOH Output High Voltage VCC–0.4 V IOH = –10 µA

VOH1 OVF Output High Voltage 2.4 V IOH = –1.6 mA

VOH2 EOM Output High Voltage VCC – 1.0 VCC – 0.8 V IOH = –3.2 mA

ICC VCC Current (Operating) 25 30 mA REXT = ∞ (3)

ISB VCC Current (Standby) 1 10 µA (3)

IIL Input Leakage Current ±1 µA

IILPD Input Current HIGH w/Pull Down

130 µA Force VCC (4)

REXT Output Load Impedance 16 Ω Speaker Load

RMIC Preamp In Input Resistance

4 9 15 KΩ MIC and MIC REF Pins

RAUX AUX INPUT Resistance 5 11 20 KΩ

10 Voice Solutions in Silicon™

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Table 7: AC Parameters (Packaged Parts)

Symbol Characteristic Min (2) Typ (1) Max(2) Units Conditions

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Table 6: DC Parameters (Packaged Parts)


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Table 7: AC Parameters (Packaged Parts)

Symbol Characteristic Min (2) Typ (1) Max(2) Units Conditions


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Table 8: Absolute Maximum Ratings (Die)(1)

Condition Value

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Table 9: Operating Conditions (Die)

Condition Value

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Table 10: DC Parameters (Die)


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Table 11: AC Parameters (Die)

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Table 10: DC Parameters (Die)


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Table 11: AC Parameters (Die)

Symbol Characteristic Min(2) Typ (1) Max(2) Units Conditions


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Figure 4: ISD2560/75/90/120 Application Example—Design Schematic

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Table 12: Application Example—Basic Device Control

Control Step Function Action

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% ##! ! ! !#1-'5.* ##! 2=2

2 6 -'5.* +1/ A :& 4( A +'# 3)8

6 6 ! !# +1/ A 3)8& 4( A 3)8

2

6

(# -'5.*

(# ! !#

2 %

+ ! 4( A :


Table 13: Application Example—Passive Component Functions

Part Function Comments

/ ! -$ - "! --'5 # -' /# - "! --'5

/ /' % !' % ! 2:4

/& / ! -$ . ! ! +! 0# . ! %! -$ -!

/ ! '% ! ! /# '0' -!0 # ! $$! --'5

0 '

/ ! '% ! ! /# '0' $$ --'5 0 '

4& 4 ! -$ 4=.' * - !

3 "!F5

-' %! -$ . ! % $- +! 0# '

- ' ' "!F5 # %% % #

!K

4 2*1/' % *1!' % ! 2:4

4 3 "!F5 - ! +! 0# ## ' - ' ! ' "!F5

4 ! -$ - "! --'5 # -' /# - "! --'5

4& 4& 4 + "! --'5 - ! '! # .5- - "! --'5

, !"

& &#" ,- !# " #/

( &/= # #&/

&! ! & # & :/

1& + ! & " ,&(

( $9;; && 1 &"+

, + & ,&D "

( " #&&! &

=& # & !

,& ##! $9;; 1(

&"+ , + " "& &

NOTE *+

# ) # .

19ISD


Figure 5: ISD2560/75/90/120 Application Example—Microcontroller/ISD2500 Interface

Figure 6: ISD2500 Application Example—Push-Button

4 )

Table 14: Application Example—Push-Button Control

Control Step Function Action

' ! !#1-'5.* % # +1/ A 2 #!#

2

6

6 -'5.*

6 ! !#

+1/ A :& 4( A +'# 3)8

+1/ A 3)8& 4( A +'# 3)8

+ ! !# ! -'5.* 4( A +'# 3)8

2

6

(# -'5.*

(# ! !#

2 % () %!*! ! + A +'# :

+ A +'# :

Table 15: Application Example—Passive Component Functions

Part Function Comments

/ /' % !' % ! 2:4

/ ! '% ! ! /# '0' -!0 # ! $$! --'5

0 '

/& / +''- # -''# " ! ! -

4& 4& 4 + "! --'5 - ! '! # .5- - "! --'5

4 2*1/' % *1!' % ! 2:4

4 3 "!F5 - ! +! 0# ## ' - ' ! ' "!F5

Table 16: Push-Button Parameters

Symbol Characteristic Min Typ (1) Max Units Conditions

E 4( +' 8#$ L!1+M

E 4 ! '12##! - E%

E + "!C- '5

%

%

%

%

E + +' 8#$ L -1/M

E 4( () :

E 4( () 3)8

E 4( : .

%

%

%

%

21ISD

+ "%%

Figure 7: Push-Button Mode Record

Figure 8: Push-Button Mode Playback

?8 >8 < ! - 1

" /9

" 1 "

" @)A@ "*= +

" /9 8 8 4

8 @)A@ "*= + 8 ) 8 @)A@ "*=

" /9 8 8 B

8 @)A@ 4* 8 8


23ISD

& $!%"

Figure 9: 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type I (E)

/ '''C

Table 17: Plastic Thin Small Outline Package (TSOP) Type I (E) Dimensions

INCHES MILLIMETERS

Min Nom Max Min Nom Max

2

6

4

(

:

< < < < < <

;

Figure 10: 28-Lead 0.600-Inch Plastic Dual Inline Package (PDIP) (P)

/ '''C

Table 18: Plastic Dual Inline Package (PDIP) (P) Dimensions

INCHES MILLIMETERS

Min Nom Max Min Nom Max

2

6

6

4

4

(

:

;

F < < < <


Figure 11: 32-Lead 8x20mm Plastic Thin Small Outline Package (TSOP) Type I (T)

/ '''$

Table 19: Plastic Thin Small Outline Package (TSOP) Type I (T) Dimensions

INCHES MILLIMETERS

Min Nom Max Min Max

2

6

4

(

:

< < < < < <

;

25ISD

Figure 12: ISD2560/75/90/120 Products Current Bonding Physical Layout 1 (Unpackaged Die)

" : )

* : D 8 )*

"#$%&'()%(*'(+$

I. #&&

5D ?> N #&

@D .AA N #&

II. -&&

>9 N #&

III. !

;A 4 ;A #&

3. 4 3. #&

2

2

2

2CD , ?

+>

+=

?

4

4 /(

2:4

2,2 ,

2,2 )CE

)?

()+1/

4(

D43?2

2

2

2

2

2

"#$%&'()%(*'(+$'

+

2

?


Table 20: ISD2560/75/90/120 Products Current PIN/PAD Designations, with Respect to Die Center (µm)

Pin Pin Name X Axis Y Axis

2 2##! =

2 2##! =

2 2##! =

2 2##! =

2 2##! =

2 2##! =

2 2##! =

2 2##! = =

2 2##! = =

2 2##! = =

2CD , 2I'!5 - = =

? ? ' + "! --'5 = =

? ? 2' + "! --'5 = =

+> -*! )- > = =

+= -*! )- = =

? ? 2' + "! --'5 =

4 ! -$ - =

4 /( ! -$ /! =

2:4 2 % : 4 ! ' =

2,2 , 2' - =

2,2 )CE 2' )- =

)? )0!' " )-

4( 4$- (.' -

+ + "! " -

() (#

D43 , 4 7 - '9

+1/ +'5.*1/ !#

? ? ' + "! --'5

27ISD

Figure 13: ISD2560/75/90/120 Products Future Bonding Physical Layout 1 (Unpackaged Die)

" : )

* : D 8 )*

"#$%&'()%(*'(+$'

I. #&&

5D 3A9 N #&

@D $:$; N #&

II. -&&

? N3 #&

III. !

4 #&

33 4 33 #&

2

2

2

2CD , ?

+>

+=

?

4

4 /(

2:4

2,2 ,

2,2 )CE

)?

()+1/

4(

D43?2

2

2

2

2

2

"#$%&'()%(*'(+$'

+

2

?


Table 21: ISD2560/75/90/120 Products Future PIN/PAD Designations, with Respect to Die Center (µm)

Pin Pin Name X Axis Y Axis

2 2##! =

2 2##! =

2 2##! =

2 2##! =

2 2##! =

2 2##! =

2 2##! =

2 2##! = =

2 2##! = =

2 2##! = =

2CD , 2I'!5 - = =

? ? ' + "! --'5 = =

? ? 2' + "! --'5 = =

+> -*! )- > = =

+= -*! )- = =

? ? 2' + "! --'5 =

4 ! -$ - =

4 /( ! -$ /! =

2:4 2 % : 4 ! ' =

2,2 , 2' - =

2,2 )CE 2' )- =

)? )0!' " )-

4( 4$- (.' -

+ + "! " -

() (#

D43 , 4 7 - '9

+1/ +'5.*1/ !#

? ? ' + "! --'5

29ISD


ORDERING INFORMATION Product Number Descriptor Key

When ordering ISD2560/75/90/120 products, please refer to the following valid part numbers.

For the latest product information, access ISD’s worldwide website at http://www.isd.com.

Part Number Part Number Part Number Part Number

ISD2560G ISD2575G ISD2590G ISD25120G

ISD2560P ISD2575P ISD2590P ISD25120P

ISD2560S ISD2575S ISD2590S ISD25120X

ISD2560T ISD2575T ISD2590T

ISD2560X ISD2575X ISD2590X

ISD25 _ _ _ _

2500 Series

Duration:60 = 60 Seconds

75 = 75 Seconds

90 = 90 Seconds

120 = 120 Seconds

Special Temperature Field:Blank= Commercial Packaged (0˚C to +70˚C)

or Commercial Die (0˚C to +50˚C)

Package Type:G = 28-Lead 0.350-Inch Small Outline Integrated

Circuit (SOIC)

P = 28-Lead 0.600-Inch Plastic Dual In-Line Package (PDIP)

S = 28-Lead 0.300-Inch Small Outline Integrated Circuit (SOIC)

T = 32-Lead 8x20-mm Thin Small Outline Package (TSOP)

X = Die


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