intelligent sensor systems for condition monitoring ... · feasibility study funding – 6 month...
TRANSCRIPT
Intelligent sensor systems for condition monitoring through
additive manufacture of ceramic packages
Robert Kay, Maria Mirgkizoudi, Ji Li, Russell Harris, Alberto Campos-Zatarain & David Flynn
IeMRC Annual Conference
Intelligent sensor systems for condition monitoring through additive manufacture of ceramic packages
2
• Loughborough and Heriot-Watt University • 2 year project • 6 Industrial partners covering full supply
chain
Project Motivation
• Many industrial sectors require bespoke packages for remote sensor networks that can reliably operate in harsh environments.
• Ceramic packages have a number of advantages in terms of high reliability, hermetical sealing and ability to withstand high thermal and mechanical shock.
• To produce Ceramic substrates (LTCC & HTCC) requires template based manufacturing processes that need large batch production sizes in order to become economically viable. The also have a 2.5D limitation.
• Use of additive manufacturing to overcome the current limitations of ceramic substrate manufacture
3
Multi-Chip Module from Baker Hughes
Additive Manufacturing / 3D Printing
4
• AM offers greater geometric complexity over traditional manufacturing processes.
• For low production volumes AM is very cost effective.
ASTM F42 Process families categorisation
1. Material extrusion- A material is selectively dispensed through a nozzle or orifice (FDM).
2. Vat photopolymerization - Liquid photopolymer in a vat is selectively cured by light-activated polymerization (Stereolithography).
3. Powder bed fusion - thermal energy selectively fuses regions of a powder bed (SLS).
4. Material jetting - Droplets of build material are selectively deposited (Ink jet printing).
5. Binder jetting - A liquid bonding agent is selectively deposited to join powder materials (Zcorp 3D printing).
6. Directed energy deposition - Focused thermal energy is used to fuse materials by melting as the material is being deposited (LENS).
7. Sheet lamination - Sheets of material are bonded to form an object (UC).
5
Feasibility demonstrator – 555 timer circuit
555 timer circuit consists of: • 3 x capacitors • 1 x LED • 4 x resistors • 1 x transistor • 1 x 555 timer chip.
6
3D micro-extrusion apparatus
• 5-axis table drives the dispensing head with motion accuracy ±25µm. • Micro-extrusion head equipped with a piezoelectric actuator is used for
printing of a ceramic paste. The actuator is used to quickly open and close the valve to accurately control the dispensing process.
• Mach3 software controls the motion of the table and the actuation of the extrusion head.
7
Air Supply
Dispensing Controller
Mach3 Software 5-axis
table
Extrusion head
3D ceramic forming process
• Alumina based paste supplied by Morgan Advanced Materials • Fine particle size distribution • Exhibited the required viscoelastic
characteristics • Enabled printing successfully down through
100µm nozzles. • 150µm nozzle used for this printing process • Printing process
1. Extrude a perimeter defining the layer features 2. Layer is in-filed using a rectilinear infill pattern 3. The process is then repeated layer-by-layer to
build up the substrate
8
Perimeter
Infill
150µm nozzle
Resultant fired ceramic substrates
• Feasibility demonstrator consisted of 4 layers
• Green part fired at 1600°C • Shrinkages ~15% from the process
• Fired part dimension: 29.5 x 24.5 x 0.8mm
• Cross sectioning reveals a high density • Printed layers not visible • Polishing needs improving as grains have
been cleaved from the sample surface. • Better elimination of air entrapment in the
paste prior to printing is required.
9
Dispensing the conductor layer
• Mushasi dispensing system • 3-axis motion table is used to drive the dispensing
head with motion accuracy ±1µm • CCD camera for alignment • Laser are used for for surface mapping of 3D
geometries • Nozzle sizes down to 20 microns
10
Air Pressure Controller
Motion Table
DispensingHead
Laser and CCD camera
• Ag based LTCC paste selectively deposited onto the fired ceramic substrate • Designed for screen printing • 200µm nozzle used
Conductor layer print results
• Material exhibited sheer thinning characteristics required for dispensing however had a tendency to slump and flow to easily through the nozzle.
• Using a smaller nozzle diameter plus adjustments to the rheological properties of the paste material and a reduction of particle size could enable finer track widths.
11
Fired ceramic based electronic substrate
• After printing the substrate was fired again using a profile of: • 3°C/min to 100°C è 2°C/min to 450°C è 10°C/min to 865°C è
hold for 20 min è cool at 6-10°C/min • Final line width after firing was approximately 700µm. • Fired conductor lines exhibited a strong adhesion and a low
resistance similar to conventional LTCC conductive tracks.
12
Assembly process
The ceramic substrate was processed using a conventional surface mount assembly process:
1. Solder paste deposition. 2. Pick and placement of the
individual components 3. Reflow process in a convection
oven.
13
Final assembled demonstrator
This work demonstrates the first fully 3D printed ceramic electronic substrate completely compatible with conventional surface mount packaging.
14
Future work
• Multilayer circuit capability • High accuracy system alignment • Z-axis vias
• Harsh environment testing, “Shake and bake” • Hermitic packages evaluation • Co-fireable ceramic paste formulation • Conductor formation on 3D surfaces rather than planar using 5-
axis machine and vision system • Development of SLID packaging process with SiC power electronic
devices • Novel Stereolithography Apparatus for dense micron tolerance
ceramic parts
15
EPSRC Centre for Power electronics feasibility study funding – 6 month project
Broaden the original remit of the IeMRC project: • By incorporating SiC devices into the 3D printed
ceramic packages • Testing SLID samples for harsh environments -
electrodynamic shaker with hotplate custom built at Loughborough University
• Translate the IeMRC findings and further develop the 3D printing process for power electronics applications
16
Conclusions
• First digitally driven ceramic electronic substrate manufacturing process demonstrated with a working feasibility demonstrator.
• The use of additive manufacturing has the potential to revolutionise the production of ceramic based packages by enabling: • Mass customisation • Iterative product development • Rapid turnaround time of parts, • Cost effective low-volume production, • Improved resource efficiency • Generation of more complex structures with increased design
freedoms. • In particular, the offshore renewable energy, oil & gas and military sectors
would benefit immensely for having a flexible, fast, low cost manufacturing process where production volume or complexity is not a limiting factor.
17
Acknowledgments
• Financial support from the IeMRC • Special thanks to Maria Mirgkizoudi and Ji Li • Chris Hampson at Morgan Advanced Materials • Alberto Campos-Zatarain and David Flynn at Heriot-
Watt University • The Industrial Consortium on this project:
• Baker Hughes, Eltek Semiconductor, MacTaggart Scott, Morgan Advanced Materials, Renishaw, Torishima
18
IeMRC 2015 conference posters
#21 - Alberto Campos-Zatarain, Maria Mirgkizoudi & David Flynn, Thermomechanical Characterization of Cu-Sn SLID Interconnects for Harsh Environment Applications
#22 - Jack Hinton & Tom Wasley, Design and Development of an Optical Alignment System for the Integration of Additive Manufacturing Processes
#23 - Matthew Smith, High Resolution 3D Printing of Ceramic Components Using Stereolithography
#24 - Alastair Lennox & Alex Bowen, Conditional monitoring of wind turbines using Additive Manufacturing
#25 - Chris Ruddock, The Development of an Integrated Swimming Performance Monitor and Training Aid
#26 - Tom Wasley, Hybrid Additive Manufacturing of 3D Electronic Circuits
#27 - Maria Mirgkizoudi & Ji Li, Digital 3D forming of Ceramic Electronic Components
#28 - Ji Li & Tom Wasley, Direct Digital Fabrication of Advanced Manufacturing Processes
19
Thank you – Any Questions?
Dr. Robert Kay Senior Lecturer in Additive Manufacturing Wolfson School of Mechanical & Manufacturing Engineering Loughborough University LE11 3TU UK
01509 227619 [email protected] www.lboro.ac.uk/amrg
20