iemrc iemrc 2011 conference - loughborough university · iemrc innovative electronics manufacturing...

IeMRC IeMRC 2011 Conference

Innovative electronics Manufacturing Research Centrewww.iemrc.org

Wednesday 21st September 2011

Holywell Park Conference Centre,Loughborough

6th Annual Conference of the Innovative electronics Manufacturing Research Centre

The vision of the IeMRC is to be the UK's internationally recognised provider of world-class electronics manufacturing research. It will focus on sustaining and growing high value manufacturing in the UK by delivering innovative and exploitable new technologies through its highly skilled people and by providing strategic value to the electronics industry.

The 6th annual IeMRC Conference will be held at Holywell Park Conference Centre, Loughborough University. The day will include eight research presentations, table top exhibitions from UK industry and posters of work from current and previously funded electronics manufacturing related projects.

Further information is available on our website:www.iemrc.org

If you would like to present a poster of your work, or request a table top exhibition space, please let us know in your registration

To register for our conference or for any enquiries please email us at:[email protected]

SpeakersKeynote: Jim Morris

-Portland State University-

Hazel Assender- Materials, Oxford -

Geo� Wilcox- Loughborough -

Marc Desmulliez- Heriot Watt -

Odette Valentine- Brunel -

Yiannis Vardaxoglou- Loughborough -

Robert Blue- Strathclyde -

Bill Drury- Control Techniques -

Andrew Holmes - Imperial-

IeMRC IeMRC Agenda


6th Annual Conference 21st September 2011

Holywell Park Conference CentreLoughborough

Welcome and Introduction, Martin Goosey IeMRC Industrial Director

Session 1Keynote: Jim Morris, Portland State University Nanopackaging: Nano-technologies in microelectronics packaging

Hazel Assender, University of Oxford Roll-to-roll manufacture of organic transistors for low cost circuits

Geo� Wilcox, Loughborough University Tin Whisker Growth in Electronics

Session 2Marc Desmulliez, Heriot-Watt University Technologies for the patterning of �ne metal tracks on �exible substrates

Odette Valentine, Brunel University Soft-wear: identifying meaningful design spaces for wearable technology

Yiannis Vardaxoglou, Loughborough University Wearable �exible antennas for multiple applications

Session 3Robert Blue, University of Strathclyde Organic semiconductor based microsensors for nitro vapours

Bill Drury, Emerson-Control Techniques / University of Bristol Power Electronics in the low carbon UK economy

Andrew Holmes, Imperial College London Thermosonic-Adhesive Flip Chip Assembly for Advanced Microelectronic Packaging

Close of lectures, Martin Goosey IeMRC Industrial Director

Agenda

8.30- 9.15 Registration

9.30 Session 1

11.00 Morning Break

11.30 Session 2

13.00 Lunch

14.30 Session 3

16.10 Close

Breaks and lunch will be held in the main poster display area

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IeMRC Abstracts

for registration please email [email protected] let us know if you would like to display a poster of your work in the exhibition area

Session 1

Hazel Assender, University of Oxford Roll-to-roll manufacture of organic transistors for low cost circuits

The RoVaCBE Flagship project brings together novel materials, manufacturing methods and circuit design to develop a roll-to-roll manufacturing process for organic transistors. Unlike much research in the UK in this area, our process is based on a high speed, solventless, vacuum based deposition technology, similar to that already widely used in the packaging industry, and is being developed on a research roll-to-roll facility based in Oxford. Having previously demonstrated reliable working transistors, we report on developments in high speed curing of the insulator layer suitable for high throughput manufacture, and our �rst examination of new materials to improve the manufacture of devices, and their performance and stability. We make use of organic semiconductors synthesised speci�cally for this application, di�erent gate insulator polymers, and interfacial modi�cation layers.

Geo� Wilcox, Loughborough University Tin Whisker Growth in Electronics

Tin and, to a lesser extent, zinc, are electroplated metallic �nishes that have signi�cant applications in modern day electronic devices. They are also known to be capable of forming whisker-like growths on their surfaces over a period of time that can grow to several millimetres in length. With the ever shrinking inter-component spacing in modern electronics the likelihood of localised shorting incidents due to this type of growth is marked. Until recent environmental legislation (for example WEEE and RoHS), lead alloyed with tin was regarded as an e�ective tin whisker inhibitor. The removal of lead, the advent of lead-free solder �nishes and the return to electrodeposited pure tin has resulted in the fear of a resurgence of tin whisker failures. This presentation examines the perceived threats from tin whisker growth and the early �ndings from WHISKERMIT, a recent IeMRC funded project examining strategies to combat such types of growth.

Jim Morris, Portland State University Nano-packaging: Nanotechnologies in microelectronics packaging

Nanotechnologies o�er a variety of materials options for reliability improvements in microelectronics packag-ing, primarily in the applications of nanoparticle nanocomposites, or in the exploitation of the superior prop-erties of carbon nanotubes and graphene. Nanocomposite materials are studied for resistors, high-k dielec-trics, electrically conductive adhesives, conductive “inks,” under�ll �llers, and solder enhancements, while CNTs and graphene may also �nd thermal, interconnect, and shielding applications. The talk will focus on these materials technologies, with some discussion of nanoparticle and CNT properties, modeling, post-CMOS reliability issues, and EHS issues in nanotechnologies manufacturing.

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IeMRC Abstracts

Session 2

Marc Desmulliez, Heriot-Watt University Technologies for the patterning of fine metal tracks on flexible substratesFlexible circuits is an enabling technology for creative packaging. It allows designers to add more functionali-ties to new products, higher complexities in the assembly with non-traditional components like MEMS, in ever smaller and thinner footprints. In the booming flex industry, new process technologies are evolving to meet the demand of fine pitch circuits production whilst being robust, scalable and economical is the key to success. This talk first summarizes the processes currently in use in the industry including the semi-additive LIGA process and laser ablation. Then this is followed by the research activities at Heriot-Watt University including the additive ion-exchange photo/chemical reduction process and the megasonic assisted LIGA process. Sub-50 μm copper line width in high density with high yield has been achieved in a simple labora-tory set up. The process is also suitable for upscaling to a roll-to-roll production line.

Odette Valentine, Brunel University Soft-wear: identifying meaningful design spaces for wearable technology

Wearable technology encompasses a gamut of products that variously integrate electrical, computational or telecoms components into garments or accessories traditionally worn or carried upon the human body (as opposed to merely portable or hand-held devices). Despite early hype about the potential of wearable tech-nologies, the integration of components into the soft, flexible substrates which characterise current styles of clothing has lagged the development of the underlying technologies. Thus widely meaningful consumer formats that offer genuine advantages over a hand-held device have been slow to emerge. By taking a user-centred perspective it may be possible to identify user needs & product spaces where creative and aesthetic design can play a significant role in increasing mainstream consumer acceptance of the physical form factors and functional limitations of the available components. This presentation will discuss an initial design frame-work developed to help reconsider the unique services, experiences and channels of expression that wearable systems could deliver.

Yiannis Vardaxoglou, Loughborough University Wearable flexible antennas for multiple applications

This collaborative project is exploring the most effective ways to manufacture a fabric antenna and its associ-ated electronics. It is working to overcome the challenges of integrating the antenna into the fabrics of func-tional clothing and other products. The project is funded over three years and initial findings are encouraging. Work is focusing on refining electromagnetic design rules to understand exactly how the experimental antenna is working so it may be adapted to suit the needs of potential end-users and help in the identification of the best fabrics to obtain optimal performance in high frequency applications. Collaborators Nottingham Trent University, are making progress on the identification of suitable fabrics and yarns and also on the meth-odology of integrating the antenna with the ‘host’ fabric using textile manufacturing techniques. Other chal-lenges to be tackled include, the minimisation of body interference, ensuring consistency of performance in harsh environments, and scalability to cost-effective mass manufacture. Alongside these technical activities the project is expanding understanding of possible markets and the requirements of end users and working with industrial partners to ensure that the end result can be easily translated into industrial applications.

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IeMRC Abstracts

Session 3

Bill Drury, Emerson-Control Techniques / University of Bristol Power Electronics in the low carbon UK economy

Power Electronics is a £70 billion direct global market, growing at a rate of 11% per annum. It is an enabling technology that often determines the performance of, and provides the competitive advantage for, much more expensive devices or systems. It is a critical technology for all renewable energy sources and for the efficient use of electrical energy. Further, it is a technology in which the UK plays a significant global role both in terms of design and manufacture. It adds significantly to the countries GDP and employment. This presenta-tion aims to highlight the UK’s strengths, weaknesses, threats and opportunities in some key market sectors, and suggest some actions to ensure future success.systems could deliver.

Robert Blue , Strathclyde University Organic semiconductor based microsensors for nitro vapours

We report miniature sensors based on proprietary polymer materials that are chemically engineered to have a higher affinity for target molecules than off-the-shelf polymers. The initial target molecules are nitro-functionalised compounds related to explosives such as TNT, DNT, RDX, or PETN. A key feature of the work is the electrochemical deposition of these polymers which offers advantages of parallel, localized deposition of polymer films to sub-micron dimensions. Prototype capacitance sensors were formed on interdigitated gold electrodes and exhibited a large, reversible response to nitro-bearing compounds as well as a low cross sensi-tivity to other volatile organic chemicals commonly found in the atmosphere

for registration please email [email protected] let us know if you would like to display a poster of your work in the exhibition area

Andrew Holmes, Imperial College London Thermosonic-Adhesive Flip Chip Assembly for Advanced Microelec-tronic Packaging

Flip chip assembly using anisotropic conductive adhesive (ACA) has so far been limited to a relatively narrow range of applications, largely because ACA interconnections are constructed through purely mechanical contacts which may suffer from abnormally large joint resistances and reliability failures. We are investigating the feasibility of introducing a thermosonic bonding step into the ACA flip chip assembly process in order to replace the mechanical contacts by metal-metal thermosonic bonds. This so-called thermosonic-adhesive (TA) assembly process is expected to result in a reduction in contact resistance and improved reliability. A similar approach will be applied to nonconductive adhesive (NCA) flip chip assembly, where interconnection occurs directly between metal bumps on the chip and metal pads on the substrate. The talk will report on progress towards these goals. A dedicated thermosonic-adhesive flip-chip bonder has been developed incorporating an ultrasonic bonding head that can be rapidly temperature cycled by IR laser heating and compressed air cooling. Initial results will be presented for assembly trials with dummy flip chips on glass and flex substrates.

iemrc iemrc 2011 conference - loughborough university · iemrc innovative electronics manufacturing...

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