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INTEL-POWERED 2 IN 1S AND INTEL® COMPUTE STICK In Focus VOLUME 1 • 2016 WWW.INTEL.IN/DIRECTIONS | INTEL® ROADMAP DIRECTIONS 2016 A RESOURCE GUIDE FOR CIOS AND IT PROFESSIONALS

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Page 1: INTEL® ROADMAP DIRECTIONS 2016 · 2016 turns the spotlight on how Intel continues to lead with innovative technologies and breakthrough products. In this edition, discover how an

INTEL-POWERED 2 IN 1S AND INTEL® COMPUTE STICKIn Focus

VOLUME 1 • 2016 WWW.INTEL.IN/DIRECTIONS |

INTEL® ROADMAP DIRECTIONS 2016A RESOURCE GUIDE FOR CIOS AND IT PROFESSIONALS

Page 2: INTEL® ROADMAP DIRECTIONS 2016 · 2016 turns the spotlight on how Intel continues to lead with innovative technologies and breakthrough products. In this edition, discover how an

WelcomeThe first edition of Intel® Roadmap Directions

2016 turns the spotlight on how Intel continues

to lead with innovative technologies and

breakthrough products.

In this edition, discover how an Intel® processor-

based 2 in 1 combines the performance of a

laptop and versatility of a tablet into one sleek,

razor-thin device, and why you should get a 2 in

1 computer for work. Additionally, discover the

Intel® Compute Stick, a tiny device the size of a

pack of gum that can transform any HDMI* TV or

display into a complete computer.

Volume 1 of Intel® Roadmap Directions 2016 also

focuses on the Intel® Open Network Platform for

Servers that streamlines the adoption of

software-defined networking (SDN) and network

function virtualization (NFV). Furthermore, learn

about Open vSwitch* enabling SDN & NFV

transformation.

In addition, this edition highlights on improving

performance and security of big data and cloud

solutions with Intel® QuickAssist Technology.

Gain insights on advanced power management

with Intel® Node Manager in Baidu Data Center.

And finally, read about the Intel® Xeon®

processor E3-1200 v5 product family, a versatile

platform to meet a range of business needs.

This edition of the roadmap, like always, provides

you with an inimitable source of cutting edge

technical information to enable you to keep

ahead in a dynamic business environment.

An Intel® processor-based 2 in 1 combines the performance of a laptop and

versatility of a tablet into one sleek, razor-thin device. Having two devices in

one means more capabilities for less cost.

Intel-powered 2 in 1s

Empowering Workers

Get the level of mobility and

performance your business requires

with sleek, versatile 2 in 1s or the

latest Ultrabook™ devices.

Choose the 2 in 1 that Best Fit Your Needs

More options is the best option

Built Smarter to Work SmarterA new Intel® processor inside your 2 in 1 gives you the power

and performance to experience your device like never before.

Up to 12% Better Productivity Performance vs. 1previous gen

Up to 20% Faster in Converting 4k Videos for Sharing 2vs. previous gen

3 Up to 17% Better Web Performance vs. previous gen

4 Up to 10hrs battery life based on 36 WHr battery

5 0.5 second wake-up based on Modern Standby

2 in 1 personal computers powered by Intel®

processors offer the benefits of both a powerful

touchscreen laptop and a fast, detachable tablet.

Intel® processors drive convertible 2 in 1 devices that

let you quickly convert your laptop into a portable

tablet while keeping the keyboard attached.

Convertible

Flip, Swivel, or SlideDetachable

Powerful Laptop + Tablet Fun

INTEL® ROADMAP DIRECTIONS 20162

Read More at www.intel.in/content/www/in/en/2-in-1/laptop-tablet.html

Page 3: INTEL® ROADMAP DIRECTIONS 2016 · 2016 turns the spotlight on how Intel continues to lead with innovative technologies and breakthrough products. In this edition, discover how an

A RESOURCE GUIDE FOR CIOs AND IT PROFESSIONALS 3

WHY YOU SHOULD GET A 2 IN 1 COMPUTER FOR WORK

2 in 1 devices commonly run Windows*, the same operating system as most common office apps. With the

new Windows 10, you may also get incredible battery life, great multitasking capabilities and more

responsive apps. With Windows Hello*, you have facial, iris and fingerprint recognition for instant secure

log-ins without passwords. Better still, not only can you access and work on your documents, spreadsheets

and presentation slides anywhere, you can make notes directly onto web pages for improved productivity

with Microsoft Edge*, even in tablet mode.

Of course, 2 in 1s are sleek, modern

devices that look just as good as they

perform. Leave an impression with

clients that you and your company are

up-to-date on technology.

IT’S VERSATILE So easy to carry around Powerful performance

Same OS as your work apps Make an impression

The new 2 in 1s are powerful PCs that can transform from a notebook into a tablet. These computers, sometimes called hybrid PCs,

are great for today's mobile worker. Why? Let's find out.

By having both a notebook and a

tablet in one device, you enjoy the

advantages of both. Use it in notebook

mode to get work done and switch to

tablet mode to make an impression

during meetings. Time to replace your

old notebook? You can get two

devices for the price of one.

Work will take you places, whether it's

meetings, conventions or site visits. It's

great to have a lightweight PC like a

2 in 1 you can take everywhere. Some

2 in 1s even have a screen that can be

detached and used as a tablet, letting

you shed the excess weight when you

don't need it.

You work hard, so you need a device that

can keep up. The 2 in 1 is powered by

an Intel® Core™ processor that lets you

move effortlessly between applications,

get a burst of speed whenever you need,

wake it in a flash, and access files

instantly. This is performance you can

count on.

Read More at www.intel.in/content/www/in/en/learn/different-computers-for-different-needs/hybrid-pc.html

Page 4: INTEL® ROADMAP DIRECTIONS 2016 · 2016 turns the spotlight on how Intel continues to lead with innovative technologies and breakthrough products. In this edition, discover how an

INTEL® ROADMAP DIRECTIONS 20164

PC PERFORMANCE. MOBILE FLEXIBILITY.Intel® Compute Stick

Read More at www.intel.in/content/www/in/en/compute-stick/intel-compute-stick.html

The Intel® Compute Stick is a tiny device the size of a pack of gum that can transform any HDMI* TV or display into a complete computer.

Available with a range of Intel® processors, it’s everything you love about a desktop computer in a device that fits in the palm of your hand.

Expand Your Computing Potential

BUILT FOR PERFORMANCEWhile the Intel® Compute Stick is

small in stature, it's what’s inside

that makes the biggest difference: a

choice of Intel® Atom™ or Core™ M

processors with up to 4 GB memory

and 64 GB of on-board storage.

Sized for ConvenienceIt's not like a computer. It is a

computer. Same operating system,

same high quality graphics, and

same wireless connectivity as a

full-sized computer. Totally

different dimensions.

Ready Out Of the BoxPop it out of the box. Pop it into a

TV. Go. It’s that easy to transform

any HDMI* TV or monitor into a

powerful computer with all the

expected benefits of a premium

Windows® 10 experience.

Cool Under PressureThe Intel® Compute Stick

features a tiny, quiet

cooling fan inside to

enable reliable and fast

performance without

overheating.

DIRECTORY

Education Productivity Thin Client Digital Signage

Create a thin-client platform

from any display with the

Intel® Compute Stick.

Transform a display

into a fully functional

digital signage solution.

Plug-and-go

education performance

that fits in one hand.

Turn an HDMI* display

into a computer with

an Intel® processor.

Page 5: INTEL® ROADMAP DIRECTIONS 2016 · 2016 turns the spotlight on how Intel continues to lead with innovative technologies and breakthrough products. In this edition, discover how an

5 great reasons to get an Intel® Compute StickA RESOURCE GUIDE FOR CIOs AND IT PROFESSIONALS 5

Read More at www.intel.in/content/www/in/en/learn/whats-new/intel-compute-stick.html

Now you can enjoy all the cool features of a smart TV

on a regular HD TV with just one small add-on. Simply

plug in the Intel® Compute Stick and you can connect

on social media, browse photo albums, surf the web

etc. That saves you money you could possibly use for

a new sound system to make the experience better.

It’s amazing how small computers are getting. So what does this all mean?Here are 5 reasons to get the Intel® Compute Stick.

Imagine travelling with a PC in your pocket. That’s

what you get with the Intel® Compute Stick. Simply

plug it into the hotel room’s HD screen, log on to the

WiFi and you’ll be instantly connected to the Internet,

work, and even your home. You don’t even need to

bring along a charger, as there are no batteries

required.

Experience onlineentertainmenton the big screen

There’s nothing better than watching your favorite

shows and movies on your TV. With the Intel®

Compute Stick, it becomes a media entertainment

center. Now you can download or stream music or

videos and play it with the Intel® Compute Stick.

Imagine all those streaming sites from YouTube* to

Netflix* available in Full HD!

Get a smart TVwithout buyinga smart TV!

No desk space?No problem

Stay connectedwhile you travel

1

2

The Intel® Compute Stick runs on Windows* 8 (with a free upgrade

to Windows® 10) – that’s the same Operating System (OS) as many

regular PCs. This means that if you’ve used Windows before, you

already know how to use it. Just plug it in to access the Internet,

watch videos or browse your photo albums in moments.

FamiliarPC experienceon the TV

5

The Intel® Compute Stick gives you the large screen

experience of a desktop PC without the need for a

tower unit. It may be less performance focused but it’s

great if you only need to connect to the Internet, write

emails and do basic tasks. Just mount your screen on

the wall, plug the stick in and you’re good to go!

3

4

4.06”

1.46” 0.47”

Page 6: INTEL® ROADMAP DIRECTIONS 2016 · 2016 turns the spotlight on how Intel continues to lead with innovative technologies and breakthrough products. In this edition, discover how an

SDN and NFV for Carrier-Grade Infrastructure and Cloud Data Centers

INTEL® OPEN NETWORK PLATFORM SERVER REFERENCE ARCHITECTUREThe Intel® Open Network Platform (Intel ONP) ® for Servers streamlines the adoption of software-defined networking (SDN) and network function virtualization (NFV)

by datacenter operators as well as cloud and telecom service providers. This reference design enables highly reliable, low-latency services while delivering the

CAPEX and OPEX advantages of a tailored, standards-based architecture supported by a broad ecosystem.

INTEL® ROADMAP DIRECTIONS 20166

Business Drivers Behind Intel® ONP for ServersIntel® ONP for Servers supports the efforts of many communications networks to meet this

emerging demand by adopting architectural practices and standards more typically used in

data centers.

Architecture for the Intel® ONP Server Reference DesignThe over-arching goal of Intel® ONP is to reduce the cost and effort required for service

providers, data-center operators, TEMs, and OEMs to adopt and deploy SDN and NFV

architectures. The foundations of this effort are the Intel® ONP Server Reference Design and

the Intel® ONP Switch Reference Design.

Enabling SDN and NFV Solutions on the Intel® ONPServer Reference Design

Building on top of open-standards servers based on Intel® architecture, the Intel®

ONP for Servers reference design reflects the value of enabling work across the

ecosystem, including support and development for software, systems integration,

and industry standards. This enablement directly benefits end customers with a

focus on flexible options for implementation that are informed (but not

constrained) by the reference design.

Adoption Paths for SDN and NFV on Intel® Architecture

Whatever their role, and however closely or loosely their solutions follow the

reference design, parties that evaluate Intel® ONP for Servers have access to the

same fundamental benefits:

Simplicity:

Intel® ONP for Servers

is easy to evaluate,

develop, and deploy,

providing a fast path

to insight about

design approaches

and capabilities for

SDN and NFV

architectures.

Flexibility:

Adherence to

standard software

approaches and

choice among a wide

array of software

options makes Intel®

ONP’s underlying

architecture readily

modifiable.

Cost-effectiveness:

The use of industry-

standard servers

offers a foundation

for solutions that

have advantages in

terms of low TCO.

Learn more about the Intel® Open Network Platform at www.intel.com/ONP

Intel® ONP for Servers

• Linux*: Fedora* 20

• KVM Hypervisor

• OpenStack* Optimizations (Icehouse)

• OpenDaylight (Hydrogen Compatible)

Intel® Data Plane Development Kit (Intel® DPDK)

Intel DPDK Accelerated

Open vSwitch An Open Virtual Switch

• Intel® QuickAssist Technology Drivers

• Intel® Ethernet Drivers: 10 Gigabit Ethernet and 40 Gigabit Ethernet

• Intel® Data Plane Performance Demonstrator: vBNG

Intel® EthernetController

Intel® Xeon®Processor E5 v3

Intel® CommunicationsChipset 89xx Series

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A RESOURCE GUIDE FOR CIOs AND IT PROFESSIONALS 7

To find out more about the OPNFV project, visit www.opnfv.org.For more information about Open vSwitch, visit www.openvswitch.org.For more information about the Intel® Open Network Platform Reference Architecture, visit www.intel.com/content/www/in/en/communications/open-network-platform-server.html.

Intel’s collaboration with the Open vSwitch community on DPDK boosts Open vSwitch performanceby more than 12x to meet the demanding needs of SDN and NFV.

OPEN VSWITCH* ENABLES SDN & NFV TRANSFORMATION

Intel’s focus with Open vSwitch* (OvS*) software has been to target bottlenecks in performance and enhance functionality to meet CSP, enterprise, and cloud needs by using

the Data Plane Development Kit (DPDK) OSS libraries. OvS can be configured to support two software architectures:

• Native OvS: OvS with an in-kernel datapath

• OvS with DPDK: OvS compiled with the DPDK datapath

Open vSwitch Architecture with DPDKThe DPDK is a set of data plane libraries and network interface controller

drivers that enable high-throughput and low-latency packet processing.

The openvswitch.org project recently included DPDK support as a

compile-time option for the user space fast path that helps accelerate

datapaths across physical and virtual interfaces.

OPNFV: A Continuing Commitment to Open

PlatformsSuccessful deployments of NFV services and appliances require platforms

with performance and capabilities to support the different virtualized

functions. The Intel® ONP reference architecture is one such design, on

which Intel has based much of its work and evaluation for OvS with DPDK.

Physical-to-Virtual-to-Physical

Test Results

Physical-to-virtual-to-physical test results show that Open vSwitch* (OvS) with

Data Plane Development Kit (DPDK) performs 7x faster than native OvS.

Intel internal measurements, July 2015.

Physical-to-physical test results show that Open vSwitch* (OvS) with Data

Plane Development Kit (DPDK) is almost 12x faster than native OvS.

Intel internal measurements, July 2015.

1.0

7.1x

11.4x

1.0

OvS with DPDKSingle CoreNative OvSOvS with DPDKNative OvS

12.9x

OvS with DPDKTwo Core

Physical-to-Physical

Performance Comparison

Open vSwitch withDPDK PerformanceBenchmarks

Intel’s vSwitch ProjectsIntel is a leader of several vSwitch projects in OPNFV.org and is committed to the

advancement of SDN and NFV on open platforms. These projects include the following:

Characterizing vSwitch Performance for Telecom NFV Use Cases

This project develops a generic and architecture-agnostic vSwitch testing framework with

associated tests that serve as a basis for validating the suitability of different vSwitch

implementations in a Telecom NFV deployment environment.

Open vSwitch for NFV

This project proposes modifying the Open Platform for NFV* (OPNFV*) build to include a

deployment option for the OvS build with a software-accelerated user space design.

Page 8: INTEL® ROADMAP DIRECTIONS 2016 · 2016 turns the spotlight on how Intel continues to lead with innovative technologies and breakthrough products. In this edition, discover how an

IMPROVING PERFORMANCE AND SECURITY OFBIG DATA AND CLOUD SOLUTIONSUsing Intel® QuickAssist Technology to Accelerate Public Key Cryptography and CompressionAs the complexity of networking and security applications continues to grow, systems need more and more computational resources for demanding tasks. Intel® QuickAssist

Technology is designed to offload security and compression algorithms to allow developers to easily incorporate acceleration into their software.

Intel® QuickAssist Technology Use Cases

For further information about Intel® QuickAssist Technology, visit www.intel.com/content/www/in/en/io/quickassist-technology/quickassist-technology-developer.html

INTEL® ROADMAP DIRECTIONS 20168

Intel® QuickAssist Technology:

Integrated Acceleration

Intel® QuickAssist Technology integrates hardware-acceleration in

Intel® chipsets for widely used, compute-intensive algorithms,

including key exchanges, data compression, SSL Bulk Encryption

Algorithms, and SSL ciphers for Intel® chipsets.

The Intel® QuickAssist Software Framework

The Intel® QuickAssist Technology shims and patches in the Intel®

QuickAssist Software (such as a zlib patch for offloading

compression) offer the best performance by offloading these

compute-intensive workloads from the CPU core to the accelerator.

Intel®QuickAssistTechnology

Network Compute Storage

Resource Pool

Orchestration Software

Applications

The following use cases illustrate two examples where Intel® QuickAssist Technology has proven a significant benefit in server throughput.

Intel® QuickAssist Technology-enabled accelerators give developers new opportunities to create value-added applications for enterprise and cloud data centers that can improve data

movement and cryptography performance.

Hadoop* Compression Offload Significantly Improves Big Data Application Performance

Hadoop jobs move massive amounts of data in and out of the Hadoop Distributed File System (HDFS) and across the network. Hadoop I/O results in considerable disk operations and network utilization, such that Hadoop MapReduce jobs are often I/O bound.

Use CaseDynamic Web SSL Encryption Offload Boosts Throughput

Intel® Data Protection Technology with Advanced Encryption Standard New Instructions available in today’s Intel® processors significantly speeds up symmetric cryptography, however, processing public key cryptography can considerably impact server performance. Hardware-accelerating SSL with Intel® QuickAssist Technology can improve server throughput by freeing significant processor cycles spent on exponential calculations for key decryption for other useful computations.

Use Case

1 2

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A RESOURCE GUIDE FOR CIOs AND IT PROFESSIONALS 9

Baidu Server Technology 2014 integrates Intel® Node Manager 3.0 to significantly improve availability and efficiency ofserver power usage and thermal control.

ADVANCED POWER MANAGEMENT WITHINTEL® NODE MANAGER IN BAIDU* DATA CENTERAs IDC recently identified, power management is a critical consideration in a modern data center. To maximize power usage and performance, data centers usually would like

to run their servers continuously as close to the maximum allowed power for the rack as possible without tripping protecting mechanisms that keeps the equipment from

damage but interrupts services on that server. Ideally, keeping the workload of servers at a balanced value could also keep the total power consumption of racks at a stable

number. However, in real world circumstances of online services like Baidu servers, workload of a server could be dynamically changing and could have unpredictable peaks in

power consumption.

Challenges of this situation includes how to maximize the balance of performance and

availability of data center, how to manage power consumption in a smart way, and how to

maintain good thermal environment while having solutions for other challenges.

Solution of Intel® Node Manager Technologies with Baidu data center provides immediate

control and prevention of protecting circuit breakers in the data center. The node level

power controlling also enables a comprehensive view of power usage and cooling in their

state-of-the-art data centers.

Benefits gained from this solution include availability and efficiency of server power usage,

and the flexibility of advanced power and thermal controlling technologies. Comparing to

the case without Intel® Node Manager, up to 11% of range of unpredictable power

consumption could be reduced and thus the server remains in a much more stable status.

Policies

Intel® NodeManager

MonitorControl

Policy

Monitor

Power SensorsThermal Sensors Policies

Power ControlThermal Control

Data Center Manager /

Remote Controlling Software

Baidu Servers with

Intel® Node Manager

Solution withoutPower Handling

Intel® Node ManagerSolution

Po

we

r

Limit in Spec Limit of Policy

Time Time

Po

we

r

To know more about Intel® Node Manager, visit

www.intel.in/content/www/in/en/data-center/data-center-management/techrefresh-info-nodemanagerfull.html

Page 10: INTEL® ROADMAP DIRECTIONS 2016 · 2016 turns the spotlight on how Intel continues to lead with innovative technologies and breakthrough products. In this edition, discover how an

A VERSATILE PLATFORMTO MEET A RANGE OF BUSINESS NEEDSBusinesses of all sizes must keep up with market dynamics, evolving customer expectations, and the multitude of applications and data.

They must be creative in how they support their customers and ultimately grow. Meet the latest Intel® Xeon® processor E3-1200 v5

product family-based platforms—a smart investment for a wide range of business needs and sizes.

INTEL® ROADMAP DIRECTIONS 201610

Built for ProfessionalsWith Intel® Xeon® processor E3-1200 v5 product family-based workstations, you’ll

find the capabilities that get designers, engineers, and animators started. Accelerate

exploration of complex data with the graphics performance of Intel® HD Graphics

P530. Improve the integrity and uptime of design data with ECC memory

technology. And with Intel® vPro™ technology, you can make sure your workstations 6,7are as secure and manageable as any PC in your organization’s fleet.

Reliability for Small and Medium BusinessesProtect your customer, inventory, and financial records with a server that delivers

the integrity and reliability of an all-day, all-night workhorse. Implementing a

powerful server is also a smart investment in growth. You’ll gain the power to

deploy new business-class applications and tools that can help you increase sales

and improve margins. A server based on the Intel® Xeon® processor E3-1200 v5

product family lets you access your information faster and respond to customers

sooner from any device on your network.

Intel® Xeon® Processor E3-1200 v5 Product Family

Intel® Xeon® Processor E3 Processor FamilyGenerational Performance Gains

HIGHER IS BETTER

Intel® Xeon®

Processor

E3-1275 v2

Intel® Xeon®

Processor

E3-1276 v3

Intel® Xeon®

Processor

E3-1275 v5

8The Intel® Xeon® Processor E3-1275 v5 provides up to 1.43x the compute performance and 2.26x the graphics performance of prior generations.

1.01.13x

1.43x

CPU Performance

Intel® Xeon® Processor E3 ProcessorFamily with Intel® HD Graphics P530

Generational Performance Gains

Intel® Xeon®Processor

E3-1275 v2

Intel® Xeon®Processor

E3-1276 v3

PROFESSIONAL GRAPHICS8

PERFORMANCE

Intel® Xeon®Processor

E3-1275 v5

1.0

1.78x

2.26x

Graphics Performance

Read more at www.intel.in/content/www/in/en/processors/xeon/xeon-e3-1200v5-brief.html

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A RESOURCE GUIDE FOR CIOs AND IT PROFESSIONALS 11

MOBILE ROADMAP GUIDANCEThis latest Intel® architecture building block

¤roadmap update is intended to provide you withrecommendations for your Mobile deployment.

¤ Please refer to Mobile Reference Tables for getting the exact SKU information.

Mobile Segment Processor Processor No. Clock Speed Cache

Mobile Workstation Intel® Xeon® Processor E3 v5 Series E3-15x5M v5 Series Minimum 2.80 GHz & above 8 MB Cache

Portable Workstation Intel® Core™ i5/i7 Processor i5/i7-6000HQ Series Minimum 2.30 GHz & above 6 MB L3 Cache or higher

2 in 1 (Detachable) Intel® Core™ m Processor m3/m5/m7 6YXX Series Up to 3.1 GHz 4 MB L3 Cache

Ultrabook™ & Convertible Intel® Core™ i3/i5 Processor i7-6500U; i5-6200U Minimum 2.3 GHz & above 3 MB L3 Cache or higher

Enterprise Notebook Intel® Core™ i5/i7 Processor i7-6600U; i5-6300U Minimum 2.4 GHz & above 3 MB L3 Cache or higher

with vPro™ Technology

SME Notebook Intel® Core™ i3/i5 Processor i5-6200U; i3-6100U Minimum 2.3 GHz & above 3 MB Cache or higher

SMB/Education Notebook Intel® Pentium® Processor 3825U/4405U Dual Core Minimum 1.6 GHz & above 2 MB Cache

N3700/N3710 Quad Core

A1020 Quad Core

Value Notebook Intel® Celeron® Processor 3855U & 3955U Dual Core Minimum 1.6 GHz & above 2 MB Cache

N3050/N3160 Quad Core

DESKTOP ROADMAP GUIDANCE¤This latest Intel® architecture building block roadmap update is intended to

provide you with recommendations for your Desktop deployment.

Desktop Segment Processor Chipset Processor No. Clock Speed Cache

Enthusiast Desktop Intel® Core™ i7 Processor Intel® X79/X99 Chipset i7-5000/6000 Sequence Up to 4.0 GHz Up to 8 MB L3 Cache

Enterprise Managed Intel® Core™ i5 Processor Intel® Q87/Q170 Chipset i5-6000/i7-6000 Sequence Up to 3.4 GHz Up to 8 MB L3 Cache

Desktop with vPro™ Technology

Advanced Desktop Intel® Core™ i3 Processor Intel® H81/H100 Series Chipset i3-6000 Sequence Up to 3.9 GHz Up to 4 MB L3 Cache

Evolving/Basic Desktop Intel® Pentium® Processor Intel® H81/H110 Series G3000/G4000 Sequence Up to 3.6 GHz 3 MB L3 Cache

Express Chipset

¤ Please refer to Desktop Reference Tables for getting the exact SKU information.

A RESOURCE GUIDE FOR CIOs AND IT PROFESSIONALS 11

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INTEL® ROADMAP DIRECTIONS 201612

SERVER ROADMAP GUIDANCE¤This latest Intel® architecture building block roadmap update is intended to

provide you with recommendations for your Server deployment.

¤ Please refer to Server Reference Tables for getting the exact SKU information.

WORKSTATION ROADMAP GUIDANCE¤This latest Intel® architecture building block roadmap update is intended to

provide you with recommendations for your Workstation deployment.

¤ Please refer to Server Reference Tables for getting the exact SKU information.

ΦWorkstation Segment Processor Clock Speed No. of Cores Cache FSB/QPI

Performance DP Workstation Intel® Xeon® Processor E5-2600 v3 Series Up to 3.1 GHz Up to 10 Cores Up to 25 MB L3 Cache Up to 9.6 GT/sec QPI

Mainstream DP Workstation Intel® Xeon® Processor E5-2600 v3 Series Up to 3.2 GHz Up to 8 Cores Up to 20 MB L3 Cache Up to 9.6 GT/sec QPI

Entry DP Workstation Intel® Xeon® Processor E5-2600 v3 Series Up to 2.4 GHz Up to 6 Cores Up to 15 MB L3 Cache Up to 8 GT/sec QPI

Performance UP Workstation Intel® Xeon® Processor E5-1600 v3 Series Up to 3.7 GHz Up to 8 Cores Up to 15 MB L3 Cache N/A

Entry UP Workstation (1-skt) Intel® Xeon® Processor E3-1200 v3/v4 Series Up to 3.6 GHz Up to 4 Cores Up to 8 MB L3 Cache N/A

ΦServer Segment Processor Clock Speed No. of Cores Cache FSB/QPI

High-End Mission Critical Intel® Itanium® Processor 9500 Series Up to 2.53 GHz Up to 8 Cores Up to 32 MB L3 Cache Up to 6.4 GT/sec QPI

Mainstream Mission Critical Intel® Xeon® Processor E7-4800 v3/8800 v3 Series Up to 3.2 GHz Up to 18 Cores Up to 45 MB L3 Cache Up to 9.6 GT/sec QPI

High Density Server (4-skt) Intel® Xeon® Processor E5-4600 v3 Series Up to 2.9 GHz Up to 18 Cores Up to 45 MB L3 Cache Up to 9.6 GT/sec QPI

Performance DP Server Intel® Xeon® Processor E5-2600 v3 Series Up to 3.5 GHz Up to 18 Cores Up to 45 MB L3 Cache Up to 9.6 GT/sec QPI

Mainstream DP Server Intel® Xeon® Processor E5-2600 v3 Series Up to 2.6 GHz Up to 8 Cores Up to 20 MB L3 Cache Up to 8 GT/sec QPI

Entry DP Server Intel® Xeon® Processor E5-2600 v3 Series Up to 2.4 GHz Up to 6 Cores Up to 15 MB L3 Cache Up to 8 GT/sec QPI

UP Server (1-skt) Intel® Xeon® Processor E3-1200 v3 Series Up to 3.6 GHz Up to 4 Cores Up to 8 MB L3 Cache N/A

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A RESOURCE GUIDE FOR CIOs AND IT PROFESSIONALS 13

¥ Need other compatible components like chipset and firmware

DESKTOPS - Intel® processor reference chartIntel® Brand or

Processor Family Intel® vPro™9, ¥Technology

9Intel® Graphics9Intel® HT

Base

Frequency

(GHz)

Processor

NumberCache

Cores /

Threads

Memory

Speed DDR3/

DDR4 (MHz)

Intel® TechnologiesIntel® Turbo Boost

9Technology

- Max Turbo (GHz)

Power

(Max TDP)

6th Generation Intel® Core™ i7 Processor Family (14nm)

i7-6700K 4.0 4.2 1600/2133 8 MB L3 4/8 91W √ Intel® HD Graphics 530

i7-6700T 2.8 3.6 1600/2133 8 MB L3 4/8 35W √ Intel® HD Graphics 530 √

i7-6700 3.4 4.0 1600/2133 8 MB L3 4/8 65W √ Intel® HD Graphics 530 √

6th Generation Intel® Core™ i3 Processor Family (14nm)

i3-6320 3.9 N/A 1600/2133 4 MB L3 2/4 51W √ Intel® HD Graphics 530

i3-6300T 3.3 N/A 1600/2133 4 MB L3 2/4 35W √ Intel® HD Graphics 530

i3-6300 3.8 N/A 1600/2133 4 MB L3 2/4 51W √ Intel® HD Graphics 530

i3-6100T 3.2 N/A 1600/2133 3 MB L3 2/4 35W √ Intel® HD Graphics 530

i3-6100 3.7 N/A 1600/2133 3 MB L3 2/4 51W √ Intel® HD Graphics 530

i3-6098P 3.6 N/A 1600/2133 3 MB L3 2/4 54W √ Intel® HD Graphics 510

i5-6600K 3.5 3.9 1600/2133 6 MB L3 4/4 91W Intel® HD Graphics 530

i5-6600T 2.7 3.5 1600/2133 6 MB L3 4/4 35W Intel® HD Graphics 530 √

i5-6600 3.3 3.9 1600/2133 6 MB L3 4/4 65W Intel® HD Graphics 530 √

i5-6500T 2.5 3.1 1600/2133 6 MB L3 4/4 35W Intel® HD Graphics 530 √

i5-6500 3.2 3.6 1600/2133 6 MB L3 4/4 65W Intel® HD Graphics 530 √

i5-6402P 2.8 3.4 1600/2133 6 MB L3 4/4 65W Intel® HD Graphics 510

i5-6400T 2.2 2.8 1600/2133 6 MB L3 4/4 35W Intel® HD Graphics 530

i5-6400 2.7 3.3 1600/2133 6 MB L3 4/4 65W Intel® HD Graphics 530

6th Generation Intel® Core™ i5 Processor Family (14nm)

Page 14: INTEL® ROADMAP DIRECTIONS 2016 · 2016 turns the spotlight on how Intel continues to lead with innovative technologies and breakthrough products. In this edition, discover how an

¥ Need other compatible components like chipset and firmware

DESKTOPS - Intel® processor reference chart

Intel® Pentium® Processors (14nm)

G4520 3.6 N/A 1600/2133 3 MB L3 2/2 51W Intel® HD Graphics 530

G4500T 3.0 N/A 1600/2133 3 MB L3 2/2 35W Intel® HD Graphics 530

G4500 3.5 N/A 1600/2133 3 MB L3 2/2 51W Intel® HD Graphics 530

G4400T 2.9 N/A 1600/2133 3 MB L3 2/2 35W Intel® HD Graphics 510

G4400 3.3 N/A 1600/2133 3 MB L3 2/2 54W Intel® HD Graphics 510

G3470 3.6 N/A 1600 (DDR3) 3 MB L3 2/2 53W Intel® HD Graphics

G3460T 3.0 N/A 1600 (DDR3) 3 MB L3 2/2 35W Intel® HD Graphics

G3260T 2.9 N/A 1333 (DDR3) 3 MB L3 2/2 35W Intel® HD Graphics

G3260 3.3 N/A 1333 (DDR3) 3 MB L3 2/2 53W Intel® HD Graphics

J3710 1.6 2.64 1600 (DDR3) 2 MB L2 4/4 6.5W Intel® HD Graphics 405

Intel® Brand or

Processor Family Intel® vPro™9, ¥Technology

9Intel® Graphics9Intel® HT

Base

Frequency

(GHz)

Processor

NumberCache

Cores /

Threads

Memory

Speed DDR3/

DDR4 (MHz)

Intel® Technologies

Burst FrequencyPower

(Max TDP)

Intel® Celeron® Processors (14nm)

G3920 2.9 N/A 1600/2133 2 MB L3 2/2 51W Intel® HD Graphics 510

G3900T 2.6 N/A 1600/2133 2 MB L3 2/2 35W Intel® HD Graphics 510

G3900 2.8 N/A 1600/2133 2 MB L3 2/2 51W Intel® HD Graphics 510

J3160 1.6 2.24 1600 (DDR3) 2 MB L2 4/4 6W Intel® HD Graphics 400

J3060 1.6 2.48 1600 (DDR3) 2 MB L2 2/2 6W Intel® HD Graphics 400

INTEL® ROADMAP DIRECTIONS 201614

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¥ Need other compatible components like chipset and firmware

notebookS - Intel® processor reference chartIntel® Brand or

Processor Family Intel® vPro™9, ¥Technology

9Intel® Graphics9Intel® HT

Base

Frequency

(GHz)

Processor

NumberCache

Cores /

Threads

Memory

Speed DDR3/

DDR4 (MHz)

Intel® TechnologiesIntel® Turbo Boost

9Technology

- Max Turbo (GHz)

Power

(Max TDP)

6th Generation Intel® Core™ i3 Processor Family (14nm)

i3-6167U 2.7 N/A 1866/2133 3 MB L3 2/4 28W √ Intel® Iris™ Graphics 550

i3-6100H 2.7 N/A 1866/2133 3 MB L3 2/4 35W √ Intel® HD Graphics 530

i3-6100U 2.3 N/A 1866/2133 3 MB L3 2/4 15W √ Intel® HD Graphics 520

i5-6440HQ 2.6 3.5 1866/2133 6 MB L3 4/4 45W Intel® HD Graphics 530 √

i5-6360U 2.0 3.1 1866/2133 4 MB L3 2/4 15W √ Intel® Iris™ Graphics 540 √

i5-6300HQ 2.3 3.2 1866/2133 6 MB L3 4/4 45W Intel® HD Graphics 530

i5-6300U 2.4 3.0 1866/2133 3 MB L3 2/4 15W √ Intel® HD Graphics 520 √

i5-6287U 3.1 3.5 1866/2133 4 MB L3 2/4 28W √ Intel® Iris™ Graphics 550

i5-6267U 2.9 3.3 1866/2133 4 MB L3 2/4 28W √ Intel® Iris™ Graphics 550

i5-6260U 1.8 2.9 1866/2133 4 MB L3 2/4 15W √ Intel® Iris™ Graphics 540

i5-6200U 2.3 2.8 1866/2133 3 MB L3 2/4 15W √ Intel® HD Graphics 520

6th Generation Intel® Core™ i5 Processor Family (14nm)

6th Generation Intel® Core™ i7 Processor Family (14nm)

i7-6920HQ 2.9 3.8 1866/2133 8 MB L3 4/8 45W √ Intel® HD Graphics 530 √

i7-6820HK 2.7 3.6 1866/2133 8 MB L3 4/8 45W √ Intel® HD Graphics 530

i7-6820HQ 2.7 3.6 1866/2133 8 MB L3 4/8 45W √ Intel® HD Graphics 530 √

i7-6700HQ 2.6 3.5 1866/2133 6 MB L3 4/8 45W √ Intel® HD Graphics 530

i7-6650U 2.2 3.4 1866/2133 4 MB L3 2/4 15W √ Intel® Iris™ Graphics 540 √

i7-6600U 2.6 3.4 1866/2133 4 MB L3 2/4 15W √ Intel® HD Graphics 520 √

i7-6567U 3.3 3.6 1866/2133 4 MB L3 2/4 28W √ Intel® Iris™ Graphics 550

i7-6560U 2.2 3.2 1866/2133 4 MB L3 2/4 15W √ Intel® Iris™ Graphics 540

i7-6500U 2.5 3.1 1866/2133 4 MB L3 2/4 15W √ Intel® HD Graphics 520

A RESOURCE GUIDE FOR CIOs AND IT PROFESSIONALS 15

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notebookS - Intel® processor reference chartIntel® Brand or

Processor Family Intel® vPro™9, ¥Technology

9Intel® Graphics9Intel® HT

Base

Frequency

(GHz)

Processor

NumberCache

Cores /

Threads

Memory

Speed DDR3

(MHz)

Intel® TechnologiesIntel® Turbo Boost

9Technology

- Max Turbo (GHz)

Power

(Max TDP)

i5-5350H 3.1 3.5 1866 4 MB L3 2/4 47W √ Intel® Iris™ Pro Graphics 6200

i5-5350U 1.8 2.9 1866 3 MB L3 2/4 15W √ Intel® HD Graphics 6000 √

i5-5300U 2.3 2.9 1600 3 MB L3 2/4 15W √ Intel® HD Graphics 5500 √

i5-5287U 2.9 3.3 1866 3 MB L3 2/4 28W √ Intel® Iris™ Graphics 6100

i5-5257U 2.7 3.1 1866 3 MB L3 2/4 28W √ Intel® Iris™ Graphics 6100

i5-5250U 1.6 2.7 1866 3 MB L3 2/4 15W √ Intel® HD Graphics 6000

i5-5200U 2.2 2.7 1600 3 MB L3 2/4 15W √ Intel® HD Graphics 5500

5th Generation Intel® Core™ i5 Processor Family (14nm)

5th Generation Intel® Core™ i7 Processor Family (14nm)

i7-5950HQ 2.9 3.8 1866 6 MB L3 4/8 47W √ Intel® Iris™ Pro Graphics 6200

i7-5850HQ 2.7 3.6 1866 6 MB L3 4/8 47W √ Intel® Iris™ Pro Graphics 6200

i7-5750HQ 2.5 3.4 1866 6 MB L3 4/8 47W √ Intel® Iris™ Pro Graphics 6200

i7-5700HQ 2.7 3.5 1866 6 MB L3 4/8 47W √ Intel® HD Graphics 5600

i7-5650U 2.2 3.1 1866 4 MB L3 2/4 15W √ Intel® HD Graphics 6000 √

i7-5600U 2.6 3.2 1600 4 MB L3 2/4 15W √ Intel® HD Graphics 5500 √

i7-5557U 3.1 3.4 1866 4 MB L3 2/4 28W √ Intel® Iris™ Graphics 6100

i7-5550U 2.0 3.0 1866 4 MB L3 2/4 15W √ Intel® HD Graphics 6000

i7-5500U 2.4 3.0 1600 4 MB L3 2/4 15W √ Intel® HD Graphics 5500

i3-5157U 2.5 N/A 1866 3 MB L3 2/4 28W √ Intel® Iris™ Graphics 6100

i3-5020U 2.2 N/A 1600 3 MB L3 2/4 15W √ Intel® HD Graphics 5500

i3-5015U 2.1 N/A 1600 3 MB L3 2/4 15W √ Intel® HD Graphics 5500

i3-5010U 2.1 N/A 1600 3 MB L3 2/4 15W √ Intel® HD Graphics 5500

i3-5005U 2.0 N/A 1600 3 MB L3 2/4 15W √ Intel® HD Graphics 5500

5th Generation Intel® Core™ i3 Processor Family (14nm)

¥ Need other compatible components like chipset and firmware

INTEL® ROADMAP DIRECTIONS 201616

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¥ Need other compatible components like chipset and firmware

notebookS - Intel® processor reference chartIntel® Brand or

Processor Family Intel® vPro™9, ¥Technology

9Intel® Graphics9Intel® HT

Base

Frequency

(GHz)

Processor

NumberCache

Cores /

Threads

Memory

Speed DDR3

(MHz)

Intel® TechnologiesIntel® Turbo Boost

9Technology

- Max Turbo (GHz)

Power

(Max TDP)

5th Generation Intel® Core™ M/mX Processor Family (14nm)

M-5Y71 1.2 2.9 1600 4 MB L3 2/4 4.5W √ Intel® HD Graphics 5300 √

M-5Y70 1.1 2.6 1600 4 MB L3 2/4 4.5W √ Intel® HD Graphics 5300 √

M-5Y51 1.1 2.6 1600 4 MB L3 2/4 4.5W √ Intel® HD Graphics 5300

M-5Y31 0.9 2.4 1600 4 MB L3 2/4 4.5W √ Intel® HD Graphics 5300

M-5Y10c 0.8 2.0 1600 4 MB L3 2/4 4.5W √ Intel® HD Graphics 5300

M-5Y10a 0.8 2.0 1600 4 MB L3 2/4 4.5W √ Intel® HD Graphics 5300

M-5Y10 0.8 2.0 1600 4 MB L3 2/4 4.5W √ Intel® HD Graphics 5300

m7-6Y75 1.2 3.1 1866 4 MB L3 2/4 4.5W √ Intel® HD Graphics 515 √

m5-6Y57 1.1 2.8 1866 4 MB L3 2/4 4.5W √ Intel® HD Graphics 515 √

m5-6Y54 1.1 2.7 1866 4 MB L3 2/4 4.5W √ Intel® HD Graphics 515

m3-6Y30 0.9 2.2 1866 4 MB L3 2/4 4.5W √ Intel® HD Graphics 515

4405U 2.1 N/A 1866/2133 2 MB L3 2/4 15W √ Intel® HD Graphics 510

4405Y 1.5 N/A 1866 (DDR3) 2 MB L3 2/4 6W √ Intel® HD Graphics 515

3825U 1.9 N/A 1600 (DDR3) 2 MB L3 2/4 15W √ Intel® HD Graphics

3805U 1.9 N/A 1600 (DDR3) 2 MB L3 2/2 15W Intel® HD Graphics

N3710 1.6 2.56 1600 (DDR3) 2 MB L2 4/4 6W Intel® HD Graphics 405

N3700 1.6 2.4 1600 (DDR3) 2 MB L2 4/4 6W Intel® HD Graphics

A1020 2.41 2.66 1333 (DDR3) 2 MB L2 4/4 10W Intel® HD Graphics

Intel® Pentium® Processors (14nm)

Intel® Brand or

Processor Family Intel® vPro™9, ¥Technology

9Intel® Graphics9Intel® HT

Base

Frequency

(GHz)

Processor

NumberCache

Cores /

Threads

Memory

Speed DDR3/

DDR4 (MHz)

Intel® Technologies

Burst FrequencyPower

(Max TDP)

A RESOURCE GUIDE FOR CIOs AND IT PROFESSIONALS 17

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notebookS - Intel® processor reference chartIntel® Brand or

Processor Family Intel® vPro™9, ¥Technology

9Intel® Graphics9Intel® HT

Base

Frequency

(GHz)

Processor

NumberCache

Cores /

Threads

Memory

Speed DDR3/

DDR4 (MHz)

Intel® Technologies

Burst FrequencyPower

(Max TDP)

E3-1535M v5 2.9 3.8 1866/2133 8 MB L3 4/8 45W √ Intel® HD Graphics P530 √

E3-1505M v5 2.8 3.7 1866/2133 8 MB L3 4/8 45W √ Intel® HD Graphics P530 √

Intel® Xeon® Processor E3 v5 Family (14nm)

Intel® Celeron® Processors (14nm)

3955U 2.0 N/A 1866/2133 2 MB L3 2/2 15W Intel® HD Graphics 510

3855U 1.6 N/A 1866/2133 2 MB L3 2/2 15W Intel® HD Graphics 510

3765U 1.9 N/A 1600 (DDR3) 2 MB L3 2/2 15W Intel® HD Graphics

3755U 1.7 N/A 1600 (DDR3) 2 MB L3 2/2 15W Intel® HD Graphics

3215U 1.7 N/A 1600 (DDR3) 2 MB L3 2/2 15W Intel® HD Graphics

3205U 1.5 N/A 1600 (DDR3) 2 MB L3 2/2 15W Intel® HD Graphics

N3160 1.6 2.24 1600 (DDR3) 2 MB L2 4/4 6W Intel® HD Graphics 400

N3150 1.6 2.08 1600 (DDR3) 2 MB L2 4/4 6W Intel® HD Graphics

N3060 1.6 2.48 1600 (DDR3) 2 MB L2 2/2 6W Intel® HD Graphics 400

N3050 1.6 2.16 1600 (DDR3) 2 MB L2 2/2 6W Intel® HD Graphics

N3010 1.04 2.24 1600 (DDR3) 2 MB L2 2/2 4W Intel® HD Graphics 400

N3000 1.04 2.08 1600 (DDR3) 2 MB L2 2/2 4W Intel® HD Graphics

Intel® Brand or

Processor Family Intel® vPro™9, ¥Technology

9Intel® Graphics9Intel® HT

Base

Frequency

(GHz)

Processor

NumberCache

Cores /

Threads

Memory

Speed DDR3/

DDR4 (MHz)

Intel® TechnologiesIntel® Turbo Boost

9Technology

- Max Turbo (GHz)

Power

(Max TDP)

¥ Need other compatible components like chipset and firmware

INTEL® ROADMAP DIRECTIONS 201618

Page 19: INTEL® ROADMAP DIRECTIONS 2016 · 2016 turns the spotlight on how Intel continues to lead with innovative technologies and breakthrough products. In this edition, discover how an

Φ Intel® QuickPath Interconnect (Intel®QPI) unleashes the parallel processing performance of the latest Intel® microarchitectures.Ω Scalability mentioned is with Intel Chipsets only. OEMs can use their proprietary Node Controls to enhance the scalability.

Intel® Brand or

Processor FamilyClock Speed

(GHz)Processor

Number

ΦIntel® QPI

(GT/Sec)

Cores /

ThreadsCache

Max Turbo Clock

Speed (GHz)

Power

(Max TDP)ΩSystem Type

Memory Speed

DDR3/DDR4 (MHz)

SERVERS - Intel® processor reference chart

Intel® Xeon® Processor E7-8800/4800 v3 Sequence~

E7-8893 v3 3.2 3.5 1600/1866 45 MB L3 9.6 4/8 140W Up to 8 Processors

E7-8891 v3 2.8 3.5 1600/1866 45 MB L3 9.6 10/20 165W Up to 8 Processors

E7-8890 v3 2.5 3.3 1600/1866 45 MB L3 9.6 18/36 165W Up to 8 Processors

E7-8880L v3 2.0 2.8 1600/1866 45 MB L3 9.6 18/36 115W Up to 8 Processors

E7-8880 v3 2.3 3.1 1600/1866 45 MB L3 9.6 18/36 150W Up to 8 Processors

E7-8870 v3 2.1 2.9 1600/1866 45 MB L3 9.6 18/36 140W Up to 8 Processors

E7-8867 v3 2.5 3.3 1600/1866 45 MB L3 9.6 16/32 165W Up to 8 Processors

E7-8860 v3 2.2 3.2 1600/1866 40 MB L3 9.6 16/32 140W Up to 8 Processors

E7-4850 v3 2.2 2.8 1600/1866 35 MB L3 8.0 14/28 115W Up to 4 Processors

E7-4830 v3 2.1 2.7 1600/1866 30 MB L3 8.0 12/24 115W Up to 4 Processors

E7-4820 v3 1.9 N/A 1333/1866 25 MB L3 6.4 10/20 115W Up to 4 Processors

E7-4809 v3 2.0 N/A 1333/1866 20 MB L3 6.4 8/16 115W Up to 4 Processors

Intel® Xeon® Processor E5-4600 v3 Sequence~

E5-4669 v3 2.1 2.9 DDR4 45 MB L3 9.6 18/36 135W Up to 4 Processors

E5-4667 v3 2.0 2.9 DDR4 40 MB L3 9.6 16/32 135W Up to 4 Processors

E5-4660 v3 2.1 2.9 DDR4 35 MB L3 9.6 14/28 120W Up to 4 Processors

E5-4655 v3 2.9 3.2 DDR4 30 MB L3 9.6 6/12 135W Up to 4 Processors

E5-4650 v3 2.1 2.8 DDR4 30 MB L3 9.6 12/24 105W Up to 4 Processors

E5-4640 v3 1.9 2.6 DDR4 30 MB L3 8.0 12/24 105W Up to 4 Processors

E5-4627 v3 2.6 3.2 DDR4 25 MB L3 8.0 10/10 135W Up to 4 Processors

E5-4620 v3 2.0 2.6 DDR4 25 MB L3 8.0 10/20 105W Up to 4 Processors

E5-4610 v3 1.7 N/A DDR4 25 MB L3 6.4 10/20 105W Up to 4 Processors

Intel® Itanium® Processor 9500 Sequence~

9560 2.53 N/A 1067 (DDR3) 32 MB L3 6.4 8/16 170W MP

9550 2.4 N/A 1067 (DDR3) 32 MB L3 6.4 4/8 170W MP

9540 2.13 N/A 1067 (DDR3) 24 MB L3 6.4 8/16 170W MP

9520 1.73 N/A 1067 (DDR3) 20 MB L3 6.4 4/8 130W MP

A RESOURCE GUIDE FOR CIOs AND IT PROFESSIONALS 19

Page 20: INTEL® ROADMAP DIRECTIONS 2016 · 2016 turns the spotlight on how Intel continues to lead with innovative technologies and breakthrough products. In this edition, discover how an

« Workstation only SKU. Φ Intel® QuickPath Interconnect (Intel®QPI) unleashes the parallel processing performance of the latest Intel® microarchitectures

Ω Scalability mentioned is with Intel Chipsets only. OEMs can use their proprietary Node Controls to enhance the scalability.

SERVERS - Intel® processor reference chart

E5-2699 v3 2.3 3.6 2133 45 MB L3 9.6 18/36 145W DP

E5-2698 v3 2.3 3.6 2133 40 MB L3 9.6 16/32 135W DP

E5-2697 v3 2.6 3.6 2133 35 MB L3 9.6 14/28 145W DP

E5-2695 v3 2.3 3.3 2133 35 MB L3 9.6 14/28 120W DP

E5-2690 v3 2.6 3.5 2133 30 MB L3 9.6 12/24 135W DP«E5-2687W v3 3.1 3.5 2133 25 MB L3 9.6 10/20 160W DP

E5-2683 v3 2.0 3.0 2133 35 MB L3 9.6 14/28 120W DP

E5-2680 v3 2.5 3.3 2133 30 MB L3 9.6 12/24 120W DP

E5-2670 v3 2.3 3.1 2133 30 MB L3 9.6 12/24 120W DP

E5-2667 v3 3.2 3.6 2133 20 MB L3 9.6 8/16 135W DP

E5-2660 v3 2.6 3.3 2133 25 MB L3 9.6 10/20 105W DP

E5-2650L v3 1.8 2.5 2133 30 MB L3 9.6 12/24 65W DP

E5-2650 v3 2.3 3.0 2133 25 MB L3 9.6 10/20 105W DP

E5-2643 v3 3.4 3.7 2133 20 MB L3 9.6 6/12 135W DP

E5-2640 v3 2.6 3.4 1866 20 MB L3 8.0 8/16 90W DP

E5-2637 v3 3.5 3.7 2133 15 MB L3 9.6 4/8 135W DP

E5-2630L v3 1.8 2.9 1866 20 MB L3 8.0 8/16 55W DP

E5-2630 v3 2.4 3.2 1866 20 MB L3 8.0 8/16 85W DP

E5-2623 v3 3.0 3.5 1866 10 MB L3 8.0 4/8 105W DP

E5-2620 v3 2.4 3.2 1866 15 MB L3 8.0 6/12 85W DP

E5-2609 v3 1.9 N/A 1600 15 MB L3 6.4 6/6 85W DP

E5-2603 v3 1.6 N/A 1600 15 MB L3 6.4 6/6 85W DP

E5-1680 v3 3.2 3.8 2133 20 MB L3 N/A 8/16 140W UP

E5-1660 v3 3.0 3.5 2133 20 MB L3 N/A 8/16 140W UP

E5-1650 v3 3.5 3.8 2133 15 MB L3 N/A 6/12 140W UP

E5-1630 v3 3.7 3.8 2133 10 MB L3 N/A 4/8 140W UP

E5-1620 v3 3.5 3.6 2133 10 MB L3 N/A 4/8 140W UP

Intel® Xeon® Processor E5-2600 v3 and E5-1600 v3 Sequence~

Intel® Brand or

Processor FamilyClock Speed

(GHz)Processor

Number

ΦIntel® QPI

(GT/Sec)

Cores /

ThreadsCache

Max Turbo Clock

Speed (GHz)

Power

(Max TDP)ΩSystem Type

Memory Speed

DDR4 (MHz)

INTEL® ROADMAP DIRECTIONS 201620

Page 21: INTEL® ROADMAP DIRECTIONS 2016 · 2016 turns the spotlight on how Intel continues to lead with innovative technologies and breakthrough products. In this edition, discover how an

Φ Intel® QuickPath Interconnect (Intel®QPI) unleashes the parallel processing performance of the latest Intel® microarchitectures.Ω Scalability mentioned is with Intel Chipsets only. OEMs can use their proprietary Node Controls to enhance the scalability.

SERVERS - Intel® processor reference chart

E3-1280 v5 3.7 4.0 1600/2133 8 MB L3 N/A 4/8 80W UP

E3-1275 v5 3.6 4.0 1600/2133 8 MB L3 N/A 4/8 80W UP

E3-1270 v5 3.6 4.0 1600/2133 8 MB L3 N/A 4/8 80W UP

E3-1260L v5 2.9 3.9 1600/2133 8 MB L3 N/A 4/8 45W UP

E3-1245 v5 3.5 3.9 1600/2133 8 MB L3 N/A 4/8 80W UP

E3-1240L v5 2.1 3.2 1600/2133 8 MB L3 N/A 4/8 25W UP

E3-1240 v5 3.5 3.9 1600/2133 8 MB L3 N/A 4/8 80W UP

E3-1235L v5 2.0 3.0 1600/2133 8 MB L3 N/A 4/4 25W UP

E3-1230 v5 3.4 3.8 1600/2133 8 MB L3 N/A 4/8 80W UP

E3-1225 v5 3.3 3.7 1600/2133 8 MB L3 N/A 4/4 80W UP

E3-1220 v5 3.0 3.5 1600/2133 8 MB L3 N/A 4/4 80W UP

Intel® Xeon® Processor E3-1200 v5 Sequence~

Intel® Brand or

Processor FamilyClock Speed

(GHz)Processor

Number

ΦIntel® QPI

(GT/Sec)

Cores /

ThreadsCache

Max Turbo Clock

Speed (GHz)

Power

(Max TDP)ΩSystem Type

Memory Speed

DDR3/DDR4 (MHz)

Intel® Xeon® Processor E3-1200 v4 Sequence~

E3-1285L v4 3.4 3.8 1866 6 MB L3 N/A 4/8 65W UP

E3-1285 v4 3.5 3.8 1866 6 MB L3 N/A 4/8 95W UP

E3-1265L v4 2.3 3.3 1866 6 MB L3 N/A 4/8 35W UP

Intel® Brand or

Processor FamilyClock Speed

(GHz)Processor

Number

ΦIntel® QPI

(GT/Sec)

Cores /

ThreadsCache

Max Turbo Clock

Speed (GHz)

Power

(Max TDP)ΩSystem Type

Memory Speed

DDR3 (MHz)

A RESOURCE GUIDE FOR CIOs AND IT PROFESSIONALS 21

Page 22: INTEL® ROADMAP DIRECTIONS 2016 · 2016 turns the spotlight on how Intel continues to lead with innovative technologies and breakthrough products. In this edition, discover how an

Φ Intel® QuickPath Interconnect (Intel®QPI) unleashes the parallel processing performance of the latest Intel® microarchitectures.Ω Scalability mentioned is with Intel Chipsets only. OEMs can use their proprietary Node Controls to enhance the scalability.

SERVERS - Intel® processor reference chartIntel® Brand or

Processor FamilyClock Speed

(GHz)Processor

Number

ΦIntel® QPI

(GT/Sec)

Cores /

ThreadsCache

Max Turbo Clock

Speed (GHz)

Power

(Max TDP)ΩSystem Type

Memory Speed

DDR3 (MHz)

Intel® Xeon® Processor E3-1200 v3 Sequence~

E3-1286L v3 3.2 4.0 1600 8 MB L3 N/A 4/8 65W UP

E3-1286 v3 3.7 4.1 1600 8 MB L3 N/A 4/8 84W UP

E3-1285L v3 3.1 3.9 1600 8 MB L3 N/A 4/8 65W UP

E3-1285 v3 3.6 4.0 1600 8 MB L3 N/A 4/8 84W UP

E3-1281 v3 3.7 4.1 1600 8 MB L3 N/A 4/8 82W UP

E3-1280 v3 3.6 4.0 1600 8 MB L3 N/A 4/8 82W UP

E3-1276 v3 3.6 4.0 1600 8 MB L3 N/A 4/8 84W UP

E3-1275L v3 2.7 3.9 1600 8 MB L3 N/A 4/8 45W UP

E3-1275 v3 3.5 3.9 1600 8 MB L3 N/A 4/8 84W UP

E3-1271 v3 3.6 4.0 1600 8 MB L3 N/A 4/8 80W UP

E3-1270 v3 3.5 3.9 1600 8 MB L3 N/A 4/8 80W UP

E3-1265L v3 2.5 3.7 1600 8 MB L3 N/A 4/8 45W UP

E3-1246 v3 3.5 3.9 1600 8 MB L3 N/A 4/8 84W UP

E3-1245 v3 3.4 3.8 1600 8 MB L3 N/A 4/8 84W UP

E3-1241 v3 3.5 3.9 1600 8 MB L3 N/A 4/8 80W UP

E3-1240L v3 2.0 3.0 1600 8 MB L3 N/A 4/8 25W UP

E3-1240 v3 3.4 3.8 1600 8 MB L3 N/A 4/8 80W UP

E3-1231 v3 3.4 3.8 1600 8 MB L3 N/A 4/8 80W UP

E3-1230L v3 1.8 2.8 1600 8 MB L3 N/A 4/8 25W UP

E3-1230 v3 3.3 3.7 1600 8 MB L3 N/A 4/8 80W UP

E3-1226 v3 3.3 3.7 1600 8 MB L3 N/A 4/4 84W UP

E3-1225 v3 3.2 3.6 1600 8 MB L3 N/A 4/4 84W UP

E3-1220L v3 1.1 1.5 1600 4 MB L3 N/A 2/4 13W UP

E3-1220 v3 3.1 3.5 1600 8 MB L3 N/A 4/4 80W UP

INTEL® ROADMAP DIRECTIONS 201622

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∏ Also available as part of an Intel® Xeon Phi™ starter kit

SERVERS - Intel® processor reference chartIntel® Brand or

Processor Family

Clock Speed

(GHz)Processor

NumberCoresCache Broad TDP (Watts)Max Turbo Clock Speed (Ghz)

Clock Speed

(GHz)Processor

NumberCache

Cores /

Threads

Memory Speed

DDR3 (MHz)

Max Turbo Clock

Speed (GHz)Power (Max TDP)

Intel® Atom™ Processor C2000/S1200 Sequence~

C2750 2.4 2.6 1600 4 MB 8/8 20W

C2730 1.7 2.4 1600 4 MB 8/8 12W

C2550 2.4 2.6 1600 2 MB 4/4 14W

C2530 1.7 2.4 1333 2 MB 4/4 9W

C2350 1.7 2.0 1333 1 MB 2/2 6W

S1260 2.0 N/A 1333 1 MB 2/4 8.5W

S1240 1.6 N/A 1333 1 MB 2/4 6.1W

S1220 1.6 N/A 1333 1 MB 2/4 8.1W

Intel® Brand or

Processor Family

Intel® Xeon Phi™ Coprocessor Sequence~

7120A 1.238 1.333 30.5 MB 61 300W

7120D 1.238 1.333 30.5 MB 61 270W

7120P 1.238 1.333 30.5 MB 61 300W

7120X 1.238 1.333 30.5 MB 61 300W

5120D 1.053 N/A 30.0 MB 60 245W Π 5110P 1.053 N/A 30.0 MB 60 225W Π 3120A 1.1 N/A 28.5 MB 57 300W

3120P 1.1 N/A 28.5 MB 57 300W

Clock Speed

(GHz)Processor

NumberCache

Cores /

ThreadsMemory Types

Max Turbo Clock

Speed (GHz)Power (Max TDP)

Intel® Pentium® Processor D1500 Sequence~

D1517 1.6 2.2 DDR4, DDR3 6 MB 4/8 25W

D1509 1.5 N/A DDR4, DDR3 3 MB 2/2 19W

D1508 2.2 2.6 DDR4, DDR3 3 MB 2/4 25W

D1507 1.2 N/A DDR4, DDR3 3 MB 2/2 20W

Intel® Brand or

Processor Family

A RESOURCE GUIDE FOR CIOs AND IT PROFESSIONALS 23

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~ Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See for details. www.intel.com/products/processor_number

Φ Intel® QuickPath Interconnect (Intel® QPI) unleashes the parallel processing performance of next-generation Intel® 45nm microarchitectures.

Software and workloads used in performance tests may have been optimized for performance only on Intel® microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software,

operations, and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product

when combined with other products. For more information, go to .www.intel.com/performance

Intel is a sponsor and member of the BenchmarkXPRT Development Community, and was the major developer of the XPRT family of benchmarks. Principled Technologies is the publisher of the XPRT family of benchmarks. You should consult other information

and performance tests to assist you in fully evaluating your contemplated purchases.

1. Measured by SYSmark* 2014, a benchmark from the BAPCo* consortium that measures the performance of Windows* platforms. Find out more at . www.bapco.com

2. Measured by CyberLink MediaEspresso* 7+ (UHD) on Windows*. The workload file is a 12 minute and 14 second, ~1.5 GB, 3840x2160p, 17561 kbps, H.264 MP4 video file. The file is transcoded to a smaller 1920x1080, 8 Mbps, H.264, .m2ts file for

reduced file size during internet transfers or for viewing on a portable device with bit rate such as an iPod*.

3. Measured by WebXPRT* 2015, a benchmark from Principled Technologies that measures the performance of web applications. Find out more at . www.principledtechnologies.com

4. Video Battery Life Rundown (in minutes) as measured by Tears of Steel*, 1080p, 23.976fps, H.264, 3000kbps, rev1.mp4 >/=200nit, DPST=ON, no dimming, balanced, Wi-Fi connected.

5. Faster Resume workload consists of time to resume from standby based on OEM implementation of Windows® 10 Modern Standby on a 6th Gen Intel® Core™ processors.

1,2,3,4,5. System Configuration Details

5th generation Intel® Core™ system: Intel Reference Platform, Intel® Core™ M-5Y71processor (Turbo up to 2.9GHz/2.6GHz, PL1=4.5W TDP, 2C4T), Memory: 4GP (2x2GB) LPDDR3-1600, HDD: Intel® Solid State Drive (Intel® SSD), Display: 1920x1080, OS:

Windows® 10.

6th generation Intel® Core™ system: Intel Reference Platform, Intel® Core™ M7-6Y75 processor (Turbo up to 3.1GHz/2.9GHz, PL1=4.5W TDP 1 PL1=4.5W TDP , 2C4T), Memory: 4GB (2x2GB) LPDDR3-1600, HDD: Intel® Solid State Drive (Intel® SSD), Display:

1920x1080, OS: Windows® 10.

Intel Reference Platform is an example new system. Products available from systems manufacturers will not be identical in design, and performance will vary.

6. No computer system can provide absolute security under all conditions. Built-in security features available on select Intel Core™ processors may require additional software, hardware, services, and/or an Internet connection. Results may vary depending

upon configuration. Consult your system manufacturer for more details. For more information, visit intel.com/technology/security.

7. Intel vPro technology is sophisticated and requires setup and activation. Availability of features and results will depend upon the setup and configuration of your hardware, software, and IT environment. To learn more, visit . intel.com/technology/vpro

8. Baseline system: Intel® Xeon® Processor E3-1275 v2, Intel HD graphics P400, 16GB (4x4GB DDR3-1600MHz ECC UDIMM), Western Digital WD2000FYYZ HDD, RHEL v6.3-2.6.32-278, ACRVMBY1.86C, IC13.

Previous generation: Intel Xeon Processor E3-1276 v3 Supermicro 813M-3, X10SLM+-LN4f, Intel HD graphics P4600, 16 GB (4 x 4GB DDR3-1600MHz ECC UDIMM), Western Digital WD500GB HDD, RHEL6.5-2.6.32-431, 1.1a, IC14.

New Configuration: Intel Xeon Processor E3-1275 v5, RVP8 Skylake Reference Board, Intel HD Graphics P530, 16GB (2 x 8GB DDR4-2133MHz ECC UDIMM), Intel SSD 530 Serries 120GB model SSDSC2BW120A4, CentOS 7 - 3.10.0 123.el7.x86_64,

SKLSE2R1.R00.X092.B00.1507130736, IC14.

9. Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Performance varies depending on system configuration. No computer system can be absolutely secure. Check

with your system manufacturer or retailer or learn more at www.intel.com

Legal Disclaimers

• INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS

INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. A "Mission Critical Application" is any

application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD

INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT

OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE

DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any

features or instructions marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to

change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current

characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this

document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htm

• Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software,

operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that

product when combined with other products.

• Results have been estimated based on internal Intel analysis and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance.

• Intel does not control or audit the design or implementation of third party benchmarks or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar performance benchmarks are

reported and confirm whether the referenced benchmarks are accurate and reflect performance of systems available for purchase.

• Relative performance is calculated by assigning a baseline value of 1.0 to one benchmark result, and then dividing the actual benchmark result for the baseline platform into each of the specific benchmark results of each of the other platforms, and

assigning them a relative performance number that correlates with the performance improvements reported.

• The cost reduction scenarios described in this document are intended to enable you to get a better understanding of how the purchase of a given Intel product, combined with a number of situation-specific variables, might affect your future cost and

savings. Circumstances will vary and there may be unaccounted-for costs related to the use and deployment of a given product. Nothing in this document should be interpreted as either a promise of or contract for a given level of costs.

• SPEC, SPECint are trademarks of the Standard Performance Evaluation Corporation. See http://www.spec.org for more information. Intel® Run Sure Technology: No computer system can provide absolute reliability, availability or serviceability. Requires an

Intel® Xeon® processor E7-8800/4800/2800 v2 product families-based system (or follow-on generations of either.) Built-in reliability features available on select Intel® processors may require additional software, hardware, services and/or an internet

connection. Results may vary depending upon configuration. Consult your system manufacturer for more details.

• Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families: Go to: Learn About Intel® Processor Numbers

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Risk Factors and Optimization Notice

The above statements and any others in this document that refer to plans and expectations for the third quarter, the year and the future are forward-looking statements that involve a number of risks and uncertainties. Words such as “anticipates,” “expects,”

“intends,” “plans,” “believes,” “seeks,” “estimates,” “may,” “will,” “should” and their variations identify forward-looking statements. Statements that refer to or are based on projections, uncertain events or assumptions also identify forward-looking statements.

Many factors could affect Intel’s actual results, and variances from Intel’s current expectations regarding such factors could cause actual results to differ materially from those expressed in these forward-looking statements. Intel presently considers the following

to be the important factors that could cause actual results to differ materially from the company’s expectations. Demand could be different from Intel's expectations due to factors including changes in business and economic conditions; customer acceptance of

Intel’s and competitors’ products; supply constraints and other disruptions affecting customers; changes in customer order patterns including order cancellations; and changes in the level of inventory at customers. Uncertainty in global economic and financial

conditions poses a risk that consumers and businesses may defer purchases in response to negative financial events, which could negatively affect product demand and other related matters. Intel operates in intensely competitive industries that are characterized

by a high percentage of costs that are fixed or difficult to reduce in the short term and product demand that is highly variable and difficult to forecast. Revenue and the gross margin percentage are affected by the timing of Intel product introductions and the

demand for and market acceptance of Intel's products; actions taken by Intel's competitors, including product offerings and introductions, marketing programs and pricing pressures and Intel’s response to such actions; and Intel’s ability to respond quickly to

technological developments and to incorporate new features into its products. The gross margin percentage could vary significantly from expectations based on capacity utilization; variations in inventory valuation, including variations related to the timing of

qualifying products for sale; changes in revenue levels; segment product mix; the timing and execution of the manufacturing ramp and associated costs; start-up costs; excess or obsolete inventory; changes in unit costs; defects or disruptions in the supply of

materials or resources; product manufacturing quality/yields; and impairments of long-lived assets, including manufacturing, assembly/test and intangible assets. Intel's results could be affected by adverse economic, social, political and physical/infrastructure

conditions in countries where Intel, its customers or its suppliers operate, including military conflict and other security risks, natural disasters, infrastructure disruptions, health concerns and fluctuations in currency exchange rates. Expenses, particularly certain

marketing and compensation expenses, as well as restructuring and asset impairment charges, vary depending on the level of demand for Intel's products and the level of revenue and profits. Intel’s results could be affected by the timing of closing of acquisitions

and divestitures. Intel's results could be affected by adverse effects associated with product defects and errata (deviations from published specifications), and by litigation or regulatory matters involving intellectual property, stockholder, consumer, antitrust,

disclosure and other issues, such as the litigation and regulatory matters described in Intel's SEC reports. An unfavorable ruling could include monetary damages or an injunction prohibiting Intel from manufacturing or selling one or more products, precluding

particular business practices, impacting Intel’s ability to design its products, or requiring other remedies such as compulsory licensing of intellectual property. A detailed discussion of these and other factors that could affect Intel’s results is included in Intel’s SEC

filings, including the company’s most recent reports on Form 10-Q, Form 10-K and earnings release.

Optimization Notice

Intel's compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2, SSE3, and SSE3 instruction sets and other optimizations. Intel does not

guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not manufactured by Intel.

Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product User and

Reference Guides for more information regarding the specific instruction sets covered by this notice.

Notice revision #20110804

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For regular updates,

log on to

www.intel.in/directions

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© 2016 Intel Corporation. Intel, the Intel logo, Intel Itanium, Intel Xeon, Intel Core, Intel Xeon Phi, Intel Pentium, Intel Celeron, Intel Atom, Centrino, Intel

Inside, the Intel. Experience What’s Inside logo and Intel. Experience What’s Inside are trademarks of Intel Corporation in the U.S. and/or other countries.

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