integrated circuit and system design expertise: the heart of future electronic products
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Integrated Circuit and System Design Expertise: The Heart of Future Electronic Products. Charles G. Sodini MIT Cambridge, MA January 14, 2003. Wafer Fab. Assembly Test. Marketing Dist. Design. Electronics Products Value Chain. Components. General Characteristics - PowerPoint PPT PresentationTRANSCRIPT
The Industrial Performance Center Massachusetts Institute of Technology
Integrated Circuit and System Design Expertise:
The Heart of FutureElectronic Products
Charles G. SodiniMIT
Cambridge, MA
January 14, 2003
The Industrial Performance Center Massachusetts Institute of Technology
Electronics Products Value Chain
Components
DesignWafer
Fab
Assembly
Test
Marketing
Dist.
General Characteristics
• IDM’s perform all functions
• Value-added processes in wafer fab
• Huge Capital Costs
• Foundries perform only one function
The Industrial Performance Center Massachusetts Institute of Technology
Electronics Products Value Chain (con’t)
Product
DefinitionDesign Manufact.
Test
Marketing
Dist.Service
Products
General Characteristics
• Multinational Companies
• Strong in Product Defn, Marketing Distribution and Service
• Detailed Design and Manufacturing - often sub-contracted
The Industrial Performance Center Massachusetts Institute of Technology
Changing Face of Electronics Products
• Traditional consumer electronics examples– Audio, Video, Telephones
• Traditional PC electronics examples– PCs, Laptops, Peripherals
• Examples of PC/Consumer electronics products – DSCs, MP3 players, Cell phones, PDAs, DVDs
Rapid convergence of consumer and PC electronics offers interesting opportunities
The Industrial Performance Center Massachusetts Institute of Technology
Electronics Products Business Models
• Dominated by Multinational Corporations• Functions performed
– Product definition• Use both “off the shelf” and special purpose chips
– Marketing/Distribution – Service
• Growing importance in providing revenue streams
• Functions outsourced– Detailed product design– Manufacturing & Test
The Industrial Performance Center Massachusetts Institute of Technology
Opportunity for New Business Model
• Combine innovative product definition with special purpose chip design
• Unique products with higher value become possible• Higher barrier to entry
– Special purpose chips are difficult to duplicate rapidly
The Industrial Performance Center Massachusetts Institute of Technology
Example - SMaL Camera Technologies
• Technology developed at university– Brightness Adaptive Imaging
– Low power image sensor design
• At Company– Innovative product definition
– Complete re-design of image sensor for product application
The Industrial Performance Center Massachusetts Institute of Technology
Innovative Product Design
Form factor possible
• High level of integration
• Low power dissipation
The Industrial Performance Center Massachusetts Institute of Technology
Partner with Multinational Companies for Marketing and Distribution
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The Industrial Performance Center Massachusetts Institute of Technology
Innovation Business Model
• Perform IC design and innovative product design– High value-added functions
• Outsource wafer fab, assembly & test• Partner with Multinationals for manufacturing
marketing/distribution and service
The Industrial Performance Center Massachusetts Institute of Technology
IC Design Research and Development
• Define research driver system that pushes current design capabilities.
• System driver should push architectural as well as circuit design knowledge
• In the components model this research feeds directly into the design function.
DesignWafer
Fab
Assembly
Test
Marketing
Dist.
The Industrial Performance Center Massachusetts Institute of Technology
Wireless Gigabit Local Area Network (WiGLAN)An IC Design Research Driver at MIT
• PC Peripherals
• Consumer Electronics
• Interactive Video
controller(NGI)
HDTV
novelties
videophone
stereo
The Industrial Performance Center Massachusetts Institute of Technology
Research Goals
• Demonstrate key circuit and system concepts to advance wireless LAN to Gb/sec data rates
• Adaptive system architecture to support wide range of data rates and quality of service
• Develop low power design techniques at the circuit, chip architecture and system level to support portable appliances
The Industrial Performance Center Massachusetts Institute of Technology
WiGLAN Architecture
• Network Controller
•Allocates channels
•Measures SNR
•Space-Time Diversity
WiGLAN ADAPTER
Appliance
WiGLAN ADAPTER
High Data RateAppliance
WiGLAN ADAPTER
Appliance
WiGLAN ADAPTER
Appliance
Wi
GLAN
ADAPTER
NetworkController
Processor
NGI
The Industrial Performance Center Massachusetts Institute of Technology
Receiver Chain
Receiver Chain
Receiver Chain
Receiver Chain
Transmitter Chain
Transmitter Chain
Transmitter Chain
NetworkServer
DSP
Multi-CarrierAdaptive Rate
QAM
DSPSpace-TimeProcessing
• Digital Modulation
• Digital Space-Time Diversity Processing– Improves channel capacity
• Replicated Transmit/Receive Chain
Network Controller with Space-Time Diversity
Transmitter Chain
The Industrial Performance Center Massachusetts Institute of Technology
OFDM
• Conversion between time and frequency via (I)FFT
• Narrow bins provide more granularity for changing data demands
• Narrow bins increase total complexity, but allow greater potential for parallelism
• Cyclic prefix similar to frequency guard bands
150 MHz bandwidth available in 5.8 GHz band, with bins ~1 MHz wide.
The Industrial Performance Center Massachusetts Institute of Technology
Adaptive Modulation
• Can adaptively change modulation for each bin based on measured channel response. Either optimal (gray) or coarse (dark gray) water pouring can be used.
• Most of the benefit comes from avoiding very bad frequency bins.
• Threshold may differ for each block
• Coarse requires less overhead to identify bin modulation
• Coarse: All equal
• Optimal: 54 b/s/Hz
40 b/s/Hz
48 b/s/Hz (best)
The Industrial Performance Center Massachusetts Institute of Technology
Network Adapter Block Diagram
• Physically Small - Requires High Integration
• 3 Major IC’s - RF, Baseband Mixed Signal, DSP
• Quality of Service - Scaleable with Power Dissipation
Network adapter
ApplianceBaseband
Mixed-SignalProcessor
DigitalSignal
Processor
RFTrans.
The Industrial Performance Center Massachusetts Institute of Technology
Baseband Mixed-Signal Processor
Wideband A/D Conversion• DC-150MHz, oversampled at 600MSPS
• ~12 bit linearity/resolution
• Low power (~1W, core)
Programmable Gain Amplifier• 0-20dB, 72 dB Linearity
Channel Equalization• Channel fading characteristic requires only modest
amplitude equalization
The Industrial Performance Center Massachusetts Institute of Technology
Network Adapter Block Diagram
• Physically Small - Requires High Integration
• 3 Major IC’s - RF, Baseband Mixed Signal, DSP
• Quality of Service - Scaleable with Power Dissipation
Network adapter
ApplianceBaseband
Mixed-SignalProcessor
DigitalSignal
Processor
RFTrans.
The Industrial Performance Center Massachusetts Institute of Technology
WiGLAN Receiver: Architectural Approach
5.8 GHzRF Input
AnalogBasebandProcessing
1st LO 2nd LO
•Multiple receivers in parallel•Fully integrated analog front end
•Design & implementation of wide-bandwidth high frequency filters•Isolation between receivers
Primary Goals
Major Challenges
The Industrial Performance Center Massachusetts Institute of Technology
WiGLAN Receiver: Integrated Filters
• Q-enhancement techniques to compensate low Q on-chip inductors• Simple & novel filter building blocks • Traditional passive & active integrated circuit techniques reuse, where appropriate, to implement higher order filters
Approaches:
Challenges:
Motivations:
• Filter stability with component tolerances • Receiver linearity and noise degradation
Isolation & matching complexities with use of multiple external discrete filters
The Industrial Performance Center Massachusetts Institute of Technology
WiGLAN Receiver: Image Reject Filter (Prototype Building Block)
Tunable rejection response Tunable center frequency
The Industrial Performance Center Massachusetts Institute of Technology
The Main Messages
• Opportunity: Combine innovative product definition with special purpose chip design
• Research to develop new technology is essential to feed component design capabilities.
• Circuit and system techniques developed in the research environment should have wide applicability in future products given a well defined system driver.
• IT TAKES TIME: Research does not output results directly for products