infrastructure - coinnovatecs · 2019. 6. 5. · • pic opportunity and challenges • wafer level...
TRANSCRIPT
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Confidential Use Only – Do Not Share
INFRASTRUCTURE
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Quality Engineer, Optics
Photonics Challenges for DC Optics
Vincent Zeng
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• Facebook Data Center In Scale
• PIC Opportunity and Challenges
• Wafer Level
• Packaging
• Bath Tube Challenges
• Interoperability
Agenda
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Facebook Data Center In Scale
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Papillion, NE
Fort Worth, TX
Prineville, OR Forest City, NC Luleä, Sweden Altoona, IA
Clonee, Ireland Los Lunas, NM Odense, Denmark
New Albany, OH Henrico, VA Newton County, GA
Huntsville, AL
Eagle Mountain, UT
Singapore
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Confidential Use Only – Do Not Share
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100G Optical Transceiver Quality Performance
• DOA- almost all failures were
reported within 3months after power
on
• Among those failures, 97% comes
from laser related
• We should have more stringent
screening or Burn In process on
laser
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Yield Management- Starts From Wafer
Level
• Fully rely on post
burn-in Process
• Volume Drives
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• Laser Integration
• RF management
• Optical coupling and
alignment
Packaging Challenges
• Standard process
• Automation
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Co-packaged Optical Solution
• Conventional
pluggable optics-
not scalable
• On-board optics
• Co-packaged optics• Wafer level integration/test
• Packaging challenge to wafer
• Better process control
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Infant Mortality and Wear Out Reliability Concern
• Too early to Consider
Reliability when
• Less Stringent BI
Screening
• Less wafer level Process
Control
• Classic GR468 ONLY
Laser BI
Optimization
DOA
Challenges
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Confidential Use Only – Do Not Share
Facebook Network Fabric Topology
Interoperability challenges
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Questions
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Thank you