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©2012 iNEMI iNEMI Project on PCBA Reliability Qualification Processes for Enterprise Products SOW Review Session October 18, 2012 Co-chairs - Tom Homorodi (Dell) Aamir Kazi (Dell)

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Page 1: iNEMI Project on PCBA Reliability Qualification Processes for …thor.inemi.org/webdownload/projects/ba/PCBA/PCBA_SOW... · 2015-09-10 · ©2012 iNEMI 2 PCBA Reliability Qualification

©2012 iNEMI

iNEMI Project on PCBA Reliability Qualification

Processes for Enterprise Products

SOW Review Session

October 18, 2012

Co-chairs -

Tom Homorodi (Dell)

Aamir Kazi (Dell)

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1 ©2012 iNEMI

PCBA Reliability Qualification Process

Statement of Work Review

• Introduction of Project Chairs

• Overview of iNEMI Project Selection Process

• Company participation in Statement of Work (SOW)

development

• Introduction

• Review of SOW

• Summary and next steps

• Q&A

Agenda

Note: All phones will be on mute until the end of the presentation

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PCBA Reliability Qualification Process for Enterprise Products

• Tom Homorodi… Dell, Director Enterprise Reliability Engineering.

– Lead Design for Reliability, Subsystem Qualification & ORT, New Technology Qualification, Predictive and

Inferential Statistics, Validation Testing, S&V, and Failure Analysis teams for Dell Server, Storage and

Networking products.

– Previous experience includes High Reliability and Automotive quality/reliability program leadership in:

– Semiconductor wafer fab and assembly/test processes

– PCB assembly, in circuit, and final test processes

• Aamir Kazi… Dell, Enterprise Reliability Engineer

– New technology/ process/ materials reliability engineer for enterprise products.

– Previously responsible for reliability qualification for Lead-free/ RoHS transition for enterprise and client

products.

Project Chairs

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©2012 iNEMI

Project Management

Project Selection Process

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STRATEGY

RESOURCE

ANALYSIS

&

PLANNING

COMPANY

COMMITMENT

Resource Skills

& Utilization Maps

PROJECTS

PROJECTS

ALIGNED TO

STRATEGY

PROJECTS

REALISTICALLY

POSSIBLE

Filter Filter MARKET

OPPORTUNITIES

BUSINESS

GROWTH

Project Selection Process

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Questions to Ask:

• VALUE:

– What is the value?

• TEAM:

– Does the team have the right leadership?

– Does the team have the right

membership?

– Does the team have the necessary

experience and skills?

• PRODUCTS / RESULTS:

– What are the essential specifications?

– Is existing technology usable?

• STRATEGIC ALIGNMENT:

– Why is the project strategic?

– Is it identified as a key thrust?

– Why must we do it now?

• PROJECT SCHEDULE:

– Is the schedule achievable?

– Has a detailed work breakdown structure

been derived?

– How does “time-to-market” compare with

industry benchmarks?

• RESOURCE REQUIREMENTS:

– Are all resources identified and

committed for the schedule?

– Will all of the skills needed be available

when required?

• RISK AND ISSUE MANAGEMENT:

– Are all risks regularly identified,

monitored and managed?

– Are the probability and impacts realistic?

– Are clear action plans established for high

risks?

– Are all issues identified promptly and

escalated as appropriate for decisions?

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The Project Process - 5 Steps

SELECTION

DEFINITION

PLANNING

EXECUTION / REVIEW

CLOSURE

1

2

3

4

5 Limited to iNEMI Members

Open for Industry input

------------------- iNEMI Technical Committee (TC) Approval Required for Execution

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©2012 iNEMI

Company Participation in

SOW Development

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Statement of Work (SOW) Development

Company Participation

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©2012 iNEMI

Introduction

iNEMI Project on PCBA Reliability Qualification

Processes for Enterprise Products

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Multi-OEM Qual Process: Current Problems • Inadequately qualified product or process changes

• Inadequately qualified new and/or emerging technologies

– Product and technology changes are not sufficiently validated

• Opaque, non-standard qualification test suites

– Opacity allows suppliers/ ODM’s to set unacceptably low qualification levels

– Each supplier does something different and all say it is okay

– Lack of a standard test suite

– Uncorrelatable test results

• Multiple qualification cycles add time, costs and delay time-to-market

• ODMs receive diverging and conflicting guidance from the multiple

OEMs

• Inconsistent OEM requirements and ODM responses

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Project Summary

• Problem Statement

– Inconsistency in the qualification of new technology, materials,

suppliers/factories at EMS and ODM firms by OEMs (Each OEM has

their own, and different, qualification process).

• Opportunity

– “Level the playing field” -- Standardize PCBA reliability qualification

methods at the ODM/CM level

– Improve supplier capabilities

• Goal

– Develop an industry-wide set of common qualification elements and

processes for consistent ODM/CM PCBA reliability

– Consistent OEM Product and Process change qualification process

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Outline of Statement of Work (SOW)

• Background/Context

• Scope of Work

• Purpose of Project

• Project IS / IS NOT Analysis

• Business Impact

• Outcome of Project

• Previous Related Work

• Project Plan

• Project Monitoring Plans

• Future Project Plans

• Next Step – Project Sign-up

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©2012 iNEMI

Review of

Statement of Work

iNEMI Project on PCBA Reliability Qualification

Processes for Enterprise Products

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Background/Context

• Reliability is a key customer and market concern in computing products in

enterprise, client and mobile spaces.

• In some cases, new technologies, materials and assembly processes may

be introduced and/or qualified in a manner that is inconsistent with typical

OEM requirements.

• Various industry standards and procedures exist today to assess

acceptability and test the quality and reliability of electronic soldered-

assemblies (PCBs and PCBAs).

• Due to this variety, any given CM/EM/OEM manufacturer’s product reliability

qualification methodology and results are not easily correlated with their

peers’ results and OEM expectation.

• A common qualification framework is desired.

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Scope of Work

• A qualification process document already exists at Dell which is being proposed as the starting point for the enterprise-product-wide applicable document.

• The team will review these documents for

– Applicability to the charter

– Qualification will be at the PCBA level: PCB materials are presumed qualified (starting point) but will include tests/evaluations that look at PCB risk sites for assembly; not qualifying at the un-soldered PCB-level resin/construction

– A single project for qualification of Enterprise products

– Flow, of qualification

– Qualification procedure and process

– Pass/Fail criteria, for individual tests, not for the qualification-suite as a whole

– Establish minimum recommendations/guidelines for sample quantities and related test conditions

– Enhancement, of relevant sections

– Omissions, sections/procedures that need appending

– Exceptions, to certain sections

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Scope of Work

• These reviews may be done in the context of members’ existing

qualification process framework.

• Agreement on the reviewed items and revisions thereof.

• Editing/rewriting sections with team’s agreed-upon modifications.

• Invite CM/EMS/ODM feedback – incorporate as needed.

• Approval by team.

• Release completed document.

• Decide on the visibility: current direction is for it to be public

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Purpose of Project

• The project serves to establish a common hardware

reliability qualification process for suppliers

manufacturing computing hardware (servers, storage

and switches) to be deployed in offices, datacenters, as

well as environmentally controlled telecom datacenters.

• This is projected to deliver a complete solution

addressing new product T/M/P Reliability Qualification

Process.

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Expected Benefits of Project

• Level the playing field for qualification requirements.

• Reduce ambiguity with qualification processes at

CMs/EMSs to satisfy customers’ qualification demands.

• Limit complexity of negotiating qualification

requirements.

• Reduce effort to have suppliers accept responsibility for

qualification work.

• Reduce cost for EMSs/CMs/ODMs or repeated full qual to

comply with variegated demands of similar goals.

• Allow for leveragability of previous qualification work for

ceteris paribus (all other things being equal) technology.

• Document will serve as suite baseline for existing CMs’

re-qualification efforts for new sites moves and transfers.

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IS / IS NOT Analysis

This Project IS: This Project IS NOT:

To define an OEM/industry-wide set of PCBA reliability qualification methods and processes

(toolbox) for:

• new suppliers

• new technologies

• new materials

• new processes

… as applies to ODM/CM PCBA manufacturers

- Primary focus will be on Enterprise products (including telecom data centers)

Not intended for

• High Rel:

• Outdoor-telecom

• Military/aerospace

• Medical

Reliability evaluations are done for designs and materials. Supplier qualifications are intended

to evaluate capability and quality. This document is meant to qualify new technologies for which

the process definition/development work is complete.

Early R&D for new technology/process or

materials’ viability

Is not process definition/development or material

evaluation

Review/identification of Best Known Methods/Best Known Practices in reliability of electronic

OEMs for “new” qualifications.

Developing new reliability test

standards/procedures/test methods

Testing/materials resources commitment

Utilizing existing industry standards/procedures wherever appropriate. Regulatory/environmental materials compliance

Decide on whether the output will culminate in a guideline (that may/may not evolve into a

standard, e.g., QS9000).

Re-creation of component qualification test

methods and processes

For reliability qualification of new solder assembly processes, technologies, materials at

manufacturing facilities of new and existing suppliers. Definition of test-level failure criteria.

Failure Analysis requirement/procedure

development

Definition of qualification-suite level failure criteria

– This is the domain of each OEM, and defined by

them

PCBA-level qualification, with evaluation of risk sites on PCB’s that depend on solder-assembly

process

Raw PCB material/construction evaluation

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Business Impact

• Resolving ambiguity with qualification processes at CMs/EMSs to

satisfy their various customers’ qualification demands.

• Have suppliers accept responsibility for qualification work.

• Reduce cost for EMSs/CMs/ODMs due to varied test

protocols/qualification process flows to comply with variances

between multiple customers’ qualification requirements for similar

hardware.

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Outcome of Project

• A one-stop-shop unified qualification process document for new

process/technology/materials reliability qualification

• Sharing Project Results: the expectation is that information will be shared

as a public domain document.

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Previous Related Work

• The project team will continue to identify any related research or

development within the industry and academic communities.

– Existing OEM/Industry documents for qualification processes

– Standard industry testing practices (ASTM, IPC, etc)

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Project Schedule & Tasks

• The Timetable for this project is 9-12 months

TASK LIST Q1 Q2 Q3 Q4 Q5

Task 1: Disseminate current document

Task 2: Review OEM documents

Task 3: Gap analyses

Task 4: Develop Flow, of qualification

Task 5: Develop agreement/modifications

Task 6: Editing/rewriting

Task 7: Approval by team

Task 8: Invite EM/CM/ODM feedback

Task 9: Release completed document

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Project Monitoring Plans

• Ensure open lines of communication among participants

• Project participants will meet a minimum bi-weekly to review various aspects of

the project and make plans for next phases of the project

• Meeting minutes provided through e-mail

• Follow-up with individuals on an as-needed basis

• Project team will identify specific monitoring or communications plans to

accommodate project team member locations, e.g., multiple project meetings to

cover multiple regions (EMEA, Asia, Americas)

• Workshops and face-to-face meetings as determined by the project team

• Progress reports will be provided upon request for presentation at regularly

scheduled iNEMI meetings (e.g. a short series of PowerPoint slides showing the

work in progress at member council meetings)

• Track and document approximate man-months per quarter per team member

(this will require the active members of the team to provide estimates)

• Track and document approximate number of people on the project per quarter

(this can be tracked through iNEMI's WebEx account)

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Summary and Next Steps

• Project has been approved by the iNEMI Technical Committee

• Open Enrollment for Project Sign-up will continue until November 16, 2012

• More information can be found at http://www.inemi.org/project-page/pcba-reliability-qualification-project

• Steps for Joining the Project

– Please note: iNEMI membership is required to participate in the iNEMI Project for

PCBA Reliability Qualification Processes. The period for becoming a founding

member of this project will close on November 16, 2012. Steps for joining the

project are outlined below.

• For iNEMI members:

– Complete and sign the project statement

– Fax the completed statement to +1 (703) 834-2735 or scan + email to [email protected]

• For non-members:

– Discuss annual membership fees with Bill Bader in North America

([email protected]), Haley Fu in Asia ([email protected]), or Grace O'Malley in

Europe ([email protected]).

– Complete the iNEMI membership application. (www.inemi.org)

– Fax the completed documents to +1 (703) 834-2735 or scan + email: [email protected].

– Complete and sign the Project Statement

– Fax the completed statement to +1 (703) 834-2735or scan + email to [email protected].

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Q&A

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©2012 iNEMI

www.inemi.org Email contacts:

Mark Schaffer

[email protected]