Key Findings of iNEMI MEMS Roadmap

Michael Gaitan, NIST Chair, iNEMI and ITRS MEMS Technology Working Groups

iNEMI MEMS Workshop

“Driving Next Level Results Through Collaboration”

May 10, 2012

MEMS Technology Roadmapping

• What is Technology Roadmapping?

• What are the conditions that should be met for successful Technology Roadmapping?

• How can we roadmap MEMS Technology?

• What are Technology Requirements Tables?

• What are Showstoppers?

• Conclusions

What is a Technology Roadmap?

• A technology roadmap is a plan that matches goals with specific technology solutions to meet those goals.*

• A consensus about a set of needs and the technologies required to satisfy those needs

• A mechanism to help experts forecast technology developments in targeted areas

• A framework to help plan and coordinate technology developments both within a company or an entire industry

*Garcia, M.L. and Bray, O.H. (1997), Fundamentals of Technology Roadmapping. Strategic Business Development Department. Sandia National Laboratories.

Three Phases to Roadmapping

1. Preliminary activities satisfy the necessary conditions, identify leadership/sponsorship, define the scope.

2. Develop the roadmap identify the product that will be the focus, develop the systems requirements, drivers, targets, timelines, showstoppers, alternatives, write the roadmap.

3. Follow-up critique and validate the roadmap, develop an implementation plan, review and update

What are Required Conditions?

1. (FOM) restricted set of figures of merit.

2. (ECO) existence of a community of players.

3. (SHR) willingness to share information.

4. (WAT) potential market of significant size indicating a wide applicability of the roadmap.

5. (LEP) convergence of opinion among a majority of the key players on the progress of trends.

“More than Moore” White Paper, http://www.itrs.net

Threat as Motivation to Cooperate?

1986: Prompted by several years of slipping U.S. semiconductor market share, the Semiconductor Industry Association (SIA) and the Semiconductor Research Corporation (SRC) hold a joint meeting and issue a call for cooperation to provide the U.S. semiconductor industry with the capability of regaining world-leadership in semiconductor manufacturing.

1986 Present

http://www.sematech.org Thomas Friedman, The World is Flat

“More than Moore” White Paper, http://www.itrs.net

But … How Can We Roadmap MEMS?

• MEMS are too diverse

• We don’t need/want any standards

• MEMS are one process, one device

• Every product/company has a “secret sauce”

• There is no common ground

• MEMS companies are fiercely competitive, how will they cooperate?

• What is the scope for the ITRS roadmap of More than Moore?

A Turning Point

• Spring 2010: MEMS Industry Group (MIG) METRIC Meeting.

– MIG adopts a focus to assess needs for MEMS device testing.

• Summer 2010: iNEMI establishes a MEMS Technology Working Group (TWG).

• Winter 2010: The iNEMI MEMS chapter is completed. ITRS starts a MEMS pilot TWG.

• Spring 2011: MIG holds a MEMS Testing workshop. ITRS establishes a formal MEMS TWG.

• Winter 2011: The ITRS MEMS chapter is completed.

Integration Path

We will forecast MEMS device performance

metrics and the associated requirements

for advances in the manufacturing

technologies required

•as discrete MEMS devices advance in

performance

•evolve towards multimode sensors (e.g.,

inertial with electronic compass),

•which will require advances in packaging

and integration technologies,

•towards the goal of a “smart phone on a

chip”

“Smart Phone on a Chip”

The Continuing Evolution of the Microprocessor towards Mobile

Consumer MEMS

Phones and Tablets

• Accelerometers

• Gyroscopes

• Electronic Compass

• Pressure Sensors

• Microphones

• Micro speakers

• Auto focus

• (Pico) Projectors

• RF MEMS

Automotive MEMS

Medical MEMS Lab On A Chip Technologies

MEMS Technology Working Group

Arthur Morris

Asif Chowdhury

Bill Bottoms

Brian Gerson

Brian Jamieson

Buzz Hardy

Chengkuo Lee

Chris Apanius

Chris van Hoof

Chuck Richardson

Dave Howard

Dimitrios Peroulis

Dominique Schinabeck

Don DeVoe

Edward Chiu

Fabio Pasolini

Fabrice Verjus

Fumihiko Nakazawa

Gilles Poupon

Goro Nakatani

Hebert Bennett

Henne van Heeren

Wispry

Analog Devices

3MTS, Packaging TWG

PMC-Sierra, RF/AMS TWG

SB Microsystems

MEMSCAP

National U of Singapore

Promeus

IMEC

iNEMI

Jazz Semiconductor

Perdue

Acutronic

University of MD

Asian Pacific Microsystems

ST

KFM Technology

Fujitsu, JEITA

LETI

Rohm, JEITA

NIST, RF/AMS TWG

enablingMNT

Hiroshi Yamada

Ingrid De Wolf

Jack Pekarik

Jae Sung Yoon

Jim Spall

Jim Mrvos

Jianmin Miao

John Rychcik

Josh Molho

Juergen Wolf

Karen Lightman

Kevin Chau

Koji Fukumoto

Marcie Weinstein

Mark Crockett

Michel Brillouet

Monica Takacs

Patric Salomon

Raffaella Borzi

Raj Gupta

Raji Baskaran

Toshiba

IMEC

IBM, RF/AMS TWG

KIMM

Delphi

Lexmark

NTU

Solidus

Caliper

Fraunhofer Institute

MEMS Industry Group

MEMStaff

Sony, JEITA

Akustica

SEMI, MEMSmart

LETI

MEMS Industry Group

4m2c

IMEC

Volant Technologies

Intel

Chair: Mike Gaitan (NIST), Chair Co-Chairs: Robert Tsai (TSMC) and Philippe Robert (LETI)

Rakesh Kumar

Robert De Nuccio

Ron Lawes

Sacha Revel

Scott Bryant

Shawn Blanton

Snezana Jenei

Stephane Donnay

Steve Breit

Steve Greathouse

Steve Tilden

Steve Walsh

Takashi Mihara

Tetsu Tanaka

Tony Stamper

Veljko Milanovic

Wei-Leun Fang

Wendy Chen

Xiaoming Wu

Yasutaka Nakashiba

Global Foundries

ST

Imperial College

Accutronic

MANCEF

Carnegie Mellon University

Infineon

IMEC

Coventor

Plexus

LTXCredence

MANCEF

Micromachine Center

Tohoku Univ., JEITA

IBM

Mirrorcle Technologies

NTHU

KYEC

Lexmark

Renesas Electronics, JEITA

MEMS Technology Working Group

Arthur Morris

Asif Chowdhury

Bill Bottoms

Brian Gerson

Brian Jamieson

Buzz Hardy

Chengkuo Lee

Chris Apanius

Chris van Hoof

Chuck Richardson

Dave Howard

Dimitrios Peroulis

Dominique Schinabeck

Don DeVoe

Edward Chiu

Fabio Pasolini

Fabrice Verjus

Fumihiko Nakazawa

Gilles Poupon

Goro Nakatani

Hebert Bennett

Henne van Heeren

Wispry

Analog Devices

3MTS, Packaging TWG

PMC-Sierra, RF/AMS TWG

SB Microsystems

MEMSCAP

National U of Singapore

Promeus

IMEC

iNEMI

Jazz Semiconductor

Perdue

Acutronic

University of MD

Asian Pacific Microsystems

ST

KFM Technology

Fujitsu, JEITA

LETI

Rohm, JEITA

NIST, RF/AMS TWG

enablingMNT

Hiroshi Yamada

Ingrid De Wolf

Jack Pekarik

Jae Sung Yoon

Jim Spall

Jim Mrvos

Jianmin Miao

John Rychcik

Josh Molho

Juergen Wolf

Karen Lightman

Kevin Chau

Koji Fukumoto

Marcie Weinstein

Mark Crockett

Michel Brillouet

Monica Takacs

Patric Salomon

Raffaella Borzi

Raj Gupta

Raji Baskaran

Toshiba

IMEC

IBM, RF/AMS TWG

KIMM

Delphi

Lexmark

NTU

Solidus

Caliper

Fraunhofer Institute

MEMS Industry Group

MEMStaff

Sony, JEITA

Akustica

SEMI, MEMSmart

LETI

MEMS Industry Group

4m2c

IMEC

Volant Technologies

Intel

Chair: Mike Gaitan (NIST), Chair Co-Chairs: Robert Tsai (TSMC) and Philippe Robert (LETI)

Rakesh Kumar

Robert De Nuccio

Ron Lawes

Sacha Revel

Scott Bryant

Shawn Blanton

Snezana Jenei

Stephane Donnay

Steve Breit

Steve Greathouse

Steve Tilden

Steve Walsh

Takashi Mihara

Tetsu Tanaka

Tony Stamper

Veljko Milanovic

Wei-Leun Fang

Wendy Chen

Xiaoming Wu

Yasutaka Nakashiba

Global Foundries

ST

Imperial College

Accutronic

MANCEF

Carnegie Mellon University

Infineon

IMEC

Coventor

Plexus

LTXCredence

MANCEF

Micromachine Center

Tohoku Univ., JEITA

IBM

Mirrorcle Technologies

NTHU

KYEC

Lexmark

Renesas Electronics, JEITA

Subgroup Leaders

•Inertial Sensors – Philippe Robert, LETI •Microphones – Jainmin Miao, NTU •RF MEMS – Robert Tsai, TSMC •Emerging MEMS – Chris van Hoof, IMEC •Design and Simulation – Steve Breit, Coventor •Packaging and Integration- Raji Baskaran, Intel •Testing – John Rychcik, Solidus

MEMS Technology Working Group

Arthur Morris

Asif Chowdhury

Bill Bottoms

Brian Gerson

Brian Jamieson

Buzz Hardy

Chengkuo Lee

Chris Apanius

Chris van Hoof

Chuck Richardson

Dave Howard

Dimitrios Peroulis

Dominique Schinabeck

Don DeVoe

Edward Chiu

Fabio Pasolini

Fabrice Verjus

Fumihiko Nakazawa

Gilles Poupon

Goro Nakatani

Hebert Bennett

Henne van Heeren

Wispry

Analog Devices

3MTS, Packaging TWG

PMC-Sierra, RF/AMS TWG

SB Microsystems

MEMSCAP

National U of Singapore

Promeus

IMEC

iNEMI

Jazz Semiconductor

Perdue

Acutronic

University of MD

Asian Pacific Microsystems

ST

KFM Technology

Fujitsu, JEITA

LETI

Rohm, JEITA

NIST, RF/AMS TWG

enablingMNT

Hiroshi Yamada

Ingrid De Wolf

Jack Pekarik

Jae Sung Yoon

Jim Spall

Jim Mrvos

Jianmin Miao

John Rychcik

Josh Molho

Juergen Wolf

Karen Lightman

Kevin Chau

Koji Fukumoto

Marcie Weinstein

Mark Crockett

Michel Brillouet

Monica Takacs

Patric Salomon

Raffaella Borzi

Raj Gupta

Raji Baskaran

Toshiba

IMEC

IBM, RF/AMS TWG

KIMM

Delphi

Lexmark

NTU

Solidus

Caliper

Fraunhofer Institute

MEMS Industry Group

MEMStaff

Sony, JEITA

Akustica

SEMI, MEMSmart

LETI

MEMS Industry Group

4m2c

IMEC

Volant Technologies

Intel

Chair: Mike Gaitan (NIST), Chair Co-Chairs: Robert Tsai (TSMC) and Philippe Robert (LETI)

Rakesh Kumar

Robert De Nuccio

Ron Lawes

Sacha Revel

Scott Bryant

Shawn Blanton

Snezana Jenei

Stephane Donnay

Steve Breit

Steve Greathouse

Steve Tilden

Steve Walsh

Takashi Mihara

Tetsu Tanaka

Tony Stamper

Veljko Milanovic

Wei-Leun Fang

Wendy Chen

Xiaoming Wu

Yasutaka Nakashiba

Global Foundries

ST

Imperial College

Accutronic

MANCEF

Carnegie Mellon University

Infineon

IMEC

Coventor

Plexus

LTXCredence

MANCEF

Micromachine Center

Tohoku Univ., JEITA

IBM

Mirrorcle Technologies

NTHU

KYEC

Lexmark

Renesas Electronics, JEITA

MEMS Industry Group

MEMS TWG

Subgroups: Devices, Design and Simulation, Packaging and

Integration, and Testing

Integration Path for Inertial Sensors

Year of Production 2011 2013 2015 2017

Integration path at the package level

6 DOF (accelero + magneto or accelero +

gyro)

9 DOF (3 axis accelero

+ gyro + magneto)

10 DOF (accelero +

gyro + magneto + pressure)

Integration path at the chip level

3-axis accelero and gyros

Integrated 6 DOF Product

Integrated 9 DOF Product

Integrated 10 DOF Product

DOF = Degrees of freedom. For example, a 10 DOF product is a 3-axis accelerometer, 3-axis gyroscope, 3-axis magnetometer, and a pressure sensor.

State of the Art: 10 DOF Board Level

June 16, 2011 Analog Devices ADIS16407 iSensor MEMS-based inertial measurement unit combines a tri-axis accelerometer, a tri-axis gyroscope, a tri-axis magnetometer, and a pressure sensor in a single unit.

May 18, 2011 STMicroelectronics’ Three MEMS Sensors Provide 10 DoF. The three ST MEMS sensors include a geo-magnetic module, a gyroscope, and a pressure sensor.

Analog Devices STMicroelectronics

Grand Challenges Difficult Challenges Potential Solutions

Integration of MEMS in the Package • Standardization for MEMS packaging to support integration.

• Packages are needed that reduce or eliminate mechanical stress and enhancing hermeticity.

• Package data that can be used to accurately predict the effect of the package on device performance.

Testing of MEMS • More testing towards the wafer level. • Validated tools to predict device device

performance from wafer tests. • Methodologies for “Design for Test” or

“Design for NO Test.”

Validated accelerated life testing for MEMS

• More knowledge of the physics of failure is required to develop accelerated life tests.

• Need to share information. Individual solutions exist but are not being generalized across the industry.

Design Fabrication (Foundry)

Assembly and

Packaging

Design for test

Wafer Level Testing

Device Testing

Testing in the Manufacturing Process

Systems Integrator

Conclusion

• The back-end (packaging and test) typically consumes 2/3 of the manufacturing cost for MEMS devices.

• Most R&D investment has been in the front end (device and process development).

• The issues at the back-end which may be useful in (re)focusing future R&D efforts.

Packaging and

Testing

Device Fabrication

MEMS Manufacturing Cost R&D Investment

Device and Process

Development

Packaging and Testing