ic fabrication
DESCRIPTION
ic fabricationTRANSCRIPT
-
Semiconductor device fabricationFrom Wikipedia, the free encyclopedia
This article needs additional citations for verification. Please help improve this article by adding citations to reliable sources. Unsourced material may be challenged and removed. (September 2008)Semiconductormanufacturingprocesses10 m 19716 m 19743 m 19771.5 m 19821 m 1985800 nm 1989600 nm 1994350 nm 1995250 nm 1997180 nm 1999130 nm 200190 nm 200465 nm 200645 nm 200832 nm 201022 nm 201214 nm 201410 nm 20167 nm 20185 nm 2020Half-nodesv t e
NASA's Glenn Research Center clean room.Semiconductor device fabrication is the process used to create the integrated circuits that are presentin everyday electrical and electronic devices. It is a multiple-step sequence of photo lithographic and chemical processing steps during which electronic circuits are gradually created on a wafer made of pure semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications.
The entire manufacturing process, from start to packaged chips ready for shipment, takes six to eight weeks and is performed in highly specialized facilities referred to as fabs.