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Ee503 Ic fabrication and packaging technologyCHAPTER 1

Course Learning OutcomesCLO 1 :Describe clearly the integrated circuit technology evolution and Micro- Electromechanical System (MEMS) concept. (C1)

What is Ics?A complete circuit that usually built on a semiconductor substrate having the same functions with the circuit on PCB in a very small package where the circuit may be a complex circuit consisting of a combination of several tens / hundreds / thousands to the millions of components.

PCB Printed Circuit BoardDis 2013

PCB boardA Die inside an ICMain functions of ICs - Missilesystem,- MilitaryAreas- TV /Radio /Video,-Computer - WorkStation- Server- EquipmentToyschildren-Mobile Phone- TelecommunicationsSystem-RoboticSystem-DigitalClock-Field ofAerospace- MedicalField

AnOsborne Executiveportable computer, from 1982 with aZilog Z804MHz CPU, and a 2007AppleiPhonewith a 412MHzARM11CPU. The Executive weighs 100 times as much, is nearly 500 times as large by volume, costs approximately 10 times as much (inflation adjusted), and has 1/100th theclock frequencyof the phone.DISCRETE COMPONENT vs IC

An elementary (basic) electronic device constructed as a single unit. Before the advent (start) of integrated circuits (chips), all transistors, resistors, capacitors and diodes were discrete (Individually separate). Discrete components are widely used in amplifiers and other electronic products that use large amounts of current. On a circuit board, they are intermingled (bercampur) with the chips, and there is hardly any electronic product that does not have at least one or two discrete resistors or capacitors

The advantages of ics over discreet componentsVery small sizeVery low weightFast operatingLow costLow power consumptionHigh reliabilityRepair work easierEasy replacement

Dis 2013

Giga Large Scale (GSI) 2000 above more than 10 millionDis 2013Moores lawMoore's lawis the observation that over thehistory of computing hardware, the number oftransistorsonintegrated circuitsdoubles approximately every two years.

The law is named after Intel co-founderGordon E. Moore, who described the trend in his 1965 paper.The paper noted that the number of components in integrated circuits had doubled every year from the invention of the integrated circuit in 1958 until 1965 and predicted that the trend would continue "for at least ten years".

microprocessor

IC fabrication methodsMONOLITHICFILMHYBRID

Ic fabrication methodsMONOLITHICAll components (active and passive) is produced on a silicon chip (wafer).The most popular use - low costhigh reliabilityWeaknessThe weakness of isolationLimited range of passive componentsCircuit design is not flexibleActive component: produce new signal from input signal ( transistor, diod)Passive component: can be used to send signal from one part to another part. ( resistor, capacitor, inductor)FILMFormed on a chip components such as ceramic or glass insulatorsOnly passive componentsWider range of componentsLess problem of isolationActive components can be added externally, - more flexible designWeaknessHigher costNot suitable for active components

Active component: produce new signal from input signal ( transistor, diod)Passive component: can be used to send signal from one part to another part. ( resistor, capacitor, inductor)HYBRIDCombination of two or more chipsCombination of film and monolithic fabrication methodActive component formed by monolithic methodPassive components formed by film methodThe most flexible designOften used as a prototype of a monolithic integrated circuitWeaknessThe cost is too highLess reliability

Active component: produce new signal from input signal ( transistor, diod)Passive component: can be used to send signal from one part to another part. ( resistor, capacitor, inductor)

Dis 2013Comparative characteristics of the fabrication technologies of Integrated Circuits

Active component: produce new signal from input signal ( transistor, diod)Passive component: can be used to send signal from one part to another part. ( resistor, capacitor, inductor)Transistor typestransistorBJTFETNPNPNPJFETMOSFETTTLIILPMOSNMOSCMOSBiCMOSBASIC COMPONENTS MOS ( METAL OXIDE SEMICONDUCTOR )The Types Of MOS Transistor

PMOSNMOS

advantages:

The cost of cheap manufacture. simple fabrication methods.

weaknesses:

Operation of the circuit delay Movement of hole current 2x slower than the electrons.

advantages:

smaller size compared to pMOS. fast operating speed compared to pMOS

weaknesses:

difficult to make

advantages: low power dissipation. High Reliability. better performance.

weaknesses:

The size are larger of the pMOS and nMOS. involve more steps during the fabrication process. more silicon area required to build p-wells. The false switching or "latching" if not carefully designed due to parasitic bipolar effects and structure of four layers NPNP.BASIC COMPONENTS BIPOLAR TRANSISTORTTL( Transistor-transistor Logic )

NPN PNP

advantages: high switching speed. Input provide more functionality.

weaknesses:

Requires a wide area during the fabrication of silicon.

BiCMOS (bipolar + CMOS)

advantages:

high operating speed. low power dissipation weaknesses:

The size of chip large a complex fabrication process. The cost of making expensiveICs classification :ICs can be classify based on their types of application:

Analog circuitdigitalcircuitmixed signal circuit(both analog and digital on the same chip).Analog ICs, such as sensors,power management circuits, andoperational amplifiers, work by processing continuous signals. They perform functions likeamplification,active filtering,demodulation, andmixing. Analog ICs ease the burden on circuit designers by having expertly designed analog circuits available instead of designing a difficult analog circuit from scratch.Analog ICsDigital ICsDigital ICs can contain anything from one to millions oflogic gates,flip-flops,multiplexers, and other circuits in a few square millimeters. The small size of these circuits allows high speed, low power dissipation, and reducedmanufacturing costcompared with board-level integration. These digital ICs, typicallymicroprocessors,DSPs, memory and micro controllers, work using binary mathematics to process "one" and "zero" signals.Mixed Signal ICsICs can also combine analog and digital circuits on a single chip to create functions such asA/D convertersandD/A converters. Such circuits offer smaller size and lower cost, but must carefully account for signal interference.