ibl slides g. darbo – infn / genova csn1, 22 november 2010 o ibl spare slides commissione i – 22...

IBL SlidesG. Darbo – INFN / Genova CSN1, 22 November 2010o

IBL Spare Slides

Commissione I – 22 Nov 2010

G. Darbo - INFN / Genova

IBL SlidesG. Darbo – INFN / Genova CSN1, 22 November 20102

Material from Raphael/NealThe Insertable B-Layer (IBL) is a fourth layer added to the present Pixel detector between a new beam pipe and the current inner Pixel layer (B-layer).

ISTIBL Support Tube

Alignment wires

PP1 Collar

IBL Detector

IBL Staves

Sealing service ring

IBL key Specs / Params

• 14 staves, <R> = 33.25 mm• CO2 cooling, T < -15ºC @ 0.2 W/cm2

• X/X0 < 1.5 % (B-layer is 2.7 %)• 50 µm x 250 µm pixels• 1.8º overlap in ϕ, <2% gaps in Z • 32/16 single/double FE-I4 modules

per stave• Radiation tolerance 5x1015 neq/cm2


History of IBL Project - Time Line

1998: Pixel TDR • B-layer designed to be substituted every 3 years of nominal LHC (300 fb-1): due

to then available radiation hard sensor and electronic technologies.

2002: B-layer replacement • became part of ATLAS planning and was put into the M&O budget to RRB.

2008: B-layer taskforce• B-layer replacement cannot be done – Engineering changes to fulfil delayed on-

detector electronics (FE-I3, MCC) made it impossible even in a long shut down. • Best (only viable) solution: “make a new smaller radius B-layer insertion using

technology being developed for HL-LHC prototypes”. This became the IBL.

2009: ATLAS started IBL project:• February: endorsed IBL PL and TC• April: IBL organization in place (Endorsed by the ATLAS EB)

2010: TDR and interim-MoU• TDR is under approval in ATLAS• Interim-MoU is collecting last signatures.


WGs, Pixel Liaison & Tasks

Module WG(WG1)

• M. Garcia-Sciveres• F. Hügging

Stave WG(WG2)

• E. Vigeolas• O. Rohne

Integration & Installation WG

(WG3)• F. Cadoux• R. Vuillermet

Off-detector(WG4)

• T. Flick• S. Débieux

IBL Management Board (MB)Membership:• IBL PL + IBL TC• Coordinators of WG• Pixel / IBL Liaison• Ex-officio

PIXEL / IBL “LIAISON”Common Pixel / IBL Membership:• Offline Software: A. Andreazza (untill 9/2010)• DAQ: P. Morettini• DCS: S. Kersten

WG

Description

Responsible

TASK

Module


Management Board (MB)

Module WG(2 cordinators)

• FE-I4• Sensors• Bump-Bonding• Modules• Procurement & QC• Irradiation & Test

Beam

Stave WG(1 Phys + 1

Eng.)

• Staves• Cooling Design &

Stave TM• HDI (Flex Hybrid)• Internal services• Loaded stave• Procurement & QC

Integration & Installation WG

(2 Eng.)• Stave Integration• Global Supports• BP procurement• Ext. services inst.• BP extraction• IBL+BP Installation• Cooling Plant

Off-detector(1 Phys + 1 E.Eng.)

• BOC/ROD• Power chain & PP2• DCS & interlocks• Opto-link• Ext. serv .design/proc.• Procurement & QC• System Test

IBL Management Board (MB)Membership:• IBL PL + IBL TC• 2 cordinators from each WG• Plus “extra” members

MB ad-interim membership

IBL Project Leader: G. DarboIBL Technical Coordinator: H. Pernegger“Module” WG: F. Hügging & M. Garcia-Sciveres“Stave” WG: O. Rohne + E. Vigeolas“Integration & Installation” WG: F. Cadoux + R. Vuillermet“Off-detector” WG: T. Flick + S. Débieux“Extra” members:IBL/Pixel “liaison”: Off-line SW: A. Andreazza, DAQ: P. Morettini, DCS: S. KerstenEx officio: Upgrade Coordinator (N. Hessey), PO Chair (M. Nessi), Pixel PL (B. Di Girolamo), ID PL (P. Wells), IB Chair (C. Gößling)


Interim-MoU - Institutions43 institutions in the IBL project

• Large interest for the sensor (22 Institutions)

300 people have expressed their interest to contribute to the project

• The list of names is in Ch.11 of IBL TDR


Money Matrix (A.4)Unknown covers the previously assigned contribution to UK. UK cannot commit until sensor decision,

The Annex 4 has been changed in the technology option with the addition of is Munich MPI (D-MPG) – 12 kCH for the IZM order.


Institutes and Contributions to IBL

Note: the numbers in the table "are not final, nor are the suggested financial contributions yet firm, but are meant for a common overall discussion.”

Technology options refer to supplementary costs that are sensor technology specific and will be known before the definite MoU takes effect.

42 Institutes in the interim-MoU (few others are “observers” ).14 Countries + CERN

9.7 MCH total project cost


Money Matrix (A.4 ext)


Annex 5: IBL Payment ProfileFunding profile follows schedule for “ready to installation by end of 2014”

• 2010 Expenditures: in large fraction for prototyping of FE-I4, sensors, modules, staves…

• Two common contracts and several prototype costs already done in the framework of the interim-MoU.


Institutes (A.3)


IBL TDR – Endorsed by CB, LHCC

IBL TDR endorsed by ATLAS Collaboration Board (8/10/2010):• CERN-LHCC-2010-13, ATLAS TDR 19• In printing 200 copies• Editorial team:M. Capeans (technical editor), G. Darbo, K. Einsweiller, M. Elsing, T. Flick,M. Garcia-Sciveres, C. Gemme,H. Pernegger, O. Rohne and R. Vuillermet.

IBL TDR presented to LHCC 21/9/2010:http://indico.cern.ch/conferenceDisplay.py?confId=107477

• The project has received very positive comments and TDR was considered a solid documents.

• We expect some feedback from the reviewers (hope towards a formal approval) by end of the year/beginning of next year

http://indico.cern.ch/conferenceDisplay.py?confId=107477


IBL TDR in ATLAS e-News

http://atlas-service-enews.web.cern.ch/atlas-service-enews/2010/news_10/news_Insertable%20B-layer.php





Physics Performance

Sound TDR section on Physics and Performance:• Pixel / IBL software Group – Coordinated by Attilio• Boosted in the last 3 months by the P & P TF – Chaired by Markus• Need to channel again the efforts in the Pixel / IBL Offline Software!

2 jets of 500 GeV event with 2 x 1034 pile-up

Same event w/o pile-up

IBL


Physics Performance

b-tagging performance crucial for:• New Physics (3rd generation !)• observation of H → bb through boosted WH production

Main conclusions of IBL performance Task Force: • performance at 2x1034 with IBL is equal to or better

than present ATLAS without pile-up• w/o IBL and 10% B-layer inefficiency: b-tagging ~ 3

times worse at 2x1034 than today

b-tagging with pile-up & inefficiencies

b-tagging with pile-up 2 jets of 500 GeV event with 2 x 1034 pile-up Same event w/o pile-up

IBL

IBL

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Perf

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ance

Ta

sk F

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The New Front-end Chip (FE-I4)

Reason for a new front-end chip• Increased radiation hard (> 250

Mrad)• New architecture to reduce

inefficiencies (L=2x1034): faster shaping; not move hits from pixel until LVL1 trigger.

• Smaller pixel size 50 x 250 µm2 (achieved by 0.13 µm CMOS with 8 metals)

• Larger fraction of footprint devoted to pixel array (~90%) – little space for IBL envelope.

FE-I4 submitted on July 1st

• More than 2 years of engineering work for a team of >15 Engineers/physicist

• Largest HEP chip ever! 20.2x19.0 mm2, 87 million transistors!

• 60 Known Good Dies (KGD) / 8” wafer.• 16 wafer engineering run – 3 received and

under test.

Money contributions collected following interim-MoU share.

• Engineering run cost > 500kCH

18

160

FE-I3(Pixel) FE-I4

(IBL)

80 columns

336 rows

19

mm

20.2 mm60 KGD / Wafer


FE-I4 Wafer Received!FE-I4 Production

3 wafers received 27/97 more expected early december6 more held back

One wafer partially diced6 chips put on boards All works!

One wafer under probed41/60 are good!

FE-I4 8” wafer - 60 KGD / Wafer

FE-I4 die~2x2 cm2

ibl slides g. darbo – infn / genova csn1, 22 november 2010 o ibl spare slides commissione i – 22...

Documents

insertable blayer ibl

darbo infn genova csn1

oibl slidesg

present pixel detector

new beam pipe

mmco2 cooling

summary of status