high pressure open - ilshinautoclave

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It has application of touch panel and film, semiconductor industry to remove voids. HIGH PRESSURE OVEN Removal of Void (Film, Carbon/Epoxy) Laminated Films (Anisotropic Conductive Film, Flip Chip) Cure Pressure / MPa Void content / % Tensile strength / MPa Void content / % 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 1450 1400 1350 1300 1250 1200 1150 1100 1050 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0.0 0.1 0.2 0.3 0.4 0.5 0.6 Experimental data Fitting curve Experimental data Fitting curve Vv = 3.33exp(-2.57P) S=1443exp(-0.074r)) Pathway of gas or water vapor Void Heat & Pressure Composite Lay-up Autoclave Vessel After Before Flex Cu Die Conducing Particles Au ACF Ni Ai Autoclave Process Adhesive layer sintering & Pressing PET Film Ferrite Adhesive layer Separator PET Film Ferrite Adhesive layer Separator Solderball Top and Bottom Die Die Attach Film/Paste Air Bubbles (기포) Dieelectric Before After Mold Cap FR-5 Substrate Silicon IC Epoxy Undrfill Air Bubbles Ref. J. Mater. Sci. Technol., 27(1), (2011) 69-73 Ref. Mater. Sci. Eng. B., 98, (2003) 255-264 Solder Ball (63Sn/37Pb) Clutch Door Circulation fan & Motor Touch Screen Chamber Temperature 200 degree C, 80 degree C Pressure 20 kg/㎠ 255, Techno 2-ro, Yuseong-gu, Daejeon, Korea (Daedeok techno valley) Tel: +82-42-931-6100 Fax: +82-42-935-6103 Homepage: www.suflux.com E-mail: [email protected]

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Page 1: High Pressure open - ilshinautoclave

It has application of touch panel and film, semiconductor industry to remove voids.

HIGH PRESSURE OVEN

Removal of Void (Film, Carbon/Epoxy) Laminated Films (Anisotropic Conductive Film, Flip Chip)

Cure Pressure / MPa Void content / %

Tens

ile s

tren

gth

/ MPa

Void

con

tent

/ %

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0

1450

1400

1350

1300

1250

1200

1150

1100

10500 0.5 1.0 1.5 2.0 2.5 3.0 3.50.0 0.1 0.2 0.3 0.4 0.5 0.6

Experimental dataFitting curve

Experimental dataFitting curve

Vv = 3.33exp(-2.57P) S=1443exp(-0.074r))

Pathway of gas or water vapor

Void

Heat & Pressure

Composite Lay-up

Autoclave Vessel

AfterBefore

Flex

Cu

Die ConducingParticles

Au

ACFNi

Ai

Autoclave Process

Adhesive layersintering & Pressing

PET Film

Ferrite

Adhesive layer

Separator

PET Film

Ferrite

Adhesive layer

Separator

Solderball

Top and Bottom Die Die Attach Film/Paste

Air Bubbles (기포)

Dieelectric

Before After

Mold Cap

FR-5 Substrate

Silicon ICEpoxy Undrfill

Air Bubbles

Ref. J. Mater. Sci. Technol., 27(1), (2011) 69-73 Ref. Mater. Sci. Eng. B., 98, (2003) 255-264

Solder Ball (63Sn/37Pb)

Clutch Door Circulation fan & Motor

Touch ScreenChamber

Temperature

200 degree C,80 degree C

Pressure

20 kg/㎠

255, Techno 2-ro, Yuseong-gu, Daejeon, Korea (Daedeok techno valley) Tel: +82-42-931-6100 Fax: +82-42-935-6103 Homepage: www.suflux.com E-mail: [email protected]