Download - High Pressure open - ilshinautoclave
It has application of touch panel and film, semiconductor industry to remove voids.
HIGH PRESSURE OVEN
Removal of Void (Film, Carbon/Epoxy) Laminated Films (Anisotropic Conductive Film, Flip Chip)
Cure Pressure / MPa Void content / %
Tens
ile s
tren
gth
/ MPa
Void
con
tent
/ %
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
1450
1400
1350
1300
1250
1200
1150
1100
10500 0.5 1.0 1.5 2.0 2.5 3.0 3.50.0 0.1 0.2 0.3 0.4 0.5 0.6
Experimental dataFitting curve
Experimental dataFitting curve
Vv = 3.33exp(-2.57P) S=1443exp(-0.074r))
Pathway of gas or water vapor
Void
Heat & Pressure
Composite Lay-up
Autoclave Vessel
AfterBefore
Flex
Cu
Die ConducingParticles
Au
ACFNi
Ai
Autoclave Process
Adhesive layersintering & Pressing
PET Film
Ferrite
Adhesive layer
Separator
PET Film
Ferrite
Adhesive layer
Separator
Solderball
Top and Bottom Die Die Attach Film/Paste
Air Bubbles (기포)
Dieelectric
Before After
Mold Cap
FR-5 Substrate
Silicon ICEpoxy Undrfill
Air Bubbles
Ref. J. Mater. Sci. Technol., 27(1), (2011) 69-73 Ref. Mater. Sci. Eng. B., 98, (2003) 255-264
Solder Ball (63Sn/37Pb)
Clutch Door Circulation fan & Motor
Touch ScreenChamber
Temperature
200 degree C,80 degree C
Pressure
20 kg/㎠
255, Techno 2-ro, Yuseong-gu, Daejeon, Korea (Daedeok techno valley) Tel: +82-42-931-6100 Fax: +82-42-935-6103 Homepage: www.suflux.com E-mail: [email protected]
