Hall 18 E01

Connected Automation Experience Tour

Map of the Connected Automation Experience Tour

North 1 09

5 C37

3 C07

8A A48

6 E02

8A B41

6 A30/C58

6 D40

5 J38

15 B25

4 A21

3 B07

18 E01

18 E01

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Bosch Rexroth Hall 18 Booth E01, Start of TourWestRock Hall 18 Booth E01M2M-Project "ChoConnect" Hall 18 Booth E01ROVEMAHall 15 Booth B25SchubertHall 14 Booth A06CamaHall 13 Booth C31Ronchi MarioHall 8A Booth A48Bosch Packaging TechnologyHall 6 Booth A30MF PackagingHall 8A Booth B41Bosch Packaging TechnologyHall 6 Booth C58ILLIGHall 6 Booth E02ro-ber IndustrieroboterHall 6 Booth D40VC999Hall 5 Booth C37Winkler und Dünnebier SüßwarenmaschinenHall 3 Booth C07IPI International Packaging InstituteNorth Entrance 1 Booth 09

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13 C31

14 A06

15 A41

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With our Connected Automationportfolio we enable various machine manufacturers to build machines that are connected, cabinet-free, adaptive, simple and efficient in order to meet the market requirements. Read more about the successfull implementation of current pack-aging trends in this brochure or see the application highlights live on the fair by taking part in our Connected Automation Experience Tour. Get ready for the future now and start your personal Experience Tour at the booth of Bosch Rexroth!

Connected Automation in Packaging

See you at hall 18 booth E01

ERP

MES

Smart Sensor Technologies

ERP/MES Connection

Connectivity Upgrade

Cloud Connection

Connected

Adaptive

Smart Sensor Technologies

Intelligent Motion Control

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Connected Automation in Packaging

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WebComposerERP

MES

Open Standards

MODEL BASED ENGINEERING

Cabinet-free

Cabinet-free Drive Technology

Open Standards

Data Analysis

Web Technologies in Automation

ERP/MES Connection

EfficientSimple

InteractiveCommunication

Machine Chain Model-based Engineering

Digital Engineering

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New packaging line in record time

John Perkins, Vice President Global Systems

„The partnership we have with Bosch and Dassault around simulating our machine designs where we can shorten the development cycle is really letting us respond in a faster way to our customers for these opportunities representing themselves.“

ChallengeShorter development time for a quicker implementation of customized packaging lines.

See model-based engineering live on the fair: hall 18 booth E01

SolutionReduced development time and production costs thanks to a consistently digital engineering that connects the virtual simula-tion with the real machine world with Open Core Engineering.

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The sweet side of M2M communication

ChallengeIncreasing complexity of com-plete chocolate production lines requires more transparency of the process of each machine and the complete production line.

SolutionThanks to the M2M communica-tion by using OPC UA, processes are made more flexible and the overall equipment efficiency increases significantly.

Bernd Plies, WDS, Manager Electrical and Automation Engineering

„The most important factors for the success of the project were the good technical support and the high degree of expertise in the areas of open interfaces and OPC UA by Bosch Rexroth.“

See it live on the fair at all the project partners and at VDMA

The Project ChoConnect demonstrates the easy line integration of machines from different vendors, by using the open commu-nication standard OPC UA.

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ChallengeDefine a servo drive concept for a compact and extremely flexible SBS brick pack machine, a combi- nation of a Form Fill Seal machine with downstream systems for bag and bag closure designs, without

Low-dust packaging of flour and powdery products

Siegfried Wacker, Head of Product Development

„With the use of the Bosch Rexroth components we have been able to further improve our machine’s hygienic design and to reduce our control cabinet’s footprint without compromising on the machine’s flexibility in bag designs.“

See the SBS brick pack machine live on the fair: hall 15 booth B25

limiting the modular extensions possible in bag top designs and applications.

SolutionSBS brick pack machine with the new generation of servo motors MS2N with practical single-cable connection in combination with compact servo drives IndraDrive Cs enables a compacter machine design and reduces the cabling efforts.

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ChallengeEnable FMCG companies to benefit from maximum efficiency and availability in their final packaging line.

Cabinet-free packaging machine – milestone in packaging technology

Ralf Schubert, Managing Director

„With the cabinet-free drive technology provided by Rexroth, we significantly expand the capabilities of our packaging machines.“

SolutionThe decisive advantage of the TLM machine without an elec- trical cabinet is the reduction of electrical components and the resulting simplification of the machine. By eliminating the electrical cabinet, the number of cables and the installation work are significantly decreased.

See the cabinet-free milestone live on the fair: hall 14 booth A06

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Flexible product grouping with Triaflex Robots

Annalisa Bellante, Marketing Manager

„The Bosch Rexroth automation platform enables Cama to manage complex machine configurations. This way we can fulfill the sophisticated requirements of the packaging industry.“

SolutionA perfectly synchronized compact packaging line that allows flexible format changes by simply ad- justing system paramters inside the IndraMotion MLC with its integrated robotic functions.By installing the IoT Gateway Cama uses smart applications in the industrial Internet of Things.

See the packaging line live on the fair: hall 13 booth C31

ChallengeQuick and easy changes in product sizes, packaging volumes and product arrangement while maintaining a high machine performance.

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ChallengeSimplifying the machine design while offering the highest accu-racy for filling and capping processes.

Performance and reliability for home, beauty and health care

Fabio Rognoni, Head of Automation Engineering

„We can count on the colla-boration with Bosch Rexroth. For our EXACTA/R 12/6 they provided various strategic components to allow greater productivity and reliability.“

SolutionInnovative machine design with increased productivity and reli- ability of the new line – thanks to cabinet-free drive technology and the IndraMotion platform stability. Connection via IoT Gateway provides data transparency and connectivity in future Industry 4.0 environments.

See the latest trends in filling and capping technology: hall 8A booth A48

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ChallengeProviding to the customer all relevant production data to plan the use and lifecycle of his Die Heads.

Die Heads i4.0 Condition Monitoring

Jan Michaelis, Vice President Product Group

„With our IoT product, developed together with Bosch Rexroth, we can now offer an exciting solution by combining well estab-lished sensor technology with latest software monitoring features that solves our clients’ challenges in Die Head Management.“

SolutionThe solution allows to monitor the production on Die Heads on machine and plant level and evaluates the optimal mainte-nance.

See Die Head Management live on the fair: hall 6 booth A30

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ChallengeIncreasing production capacity and saving space by integrating all components of the automation platform in the easiest configu- ration possible.

Performance and innovation with two reels and one worker

Andrea Coccia, Sales & Marketing Manager

„Innovation is our priority and Rexroth is our partner to achieve this.“

SolutionIn cooperation with Rexroth, M.F. developed a high performance, innovative vertical packaging machine. Compared to the same model with a single reel it has twice as much capacity and is upgraded with regard to its connectivity thanks to the IoT Gateway.

See the vertical packaging machine live on the fair: hall 8A booth B41

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ChallengeFast moving, reliably working mandrel wheel packaging and filling machine, with diverse optional machine functions. Further aim is to reduce the commissioning duration.

Promisingly connected and future proof

Joachim Dittrich, Management Product Group

„We have set up the PME machine with latest control and drive equipment from Bosch Rexroth, and it is promising a clear competition advantage.“

SolutionFuture proof automation concept with MLC motion control. Can be used as platform for connection to the Bosch IoT Cloud, and the related services. Reduction of cabling efforts by usage of cabinet-free drive system IndraDrive Mi, including certified safety technology.

See the latest trends in mandrel wheel packaging live: hall 6 booth C58

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ChallengeAutomation of high productive thermoforming machines, with use of latest Rexroth Motion and Servo technology for robust operation and future oriented production capabilities.

Thermoformed containers at highest rates with In-Mould Labeling (IML-T)

Markus Peter, Head of Development Automation

„With Rexroth we have a strong partner to develop the most valuable Thermoforming machine in the market.“

SolutionLeading edge Motion Control with IndraMotion MLC, controlling the machine via robust and high performance servo drives series IndraDrive. Leading technology for highest quality and productivity.

See the Thermoforming machine live on the fair: hall 6 booth E02

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ChallengeBuild up a new high-performance gantry robot that achieves shortest cycle times and enables large working areas by reducing foot-print of the machine at the same time.

Wider area for the robot

Claus Middelhoff, Management

„Free space on the shop-floor of our customers is limited. The cabinet-free drive technology allows us to realize an area gantry robot with the smallest footprint ever.“

SolutionThe new area gantry robot Genix FP-150 with IndraDrive Mi is a 100% cabinet-free drive solution. This enables an enor-mous reduction of the footprint of the machine. The consistent modular structure enables easy extension of the portal.

See the new area gantry robot live on the fair: hall 6 booth D40

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„We´re very excited about the performance increase due to the use of the powerful IPC Hardware platform. This opens up completely new possibili-ties to us and gives us room for further extensions. Further-more the smooth transfer of existing projects to the new hardware platform saves us time and allows us to realize scalable projects.“

ChallengeFunctional extensions of the High Speed Slicing Machine SL600 requires higher performance of existing Motion-Logic controller.

Sometimes we need a little bit more

Manfred Achenbach, Vice President Sales

SolutionA significant performance improvement could be reached by the use of the system IndraMotion MLC running on a robust and powerful IPC plat-form. Existing projects running on embedded controller can be used seamlessly.

See the High Speed Slicing Machine SL600 live on the fair: hall 5 booth C37

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ChallengeRealize a future proof concept for chocolate plants that enables maximum flexibility in minimum space.

Modularity to melt away

Bernd Plies, Manager Electrical and Automation Engineering

„The Mi concept, with all additionally available products, made the consequent modular design possible and represents the basis for the WDS machine of the future.“

SolutionThe cabinet-free drive technology IndraDrive Mi enables to build up complete modular moulding plants beginning from the small-est plants for growing businesses and artisans to the high perfor-mance moulding plants. The concepts allows to adapt the plants to the future requirements of the market at any time.

See the future of chocolate production live on the fair: hall 3 booth C07

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ChallengeYou're looking for a business partner to help tackle your packaging issues? You need to be on top of the latest developments in packaging? You're seeking dialogue with packaging? 

New network and knowledge platform for the packaging industry

SolutionJoin CleverPack – THE packaging industry's leading network and knowledge platform! Identify new business partners, find the expertise you need, get your packaging questions answered.

See CleverPack live on the fair: North Entrance 1 booth 09

Steffen Poppitz, Managing Director

„IPI International Packaging Institute as Competence Center of Packaging relies on Bosch Rexroth as partner for our expert seminars and the CleverPack platform.“

Connected Automation Experience Tour

© 2017 Bosch Rexroth AG – Subject to revisions

Hall 18 E01

www.boschrexroth.com/packaging