geosat program communication payload · 2014-06-30 · 2.1.3 the nominal input power in fixed gain...

Date: 11-Jun-14 Space Applications Centre (ISRO)

RFP part A for fabrication testing and optimization of Ku-Band ALC Channel Amplifier

GEOSAT Program

Communication Payload

Request for Proposal

For fabrication, testing and delivery of

Ku-Band ALC Channel Amplifier RFP No.: SAC-SNPA-GEOSAT-CAMP-05-2014 (PART-A)

May-2014

Government of India

Indian Space Research Organisation Space Applications Centre

Ahmedabad-380015 INDIA

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RFP for fabrication testing and optimization of Ku-Band ALC Channel Amplifier

DOCUMENT CONTROL AND DATA SHEET

Title : Request for proposal for fabrication, testing and delivery of HI –REL MMIC based Ku band ALC CAMP Document No. : SAC-SNPA-GEOSAT-CAMP-05-2014 (PART-A) Date : May 2014

Type of report : Technical No. of Pages : 51 Prepared by : CAMP TEAM, AD/RSFG/SNPA Reviewed by : SNPA- Technical Evaluation Committee Originating Unit : AD/RFSG/SNPA/SAC

Distribution : Within ISRO and concerned industry only

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INDEX

Section Description Page No.

1. INTRODUCTION 4

1.1 GENERAL OVERVIEW 5

2. TECHNICAL SPECIFICATION 7

2.1 ELECTRICAL SPECIFICATIONS 8

3. SCOPE OF WORK 12

4. RESPONSIBILITIES OF SAC AND VENDOR 16

5. QUALITY, DELIVERABLES & OTHER REQUIREMENTS

5.1 QUANTITY REQUIREMENTS 17

5.2 DELIVERABLE DOCUMENTS 17

5.3 WARRANTY AND BANK GUARANTEE/INDEMENITY BOND 18

5.4 TERMS AND CONDITIONS 19

6. TYPICAL SEQUENCE OF EVENTS & GUIDELINES TO VENDORS

FOR SUBMITTING THE OFFER

20

PART-1: TECHNICAL PROPOSAL 22

PART-2: COMMERCIAL OFFER 22

7. TYPICAL FORMAT OF NON-DISCLOSURE UNDERTAKING 24

8. R & QA REQUIREMENTS 25

LIST OF FIGURES

Figure 1.1 Block Schematic of MMIC Ku ALC CAMP 5

Figure 1.2 Assembly drawing of MMIC Ku ALC CAMP 6

Figure 2.1 Timing diagram for Tele command data 10

Figure 2.2 ALC ON-OFF Command and TM Interface circuits 11

Table 2.1

LIST OF TABLES

Ku Band Channel Amplifier Electrical Performance Specifications

7

Table 2.2 Camp Commands 9

Table 2.3 Camp Telemetry 10

Table 4.1 Work flow sequence with responsibilities 17

Table 5.1 Delivery Schedule of Units 18

Table 6.1 Checklist table to be filled by vendor along with Proposal

24

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LIST OF ABBREVATION

SR NO NAME DESEREPTION 1. CAMP Channel Amplifier 2. ALC Automatic Level Control 3. FGM Fixed Gain Mode 4. MMIC Monolithic Microwave integrated circuits 5. PFT Print Fire & Trim 6. PCB Printed Circuits Board 7. FM Flight Model 8. QM Qualification Model 9. TM Telemetry 10. TC Tele command 11. CMOS Complementary Metal Oxide Semiconductor 12. GCA Gain Control Attenuator 13. OPCA Output Power Control Attenuator 14. SMD Surface Mount Device 15. MIC Microwave Integrated Circuits 16. CP Carrier Plate 17. RTV Room Temperature Vulcanize

18. TBD To be decided 19. EMI Electro Magnetic Interference 20. EMC Electro Magnetic Compatibility 21. NDA Non Disclosure Agreement 22. VVA Voltage Variable Attenuator 23. EQUA Equalizer 24. DET Detector 25. IMP Inter Mode Product 26. ESD Electric Static Discharge 27. FIM Free Issue Material 28. BOM Bill of material 29. RFP Request for proposal

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1. Introduction Space Applications Centre is a unit of ISRO involved in design and development of various communication, navigation and remote sensing payloads of the GSAT, IRNSS & IRS series of satellites for the Indian space program. As new projects are being continuously taken up, it has been ISRO’s policy to involve Indian Industries for the production of existing proven designs and fabrication technology as per project requirements and realize the space qualified systems, components and hardware, indigenously. In keeping with this policy, it is intended to offload to industry the production of HI –REL MMIC based Ku band ALC Channel Amplifier used for amplification of signal in GEOSAT spacecraft. The unit shall be referred as CAMP in this document It is intended that Indian industries having the capability and experience in the above field with past heritage, shall offer their interest in carrying out the above job in response to this RFP. This RFP outlines the fabrication and testing details including procurement of raw materials, required for fabrication and environmental testing of CAMP for onboard application in upcoming GEOSAT missions, as followed at SAC and as guideline to the fabricator. This document does not cover management and commercial aspects.

This RFP is divided into Part A and Part B. Part A is published along with this tender and Part B will be issued to the interested vendors after signing the non-disclosure agreement as per enclosed format. The Part A consists of:

1. General overview. 2. Technical specifications 3. Scope of Work 4. Responsibilities of Vendor and SAC 5. Deliverables, Time Schedule 6. Terms & Conditions 7. Typical sequence of events & guidelines to vendors for submitting the offer. 8. Reliability & Quality Assurance requirements

The Part-B consists of A) Fabrication details as given below,

� Substrate details � CP assembly drawings and consolidated component lists. � Control circuit PFT assembly drawing � Temp compensation PCB drawing & consolidated component lists � Overall package Harness drawing � Fabrication sequence

B) Functional description details as below, � RF circuit description. � Control circuit description and block schematic diagram � Temp compensation circuit diagram.

C) Testing and performance optimization steps D) Reference for Temperature compensation in ALC mode as well as in fixed gain mode. E) Mechenical fabrication F) Laser sealing G) BOM and Cost of the components and modules to be issued by SAC

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1. 1 General Overview

The CAMP consist of RF Amplifiers, Voltage Variable Attenuators and Commandable Attenuators. The CAMPs have capability to be operated either in Automatic Level Control (ALC) mode or Fixed Gain Mode (FGM) by ground command. TM output is to be provided to know the present mode of operation. Functional block diagram of the ALC CAMP is shown in Figure 1.1

Ku-band CAMPs are equipped with step attenuators to provide the Tele-commandable control of the transponder gain from ground. This is realized by inserting attenuation into transmission path of each CAMP.

Figure 1.1 : Block Schematic of MMIC Ku ALC CAMP

CAMPs have a nominal gain of 60 dB with 30 dB commandable gain step in Fixed Gain Mode (FGM) operation and provide nearly 6-dBm output power in ALC mode over the input power range of +30 dB with respect to nominal input power level of -54 dBm with additional facility of commandable output power control of 15 dB in steps of 0.5 dB.

Each package consists of a single CAMP. As shown in Figure 1.2, the box has 5 cavities- 3 for RF circuits, 1 for Control circuit and 1 for temperature compensation circuit.

RF circuits are realized by thin film technology using 10 mil alumina circuits having slot cutting for MMIC Chips, control circuit realized by thick film PFT substrates on 25 mil alumina substrates. Temperature compensation circuit is realized on FR4 substrates.

In addition, Micro d connector is laser welded by butt joint and RF connectors beads are soldered to ensure hermetic environment. Package is hermetically sealed to protect all active MMIC chips and other bare DIEs.

The integrated unit as shown in Figure 1.2 shall be fabricated, integrated and optimised to meet specifications as per Table 2.1 by vendor based on SAC design.

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Figure 1.2 : Assembly diagram of MMIC Ku ALC CAMP

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2.0 TECHNICAL SPECIFICATIONS 2.1 The performance specifications are listed in Table 2.1 Table 2.1 : Ku Band Channel Amplifier Performance Specifications Sr. No.

Parameters Unit Specifications

1 Frequency Band GHz 11.45 to 11.7 2 Operation mode 1. FGM,

2. ALC 3 Input Power

3.1 Nominal Input Power (with 10 dB step Attenuator)

dBm -44

3.2 FGM I/P Power (with 0 dB step Attenuator) dBm -54 3.3 ALC dynamic Range dBm -54 to -24 4 Output Power

4.1 ALC mode (0 dB attn.) dBm +6 ± 1.0 4.2 Temp. Stability in ALC mode dB-pp 0.8 max 5 Gain

5.1 Nominal at FGM dB 50 ± 1.0 5.2 Range in FGM dB 30 to 60 5.3 Temp Stability in FGM dB 0.8 max 5.4 Flatness over 250 MHz dB 1.5 max 5.5 Flatness over any 40 MHz dB 0.3 max 6.0 Noise Figure 6.1 FGM @ gain = 50 dB dB 15 max 6.2 FGM @ gain = 30 dB dB 25 max 7 Commandable Step Attn. in FGM

7.1 Step attn. in FGM dB 0 - 30 7.2 Step size attn. in FGM dB 1.0 7.3 Attn. Step Accuracy in FGM dB ± 1.0 max 8 Commandable Step Attn. in ALC

8.1 O/P attn. range in ALC dB 0 -15 8.2 O/P attn. Step in ALC dB 0.5 8.3 Attn. Step Accuracy in ALC dB ± 0.5 max 9 Two Tone IMP @ I/P per carrier

9.1 -27 dBm, 30 dB FCA (FGM) dBc -25 max 9.2 -47 dBm, 10 dB FCA (FGM) dBc -30 max 9.3 -27 dBm, ALC Mode dBc -25 max 9.4 -47 dBm, ALC Mode dBc -30 max 10 Input/Output Return loss dB 18 min 11 In-Band Spurious dBc < -60 max 12 DC Voltage/Power V/W ±6.5±0.4/ 3.5 Max

Unless otherwise specified, the electrical performance requirements given in this section shall be met over: (A) The total bandwidth. (B) Under all environmental condition for specified life time. (C) All specifications are to be met in FGM as well as in ALC mode

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These parameters are described as below, 2.1.1. The CAMP shall be optimised for performance in the specified bands of frequencies as specified in Table 2.1 2.1.2 The CAMPs have capability to be operated either in Automatic Level Control (ALC) mode or Fixed Gain Mode (FGM) by ground command. ALC circuit is used to provide constant output power level over specified input dynamic range by the use of ALC attenuator in a closed loop configuration. CAMP have ALC function enable-disable option, selectable through 5 V CMOS pulse command with source current <100-µA. Interface circuit diagram with noise immunity provision is shown in Figure 2.1 In fixed gain mode ALC loop circuit is disabled and amplifier will provide fix gain depending upon GCA setting. 2.1.3 The nominal input power in Fixed gain mode is -44 dBm with 10 dB attenuator. ALC mode output power will be maintained within 6±1 dBm over -54 to -24 dBm input power. 2.1.4 The output power in the ALC mode at nominal input power condition shall be within +5 dBm to +7 dBm over the entire frequency band of operation. The output power variation in ALC mode over the operating temperature range shall not be more than 0.8 dB p-p for any given input power level over the specified input power range 2.1.5 The nominal gain of the CAMP shall be 49 dB (Minimum) and 51 dB (Maximum). Gain Stability over the operating temperature range shall be 0.8 dB (p-p).The gain flatness of CAMP shall be better than 0.8 dB over any 240 MHz & better than 0.3 dB over any 40 MHz. The units should preferably meet all the specifications over entire band of 11.45 to 11.75 GHz. 2.1.6 The worst-case noise figure of the CAMP shall not exceed the limits specified in Table 2.1. 2.1.7 The commandable Gain Control Attenuator (GCA) circuit shall operate between 0 to 30 dB in steps of 1 dB in FGM. The accuracy of each step setting should be within ± 1.0 dB over the specified operating temperature range. 2.1.8 The commandable Output Power Control Attenuator (OPCA) circuit shall operate between 0 to 15 dB in steps of 0.5 dB in ALC. The accuracy of each step for OPCA attenuation settings and ± 0.5 dB over the specified operating temperature range. 2.1.9 The level of third order inter-modulation products of two equal carriers of input power level and separated from each other by 1 MHz shall be as per Table 2.1. Frequency swept measurement to be done to show the compliance over full frequency bands. 2.1.10 The input and output return loss in operating conditions shall be better than 18 dB 2.1.11 The CAMP input and output shall not exhibit spurious signals (i.e. signals not harmonically related to the input signals) of more than -60 dBc when the amplifier is driven by a single carrier at any level in ALC mode as well as FGM mode at any frequency in the operating frequency band 2.1.12 The DC power consumption of the CAMP shall be 3.5 Watt (maximum) under any operating condition over the specified operating temperature and frequency range. The CAMP shall be operated with DC power supply of +6.1 to +6.9 V and –6.1 to -6.9 V. It should meet all the specifications with ripple voltage of 8.0 mV and spikes of 50 mV from the power supply. Gain of amplifier should not vary more than ± 0.4 dB with change in supply voltage over the specified limit.

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2.2 CAMP Commands and Telemetry

Camp command details are given in Table 2.2 and Telemetry details are given in Table 2.3 Table 1.2: Camp Commands

Sr No. Command Name Remarks 1 Select Fixed Gain Mode FGM Operation 2 Select ALC Mode ALC Operation 8 GCA State Random

Selection Sets GCA to desired attenuation state

12 OPCA State Random Selection

Sets OPCA to desired attenuation state

Table 2.3: Camp Telemetry

Sr No.

TM Name Type Level/Logic Description

1 Operational Mode Digital FGM=0,ALC=1 ALC=1

Selected Mode of operation

3 GCA State Analog 0-5V CAMP output power in FGM

4 OPCA State Analog 0-5V CAMP gain in (OPCA) state in ALC mode

Note : ALC mode have Enable/Disable option selectable through ground command and related TM output is 1 for ALC ON, 0 for ALC OFF.

2.2.1 Data Command for Commandable Gain Setting Cir cuit This consist of three lines:

a) 16 bit serial data (5V CMOS interface) b) Transfer pulse c) Clock Signal (Frequency 1 KHz)

The timing of these three lines is shown in Figure 3 Note

• Data Rate is 1 kbps • Clock is delayed by 0.25ms with respect to data • Transfer pulse is asserted 5 ms after the falling edge of 16th clock cycle. • Transfer pulse width is 50 ms approximately. • MSB is first in serial data flow

2.2.2 Data Command for mode selection This consists of two different lines for ALC and FGM operation mode selection. Timing diagram is shown in Figure 2.1.

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2.2.3 Telemetry Monitoring TM output of 4 Volt is CMOS compatible with current capability >100 µA. To indicate the mode of operation of the CAMP a digital TM is provided. Logic 1 is for ALC ‘ON’ and Logic 0 is for ALC ‘OFF’. Other digital and analog TM is provided as written in Table 3. TM interface circuit with 5V Zener diode for protection is shown in Figure 2.2.

Figure 2.1 Timing diagram for Tele command data

External Harness & RF Connectors

RF and DC savers are necessary to protect the RF an d DC connectors. These are to be procured by vendor and delivered with each unit. The RF input and output connectors are SMA Female and DC interface is 15 pin Micro-D connector.

The outside mating DC connector harness assembly (Micro D plug type) is to be assembled by vendor. Crimpable Micro D type connectors and crimp contacts will provided as FIM.

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ALC OFF CMD

5 V

64 ±4 mS 5V

ALC ON/OFF TM

64 ±4 mS 5V

CD40106 or equivalent

10 KpF 100 K

560 K 10 K

1K 1K

SCHMITT TRIGGER

DA

DA

5V CMOS Compatible

5V CMOS Compatible

DA

CD40106 or equivalent

10 KpF 100 K

560 K 10 K

ALC ON CMD

SCHMITT TRIGGER

Figure 2.2 : ALC ON-OFF Command and TM Interface circuits

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3.0 Scope of the work

The vendor is required to fabricate, test and deliver the CAMPs for space flight usage. SAC has already fabricated tested and qualified this design for FM use. The total work quantum described above in the realization of the unit can be typically divided in following stages, (A) Mechanical and Electronic Fabrication (B) Procurement of Mechanical and Electronic parts, material and inspection (C) Components mounting, assembly and packaging (D) Testing and performance optimisation (E) Data review by SAC (F) Hermetic Sealing (G) Acceptance/Qualification level environmental testing

These fabrication activities are to be carried out by vendor as per SAC/ISRO qualified processes and by SAC approved vendors, with quality control at each step, as per the SAC approved fabrication and test documents. Activities in detail are given as below, A) Mechanical and Electronic Fabrication

SAC will supply QA approved assembly and detail fabrication drawings/Gerber/DXF files of all Carrier Plates, Housing, MICs, and PCBs.

• Mechanical fabrication includes the following: i) Fabrication of mechanical packages. ii) Fabrication of kovar carrier plates. iii) Gold plating of carrier plates and aluminium package. iv) Post gold plating machining of package v) Fabrication of sealing cover vi) Laser welding of Micro D connector and cover on aluminium alloy package vii) Thermal paint / tape application on the package viii) Jigs and mounting plates required for fabrication and testing

• Electronic fabrication activities include the following:

ix) Fabrication (Pattern engraving) of MICs on 10 mil Alumina substrates with space qualified thin film metallization.

x) Slot cutting for MMIC in thin film substrates xi) Fabrication of bare PCBs on FR4 (glass epoxy) laminates. (Two Layers) xii) External Crimpable Micro D connector harness

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Post-fabrication compatibility check is performed to ensure the mechanical compatibility of package with all MICs, PCBs, carrier plates and components.

B) Procurement of Mechanical and Electronic parts, material and inspection

i) Procurement of mechanical hardware, RM0705 resistors for TBD values, RF and DC savers and material like getter, absorber, Conductive RTV CHO- 1075 and other fabrication related materials

ii) Incoming inspection of parts and materials

C) Component mounting, assembly and packaging

All components will be supplied by SAC as Free-Issue Material (FIM) except RF and DC savers and 15 TBD resistors (Type : RM0705). Following processes are involved,

i) Attachment of Alumina substrates on carrier-plates using reflow soldering. ii) Mounting of discrete SMD components like chip capacitors, resistors, wires, active

devices on MICs and PCB iii) 1 mil wire bonding from Alumina substrate to component & MMICs iv) Fitting of MICs, Control circuit PFT & PCB in actual box v) Assembled package wiring with Cu enamel wire ( approx. 45 interconnections) vi) Soldering on assembled PFT substrates (thick film 25 mil alumina) vii) RF absorber and getter material mounting on Al alloy cover viii) Conductive RTV application on RF connector flange ix) Crimpable Micro D type connector harness

Fabrication sequence may be modified depending upon approved fabrication processes D) Testing and Performance Optimisation

Unit testing is carried out in following phases: i) Functional Testing & Optimisation ii) Temperature compensation for finalising the TBD values of FGM and ALC

compensation networks. iii) Verification of performance of the sub-system over given temperature range. iv) Functional testing as per specification listed in Table 2.1 after hermetic sealing

E) Data Review by SAC

• Data review for QM will be done as below,

i) All electrical measurement as per part B will be reviewed.

ii) TBD values will be verified

iii) Pre sealing test data will be reviewed

• Pre sealing test data will be reviewed for all FM units

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F) Hermetic sealing is required for following i) Laser welding of 15 pin Micro D connector on Aluminium alloy package ii) Laser welding of cover on Aluminium alloy package iii) Soldering of RF bead on Aluminium alloy package

F) Acceptance/Qualification level environmental tes ting

1. Qualification Testing

The QM assembly will go through qualification level test. Qualification testing is a set of tests carried out on one unit to qualify the fabrication with a given set of part process and material. This also demonstrates the available performance margins of the unit under given operating conditions. It includes various tests such as Burn-in, EMI/EMC/ESD tests, vibration/Shock test, thermal vacuum test, Life test etc as per list and details included in R&QA section of this RFP. Acceptance test on FM units shall be started only after review & clearance of Qualification tests results by SAC.

2. Acceptance Testing

The each FM unit shall go through acceptance level test. Acceptance testing is a set of tests carried out on each unit to verify the workmanship and performance of the unit under given operating conditions. It includes various tests such as Burn-in, EMI/EMC tests, vibration test and thermal vacuum test etc as per list and details included in R&QA section of this RFP.

The units are required to undergo the above tests successfully, meeting all the specifications, before delivery to SAC.

Vendor should have capability in terms of fabrication facility, storage facility and test facility as well as necessary technical expertise to build, optimise, test and deliver the high reliability product.

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4.0 Responsibility of SAC AND VENDOR 4.1 Responsibility of SAC

1. Free Issue Material (FIM) • All Components as per list attached • FM accepted assembled PFT substrates

2. Design and fabrication documents after NDA

4.2 Responsibility of Vendor

1. Procurement of Mechanical and Electronic parts, material, RF and DC savers, RM 0705 resistors

2. Mechanical package & CP fabrication 3. Surface treatment- Gold plating, Thermal tape application 4. Post gold plating machining 5. Laser sealing of Micro d type connector and Aluminium alloy package 6. Bare PCB fabrication 7. MIC substrate fabrication and slot cutting 8. MIC circuits, PFT and PCB assembly, integration and harness 9. Automated RF Test set up (recommended) for Ku band ALC CAMP. 10. RF testing, tuning and optimization of Ku band ALC CAMP. 11. Temperature compensation of package in FGM and ALC mode 12. Rework, re-tuning and re-optimization, if required 13. Interim test data in soft format and final test data in soft and hard format

Detail of work flow sequence with responsibilities are defined in Table 4.1 Any delay on SAC part with respect to Sr. No.1, 5, 10, 18, 21 and 26 of Table 4.1, will not be considered in LD computation.

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Table 4.1 work flow sequence with responsibilities

Sr. No.

Activity Responsibility Remarks SAC Vendor

1) Fabrication document ( SAC approved mechanical drawings, components list, assembly details and fabrication sequence)

√

2) Testing Procedures (To be prepared by Vendor and to be reviewed and approved by SAC).

√

3) To get SAC QA approval of procurement 10 mil Alumina Substrate, PCB boards & parts as per Para (B) on page 14

√

4) Procurement of Mechanical & Electronic parts and All raw materials & consumable and their incoming inspection & batch acceptance tests / COC

√

5) Active, Passive Components & FIM for CAMP, Gerber/DXF files of MICs and PCBs

√

6) Mechanical Hardware Fabrication including all surface treatments

√

7) Post gold plating machining and cover fabrication for laser welding of Micro D connector and hermetic sealing

√

8) Photo films/masks for MICs & PCBs fabrication and its QC √

9) Electrical Hardware Fabrication and QC (Including bare MICs and PCBs fabrication and external DC harness)

√

10) R & QA audit √ 11) Assembly and packaging of RF section √

12) Assembly of PFT substrates CP6, PCB and interconnection √

13) Absorber fixing on RF cover √ 14) Calibrated Test Equipments & Facilities √ 15) Functional testing, tuning and optimisation √ 16) Temperature compensation and final verification √ 17) RTV and araldite application √ 18) R & QA audit before cover closing √ 19) Cover closing clearance & RF cover closing √

20) Final functional verification and temperature test data, Documentation of test results & compliance chart

√

21) Sealing clearance √ 22) Rework and re-optimisation, if required at any stage √ 23) Hermetic sealing activities √ 24) T&E √ 25) Documentation of test results & compliance chart √ 26) Shipment clearance √ 27) Delivery of Fabricated units √

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5. Quantity, Deliverables and other requirements 5.1 Quantity requirement: Vendor is required to supply flight worthy units fabricated and tested complying with space quality R&QA requirements and also, meeting all electrical/ functional requirements. Unit data pack and copy of fabrication history to be submitted in hardcopy and softcopy formats.

Table 5.1 Delivery Schedule of Units :-

S.

No. Unit

Deliverable

Quantity Delivery Schedule Remarks

1

• Approved drawings

• One Set (Soft Copy)

*T0 SAC responsibility

• Components • For all units T1 = *T0 + 15 Days #

2 QM 01 T2 = T1 + 6 Months # Vendor

responsibility

3 FM 24√ T3 = T2 + 6 Units

per month #

Vendor

responsibility

* T0 = Receipt and acceptance of PO by Vendor

√ Please Quote in slabs: 1) 15 to 20 2) 21 to 50

# The time schedule excludes the time taken by SAC in fulfilling their obligation as per table

4.1 and will be excluded accordingly in LD computation. This is maximum time given,

however if unit is manufactured and tested prior to delivery period it should be delivered to

SAC instead of storage at their end.

Note : 1. T & E Results and conformance matrix shall be delivered along with each unit.

2. The QM unit shall be delivered.

5.2 Deliverable Documents:

5.2.1 The following documents shall be supplied alo ng with the quote:

a) Plan for realization of units with time schedule to complete different activities for delivery of units within time.

b) Details of proposed fabrication procedures. c) Point by point Compliance to all the requirements of this RFP. (Marking such as “C”

/ “√” / “-”etc. are not acceptable) .

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5.2.2 The following documents shall be supplied during the contract:

a) Materials & Process List to be used for the fabrication of units, detailing their quality level, procurement specifications, traceability information, out gassing specifications etc.

b) Interim Test data before sealing c) Process Identification Document d) Test plan documents for Qualification and Acceptance tests with test conditions,

procedures, list of equipments and their calibration status, for approval by SAC. e) Non-conformance management plan f) Configuration change control plan g) Programme management plan

5.2.3 The following documents shall be supplied dur ing the programme with

respect to relevant activity:

a) Status report at the agreed intervals b) Status report for the fabrication activity and test schedule c) Schedule for Cover closing of the QM and FM units d) Details of test set-up and readiness e) Non-conformance report at agreed intervals f) Failure Report; as and when failure occurs g) Test Data Summary as Pre-shipping Review Sheet (Including Excel tables as per

Table 2.1 of RFP part A) h) End Item Data Package with Hardware (Including Excel tables as per Table 2.1 of

RFP part A)

5.3 WARRANTY and Bank guarantee/Indemnity bond

(A) The vendor shall provide warranty as given below;

“The units supplied here upon shall be free from any defects in material of workmanship and in accordance with the applicable specifications and drawings”.

(B) This warranty shall run for a period of four years from the date of final acceptance by SAC / ISRO and shall be in addition to any other rights available to SAC /ISRO. This warranty shall continue to be valid for corrected or reworked units until four years after the date of final acceptance by SAC / ISRO of these units.

(C) Cost of the components and modules to be issued by SAC is Rs 4.2 Lakh/ CAMP for which bank guarantee of Rs 105 Lakh is required as per purchase norms.

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5.4 TERMS AND CONDITIONS

1. Bids from only those vendors which have valid qualification / certification as per SAC/ISRO guidelines for all processes, manpower and facility (required for the mentioned scope of work as specified in para 3.0), on the date of submission of bids will be considered. Vendor to submit the necessary certificates along with the technical proposal.

2. SAC retains the option to split the requirements and can award multiple contracts to more than one vendor taking into account the capabilities of the parties, quantum of work, project requirements and schedule etc.

3. The fabrication is to be carried out as per SAC/ISRO approved processes. (Applicable Documents given in sub-section 8.2 of R&QA Requirements).

4. All raw materials, mechanical parts, substrates, PCBs, etc. shall be procured by vendor through qualified sub-vendors*. The procurement specifications are to be generated by the vendor and approved by SAC before procurement/ placement of Purchase Order.

5. Vendor should have a controlled environment storage area for components, materials and fabricated hardware.

6. Vendor should have test equipments and environmental facilities as given in Table 7.1 (with valid calibration at the time of testing). Vendor to confirm the availability of the instruments and environmental facilities in the quote.

7. Any changes carried out in the design, drawings or documents during the contract tenure, done by vendor or SAC shall be exclusive property of SAC and shall not be used for any purpose other than agreed upon.

8. SAC reserves the right to modify any part of the design as per project requirements.

9. Vendor shall take approval from SAC prior to third party outsourcing. R&QA requirements will be applicable to third party also.

10. In case, deliverables are rejected / delayed due to various domestic constraint of third party / sub-contractor engaged by contractor, SAC shall not be held responsible & contractor has to make good of the loss. However additional components will be given considering reasons of rejection and its failure analysis report.

11. Final approved fabrication document and Test Document shall be supplied to the vendor after the contract is awarded. All documents supplied by SAC are the exclusive property of SAC and shall not be used for any purpose other than agreed upon. These documents shall be return to SAC after completion of the work.

12. R & QA requirement should be fully complied.

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6.0 TYPICAL SEQUENCE OF EVENTS & GUIDELINES TO VEN DORS FOR SUBMITTING

THE OFFER

The typical sequence of events in completion of Request for Proposal (RFP) for Fabrication, testing and delivery of HI –REL MMIC based Ku band ALC CAMP under vide Document No. SAC-SNPA-GEOSAT-CAMP-05-2014 (PART-A) is described as below:

1. The vendor to assess their technical capability, facility & infrastructure, manpower skill levels & certifications required to carry out the work specified in this RFP.

2. Vendor to communicate expression of interest for carrying out the work within fifteen days from the publication of this RFP.

3. The pre-bid discussions with interested vendors (if required) shall be organized at SAC, Ahmedabad, within twenty one days from the publication of this RFP. The date of same shall be communicated five working days in advance. The pre-bid discussions/ meeting with Vendors at SAC, Ahmedabad is planned to clarify/ resolve doubts/ remarks of vendors.

4. The interested vendors may obtain Part B of this RFP containing technical details by signing the non-disclosure agreement in the format attached in this RFP. This step has to be exercised within thirty days from the date of publication of this RFP.

5. Submission of final bids in two parts as per advertisement & RFP. Bids should reach to Space Applications Centre (SAC), Ahmedabad within two months from the publication of this tender.

Part-1: Technical proposal ; including the following:

i) Point by point compliance to all the requirements in RFP including R&QA requirements.

ii) Vendor to submit the necessary certificates for all processes, manpower and facility required for the specified work along with the technical proposal on the date of submission of bids.

iii) Duly filled check-list as given in Table-4.1. iv) Details of infrastructure/ facilities / test equipments available at vendor’s site for

fabrication & testing as per this RFP. In case vendor envisages outsourcing partial fabrication / testing work it should be indicated clearly against table 4.1.

v) Any previous heritage of supplying space hardware. If yes, necessary documents to be enclosed.

vi) Time schedule: Vendor to note that the time schedule is critical for the project. Past performance of vendor about previous contracts with SAC may be reviewed before awarding the contract.

vii) Format of the price bid without indication of price , showing the list of quoted items and quantities.

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Part-2: Commercial offer:

i) Quote for QM unit separately

ii) Please quote in slabs for FM units 1) 15 to 20 2) 21 to 50

iii) Applicable taxes.

6. Opening of Technical Proposal bids

7. The evaluation of Technical proposal by SAC (The vendor may be asked to make technical presentation at SAC Ahmedabad during the process of evaluation).

8. Commercial assessment of only the technically suitable offers.

9. Awarding the contract to successful vendor.

23



Table 6.1 Checklist table to be filled by vendor along with Proposal

Note: Vendor shall submit supporting documents / details for each of the above i.e.

copy of qualification certificate, details of calibrated equipments etc.

S. No. Parameter Vendor

Compliance (Yes / No)

1 Understanding of specifications

2 Clarity on scope of work

3 Clarity on the Component and material requirements

4 SAC/ISRO qualified processes as per ISRO-PAX-300/305

5 SAC / ISRO certified Fabricators / Inspectors for MIC & PCB

6 Details of skilled Engineer / technician for RF optimisation shall be provided

6

Availability of Test equipments and Environmental facilities to meet requirements

Spectrum Analyser

Performance Network Analyser

Power Meter

Signal generators

Linear power supplies with Digital Voltage and

Current Meters, Analog and Digital Multimeters

Data generator

Noise Figure Meter

Automatic RF- data logging System

Thermal Chamber

Humidity Chamber

Thermovac Chamber

Vibration and Shock Facility

EMI/EMC/ ESD Test measurement Facility

Hermetic sealing facility

Chemical facilities - Gold plating, thermal paint , conformal coating etc.

7 Availability controlled environment storage area (bonded store)

8 Point to point Compliance to RFP- electrical specification- Terms & Conditions and R & QA requirements

9 Compliance to delivery schedule

10 Compliance to warranty terms & Liquidity damage Clauses

11 Commercial bid in slabs as per para

12 Point to Point Compliance to purchase commercial terms and conditions

13 Details of skilled Engr / technicians for RF optimisation shall be provided

24



7.0 Typical format of Non Disclosure Agreement is g iven below,

NON-DISLOSURE UNDERTAKING

This affidavit is to be made on Judiciary/ Non-Judiciary Stamp paper of Rs. and to be attested by 1st class Magistrate etc. We, (M/S ), hereinafter called the Vendor, fully

understand and accept that Document No. : SAC-SNPA-GEOSAT-CAMP-05-2014 (PART-

B) entitled "Request for Proposal for Fabrication, Testing and Delivery of HI–REL MMIC

based Ku band ALC CAMP ”, consisting of technical information and drawings related to

fabrication and testing of electronic hardware, is the exclusive property and Copyright of

“Space Applications Centre (ISRO), Ahmedabad-380015, Department of Space, Government

of India", hereinafter called SAC.

We, the Vendor, further undertake and guarantee that the contents of the said “Request for

Proposal” (RFP) or any part thereof, including documents and drawings appertaining thereto,

shall not be used for any purpose other than the sole purpose of preparation and submission

to SAC of technical and commercial proposals in response to the said “Request for

Proposal”. In the event of our proposal being accepted and a contract being awarded by SAC

to us, we undertake to use the said RFP and associated documents and drawings, strictly in

compliance with the terms and conditions of such contract.

We further accept and agree that any changes carried out in the design, drawings or

documents, whether by us, M/s or by SAC at any time,

shall be the exclusive property and copyright of SAC.

We further undertake and assure that we shall not make the RFP or any part thereof,

available to any third party for any reason, without first obtaining written permission from

SAC. All the above clauses, terms & conditions applicable to the Vendor M/s

, will be equally applicable to any such third party, and we (Vendor) hereby

undertake responsibility for compliance with the same.

(Authorised Signatory ) Designation