future devices for information technology 2003. 4. 4. songcheol hong
TRANSCRIPT
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Future devices for Information Technology
2003. 4. 4.
Songcheol Hong
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Contents
Electronic Devices (processing devices)High speed devices(digital, analog, RF)High power devicesMemory devices
Optical Devices QWLD, QDLD
Optical communication devicesGaN based Devices
Display
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High speed devicesHigh speed devices
Digital, Analog(RF)DSP upto Microwave frequencies
IEEE MTT Vol. 50, N0. 3, 2002 p900
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Power dissipation/ MIPS
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Digital circuits expands to Analog domain
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Trends in Transmitter Architecture(Mobile)
DC-DC converter
Vector Modulator
High Speed DSP (7GHz)
Bias control Supply voltage
control
DSP SDR
One Chip Radio
ACPR(dBc)
DSVPA
AverageEfficiency(%)
Year
2000 2003 2006 2009
0
40
60
80
SmartPA -45
-50
-55
2012
20
DigitalPredistor
Direct RFSynthesis
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Smart PA
Heterodyne type
Base/gate bias voltage control
GaAs based PA
DACIin
Qin
VCO1
IF VGA
VCO2
Up-Mixer
PARFout
Gate/base bias control
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Dynamic supply voltage (DSV) PA
Direct conversion
Supply Voltage Control Dynamic Supply Control
DSP clock speed ~ 10MHz
GaAs PA + CMOS DC-DC converter SiGe BiCMOS
DAC & ADCcontroller
Iin
Qin
RFoutPA
BiasController
VCO
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Digital Predistorer
Digital predistorter
SiGe BiCMOS PA or CMOS switching PA
RFoutPA
BiasController
VCO
DAC & ADCcontroller
Iin
Qin
Digitalpre-
distorter
Amplitude
Phase
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Direct RF synthesis
Direct RF Synthesis
DSP clock speed ~ 7 GHz
CMOS Switching PA and controller
Digital Phase &Amplitude Mod.
Iin
Qin
Phase
Amplitude/Ramping
RFoutSynthesizer/
VCO
AmplitudeModulator
SwitchingPA
RFoutIin
Qin Filter
SwitchingPA
BandpassDelta-SigmaModulator
DSP
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High speed Power Devices
• MESFET/ HEMT High Efficiency / high Linearity Temperature stability Negative bias Develop
Enhancement FET
• MOSFET/LDMOS Low Efficiency Temperature Stability Single bias
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•HBT
High Efficiency / High Linearity
Single bias
High power density
Bad temperature stability
introduce Ballast R, careful bias circuit
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Typical InGaP Emitter HBT Structure
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Fig. 1. A cross-section of IBM's SiGe HBT structure, which was used to obtain a record-breaking ft value of 350 GHz. Credit: IBM.
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HBT comparison High power v.s. Digital
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Circuit design : Power combine : Unit transistor
Power transistor (FETs)
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HBT with Ballast R ( Via hole and Air bridge)
8 finger Rb=50
12 finger Rb=50
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Power Cell64 finger
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Conventional 구조(1) Poly gate 와 drain metal 의 저항이 클것으로 예상(2) Source metal 이 drain metal 을 덮는 구조이므로 Cds 가 클것으로 예상
Conventional 구조
MOS power cell
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FET vs. HBT (size)
HBT’s (being vertical in structure) consume less die area than an equivalent FET based production technology
Example> take a PA line-up for GSM (Pout=35dBm, Vbat=3.2V)
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Ballasting• HBT devices must be BALLASTED to ensure thermal stability
• Thermal run-away is avoided if a sufficiently large ballast resistance is placed
in either the emitter or the base of the HBT
• In a multi-finger array, one device may be hotter than other. The hotter device
will experience a drop in Vbe (-2mV/oC) which will cause it to draw even more
current from a fixed-base-voltage supply… thus it will get even hotter. The end
result is finger burn-out
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Ballasting (conti…)• Three methods are available to ballast your circuit
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HBT bias circuit• Diode-bias and current-mirror circuits can be seen here:
• The key differences are:
- Diode bias requires the diode to draw current, which can be significant
- Current mirror does not track as well over temperature
- Current mirror has the “2 Vbe” reference-voltage issue
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CMOS and LDMOS power TR
IEEE EDL, Vol. 21, No.2, p81, YueTan et al.
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High power LDMOS
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Conclusions I High speed digital and analog devices1. Submicron CMOS(0.18um) is
covering upto 10Gbps and 10GHz range.2. Submicron CMOS(0.05um) will be covering upto 40 Gbps and 40 Ghz range. 3. Digital part will dominate Analog and RF4. Finally, only power amp in RF with digital control
will survive5. LDMOS+CMOS will be a winner in Power applications6. SiGe may be used in high speed digital and 10-60 GHz range RF.7. GaAs HBT is used in Power and Low noise application
1- 40 GHz8. InP HBT and HEMT are used in high frequencies(above 30Ghz)
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Figure 7.4: Simplified DRAM schematic.
DRAM
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DRAM design rule
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Figure 7.7: Vertical stacked capacitor: Top - SEM photograph of the storage plate.
Bottom - Solid model and grid of the simulated structure (only the material POLY1 is
displayed).
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Figure 7.6: Process flow of the vertical stacked capacitor.
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FINFET
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Nono MOSFET
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Quantum Dot Flash memory
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Figure 1. Schematic cross section of a FRAM unit cell [1T/1C]
FRAM
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Conclusion II Memory
DRAM: Design rule becomes smaller, Ferroelectric Materials make C smaller, New Structures
Nonvolatile Memory: Flash Nano-flash, QD flash FRAM MRAM
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QWLD, QDLD
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Self-assembled QDs
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AFM image of QD
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Figure 2. TEM micrograph showing the core of a 5-QWR Laser. The wires are positioned inside the 2D optical waveguide in an asymmetric configuration in order to maximize the overlap of the optical mode with
Quantum wire grown on V groove
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LD, VCSEL, LED
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VCSEL
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Why Blue? GaN ?
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LD, LED ---Conclusion III
Laser diode
QWQD ---- High power LD
VCSEL
QW QD ---- Low threshold Current
Blue light sources --- GaN
Storage illumination
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Ref.) Tutorials, Agilent, 2000 OE conference
Distance Fiber Solution
100m installed MMF No solution. (FP laser can go 65m)
300m new MMF850-nm VCSEL on new MMF
No solution for installed MMF
2Km SMF Uncooled 1300-nm FP laser
10km SMF Uncooled, Isolated 1300-nm DFB
40km SMFTraditional telecom-style cooled Isolated, externally
modulated DFB
Method to overcome limit
42.5 Gb/s WWDM with installed MMF & SMF
10 Gb/s TDM with SMF & 1300nm LD
Expected 10 Gigabit Ethernet solution
Standard & ApplicationsOptical communication devices
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Ref) TRW and Velocium, 2002 IEEE MTT-S workshop.
Property of GaAs/InP HEMT at TRW
Material property of electrical device
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BVCEO vs. Ft
TRW and Velocium, 2002 IEEE MTT-S workshop.Ref) Inphi inc., 2002 IEEE MTT-S workshop.
Ge Si GaAs InP
e- mobility (cm2/V-s) 3900 1400 8500 5400
h+ mobility (cm2/V-s) 1900 450 400 200
Bandgap (eV) 0.66 1.12 1.42 1.34
Thermal Cond(W/cm-C) 0.58 1.30 0.55 0.68
Property of Si/GaAs/InP HBT
Material property of electrical device
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Ref) NTT., 2002 IEEE MTT-S workshop.
Optical Rx & Tx
Digital & Analog IC
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Optical Rx & Tx
Which technology is used
Pre-amp
155Mbps CMOS
622Mbps
2.5Gbps
10Gbps
40Gbps
post-amp CDR DeMUX MUX LD-Driver
SiGe/GaAs
PD
InP
InP InP/GaAs
Si / SiGe Si/SiGe HEMT
InP
InP
InP
CMOSSi BJT
InP/GaAs InP/GaAs InP/GaAs InP/GaAs
SiGe/GaAs CMOS
Si BJT
HEMT
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40 Gbps MUX/DeMUX
Inphi inc., 2002 IEEE MTT-S workshop. AMCC., 2002 IEEE MTT-S workshop.
40 Gbps CDR+DeMUX1:4 DeMUX 4:1 MUX
With InP HBT, GPPO connector
Clock Data Recovery
1:16 DeMUX
With SiGe HBT, Ball Gray package
Electrical package
High speed modules (40 Gbps)
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Fig. 2. A 100 Gbit/s selector IC fabricated using InP-based HEMT technology. Credit: NTT.
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Aluminum Nitride package of NTT Si MEMS of SOPHIA wireless
Electrical package
High speed modules( > 40 Gbps)
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AGERE SYSTEM
Tunable EML Module- SOA Integrated- 2-Section DBR- Front PD Integrated
Monolithic IntegrationMonolithic IntegrationMonolithic IntegrationMonolithic Integration
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Fig. 1. Photoreceivers fabricated using hybrid manufacturing (a) and ELT integration (b).
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WG-PD ChipWG-PD Chip
Responsivity : 0.84 ~ 0.95 A/Wby two Aspherical lenses
The total coupled CPW lines : characteristic impedence of 50 ohm
CPW line
Front end IC Chip
Ceramic CPW
V-Connector
Near Field Diameter : 2 m
Cavity Resonance in PKG Housing
40Gbps modules in NTT40Gbps modules in NTT40Gbps modules in NTT40Gbps modules in NTTWaveguide type PIN-TIAWaveguide type PIN-TIA
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Optical Communication Devices --Conclusion IV
LD + Modulator High speed VCSEL arrayWDM
PD+TIA integration
TIA and LD/Modulator Drive
Optical chip set
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Fig. 1. GaN-on-silicon platform technology offers a broad range of applications, including microelectronic and optoelectronic products, optical sensors and high-voltage rectifiers
GaN applications
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<< Back to article
Fig. 1. A typical layer structure used for the fabrication of AlGaN/GaN HEMTs
Figure 1
AlGaN/GaN HEMTs
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Fig. 3. Power performance of a 0.36 mm wide AlGaN/GaN FET at 30 GHz, showing 2.3 W output power, 38% PAE and 8.8 dB gain. Credit: NEC.
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Fig. 2. Comparison of the potential power delivered by HEMTs that have been fabricated in GaAs, SiC and GaN.
High power Transistor– base station amplifier
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High power/speed devices Conclusion V
LDMOS
MESFET
SiC MESFET/MOSFET
GaN HEMT
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Display devices --- Organic LED
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Conclusion-VI
Display
LCD OLED CRT Plasma Projection LED
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Conclusions
Conclusion I --- high speed digital analog
Conclusion II --- high density memory
Conclusion III ---LD,LED
Conclusion IV ---Optical communication device
Conclusion V --- high voltage
Conclusion VI--- dispaly