www.EVGroup.com

Fully-Automated Fusion Bonding SystemEVG® GEMINI® FB XT

Vertical stacking of semiconductor devices has become an increasingly viable approach to enabling continuous improvements in device density and performance. Wafer-to-wafer bonding is an essential process step to enable 3D stacked devices. EVG’s GEMINI FB XT integrated fusion bonding system extends current standards and combines higher productivity with improved alignment and overlay accuracy for applications such as memory stacking, 3D systems on chip (SoC), backside illuminated CMOS image sensor stacking, and die partitioning . The system features the new SmartView NT3 bond aligner, developed specifically for fusion and hybrid wafer bonding alignment requirements of <50 nm.

Best in class wafer-to-wafer alignment- SmartView® NT3- < 50 nm (3σ) face-to-face alignment

Up to 20 wafers per hour throughput- Upgrade to six pre-processing modules- Faster handling and improved process flows

Enabling new devices- 3D stacked memory (high bandwidth memory, etc.)- Next-generation stacked CMOS image sensors- Monolithic device architecture

ContactEV Group DI Erich Thallner Strasse 1 4782 St. Florian am Inn Austria Phone: +43 7712 5311 0 Fax: +43 7712 5311 4600 E-Mail: Contact@EVGroup.com

EVG® GEMINI® FB XTAutomated Production Fusion Bonding System

Features

■ SmartView® NT3 face-to-face bond aligner with better than 50 nm (3σ) alignment accuracy

■ Process modularity allows for upgradeability of additional modules

■ Up to six pre-processing modules like Clean Module, LowTemp™ Plasma Activation Module, Alignment Verification Module and Debond Module available

■ XT Frame concept for highest throughput with EFEM (Equipment Frontend Module)

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