CMP annual users’ meeting - 25-Jan-18 - PARIS

Circuits Multi-Projets®MPW Services Center for ICs, Photonics & MEMS

Prototyping & Low Volume Productionmycmp.fr

Grenoble - France

From layout to chips

CMP annual users’ meeting - 25-Jan-18 - PARIS

From layout to chips

MEMS & Photonics MPW services

CMP annual users’ meeting - 25-Jan-18 - PARIS

CEA/LETI Photonic – Si-310 PHMP2M

MEMS Processes

Bulk Micromachining

MUMPs from MEMSCAP

Teledyne DALSA MIDIS

Outline

CMP annual users’ meeting - 25-Jan-18 - PARIS

CEA/LETI Photonic – Si-310 PHMP2M

Photonic – Si-310 PHMP2M• 200mm CMOS SOI platform• Silicon film 310 +/-10nm• Multilevel patterning allowing silicon heights of 0, 65, 165 and 300nm• 2 Metal layers (MET1 and Alucap)

CMP annual users’ meeting - 25-Jan-18 - PARIS

CEA/LETI Photonic – Si-310 PHMP2M

Photonic – Si-310 PHMP2MPassive components

• Fiber grating coupler 1D/2D• Shallow / Rib / Strip WaveGuides & bends• Ring filter• Multimode interferometers

Active components• Mach Zender modulator• Ring Racetrack modulator• Ge Photodiode• TiTin Metal heater

CMP annual users’ meeting - 25-Jan-18 - PARIS

Direct Connection with CMOS processes• CMP propose several CMOS processses compatible

with photonic process• 3D stacking• Interposer

Packaging Compatibility• Fiber array alignment• Optical packaging

CEA/LETI Photonic – Si-310 PHMP2M

CMP annual users’ meeting - 25-Jan-18 - PARIS

Our offer• 2 MPW runs/year: next run in

March 2018• 3D Post-process option available• Supported PDKs: Cadence, Mentor

(Pyxis) , Phoenix software

2018 Expectations• Training Q3: Photonic Introduction,

kit, process and design flow presentation.

• Tutorial will be available Q3

CEA/LETI Photonic – Si-310 PHMP2M

CMP annual users’ meeting - 25-Jan-18 - PARIS

Realization Examples

1D Fiber coupler

Highly confined waveguides

2D Fiber coupler

Optical Receptors

GE PIN Diode

CEA/LETI Photonic – Si-310 PHMP2M

Optical transceiver circuit

CMP annual users’ meeting - 25-Jan-18 - PARIS

MEMS Processes

Bulk Micromachining

MUMPs from MEMSCAP

Teledyne DALSA MIDIS

CMP annual users’ meeting - 25-Jan-18 - PARIS

• Compatible with electronics• Front side bulk micromachining• ams 0.35µ CMOS, SiGe, High Voltage

MPW run turnaround : 8/10 Weeks

Post process turnaround : 5 weeks

Suspended passive device

Bulk micromachining on CMOS

CMP annual users’ meeting - 25-Jan-18 - PARIS

MEMs accelerometer and signal conditioning

• Front-end electronics close to MEMS sensor for better signal to noise ratio

Bulk micromachining designs

Test sensor structures Flow sensor

CMP annual users’ meeting - 25-Jan-18 - PARIS

A CMOS Compatible Ultrasonic Transducer Fabricated With Deep Reactive Ion EtchingLibor Rufer, Christian C. Domingues, Salvador Mir, Valérie Petrini, Jean-Claude Jeannot, and Patrick DelobelleJOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 15, NO. 6, DECEMBER 2006

• Applications : piezo resistive devices, pressure sensors, transducers

Backside bulk micromachiningIntegration of MEMS sensor and front-end electronics

Membrane and suspend structure on top of cavity

Backside bulk micromachining

CMP annual users’ meeting - 25-Jan-18 - PARIS

Design Kit• Standard DK for the 0.35µ CMOS process C35B4C3 from ams• Design Rule Manual and technology files provided for MEMS

structures• MEMS DK for :

Fabrication schedule• ams C35B4C3 : next run starts on February 20th

Access to bulk micromachining

CMP annual users’ meeting - 25-Jan-18 - PARIS

• Company created in 1997, technology

available through CMP since 1998

• 3 different processes : PolyMUMPs

SOIMUMPs

PiezoMUMPs

MEMSCAP

CMP annual users’ meeting - 25-Jan-18 - PARIS

Features• 2 mechanical and 1 electrical layer of polysilicon• 2 sacrificial layers• 1 electrical conduction layer• 1 electrical isolation layer• Optional post process : etching/release, CO2

drying, sawing

POLY 2

Applications• Acoustics

(microphones)• Accelerometers • Micro-fluidics• Display Technologies

PolyMUMPs

CMP annual users’ meeting - 25-Jan-18 - PARIS

Features• Silicon On Insulator substrate • Reactive-Ion Etching (RIE)• 10 to 25 µm structural layer• 2 Metal layers

Si

Substrate

METAL

OXYDE

Applications• Gyros• Optical devices• Display technology

Cross section of RIE etching

SOIMUMPs

CMP annual users’ meeting - 25-Jan-18 - PARIS

Features• Based on SOIMUMPs process• 0.5 µm Aluminium Nitride

piezoelectric layer• Active piezoelectric device• 2 Metal layers

Applications• Energy harvesting• Ultrasonic

transducers• Microphones• Actuators

PiezoMUMPs

CMP annual users’ meeting - 25-Jan-18 - PARIS

Design kits and CAD tools

• Physical design, DRC :

• Specific MEMS CAD tools :

Fabrication Schedule • PolyMUMPs : 4 runs in 2018 • SOIMUMPs : 3 runs in 2018 • PiezoMUMPs : 3 runs in 2018

Access to MUMPs

CMP annual users’ meeting - 25-Jan-18 - PARIS

MEMS Integrated Design for Inertial Sensors (MIDIS™)Features• Getter-free high-vacuum sealing allows resonator Q factors > 20,000• Efficient wafer-level packaging minimizes overall die size• 1.5 μm feature size in a 30 μm thick membrane• Comb height control allows out-of-plane sensing• TSV allows compact design ready for co-packaging

Applications• Accelerometers• Gyroscopes• Resonators• Inertial sensor combos (Sensor fusion)

Inertial sensorCourtesy of CMC

Teledyne DALSA MIDIS platform

CMP annual users’ meeting - 25-Jan-18 - PARIS

Teledyne DALSA MIDIS platform

Pict

ure

from

CM

C

CMP annual users’ meeting - 25-Jan-18 - PARIS

Cross section of Typical MIDIS process

Teledyne DALSA MIDIS platform

Pict

ure

from

CM

C

CMP annual users’ meeting - 25-Jan-18 - PARIS

Process Design Kit from Teledyne DALSA• Process parameters specifications• Design rules• DRC deck• Technology files for solid model generation• MIDIS solid model generation• Offers a truly representative 3D view of your design• Ready for design review• Multi-physics simulations

Fabrication schedule• 1 runs scheduled for 2018 (1st run April 10th/devices shipment 1st October)

Access to MIDIS

CMP annual users’ meeting - 25-Jan-18 - PARIS

Photonic• First Run launched in October• Already 2 designs booked for 2018• Training and Tutorial in September 2018

MEMS Process• 2 Designs in PiezoMUMPS process• 2 ams bulk micromachining designs

2017 Photonic and MEMS Results

CMP annual users’ meeting - 25-Jan-18 - PARIS

Thank you !

From layout to chips