freescale solutions for powertrain applications...

Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006.

TM

Freescale Solutionsfor Powertrain Applications(FA109)

Robin PalingPowertrain Systems TSPG

Freescale Technology Forum- ParisOctober 2006

TM

Slide 2Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.

Agenda

TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006.

Slide 3

Powertrain Trends

Freescale Product Portfolio and Roadmaps

Solutions to meet Powertrain Challenges

TM


Powertrain Trends

TM


What Have Electronics Helped Achieve So Far?

6.0

7.0

8.0

9.0

10.0

11.0

12.0

1995 1996 1997 1998 1999 2000 2001 2002 2003

Fuel

Con

sum

ptio

n (l/

100k

m)

19.6

21.6

23.6

25.6

27.6

29.6

31.6

33.6

35.6

37.6

Fuel

Con

sum

ptio

n (m

pg -

US)

ACEAACEA (gasoline only)JAMA (gasoline only)US CAFE Averages

• Increased average fuel economy

• Reduced emissions (CO, HC NOx, particulates)

• A new car today is about 30 times cleaner than a new car in the early 1980’s.

Source: Strategy Analytics

TM


Emissions Targets – A WW Challenge

Source: FIA

TM


Technology to Address the WW Challenge

Fuel Efficient Technologies

0%5%

10%15%20%25%30%35%40%45%50%

BAS Start/S

top

ISA/IMA Sys

tem

Full H

ybrid

Pow

ertrai

nCylin

der D

eacti

vatio

n

Direct

Injec

tion G

asoli

ne

Common

Rail

Dies

el

Variab

le CAM Tim

ingReg

enera

tive B

raking

Active

Therm

al Rec

overy

Therm

al Stor

age

Electric

Wate

r Pum

p

High-E

fficien

cy AC

Impr

ovem

ent

Electric Drive Systems

Engine Technologies Energy Recovery Systems

Most dramatic improvements in engine efficiency have come from Hybrid Engines and Common Rail Diesel


Slide 8

Engine TechnologyHigher PerformanceQuieterCleaner

EnablersLower peak temp: staggered main injectionFiner spray: higher pressuresSoot reduction: post injection

Focus on Combustion Control

Picture source : CRF 2004

TM


Advantages of Multiple Injections

• Flexible control of multiple injections, with almost no restrictions in number and distance

Up to 5 injections per cycleMinimum dwell time between to consecutive injections: 100μs

Common Rail with Multiple Injections

Noise control in cold operationand low rpm

Injection Duration ControlCombustion Rate ShapingSoot oxidation

DeNOxRegeneration

PILOT POSTMAIN

PRE MAIN AFTER

Common Rail1st generation

Source : CRF 2004


Slide 10

Increasing System Complexity

Camshaft Position Sensor

Crankshaft Speed Sensor

Oil Level Sensor

Oil Pressure Switch

Variable Geometry Turbine (VGT)

VGT Vacuum Modulator

VGT Actuator

Pedal Assembly

Injectors

Coolant Temperature

Sensor

to the vehicle

High Pressure

PumpFuel

Metering Valve

Rail Rail Pressure Sensor

Pressure Regulator

Valve

Pre-catalyst

Diesel Particulate

Filter

Main Catalyst

Outlet pre-cat Temperature

Sensor

Inlet DPF Temperature

Sensor

DPF Differential Pressure Sensor

UHEGO Sensor

Glow Plug Control Unit

Glow Plugs

Air Flow Meter + Air Temperature

Sensor

Air Filter

Compressor

Intercooler

Intake Manifold Pressure & Temperature Sensor

Electronic Throttle

Body

Variable Swirl Actuator

Electric Fuel-feeding Pump

Fuel Tank

Damper Volume

Fuel Filter Assembly(Fuel Heater, Fuel

Temperature Sensor, Water Separator, Water-

in-fuel Sensor)

EGR Valve

EGR Cooler

Engine Control Unit

Atmospheric Pressure Sensor


Slide 11

Challenges for Semiconductor Components in Power Train Systems

• System ComplexityHigher digital and analog I/O

• Tighter combustion control driving up system performance requirements.

Direct injection control for diesel and gasolineOn chip knock detection

• Development and Calibration

TM


Freescale Product Portfolio and Roadmaps


Slide 13

DIAG

ADC IGN / INJ

H-Bridge

OUT

BAT

AcceleratorPedal Position

Throttle Position(EGAS)

Air Mass Flow

Battery Voltage

Air Temp/Pressure

Engine Temperature

Knock

Oxygen Sensors

MCU

Crankshaft SpeedAnd TBC

Camshaft position

Clutch / Brake

Vehicle Speed

Ignition Coils

Fuel Injectors

Throttle Positioner

Main Relay

Tachout Counter

Fuel Pump

OxygenSensor Heaters

Dashboard Lamps

Camshaft Control

Fuel Tank Vent

Intake Manifold

Secondary AirValve

COM

Safety

Power Supply

EEPROM

Powertrain Electronic Control Unit Outline

CAN

MERLOT

LIN

eCANHS

eLIN

MC33810

MC33811

MPC55XX

S08

eMSDI

eMSDI

IN

eMSDI

APSIC

S12X


Slide 14

MPC5500 Product and Technology Leadership

• MPC5500 offers industry leading levels integration with Enhanced Timer Control, High Performance 5V AtoD, FlexRayTM

communications

• MPC5500 is the only available flash based MCU family to offer truly scalable platform based approach for Powertrain Applications

• The MPC5554 is the industry's first AEC qualified flash based MCU in 0.13um process technology


Slide 15

MPC55xx Family RoadmapA

pplic

atio

n Pe

rfor

man

ce

MPC5570

MPC5550/60

MPC5530

e200z67-stage

SIMD*VLE

132/150/180MHz

e200z34-stage*SIMD

VLE 66/80MHz

2005 2006 2007 2008 2009 2010

MPC55542M

MPC55531.5M

MPC5534*1M

MPC5533768K

MPC5561*1M

MPC5567*2M / FlexRay

MPC5566*3M

MPC55xx4M

MPC55xx*90nm

2011

Collision Avoidance

X-by-wire

Piezo-ElecDiesel

Advanced Gasoline

Low End Gasoline

Transmission

Chassis

MPC5510Gateway

Central Body

Peripheral Body (SLP Door, Seat)

Instrument Cluster

Available

PlannedProposed

In Design

This document contains forward-looking statements based on current expectations, forecast and assumptions of Freescale that involves risk and uncertainties. Forward looking statements are subject to risk and uncertainties associated with Freescale business that could cause actual results to vary materially from those stated or implied by such forward-looking statements.

MPC5510512K-1MB

MPC5565*2M


Slide 16

MPC5554

Core• 40-132MHz PowerPC™ ISA e200z6 Core

• Integer binary user mode compatible with RCPU(MPC500)• New SIMD module for DSP and floating point features

Memory• 2M byte RWW Flash with ECC• 115k Total SRAM (including cache and eTPU memory)

• 64k Data RAM (including 32K with standby) with ECC• 32k unified-cache (with line locking)• 19k for eTPU (16k code & 3k parameters)

I/O• 88 Timed I/O Channels

• 2 x 32 channel eTPU• 24 channel eMIOS with unified channels

• 3 x FlexCAN - compatible with TouCAN, 64 buffers each• 2 x eSCI• 4 x DSPI 16 bits wide up to 6 chip selects each

• Standard SPI with continuous mode and DMA support• Pin serialization (similar to PPM)

• 40 channel Dual ADC - up to 12 bit and up to 1.25μs conversions, 6 queues with triggering and DMA support.

System• FM-PLL• 64 Channel DMA Controller• 308 Source Interrupt Controller• Nexus IEEE-ISTO 5001-2003 Class 3+• MPC500 compatible External Bus Interface supporting ‘classic’ and burst

external flash.• 5/3.3V IO, 5V ADC, 3.3V/1.8V bus, 1.5V core (from internal regulator

controller)• 416 PBGA package

Boot Assist Module

Interrupt Controller

DMA

32/16 bit External B

us Interface

ExternalMaster

Interface

3 x 5 Crossbar Switch

I/OBridge SIU

I/OBridge2M

FLASH

64KSRAM

(32K S/B)

DS

PI

DS

PI

DS

PI

DS

PI

eSCI

eSCI

FlexCA

NFlexC

AN

FlexCA

N

AD

C

ADCiAD

C

3k DataRAM

16k CodeRAM

eTPU32

Channel

eTPU32

Channel

eMIOS24

Channel

NexusIEEE-ISTO 5001-2003

AMux

JTAGPowerPC™

e200z6

32k Cache

MMU

SIMD(DSP &

floating point)


Slide 17

MPC5534

Boot Assist Module

NexusIEEE-ISTO 5001-2003

Interrupt Controller

DMA

4 x 5 Crossbar Switch

I/OBridge SIU 1M

FLASH

64KSRAM

(32K S/B)

DS

PI

DS

PI

DS

PI

SC

IS

CI

FlexCA

NFlexC

AN

2.5k DataRAM

12k CodeRAM

eTPU32

Channel

eMIOS24

Channel

AD

C

ADCiAD

C

AMux

JTAG

PowerPC™e200z3

MMU

SIMD(DSP &

floating point)

16 bit External B

us Interface

VLE

Cal B

us Interface

Core• 30-80MHz PowerPC™ ISA e200z3 Core + VLE

• Binary User mode compatible with RCPU (MPC500) and e200z6• New SIMD module for DSP and floating point features

Memory• 1M byte RWW Flash with ECC• 78.5k SRAM

• 64k Data RAM (including 32K with standby) with ECC• 14.5k for eTPU (12k code & 2.5k parameters)

I/O• 56 Timed I/O Channels

• 32 channel eTPU• 24 channel eMIOS with unified channels

• 2 x FlexCAN - compatible with TouCAN, 64 buffers each• 2 x eSCI• 3 x DSPI 16 bits wide up to 6 chip selects each

• Standard SPI with continuous mode and DMA support• Pin serialization (similar to PPM)

• 40 channel Dual ADC - up to 12 bit and up to 1.25μs conversions, 6 queues with triggering and DMA support.

System• FM-PLL• 32 Channel DMA Controller• 210 Source Interrupt Controller• Nexus IEEE-ISTO 5001-2003 Class 3+• 5/3.3V IO, 5V ADC, 3.3V logic supply, 1.5V core (from internal

regulator controller)• Second EBI for calibration (16bit, not pinned out of BGA)• 208 MAPBGA package (no bus, 34ADC)• 324 PBGA package (40 ADC)

I/OBridge

ExternalMaster

Interface


Mother Nature

Analog Signal Conditioning

MCU/VLSI

High Voltage

Power Drivers

Low VoltageCore/NVM

Protection

SMARTMOS™

Harsh Powertrain Environment


Slide 19

A-D (8- & 10-bit)5V, ~5µs conversion

OscillatorCrystal, internal - to 8MHz, 2%

Charge PumpInternal ~ 200 µA, or external

9-Bit D-AGuaranteed monotonic

Comparators5mV, or autozeroed

Op AmpsRail-to-Rail

Precision ReferencesBandgap - 1.2V, ±1% etc.

Switched CapFilters, Gain stages

Voltage RegulatorsDC/DC & Linear 5V, 3.3V, 2.6V etc.

Non-Volatile Memory100’s of bits for trim, ID, serial numbers

Inductive Energy Clamps1J, 50 µs to 4ms

IndependentThermal Management

Shutdown at 165 ±15 °C

Load SensingShorted Load

Open LoadMovement

Load ResistanceInductance

Power MOSFETs5AP: to 65V, 5A, 50mΩ5HV+:105V, 5A, 50mΩ

Analog MOS20V or 60V or 105V

8/16-bit CPUHC08/HC12, 50MHz

RF900MHz Tx

High Speed CMOS5AP: 1K’s of gates, < 10MHz state machines5HV+: 10K’s of gates, < 25MHz state machines8MV: 100K‘s of gates, < 200MHz, 2,6V

SMARTMOSTM Product Capabilities


Slide 20

I/O’s Interface & Sensing SolutionsConfigurable I/Os, Contact Monitoring & eField

Connectivity Solutions Xcvr, SBC, IDC families

Power Actuator SolutionsH Bridges & High Side Switches

Power Management Solutions8/16 bits & 32 bits power supply

APD Key Standard Product Families


Slide 21

APSIC Automotive Power Supply IC

32 SOICW-EP

32

1

FEATURES• Operating Voltage Range 5.5V to 58V (with VDDH

guaranteed)• Operating Voltage Range 4.0V to 65V (VDDH out of

reg. limits)• Reverse Battery Protection FET driver

• Buck converter directly to 5.0 V @ 2.0A, adjustable frequency 100kHz to 500kHz, slew-ratecontrol

• Programmable/Selectable VDD3, VDDL, VKAM Output Voltages (3.3V, 2.6V, 1.5V, 1V)

• Integrated VDDL @ 440 mA, expandable by externalNPN

• VDD3_3 expandable by external NPN • VREF1,2 Protected switch to VDDH, up to 150mA• Resets: /PORESET, /HRESET• Programmable Power On Reset Delay: 0 to 56 ms.• REGON, /SLEEP• 100uA Standby supply current with all supplies shut

down

StandbyControl

VKAM15 mA, ILim

FeedForwardRamp

Gene ratorBuck

Cont rol Logic

OscillatorHS Drive,

L evelShifter

BOOT

SW

VBG

SR

INV

VCOMP

VDDH

VREF1

HRT

KA_VBAT

VBAT

VIGN

VKAM

RSTH

PORESET

GND

Ba nd-GapReference

VBG

HR Timer

SLEEP

Enable

VDDL440 mA typ.ILim, TLim

VREF2

FREQ

VDDL

VDDHReset Detect

VDD3

VDD3_FB

VBATSW

5.0 V,ILim=150 mA36V,-2V,TLim

T-lim

VKAM, VDDL,V DD3 Prog.Re f. Voltage

ProtectionFETDrive

PFD

UVLO/OVLO

VDDH = 5.0V@ 2000mA total*Battery

P1

P2

VKAM, VDDL, VDD3Ref. Voltage

ChargePu mp

5.0 V,ILim=150 mA36V,-2V,TLim

3.3V5 0 mA typ .ILim, TL im

CP

CP

RSTL

VDDL_FB

P3

REGON

5V

OptionalProtect ion FET

VDDLReset Detect

S

VREF_DISVREF_EN

RST3

VKAMRe set Detect

VDDLReset De te ct

With Buck Regulator Directly to 5.0V

TM


Solutions to Meet

Powertrain Challenges


Slide 23

Challenges for Semiconductor Components in Powertrain Systems

• System ComplexityIncreased number of digital and analog I/O

• Tighter combustion control, direct injection for diesel and gasoline, on chip knock detection

Driving system performance

• Development and Calibration Extensive development supportCalibration solution that supports full functionality and uses production silicon


Slide 24

Serialization Example at Component Level

MC33993Switch Detection

Interface8 switch inputs (programmable)

14 switch inputs (switch to gnd)

Vbat

VbatSPI

MC33926225mOhm Hbridge

MSDI

MERLOT

MPC5534MC33661

eLINLIN RX/TX

MC338006x1A LS outputs2x4A LS outputs2x CCD outputs

6 Gate Drivers/Hego

Supershreec

Vbat

VbatVbat

MC338104x4A Injector

Drivers4xIGBT Ignition

Drivers

I I D

MC33902eCANHS

CAN RX/TX

Vbat


Slide 25

Serialization from Micro Side

PA

Chan 15SIU GPIO

eTPU Pin Muxing

Ser. Data Reg. (SDR) - RO Alt. Ser. Data Reg. (ASDR)

Shift Register

TxSS

Deser. Data Reg. (DDR) - RO

MPC5554

DSPI

PA

Chan 14SIU GPIO

PA

Chan 13SIU GPIO

PA

Chan 12SIU GPIO

Shift Register SOUT

SCKSCK

PCS

GPIO 0PWM 0PWM 1PWM 2

SMOS

• 4 eTPU output channels are “serialized” and sent over DSPI A to a SMOS driver

• The 4 pads normally controlled by eTPU channels 12 – 15 can be used as for some other function such as GPIO

• SMOS could return serial data back to DSPI

PWM 2

PWM 1

PWM 0


Slide 26

Serialization from SMOS Side

Reduce • Layout of PCB • Quiescent current• Power dissipation• Number of Solder joints

Without MSDI Switch

Input

To MCU

12VSW

R1875

R222K

R314.5K

C1

Switch Input

C1

To MCU

With MSDI

• Operating voltage range • Ground effect protection


Slide 27

SUPER SHREEC 33800

VBAT

EVMV_out

EVMV_recirc

EVR_out

EVR_recirc

VBAT

VBATOUT_1 - OUT_8

SPI

.

.

.

IN1

IN2

IN14

GNDVDD

VBAT

OSS + Dual CC+Hex HEGO

R_reg R_dither

Six ChannelsR(hego)

FB

VCAL

6 Gate DriversWith pgmthreshold Vds

8 LS OutputsMax I=350mALim 3 – 5 A

2 Constant Current ControllersConfigurable with Resistor & DAC

SPI or Parallel control

heater capability

Protection& diagnostic

Features• Designed to Operate 5 V <= VPWR <= 36 V• Interfaces Directly to Microprocessor Using 3.3 V/5.0 V SPI Protocol• Parallel PWM Predriver Control• Independent Programmable Dither Frequency• Independent Programmable Dither Amplitude• Independent Programmable Current for Constant Current Controllers• Off State Open Load and On State Shorted Load Diagnostics.• Independent Programmable Predriver VDS Fault Threshold Voltage• Independent Programmable Predriver Fault Timer• VPWR Standby Current 10 µA Typical, VDD Standby Current 5µA Typical

Performance Typical ValuesLow Side Outputs 8Low Side RDS(on) max 1.4 ΩEVR RDS(on) max 500mΩEVMV RDS(on) max 1.2mΩHex HegoOperating Voltage 5 – 36 VControl/Communication SPI & Parallel

Samples Available Now !


Slide 28







Slide 29

Knock Cycle

SparkPulse

EMIOS

QADC

I/O Bridge

A

Cross-bar

Switch

DMA

I/O Bridge

B

SRAM

ETPU

eSys CoreIncl.SPE

Knock Algorithm

Knock window

I/O Bridge

ACrankSignal


Slide 30

I-Fetcher

Dispatch UnitBranch

UnitInteger

UnitLd/StUnit

GPR64-bit

e200z6 Core Complex

MMU

UnifiedCache (32KB)

Bus Interface Unit (AMBA 2.0 v6 AHB)

WriteReadAddress

SP-FPUUnit

646432

SIMDUnit

Nexus 3

32-bit Power Architecture™ e200z6 Core

• Single-issue, in-order, 7-stage pipeline• Most instructions single-cycle• Unified 32KB 8-way set associative cache required• Intended to operate up to 150MHz at 125C

32-bit Power Architecture™ e200z3 Core

• Single-issue, in-order, 4-stage pipeline• Most instructions single-cycle execution• Designed to operate (without cache) up to

80MHz at 125C (limited to 80Mhz due to FM band)

Power Architecture™ Book E e200 Cores for Automotive

e200z3 Core Complex

MMU

Bus Interface Unit (AMBA 2.0 v6 AHB)

6464

DWriteDReadDAddr

SP-FPUUnit

32

SIMDUnit

Nexus 3

IAddr

32 64

IRead

I-Fetcher

Dispatch UnitBranch

UnitInteger

UnitLd/StUnit

GPR64-bit

VLE

VLE


Slide 31

Signal Processing Extension(SPE) APU

• SPE is a Book E APU on MPC5500 family that provides DSP-like functionality

SPE provides Single Instruction Multiple Data (SIMD) and single-precision floating point capabilitiesGeneral Purpose Registers (GPRs) are 64-bit. PowerPC Book E instructions only impact lower 32-bitsSPE operates on all 64 bits of GPRCapable of operating on two sets of operands (32-bit words) per clock

rArB

rD

op op

0 31 32 63


Slide 32

Closed Loop Injector Control with eTPU and ADC

DC/DC ConverterSm

artMO

SD

rivers e.g. 33810

AN1

AN0

Low Side Control

Boost Control

High Voltage

High Side Control

High Side Control

ADC

eTPU Vbatt

DMA


Slide 33

STING I I D 33810

Performance Typical ValuesLow Side Outputs (Inj.) 4Low Side RDS(on) max .2 ΩIGBT/Gen Purp. FET drive 4Operating Voltage 4.5 - 36 VControl/Communication SPI & Parallel

Samples July 2006

Features• Designed to Operate 4.5 V <= VPWR <= 36 V• Interfaces Directly to Microprocessor Using 3.3 V/5.0 V

SPI Protocol• Parallel Ignition and Injector Control available• Dwell MAXI and NOMI Outputs • Spark Duration Output with Open secondary control• Low Voltage Output Clamp to suppress spark• Off State Open Load and On State Shorted Load

Diagnostics.• Can be cascaded for up to 10 cylinder applications• Independent Programmable Predriver Fault Timer

• VPWR Standby Current 15 µA Typical, 30 µA Max.

Spark Duration and Dwell control

4 Injector Drivers - 4.5 amp typ.SPI or Parallel control

Protection& diagnostic

4 Ignition IGBT drivers

VDD

VPWR

OUT_EN

DIN0

VD D

SI

SO

SCLKCS

33810VBAT

OUT3

OUT0

OUT2

VBATVBAT

FB0

GD0

DIN3

OUT1

GND_TAB

VBATVBAT

VBAT

GIN0

GIN3

SPKDURNOMIMAXI

RSPRSN

FB1

GD1

VBAT

FB2

GD2

VBAT

FB3

GD3

VBAT

VBat


Slide 34







Slide 35

True Scalability

• Modern customers have trend toward PLATFORM approach to ECU development

• MPC5500 family is 100% SW and HW compatible, low to high end (512K to 4MB of Flash)

• Freescale enables use of single HW and SW development platform for multiple ECU derivatives, resulting in:

> Reduced HW and SW development investment

> Improving time to market thru rapid HW prototyping

> Improved SW quality due to early access to MPC5500 silicon

MPC5554416BGA

MPC5553416BGA

MPC5534416BGA

MPC5534324BGA

MPC5553324BGA

MPC5553208BGA

MPC5534208BGAM

PC55

34C

oral

1M

MPC

5553

Moc

casi

n 1.

5MM

PC55

54C

oppe

rhea

d 2M

416BGA27mm 2

324BGA23mm 2

208BGA17mm 2

MPC5554416BGA

MPC5534416BGA

MPC5534324BGA

MPC5534324BGA

MPC5553324BGA

MPC5553324BGA

MPC5553208BGA

MPC5553208BGA

MPC5534208BGA

MPC5534208BGAM

PC55

34C

oral

1M

MPC

5553

Moc

casi

n 1.

5MM

PC55

54C

oppe

rhea

d 2M

416BGA27mm 2

324BGA23mm 2

208BGA17mm 2


Slide 36

debuggers

compilers

emulators

Initialization

IDEs

reference/evalboards ISS/BFM/FFM

drivers

RTOSes

third partytools

Freescale,third parties

Green HillsMetrowerks

Wind River(Diab)ByteCraft(eTPU)

Gaio

AshlingGreen HillsiSystems

LauterbachMacraigor

MetrowerksP&E Microsystems

AshlingLauterbach

Accelerated TechnologyENEA

ETAS (Live Devices)Green Hills

Metrowerks/OSEKVector

TektronixAgilent

DLI

Ashware eTPUGreen HillsMetrowerks

VaST (under development)

AxiomFreescale

KanisMetrowerks

PhytecWuerz (underDevelopment)

coregeneric

derivativespecific

board dependent

App

licat

ions

Fast Design Cycle: Development Tools

Industry partners enable the market leading PowerPC architecture with the most advanced Development Tools

ATIETAS

dSPACEVector

CalibrationRapid Prototyping

logicanalyzers

FreescaleUnis


Slide 37

VertiCal Calibration System

BaseBoard

Application Production

PCB

Top Board

VertiCal system meets defined requirements

• Maintenance of full software compatibility

• Maintenance of full hardware compatibility (voltage levels, drive strengths etc.)

• No loss of GPIO during calibration • Minimal size difference between

calibration and production H/W• Ability to support new hardware

features such as serial communications channels and debug trace buffers

• Flexibility for use by third party tool developers


Slide 38

DIAG

ADC IGN / INJ

H-Bridge

OUT

BAT

AcceleratorPedal Position

Throttle Position(EGAS)

Air Mass Flow

Battery Voltage

Air Temp/PressureEngine

Temperature

Knock

Oxygen Sensors

MCU

Crankshaft SpeedAnd TBC

Camshaft position

Clutch / Brake

Vehicle Speed

Ignition Coils

Fuel Injectors

Throttle Positioner

Main Relay

Tachout Counter

Fuel PumpOxygen

Sensor HeatersDashboard

Lamps

Camshaft Control

Fuel Tank Vent

Intake ManifoldSecondary Air

Valve

COM

Safety

Power Supply

EEPROM

Powertrain ECU Summary

CAN

MERLOT

LIN

eCANHS

eLIN

MC33810

MC33811

MPC55XX

S08

eMSDI

eMSDI

IN

eMSDI

APSIC

S12X

TM


freescale solutions for powertrain applications...

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