free devialet player - system plus

©2019 by System Plus Consulting | Free Devialet Player 1

22 bd. Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

Free Devialet PlayerSystem report by Benjamin PUSSATJuly 2019 – version 1


Table of Contents

Overview / Introduction 4

o Executive Summary

o Main Chipset

o Reverse Costing Methodology

Teardown Analysis 9

o Views and Dimensions of the System

o System Opening

o Part Collection

o Electronic Board

Top Side – Global view

Top Side – High definition photo

Top Side – PCB Markings

Top Side – Integrated Circuits markings

Top Side – Integrated Circuits identification

Top Side – Discrete Components markings

Top Side – Discrete Components identification

Top Side – Passive Components markings

Top Side – Passive Components identification

Bottom Side – Global view

Bottom Side – High definition photo

Bottom Side – PCB Markings

Bottom Side – Integrated Circuits markings

Bottom Side – Integrated Circuits identification

Bottom Side – Discrete Components markings

Bottom Side – Discrete Components identification

Bottom Side – Passive Components markings

Bottom Side – Passive Components identification

Cost Analysis 79

o Accessing the BOM

o PCB Cost

o Estimation of the cost of the Qualcomm APxxxxx

o Estimation of the cost of the Qualcomm WCxxxxx

o Estimation of the cost of the Realtek RTxxxxxxx

o Estimation of the cost of the XMOS XVF3xxxxxxxx

o BOM Cost – Electronic Board

o Other Parts – Estimation

o Material Cost Breakdown by Component Category

o Accessing the Added Value (AV) cost

o Electronic Board Manufacturing Flow

o Details of the Electronic Board AV Cost

o Manufacturing Cost Breakdown

Estimated Price Analysis 142

o Estimation of the Manufacturing Price

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Company Services 147


Overview / Introductiono Executive Summaryo Main Chipseto Reverse Costing

Methodologyo Glossary

Teardown Analysis

Cost Analysis

Manufacturer Price Analysis

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About System Plus

Executive Summary

The new Free Devialet Player is the first multimedia player using an audio system with six loudspeakers and System Active Matching (SAM)® technology, for a new 360° sound experience, and much more.

Led by ever-changing broadband technology, with 4K Ultra High Definition (UHD) videos, the Internet of Things and other innovative services, Internet service providers keep improving their multimedia hardware while they integrate new options in their all-in-one packages.

The Free Devialet Player is the latest multimedia player from a company that wants to be known for being at the cutting edge of the technology. It uses a 70mm x 31mm x 3mm core processing board including a Qualcomm Snapdragon 835 processor, 4GB low power double data rate 4 (LPDDR4) standard random access memory, a 32GB embedded Universal Flash Storage (eUFS) chip and a Wi-fi/Bluetooth/FM radio solution chip.

However, the player processing core is not the only feature that deserves to be mentioned. The Free Devialet Player is also fitted with wireless technology solutions, including Wi-fi, Bluetooth and Near-Field Communication (NFC), as well as its 360° Devialet loudspeakers and its wireless power charging solutions. The Free Devialet Player is therefore a true home partner, destined to be located in the middle of the living room, next to the user.

Music vocal control with Amazon Alexa and an attractive touch-sensitive interface are also part of this multimedia all-in-one package.Based on a complete teardown analysis including printed circuit board (PCB) cross-sections, PCB antenna X-rays and main integrated circuit (IC) die photos, the report provides a detailed bill-of-material (BOM), manufacturing cost and then estimates a final manufacturer price of the player.

We estimate that the device is manufactured and tested by a EMS in China for a volume of 500,000 units in 2019.

The Free Devialet Player is made with 5 electronic boards and 1582 components and parts (including Mechanical Parts).


Overview / Introductiono Executive Summaryo Main Chipseto Reverse Costing

Methodologyo Glossary

Teardown Analysis

Cost Analysis


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The reverse costing analysis is conducted in several phases:

Reverse Costing Methodology

• The initialization of the analysis

Pictures of the elements to be studied.

Identification of the components.

• Description of the material in the “SYScost+” software

Creation of an “estimation project” of the studied board with SYScost+ software.

Construction of the Bill of Material (BOM).

• Assessing the material

Searching for the price of each reference among distributors and manufacturers.

Assessing the cost of the PCB and of the unaccounted references (unknown by distributors)

The BOM is valued with SYScost+ : price simulation according to the requested quantities.

• Assessing the assembling and test phases

Assembly and test lines are modeled with the SYScost+ software.

The assembly and tests costs are estimated.

• Production cost & manufacturer price

Estimation of the production cost & manufacturer price.

• Report

A report is edited.

SYS.cost+©, is a software tool developed by SYSTEM PLUS CONSULTING to calculate the cost of electronic boards. More information on thesoftware can be found at www.systemplus.fr.

http://www.systemplus.fr/costing-tools/syscost_plus/

http://www.systemplus.fr/


Overview / Introduction

Teardown Analysis o Views & Dimensionso System Openingo Electronic Board

Cost Analysis


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Global View

Total Weight: 4.40kg

Global Views of the Free Devialet Player




Cost Analysis


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Views and Dimensions300mm

12

0m

m2

85

mm

Total Weight: 4.40kg




Cost Analysis


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System Opening




Cost Analysis


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System Opening

Electronic Board 3 Touch Sensing Area




Cost Analysis


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Electronic Board 1 – Top Side – High Definition Photo

Cross Section of PCB : 6 Layers




Cost Analysis


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Electronic Board 1 – Top Side – PCB MarkingsLead Free Logo




Cost Analysis


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Electronic Board 1 – Top Side – Integrated Circuits Identification



Teardown Analysis

Cost Analysiso Accessing the BOMo PCB Costo BOM Cost – Electronicso Other Parts Estimationo Material Cost Breakdowno Added-Value Costo Manufacuring Cost


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PCBs Cost



Teardown Analysis



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PCBs Cost – Electronic Board 1



Teardown Analysis



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Estimation of the cost of the Qualcomm WCN3990

Estimation of the Main blocks: Digital, Analog, RF.Estimation of the Technology: CMOS RF 65nm, 7 Metal layers, 1 Polysilicon layer.Lithography steps : 37Estimation of the Wafer fab unit: UMC Fab. 12A P1/P2, wafers 300mm, located at Tainan, Taiwan.

Note : a specific and complete analysis of the technology of the dies should confirm these hypothesis but a such analysis is not included in this report.



Teardown Analysis



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Estimation of the cost of the XMOS XVF3500-FB167

Estimation of the Main blocks: Digital, Analog, ROM, SRAM.Estimation of the Technology: CMOS 65nm, 7 Metal layers, 1 Polysilicon layers.Lithography steps : 35Estimation of the Wafer fab unit: TSMC Fab. 14, wafers 300mm, located at Tainan, Taiwan.

Note : a specific and complete analysis of the technology of the dies should confirm these hypothesis but a such analysis is not included in this report.



Teardown Analysis



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BOM Cost – Electronic Board 1 (1/3)



Teardown Analysis



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Material Cost Breakdown by Sub-Assembly



Teardown Analysis



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Details of Electronic Board 1 Added-Value (AV) Cost

Details of the Electronic Board 1 assembly step costs.



Teardown Analysis



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Added Value Cost Breakdown by Sub-Assembly



Teardown Analysis



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Manufacturing Cost Breakdown



Teardown Analysis

Cost Analysis

Manufacturer Price Analysiso Financial Ratioso Manufacturer Price

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Estimation of the Manufacturer Price



Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

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Teardown Analysis

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