factsheet au ha3 - low loop • high reliability • bumpingha3 characteristics for 25 µm diameter...
TRANSCRIPT
Au HA3Low Loop • High Reliability • Bumping
Diameter Microns (µm) 17.5 20 23 25 30 33 38 50
Mils 0.7 0.8 0.9 1.0 1.2 1.3 1.5 2.0
Elongation % 2 – 6 2 – 6 2 – 6 2 – 8 2 – 8 3 – 8 3 – 8 3 – 8
Breaking Load cN > 5 > 6 > 8 > 10 > 15 > 18 > 22 > 40
For other diameters, please contact Heraeus Bonding Wires sales representative.
Recommended Technical Data of Au HA3
Au HA3 BenefitsHigh reliability wire typeIncreased strength, high loop stiffnessVery good pull strengths and shearLong & low loop geometries Optimum stabilized phase formationHigh thermal stability
5.0
Au HA3 Type
In contrast to doped Au wires, alloyed wire types contain a low percentage of alloying elements. This results in markedly higher wirestrength, shorter heat affected zonesand better thermal stability without asignificant increase in electrical resist-ance. The increased wire strength,while maintaining all other mechani-cal properties, permits a reduction of
wire diameter together with a markedsaving in precious metal costs.Areas of applicationHigh frequency bonding Low temperature bonding Low- and long-loop bonding High speed bonding Ultra fine pitch bonding Ball bumping
90.080.070.060.050.040.030.020.010.00.0
Breaking Load vs. Elongation
Elongation (%)
Breaking Load (cN)
0.0 10.0
ø 50 µm
ø 38 µm
ø 32 µm
ø 25 µm
ø 22 µm
ø 20 µm
ø 17.5 µm
HA3 Characteristics for 25 µm diameter
90
80
70
60
50
40
30
20
10
0
Heat Affected Zone (HAZ)
Wire diameter (mil)
Length of HAZ (µm)
0.8 1.0 1.2
600
500
400
300
200
100
0
Breaking Load vs. Elongation
Elongation
Tensile strength (N / mm2)
2% 4% 8%
Superior Reliability
Widest Bonding Highest LoopingWindow Performance
Gold Wire Segmentation by Properties
Superior Reliability
Widest Bonding Highest LoopingWindow Performance
Superior Reliability
Electrical Performance
Widest Bonding Highest LoopingWindow Performance
High
Average
Sensitive pa
d structure
High Loop / Low Loop
Non-Gold Elements < 100 ppm
Elastic Modulus > 90 GPa
Heat Affected Zone (HAZ) 60 – 100 µm
Melting Point 1063 °C
Density 19.2 g / cm³
Heat Conductivity 3.03 W / cmK
Electrical Resistivity 2.9 µΩ-cm
Coeff. of Linear Expansion (20 – 100 °C) 14.2 ppm / K
Fusing Current for 25 µm, dia 10 mm length (in air) 0.345 A
60
50
40
30
20
10
0
High Temperature Strength (HTS)
Wire diameter (µm)
Breaking Load (cN) Elongation (%)
25 32 5038
0%
4%
8%
FAB diameter0.8 mil x 1.651.0 mil x 1.491.2 mil x 1.75
N, L
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T140
13-051
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The descriptions and engineering data shown here have been compiled by Heraeus using commonly-accepted procedures, in conjunction with modern testing equipment, and have been compiled as according to the latest factual knowledge in our possession. The information was up-to date on the date this document was printed (latest versions can always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the results obtained from its use, or any patent infringement resulting from its use (unless this is contractually and explicitly agreed in writing, in advance). The data is supplied on the condition that the user shall conduct tests to determine materials suitability for particular application.