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Embedded Solution Product Roadmap

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Page 1: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE

Embedded Solution Product Roadmap

Page 2: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE

Applications Overview

LEX System's Specialty

New products highlight

Product Development Timeline

Intel embedded chipset solutions

VIA embedded chipset solutions

LEX SYSTEM roadmap

Networking, Railway/Car PC, PoE/ NVR Surveillance, POS/Automation, Digital Signage

LEX SYSTEM chassis

LEX SYSTEM panel PC series

LEX SYSTEM accessories

Page 3: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE

DVR

Network

POS/Automation

Digital Signage

Railway/Car PC

. POS

. Kiosk

. Automation Control

. Waterproof system

. Access Control

. Building / ATM Monitoring

. PC PoE NVR System

. Firewall

. Thin Client

. VPN

. Server

. Retail / Restaurant

. Hospitality

. Enterprise

. Transportation

. In-vehicle Surveillance

. GPS / 3G / WIFI/Bluetooth

. Car Power Management

. Fleet Management

Page 4: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE

. Wide Range Power & DC-IN Power on board

. CPU / Memory / Storage on board features. Highly Integrated & Various Expansion Platform

. Extreme Temperature & Anti-Shock Ability. IP66/IP67 Water / Dust Proof Feature

. Rechargeable Battery feature

. Small form factor fanless system

. Car Power on/off delay control

. PoE Ethernet on board feature

Page 5: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE
Page 6: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE
Page 7: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE
Page 8: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE
Page 9: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE
Page 10: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE
Page 11: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE
Page 12: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE
Page 13: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE
Page 14: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE
Page 15: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE
Page 16: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE
Page 17: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE

M/B Features Chassis

CI847A/C Intel® Mobile IVY Bridge 1047UE / i3 / i7, DVI & HDMI, 4 x GbE, USB 3.0 TINO/Panel PC/Twister

3I847AW/CW Intel® Mobile IVY Bridge 1047UE / i3 / i7, DVI & HDMI, 2 x GbE, USB 3.0,LVDS & Touch Screen, Wide Range DC IN, CPC-Car Power Control (option) Twitter/Tiger/Panel PC

3I847HW Intel® Mobile IVY Bridge 1047UE / i3 / i7, DVI, 2 x GbE, USB 3.0, LVDS & Touch Screen, Wide Range DC IN , CPC-Car Power Control (option) Panel PC / DIN-Rail

2I847H Intel® Mobile IVY Bridge 1047UE / i3 / i7 ,1x GbE, USB 3.0,LVDS , Touch Screen Panel PC/DIN-Rail

3I847NM/NX/D Intel® Mobile IVY Bridge 1047UE / i3 / i7, HDMI,1x GbE, 4 x PoE, (or 5 x GbE ) USB,LVDS & Touch Screen, Wide Range DC IN, CPC-Car Power Control (3I847NM) Tiger/Twitter/Panel PC

3I770A/CW Intel® Mobile IVY Bridge CPU,VGA & HDMI, 2 x GbE, USB 3.0,LVDS & Touch Screen, Wide Range DC IN Blok/Tiger

3I380A/CW SOC BayTrail –I E38XX, 2 x GbE, USB 3.0,VGA. HDMI, LVDS & Touch Screen, Wide Range DC IN, CPC-Car Power Control (option)

Twitter/Tiger/UNOPanel PC/DIN-Rail

2I380A SOC BayTrail –I E38XX, 1 x GbE, COM, HDMI,VGA,, USB 3.0 Twin

2I385A/CW SOC BayTrail –I E38XX, 2 x GbE, COM, LVDS, Touch Screen, VGA, USB Wide Range DC IN Twin/Panel PC

2I385HW SOC Baytrail E38XX, 2 x GbE, COM, LVDS or eDP, Touch Screen , VGA,, USB Panel PC/DiN-Rail

3I380D SOC BayTrail –I E3815 /BayTrail-D J1900 , VGA. ,HDMI, 4 x GbE, ,USB, COM, SIM CARD Socket Twitter/Tiger/Uno

3I380NX SOC BayTrail –I E3845, 4 x PoE LAN, VGA, COM, USB , Wide Range DC IN Twitter/Tiger

2I385S SOC BayTrail-D J1900 ,HDMI, mini HDMI, 2 x GbE, USB, Micro-USB , Audio ,Wide Range DC-IN( option) Blade /Blade HDD/Twin

2I385PW(CPU Board)

SOC BayTrail –I E38XX, LVDS, Touch Screen, DIO , 2 x PCIe mini card, Audio Amp 80-pin connector A: 3 x COM, 5x USB, 1 x PCIe, PS2 KB/MS

80-pin connector B : VGA, HDMI ,2 x LAN,2 x USB, COM, Audio , Wide Range DC –IN, 2I847PW

(CPU Board)Intel® Mobile IVY Bridge 1047UE / i3 / i7, LVDS, Touch Screen, DIO , 2 x PCIe mini card,

Audio, LAN,COM, USB, VGA

3I860A/CW Intel® Broadwell-U Celeron/i3/i5/i7 CPU, 2 x HDMI, 4 x GbE, 5 xUSB,6 x COM,LVDS & Touch Screen, PCIE4x golden finger, Wide Range DC IN Tiger/TINO/Panel PC

Page 18: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE

Q1 Q2 Q3

2017

Sample will be ready in Q2.

3I860A/CWDimension: 3.5” (145 x 102mm)

Q1Q4

2016

2I847PWDimension: Pico-ITX (102 x 73mm)

Sample will be ready in Q2.

Page 19: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE

Q4 Q1 Q2

2016

3I380 NXDimension: 3.5” (145 x 102mm)

Q4Q3

2015

Sample released in Dec.

2I385SDimension: Pico-ITX (102 x 73mm)

2I385 PWDimension: Pico-ITX (102 x 73mm)

P-Run in Nov.

P-Run in Nov.

Page 20: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE

Q1Q4 Q2 Q3 Q4

20162015

Blade system ( slimmest embedded system )Dimension: 150W X 80.8 D x 18 H mm

Sample released in Nov.

Blade HDD system Dimension: 150W X 80.8 D x 42 H mm

Sample released in Dec.

Page 21: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE

Q1Q4 Q2 Q3 Q4

20162015

SHARK Bezel-free PPC7”/10.1”/13.3” fanless / Medical PPC10.1”/13.3” Waterproof PPC

DIN –Rail SystemMIRO 2.5” & MIRO 3.5” series

STAR Bezel-free PPC10.4”/12.1”/15” /21.5” fanless PPC10.4”/12.1”/15” Waterproof PPC

MP

MP

MP

Page 22: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE

Q1Q4 Q2 Q3 Q4

20162015

SHARK 7”/10.1” Waterproof BOX PCMB :2I385HW

Tiger-

M12 IO systemDimension: 190.8W x 130D x 58.8H mmDimension: 190.8W x 195D x 58.8H mm ( removable HDD)MB: 3I847NM/NX ; 3I380NX

MP

MP

Page 23: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE

DDR3 667/800, SATA, LVDS, PCIeIntel Atom D525

Intel CedarView –M N2600/2800DDR3 800/1066, DVI/HDMI , Low power Consumption

Intel SoC BayTrail

DDR3 1333/1600, LVDS 18/24 dual channel, USB3.0

DDR3L 1066/1333 , SATA, LAN , USB3.0

Intel Core i7/i5/Celeron

Intel Broadwell -U i7 / i5 /i3/ Celeron DDR3L 1600 , 2 x HDMI, SATA, LAN , USB3.0

Page 24: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE

V4 1066 MHz, DDR3VIA VX900

Page 25: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE

Processor Chipset Feature

Intel Broadwell-U processor, DDR3L 1333/1600 Intel Broadwell-U 3I860A/CW (2 x HDMI, 4 x GbE, 5 xUSB,6 x COM,LVDS & Touch Screen, Wide Range DC IN, ,

PCIE4x golden finger)

Intel IVY Bridge processorDDR3 1333

Intel Panther Point(PCH) QM77 3I770A/CW (2 x GbE, USB ,VGA, HDMI, LVDS/Touch Screen, Wide range DC-IN)

Intel SoC E38XX/J1900DDR3L 1066/1333 Intel SoC Baytrail

3I380A/CW (2 x GbE, CPC(option),USB 3.0, VGA,HDMI, LVDS & Touch, Wide Range DC-IN)2I385HW (Wafer IO connector board,2 x GbE, LVDS or eDP, Touch Screen, USB,

Wide Range DC-IN )3I380NX ( 4 x PoE LAN, USB,VGA,HDMI, Wide Range DC-IN)2I385PW (CPU board) :LVDS, Touch Screen, DIO , 2 x PCIe mini card, Audio Amp ,

2 x 80-pin connector : 4 x COM, 7x USB,1 x PCIe, PS2 KB/MS,VGA, HDMI ,2 x, Audio, Wide Range DC –IN

Intel IVY Bridge 1047UE/i3/i7DDR3 1333/1600

Intel Panther Point(PCH) HM76

3I847HW (Wafer IO ,2 x GbE, USB , Wide range DC-IN, CPC (option) 3I847NM (1 x GbE, 4 x PoE LAN, USB ,HDMI, CPC, LVDS, Wide range DC-IN)3I847A/CW (2 x GbE, USB , CPC(option) , LVDS, Wide range DC-IN)2I847H (Wafer IO connector board,1 x GbE, USB )

Intel Cedarivew N2800

DDR3 1066Intel Cedarview-M

+ ICH10 3I280CM (4 x USB, 2 x GbE, Wide Range DC-IN. CPC )

Intel CedarView N2600/N2800

DDR3 800/1066

Intel CedarView-M+ NM10 2I268HW (Wafer IO,1 x GbE, DVI & HDMI, LVDS, Touch Screen, Wide range DC-IN)

3I268A/CW/L (2 x GbE, 6 x COM, VGA,LVDS, Touch Screen, Wide range DC-IN,)

Page 26: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE

Processor Chipset Feature

Intel Broadwell-U processor, DDR3L 1333/1600 Intel Broadwell-U 3I860A/CW (2 x HDMI, 4 x GbE, 5 xUSB,6 x COM,LVDS & Touch Screen, Wide Range DC

IN,PCIE4x golden finger)

Intel SoC E38XX/D1900 DDR3L 1066/1333 Intel SoC Baytrail

2I385A/CW (2 x GbE, USB ,VGA, COM, LVDS, Touch screen, Wide Range DC-IN )3I380D (4 x GbE, COM,VGA, HDMI, USB )2I385S (2 x GbE, HDMI,mini HDMI,3 x USB, Audio) 2I385PW (CPU board) :LVDS, Touch Screen, DIO , 2 x PCIe mini card, Audio Amp ,

2 x 80-pin connector : 4 x COM, 7x USB,1 x PCIe, PS2 KB/MS,VGA, HDMI ,2 x, Audio, Wide Range DC –IN

InteI IVY Bridge 1047UE / i3 / i7DDR3 1333/1600

Intel Panther Point(PCH) HM76

3I847CW (2 x GbE, USB 3.0, DVI & HDMI , Wide range DC-IN)3I847D (HDMI,5x GbE LAN, USB, Mini Card PCIe )

Intel Cedarview N2600DDR3 800

Intel Cedarview-M + NM10

2I260D (HDMI, 3 x GbE, 2 x USB)2I260A (1 x Realtek GbE, DVI & HDMI )

Intel CedarView N2600

DDR3 800Intel CedarView-M

+ ICH10 3I260D ( 4 x Realtek GbE, VGA , COM )

Intel IVY Bridge processorDDR3 1333/1600

Intel Panther Point(PCH) QM77

3I770A/CW (2 x GbE, USB ,HDMI, LVDS/Touch Screen, Wide range DC-IN)

VIA E-Series Nano DDR3 1066 VIA VX900 3V900D (3 x Realtek LAN, VGA, 3 x USB)

3I380D

Page 27: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE

Processor Chipset Feature

Intel Broadwell-U processor, DDR3L 1333/1600 Intel Broadwell-U 3I860A/CW (2 x HDMI, 4 x GbE, 5 xUSB,6 x COM,LVDS & Touch Screen, Wide Range DC IN,

PCIE 4x golden finger)

Intel SoC E38XX DDR3L 1066/1333 Intel SoC Baytrail

3I380CW (2 x GbE, Car Power Control, USB , HDMI, LVDS & Touch screen, Wide Range DC-IN)2I380A (1 x GbE, USB 3.0, HDMI, VGA,COM )2I385A/CW (2 x GbE, COM, LVDS, Touch Screen, VGA, USB , Wide Range DC-IN )2I385PW (CPU board) :LVDS, Touch Screen, DIO , 2 x PCIe mini card, Audio Amp ,

2 x 80-pin connector : 4 x COM, 7x USB,1 x PCIe, PS2 KB/MS,VGA, HDMI ,2 x, Audio, Wide Range DC –IN

Intel IVY Bridge processorDDR3 1333/1600

Intel Panther Point(PCH) QM77

3I770A/CW (2 x GbE, USB ,VGA,HDMI, LVDS/Touch Screen, Wide range DC-IN)

Intel IVY Bridge 1047UE / i3 / i7DDR3 1333/1600

Intel Panther Point(PCH) HM76

3I847CW (DVI & HDMI,2 x GbE, USB, Wide Range DC-IN)CI847CW (DVI & HDMI, 4 x GbE, USB 3.0, Wide Range DC-IN)

Intel IVY Bridge DDR3 1333 Intel QM77 CI770C (HDMI, DVI/VGA, 6~10 x COM, 9 x USB )

Intel CedarView N2600/N2800

DDR3 800/1066Intel CedarView-M +

NM102I268C (1 x Realtek GbE, DVI, LVDS, Touch Screen,) 3I268A/CWL (2 x GbE, 6 x COM, VGA,LVDS, Touch Screen, Wide range DC-IN,)

VIA E-Series Nano DDR3 1066 VIA VX900 3V900C (HDMI, H.264 decode, 18/24 dual channel LVDS)

3I380CW

Page 28: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE

Processor Chipset Feature

Intel Broadwell-U processor, DDR3L 1333/1600 Intel Broadwell-U 3I860A/CW (2 x

HDMI, 4 x GbE, 5 xUSB,6 x COM,LVDS & Touch Screen, Wide Range DC IN, PCIE 4x golden finger)

Intel SoC E38XXDDR3L 1066/1333 Intel SoC Baytrail

3I380NX ( 4 x PoE LAN, USB, VGA,COM,HDMI, Wide Range DC-IN)2I385PW (CPU board) :LVDS, Touch Screen, DIO , 2 x PCIe

mini card, Audio Amp , 2 x 80-pin connector : 4 x COM, 7x USB,1 x PCIe, PS2 KB/MS, VGA, HDMI ,2 x, Audio, Wide

Range DC –IN

InteI IVY Bridge 1047UE / i3 / i7DDR3 1333/1600

Intel Pather Point(PCH) HM76

3I847NM (HDMI,1x GbE, 4 x PoE, VGA.USB,COM, CPC, Wide range DC-IN)3I847NX (HDMI,1x GbE, VGA,4 x PoE, USB,COM, Wide range DC-IN)

3I847NM

Page 29: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE

Processor Chipset Feature

Intel Broadwell-U processor, DDR3L 1333/1600 Intel Broadwell-U 3I860A/CW (2 x HDMI, 4 x GbE, 5 xUSB,6 x COM,LVDS & Touch Screen,

Wide Range DC IN, PCIE 4x golden finger)

Intel IVY Bridge processorDDR3 1333/1600

Intel Panther Point(PCH) QM77

3I770A/CW (2 x GbE, USB ,HDMI,VGA, LVDS/Touch Screen, Wide range DC-IN)

Intel SoC E38XX/J1900

DDR3L 1066/1333Intel SoC Baytrail

3I380CW (2 x GbE, LVDS &Touch Screen, USB , HDMI, Wide Range DC-IN)2I380A (1 x GbE, USB 3.0, HDMI, Audio,COM )2I385A/CW (2 x GbE, COM, LVDS, Touch Screen, VGA,COM, USB, Wide Rang DC-IN )2I385S (HDMI, mini HDMI, 2 x GbE, USB, Micro-USB)

Intel IVY Bridge 1047UE / i3 / i7DDR31333/1600

Intel Panther Point(PCH) HM76 3I847CW (2 x GbE, USB 3.0, DVI & HDMI , Wide range DC-IN)

Intel CedarView N2600

DDR3 800Intel CedarView-M

+ NM102I260A (1 x Realtek GbE, DVI & HDMI ) 3I268A/CW/L (2 x GbE, USB,VGA, 6 x COM,LVDS, Touch Screen,Wide range DC-IN,)

VIA E-Series Nano DDR3 1066 VIA VX900 3V900A (HDMI, H.264 decode, SPDIF (option))

3I770CW

Page 30: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE

Model Name BLADE BLADE HDD ANT TWIN MIRO-2

Dimensions mm 150W x 80.8D x 18H 150W x 80.8D x 42H 135W x 85D x 30H 145 x 89.3D x 35H 140 x 92D x 37H (mSATA) 140 x 92D x 64H (2.5” HDD)

Storage mSATA mSATA/2.5” HDD mSATA mSATA2.5”HDD(2I385S )

mSATA2.5”HDD

Material Aluminum Aluminum Aluminum Aluminum Aluminum

Weight 0.26 kg 0.47 kg 0.5 kg 0.7 kg 0.5 kg/0.75kg

ANT

TWIN

MIRO -2BLADE

BLADE HDD

Page 31: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE

Model TINO TINO 2PCI TWISTER NEO

Dimensions mm 245W x 177D x 68H 268W x 182D x 110H 300W x 200D x 75H 275W x 172D x 50H

Storage

1 x 2.5” HDD for 20 x 15 MB

2 x 2.5” HDD for 3.5” MB 2.5” HDD + 2 x PCI 2.5” HDD + PCI card or 3.5” HDD 2.5” HDD

Material Aluminum

Weight 2.9 kg 3 kg 2.9 kg 2 kg

Page 32: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE

Model UNO BRIK CUBE BLOK LEO TWITTER TIGER MIRO-3

Dimensions mm (W x D x H)

180 x 125 x 42 187 x 130 x 52 178 x 116 x 55 195 x 138 x 70 246 x 124 x 50 210 x 125 x 55 190.8 x 130 x 58.5190.8 x 195 x 58.5

178x 116 x 72.9178x 116 x 90.9

Storage 2.5” HDD 2.5” HDD 2.5” HDD 2.5” HDD 2.5” HDD 2.5” HDD 2.5” HDD 2.5” HDD

Material Aluminum +Plastics Aluminum Aluminum +

SECCAluminum +

SECC Aluminum Aluminum Aluminum Aluminum

Weight 1 kg 1.3 kg 1 kg 1.4 kg 1.22 kg 1.22 kg 2.2kg 1.5kG/1.75kg

UNO

BRIK

CUBE

BLOK

LEO

TWITTER

TIGER

MIRO-3

Page 33: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE

Model 1U FANLESS Half 1U FANLESS Half 1U w/ FAN

Dimensions mm 440W x 360D x 44.3H 440W x 218.8D x 44.3H 442W x 214D x 44.5H

M/B Q’ty 1~2 1~2 1~2

Storage 1 x 3.5”HDD or 2.5” HDD 1 x 3.5” HDD or 2.5” HDD 1 x 3.5” HDD or 2.5” HDD

Option Slim CD-RON / LCM / Extra USB, COM, PS2 KB&MS, GPIO, AUDIO, IEEE1394, PCI card, 3G, GPS, Bluetooth, WiFi, VGA

Half 1U FANLESS with 2 pcs Mother board

Page 34: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE

Panel Size 7” 10.1” 13.3”

Dimensions 189.7W x 40H x 122.5D mm 250W x 40H x 168D mm 349.2W x 40H x 220.8D mm

Weight 1.5 kg 1.8kg2 kg ( waterproof )

2.2 kg2.5 kg (waterproof)

Hard Drive mSATA mSATA, 2.5” HDD mSATA, 2.5” HDD

Max Resolution WSVGA 1024 x 600 WSVGA 1024 x 800 WSVGA 1366 x 768

Backlight LED LED LED

Touch Screen Resistive Touch Resistive Touch Resistive Touch

Mounting Spac. VESA 75,Panel Mount

VESA 75,Panel Mount

VESA 75/100,Panel Mount

Waterproof IP65 IP65/IP66/IP67 IP65/IP66/IP67

Page 35: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE

Panel Size 10.4” 12.1” 15” 21.5”

Dimensions 279.5W x 231D x 54H mm 323.5W x 268D x 54H mm 385 W x 317,5D x 55.9D mm 548 W x 328.6,D x 64D mm

Weight 2.5 kg 3 kg 4 kg 6 kg

Hard Drive 2.5” HDD 2.5” HDD 2.5”HDD 2.5”HDD

Max Resolution SVGA 800 x 600 (4:3)XGA 1024 x 768 (option) XGA 1024 x 768(4:3) XGA 1024 x 768(4:3) WUXGA 1920 x 1080(16:9)

Backlight LED LED LED LED

Touch Screen Resistive Touch Resistive Touch Resistive Touch Capacitive Touch

Mounting Spac. VESA 75,Panel Mount

VESA 75,Panel Mount

VESA 75,Panel Mount

VESA 75,Panel Mount

Waterproof IP65/IP66/IP67 IP65/IP66/IP67 IP65/66/IP67 IP65/66

Page 36: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE

Panel Size 8.4” 17”

Dimensions 254W x 190H x 58D mm 413W x 343H x 79.5D mm

Weight 2.5 kg 4.89 kg

Hard Drive 2.5” HDD 2.5”HDD

Max Resolution SVGA 800 x 600 SXGA 1280 x 1024

Backlight LED LED

Touch Screen Resistive Touch Resistive Touch

Mounting Spac. VESA 75,Panel Mount

VESA 75/100,Panel Mount

Waterproof IP65 IP65

Page 37: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE

Panel Size 7” 10.2” 15.6”

Dimensions 189W x 128H x 58D 286W x 190H x 60D mm 408W x 265H x 55.5D mm

Weight 1.2 kg 2.5 kg 2 kg

Hard Drive 2.5” HDD 2.5” HDD 2.5”/3.5” HDD

Max Resolution WSVGA 1024 x 600 WSVGA 1024 x 600 HD 1366 x 768

Backlight LED LED LED

Touch Screen Resistive Touch(Capacitive by Option) Resistive Touch Resistive Touch

Mounting Spac. VESA 75 VESA 75/100 VESA 75/100

Waterproof IP65 IP65 IP65

Page 38: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE

Panel Size 8.4" 10.4” 12.1” 15” 21.5”

Dimension 254W x 190H x 42D mm 287.6W x 245H x 44D mm 320.3W x 275H x 43D mm 384W x 312H x 45D mm 548W x 328.6H x 45D mm

Resolution SVGA 800 x 600 SVGA 800 x 600 SVGA 800 x 600 XGA 1024 x 768 WUXGA 1920 x 1080

Brightness 450 400 450 350 250

Contrast Ratio 600:1 700:1 700:1 700:1 1000:1

Touch Screen Resistive Touch Resistive Touch Resistive Touch Resistive Touch Capacitive Touch

Mounting Spec. VESA 75 VESA 75 / 100 VESA 75 / 100 VESA 75 / 100 VESA 75

waterproof IP65 IP65 IP65 IP65 IP65

Page 39: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE

Interface Model Name & Function Optional Model

PCI Express card E617A (4 x PoE 10/100/1000 BaseT(X) 802.3 af ; 12V DC input / 48V DC output

Mini PCIe card M574A-G (1 x Realtek 8111C 10/100/1000 Mbps LAN)

Mini PCIe card M574A-U (1 x Intel 82574 L 10/100/1000 Mbps LAN)

Mini PCIe Card M212A ( 1~2 Intel 1210IT 10/100/1000 Mbps LAN) Work with CL001/CL002

PCI Express Card E214B( 4 x Intel I210(IT) 10/100/10000 Mbps LAN, LAN by pass,)

PCI card ADSL2+Modem (PCI Golden finger or LAN link )

PoE Ethernet Switch NW617A (1 x Port GbE LAN + 4 x Port PoE on GbE LAN Switch) NW617A-5L

PCI card P811B-4R (4 x 10/100 Mbps Realtek LAN and 1 x Mini PCI socket )

NW617A :1 x GbE LAN +4 ports 802.3af PoE Ethernet Switch

Page 40: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE

Interface Model Name & Function

USB 2.0 Bluetooth (Bluetooth 2.0 + EDR support)

Mini PCIe card 3G/4G ( HSPA/UMTS, EDGE/GPRS/GSM, EV-DO/CDMA)

Mini PCIe card Wi-Fi

Mini PCIe card GPS

Bluetooth 3G/4G Wi Fi GPS

Page 41: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE

Model Name Interface Feature

M878A Mini PCI card Video capture card for 1~4 CH video input

M858A Mini PCIe card 8CH D1 video in & 8CH Audio in

1CH HD -SDI Mini PCIe card 1CH HD-SDI Video Capture Card

M878A

M858A 8CH D1surveillance card

1CH HD-SDIVideo Capture card

Page 42: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE

Model Name Interface Feature

M465A SBC USB wafer USB to SD card

CF006 SATA SATA to CFast slot

USB to SD card SATA to CFast slot

Page 43: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE

Model Name Interface Function Note

CN030 PCIe & USB 1 x SIM card Mini PCIe card

CN041 USB 2.0 2 x Mini PCIe & 2 SIM card GPRS/3G/3.5G

CC104 SBC COM wafer RS232 to ISO RS422-485

M954A Mini PCIe card Mini PCIe to 4 x RS232 or RS 422

M303A USB 2.0 USB to RS232 or RS485

CN045 2.0 wafer connector RS232 signal convert to RJ45 connector

M750A Mini PCIe card 2 x VGA or 1 x DVI + 1 x VGA 1920 x 1080 Resolution

M643A Mini PCIe card 3 x IEEE 1394 a/b Work w/ CN039

CN 041 back

CN 041Front

Page 44: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE

Riser card

RS203 (1 PCI) extend to 2 PCIe x1 For CI770 /847 w/ TINO 2PCI system

RS204 (1 PCI)extend to 2 PCIe x 1 For CI770 /847 w/ 1 U system

RS211 (1 PCI )extend to 1 PCI +1 PCIex1 For 1U with CI770, CI847

RS215 (1 PCI) extend to 1 PCI For Twister/ TINO with CI770, CI847

RS221 (1 PCI) extend to 2 PCI For 1U with CI770, CI847

RS222 (1 PCI) extend to 2 PCI For TINO -2 PCI with CI770, CI847

RS223 (1 PCI) extend to 1 PCI+1 PCIex1 For TINO -2 PCI with CI770, CI847

RS403 (PCI) extend to 1 PCI Express x4 Slot For TINO-2 x PCI with CI770A/C

RS404 (PCI) extend to 1 PCI Express x4 Slot For 1U with CI770A/C

RS405 (PCI) extend to 1 PCI Express x4 Slot For Twister with CI770A/C

Power board

Model Name Function Note

PW201 . DC IN: +9V to +36V, Adjustable power ON/OFF delay time. CPC Hardware and Software DC Out: 12V/5A

PW202. DC IN: +15V to +36V,. Adjustable power ON/OFF delay

time. CPC Hardware and Software

DC Out: 12V/10A

PW203 Battery Charger board Dual power for Master & Slave vin.

PW301 PoE IN to ISO DC 12V

PW302 PoE IN to ISO DC 12V & Charger 2S

PW351 1 x PoE OUT board

PW352 2 x PoE OUT board

PW403 Battery Charger board ( DC +12V/24V IN) DC Out: 12V/2.5A

PW405 Battery Charger board ( Wide Range DC IN)Support 2S Battery Pack DC Out: 12V/5A

Power On/off delay module

Page 45: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE

Digital I/O card

Model Name Function Note

CIO104 4 x DI or 4 x DO or 2 x DI+2 x DO (1 Power Relay + 1 SSR) CIO104-2I2O

CIO108 8 x DI or 8 x DO or 4 x DI+4 x DO(2 Power Relay + 2 SSR) CIO108-4I4O

CN034 4 DI + 4 DO ( 8 DI + 2 x DO OEM )

Mount Kits

VESA mounting kits For Panel PC / Touch monitorFor LEO / TWITTER / UNO / BRIK / CUBE

VESA 75 /100

System Wall mount kits For NEO / TWISTER / TINO

DIN Rail mounting kits For DIN Rail MIRO-2/ MIRO-3

Isolator 4 DI and 4 DO

Page 46: Embedded Solution Product Roadmap · Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap Networking, Railway/Car PC, PoE

For more information, please visit our websitehttp://www.lex.com.tw

OFFICE EmailTAIWAN Headquarters [email protected]

EUROPE Headquarters [email protected]

Russia Branch [email protected]

USA Branch [email protected]

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