electronic products august 2013

electronicproducts.comA Hearst Business Publication

AUGUST 2013

Also In This ISSUE:Flash Memory Summit preview

UFS The next generation of embedded storage

Smarter, slimmer power supplies

Best performance in a leading role.

Histogram for a statistical viewTrend chart to see trends over time

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Electronic Products Magazine (USPS 539490) (ISSN 0013-4953)Published monthly by Hearst Business Communications Inc./UTP Division, 50 Charles Lindbergh Blvd., Suite 100, Uniondale, NY 11553. Periodicals postage paid Garden City, NY and additional mailing offices. Electronic Products is distributed at no charge to qualified persons actively engaged in the authorization, recommenda-tion or specification of electronic components, instruments, materials, systems and subsystems. The publisher reserves the right to reject any subscription on the basis of information submitted in order to comply with audit regulations. Paid subscriptions available: U.S. subscriber rate $65 per year, 2 years $110. Single issue, $6.00. Information contained herein is subject to change without notice. No responsibility is assumed by the publisher for its accuracy or completeness.

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4 Contents

AUGUST 2013 electronicproducts.com ELECTRONIC PRODUCTS

Features19 Digital ICs:UFS The next generation of embedded storage

Universal Flash Storage is set to improve embedded system performance

24 Energy-Saving Initiative Series:Semiconductor advances make smarter, slimmer power suppliesAs equipment becomes smarter, maximizing energy efficiency and usage modes, power supplies can also act smarter by using the latest power semiconductor innovations

Vol. 56, No.3 August 2013

Cover Story28 HCC ultrasound advances diagnostic clinical

proceduresCutting-edge ultrasound re-search requires a high-channel-count (HCC) system that can interface to large matrix arrays

Touch Points6 Viewpoint: Undercover medical research

8 The Story Behind the Story: Dc/dc converters with more functionality, flexibility, power

11 Outlook (Technology News): Flash Memory Summit 2013 Santa Clara Next-gen LED shows new promise

22 Product Trends: Transportation electronics

34 Product Roundup: Sensors and transducers

38 Product Update: Packaging, cabinets, and enclosures

New Products41 Power Sources 45 Packaging & Interconnections43 Components & Subassemblies 46 Optoelectronics44 Test & Measurement 47 Integrated Circuits

34

11

19

Only OnlineElectronicproducts.com

Education Center:

How to turn a window, table top, and TV screen into a touchscreen device

First exoskeleton robot to mimic human motions

3D-printing artificial bone and nacre

Massive rocket explosion due to technician putting sensors in upside down

Keller Rinaudo talks about his new soft-ware which turns iPhones into personal robots

Throwable camera captures sharp, aerial photos and video that dont induce motion sickness

Handibot: A 3D milling and carpentry robot that does the work for you

Whats It Worth: Early Digital Meters and Displays

Cove

r Im

ages

: Dig

ital i

mag

ery

by D

on W

ilber

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AUGUST 2013 electronicproducts.com ElEcTronic ProdUcTS

6 Viewpoint

Undercover medical research

No one can say I don't put 100% of myself into my work. In preparing for this, our annual Medical Technology issue, I actually developed cholelithiasis (gall stones) and, for the first time since I was born, was admitted to a hospi-tal Long Island College Hospital, a part of SUNY Downstate Medical Center for an operation.

From the emergency room, I was quickly transported to radiology where I expected I would be given some sort of X ray or MRI. Imagine my surprise, when I was wheeled up next to an ultrasonography machine. I explained to the technician that I was fairly certain I was not pregnant, which is the only instance I knew of from prior experience in which ultrasound was used. But sure enough, when she applied the wand to my torso, there was a gall stone about the size of a golf ball nicely lodged in my gallbladder.

The ultrasound specialist explained to me that diagnostic ul-trasonography is being used today as an imaging technique for looking at all sorts of internal body structures: muscles, joints, internal organs, and so on. Not only is ultrasound being used for diagnosis, it is also being used theraputically, bringing heat or vibration to bear. Hence it can be used to clean teeth, treat cysts or tumors, break up kidney stones, and remove cataracts.

As the feature article on page28 by Danny Kreindler, Cephasonics' Senior Director of Technical Marketing and FAE,

explains, ultrasound's potential for medical applications is now being widely explored at research institutions, particularly using multichannel ultrasound. As he says, "Ultrasound is the modality of choice due to more and better data throughput, higher-resolution imaging, decreasing cost, and less patient risk." A few of the areas being explored are the use of 2D arrays of ultrasound sensors to create highly detailed 3D images, a less painful alternative to mammography, and remote diagnosis.

Thanks to such technologies and MEMS and wireless communications, sensors are playing an ever-increasing role in medicine and healthcare. In the on-line issue, you'll find articles by Freescale Semiconductor, Renesas, and Microchip Technol-ogythat give particular examples of how those technologies are changing the face of medicine.

But after spending a week in the hospital, the thing for which I was most gratefulwas the attention of the doctors, nurses, and orderlies who made my stay more comfortable and pleasant than I had reason to expect. On leaving, I jokingly told the staff that I planned to spend my next vacation there. The more technology can do to make it possible for patients to receive the type of individual attention I did, the more it will truly benefit all of us.

Richard Comerford To comment: http://bit.ly/15L10ew

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Mouser and Mouser Electronics are registered trademarks of Mouser Electronics, Inc. Other products, logos, and company names mentioned herein, may be trademarks of their respective owners.

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8 Story Behind the Story


A look at the making of POY award winnersElectronic PRODUCTS

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The Ericsson BM456/457 dc/dc converters are the first models in the second genera-tion of digital Advanced Bus Converter (ABC) products. They target information and communication technology (ICT) companies that need more advanced functionality and higher levels of flexibility from board-mounted power source manufacturers. To achieve this, designers are now combining at the board level a number of power units that integrate PMBus interfaces, such as power interface modules, ABCs, and PoL regu-lators. In addition, the datacom industry, working on an ac-source and converting via narrow-output voltage rectifiers to 48 or 52 V, require an increased level of output power per quarter-brick module, provided by these Ericsson products.

e company used a small core design team that was supported by dedicated re-sources from di erent design units including thermal simulation and veri cation to develop the dc/dc converters. eir biggest challenge was developing a new product at the same time as a new control IC plus rmware. When they were developing the rst ABC platform called FRIDA I and integrated digital control and power management, the company explored new ways to optimize energy utilization and make it possible for system architects to increase the integration of dc/dc converters within the rest of the digital chain. Working in close cooperation with silicon vendors,Ericsson achieved the de-velopment of such a product, but also faced an immediate demand for more advanced features and an increased level of power required by the datacom industry.

Increasing the level of functionality and making the power module even more e cient meant that the R&D team had to signi cantly increase the level of embedded so ware ( rmware) while also increasing the number of commands executed by the processor. As there was no suitable control IC available, they had to work in close cooperation with silicon vendors to develop the new control IC for the second-generation FRIDA II, in parallel with developing the product.

In addition to the complexity of developing a new platform at the same time as the con-trol IC, there was an additional level of complexity with the development of new algorithms to optimize the built-in power management. Very few so ware designers combine pow-er-switching expertise with knowledge of developing complex program algorithms.

e development of the rmware requiredthe teamto take a step-by-step approach and develop a process for design, veri cation, and validation, and nally function-by-function implementation. In the development of this new process, the most di cult part was to bal-ance functionality with processing power. e switching cycle and timing events, combined with analog delays and sampling limitations, called not only for accuracy, but also thorough veri cations and quality checks.

e result of this process was the Ericsson Energy Optimizer Firmware, which optimiz-es operational parameters to any type of load or line transients such in the case of ATCA switching from Feed A to Feed B.

is type of complex project normally takes about 36 months. However, due to the exper-tise gained from the rst-generation FRIDA I, by combining the development of so ware and rmware in a single core team, together with the companys knowledgeof energy management and dedicated algorithms,creating theBM456/457 dc/dc converterstook only 18 months.

Paul OShea

Dc/dc converters with more functionality, flexibility, power

Core members of the BM456/457 design team (le to right): Henrik Borgengren, Anders Kullman, Fredrik Wahledow, Jonas Malmberg, and Jan Arvidsson.

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Outlook 11Innovations impacting product, technology and applications

ELECTRONIC PRODUCTS electronicproducts.com AUGUST 2013

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EMC (www.emc.com) will have on handits XtremSF PCIe flash hardware that is deployed in servers to dramatically improve application performance by reducing latency and acceler-ating throughput. XtremSF can also be used in conjunction with server flash caching software from EMC for accelerated read performance with data protection.

HGST (www.hgst.com) will be at booth 606 demonstrating new 12-Gbit/s SAS SSDs that have high performance, three endur-ance-level options, capacity up to 1 Tbyte, and proven reliability. The companies Ultrastar SLC and MLC drives fit the enterprise where it is critical that they integrate seamlessly in tiered storage environments.

PNY (www3.pny.com) will talk to you in booth 414 aboutthe company'sendurance promise that offers peace of mind for solid-state drives with up to 10k program/erase cycles, so you can easily choose the right drive based on your needs. They feature capacities up to 480 Gbytes and performance up to 550 Mbytes/s.

Viking Technology (www.vikingtechnology.com) will show you its ArxCis-NV nonvolatile DDR3 DIMM memory in booth 508. It

Starting Monday August 12, at its regular spot in the Santa Clara Convention Center, the Flash Memory Summit and Exhibition will again bring together just about anybody who has knowledge and interest innonvolatile memory. Monday is reserved for four in-depth seminars, followed by a reception from 5:30 to 7 p.m. The regular conference starts Tuesday with a full gaggle of 1-hour talks that continue until 6 p.m. on Thursday. There will be11 half-hour keynote presentations given during the three conference days.

The exhibit floor is open on Wednesday (noon to 2 and 5 to 7:30 p.m.) and Thursday (noon to 2 p.m.). Here are just a few of the many interesting products being shown on the exhibit floor:

LSI Sandforce (www.lsi.com), in booth 402, will show you a new SSD NAND flash controller delivering the endurance, reli-ability, and performance customers require, even as flash memory geometries shrink.

PMC (http://pmcs.com), a leading provider of enterprise storage system solutions for networked and server storage applications, will showcase 12-Gbit/s SAS and PCIe Gen 3 solutions. They will be happy to explain how NAND vendors and storage OEMs can design managed enterprise flash solutions using off-the-shelf MLC and SLC NAND devices.

Flash Memory Summit 2013 Santa ClaraKey nonvolatile storage conference expects 4,000 attendees

12 OutlookInnovations impacting product, technology and applications


Next-gen LED shows new promiseResearchers from the Smart Lighting Engineering Research Center at Rensselaer Polytechnic Institute (RPI) have success-fully integrated an LED and a power transistor on the same gal-lium nitride (GaN) chip. This innovation could open the door to a new generation of LED technology that is less expensive to manufacture, significantly more efficient, and one that enables new functionalities and applications beyond illumination.

At the heart of these LED lighting systems are chips made from GaN. For the LED to function, many external compo-nents such as inductors, capacitors, silicon interconnects, and wires must be installed on or integrated into the chip. The large size of the chip, with all of these necessary com-ponents, compli-cates the design and performance of LED lighting products. Additionally, the process of assembling these complex LED lighting systems can

Fig. 1: A cross-section of the new monolithically integrated GaN LED and HEMT developed by engineers at Rensselaer.DATA MODUL Inc.

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Silicon Motion Technology (www.siliconmotion.com) will demonstrate their SM2246 SATA 6-Gbit/s controller in booth 615. It targets PC/ultrabook and tablet applications, with ultra-low power consumption and support for the Toggle/ONFI 3.0/Async interface.

Skyera (www.skyera.com) has leveraged experience in ad-vanced networking and chip design to build skyHawk, a vertically integrated hardware and software solution that combines a pur-pose-built flash storage array and a rich feature set of software tools.

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14 OutlookInnovations impacting product, technology and applications


Fig. 2: Researchers from Smart Lighting Engineering Research Center at RPI have integrated an LED and HEMT structure on the same GaN chip. The device is seen on the left with the LED on the right.

be slow, manually intensive, and expensive.The study, done by a research team led by T. Paul Chow, professor in the

Department of Electrical, Computer, and Systems Engineering (ECSE) at RPI, sought to solve the challenge by developing a chip with components all made from GaN. This type of monolithically integrated chip simplifies LED device manufacturing, with fewer assembly steps and less required auto-mation. Additionally, the LED devices made with monolithically integrated chips will have fewer parts to malfunction, higher energy efficiency and cost

effectiveness, and greater lighting design flexibility.

Chow and the research team grew a GaN LED structure directly on top of a GaN high-electron-mobility transistor (HEMT) structure. They used several basic techniques to interconnect the two regions, creating what they are calling the first monolithic integration of a HEMT and an LED on the same GaN-based chip. The device, grown on a sapphire substrate, demonstrated light output and light density comparable to standard GaN LED devices. Chow said the study is an important step toward the creation of a new class of optoelectronic device called a light emitting integrated circuit (LEIC).

The LEIC will play a pivotal role in cost-effective monolithic integration of electronics and LED technology for new smart lighting applications and more efficient LED lighting systems, according to Mr. Chow.

This new study, and the device we have created, is just the tip of the ice-berg, said Smart Lighting ERC Director Robert Karlicek, a co-author of the study and ECSE professor at Rensselaer. LEICs will result in even higher energy efficiency of LED lighting systems. But what will be even more exciting are the new devices, new applications, and new breakthroughs enabled by LEICsthey will truly usher in the era of smart lighting.

Visit http://tinyurl.com/qhfkeh3 for additional information.

Paul OShea

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16 Engineering Distribution


IN PARTNERSHIP WITH

Medical ApplicationsMagnetic Resonance Imaging (MRI)

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Magnetic Resonance Imaging: Some Key Components

As noted on the opposite page, magnetic resonance imaging (MRI) is a non-invasive diagnostic technology for taking very clear and detailed pictures of tissues and internal organs using high-frequency radio waves delivered in pulses and a strong magnetic field. The magnetic field forces hydrogen atoms in the body into a particular alignment (resonance). Radio frequency energy is then distributed over the patient, which is disrupted by body tissue. The disruptions correspond to varying return signals that, when processed, create the image. In this article we'll look at the role played by three product types used in the signal path whose accurate processing of MRI signals is essential to obtaining high-quality images: DACs, DSPs, and power amplifiers.

Given adequate support circuitry, component selection and proper layout, higher DAC precision produces sharper MRI image resolution. For controlling the magnetic and RF energy in an MRI, high-resolution, high-speed DACs are needed. High resolution is required to accurately define the area of the patient to be scanned. High-speed is necessary where the signals for the predominant 1.5- and 3-Tesla systems are approximately 64 and 128 MHz.

Fortunately, advances in semiconductor processing, DAC architecture, and fast on-chip calibration techniques make possible highly linear, stable, fast-settling DACs which provide controllable precision voltages. The Analog Devices AD5791 (Fig. 1), for example, is a single, 20-bit, serial input, 1-ppm-accurate voltage output DAC that operates from a bipolar supply of up to 33 V. Besides its impressive linearity, the AD5791 combines a low 0.05-ppm/C temperature drift, 1-s settling time, 0.6-Vp-p noise in the 0.1 to 10-Hz frequency band and better-than-1-ppm long-term stability. Analog Devices also offers its EVAL-AD5791, a full-featured evaluation board designed to allow the user to easily evaluate all features of the AD5791 voltage-output 20-bit DAC.

Accurate signal processing is essential to obtaining high-quality MRI images. DSPs can be used to properly control the magnets in the MRI system. A DSP can also take care of preprocessing the signal before it reaches the image reconstruction engine. The TI TMS320C6672 DSP (Fig. 2) is the highest-performance fixed/floating-point DSP based on TI's KeyStone multi-core architecture. Incorporating the C66x DSP core, this device can run at a core speed of up to 1.5 GHz. TI's TMS320C6672 DSP combines both fixed and floating point performance, an increased number of peripherals and memory per core, offers 3-GHz cumulative DSP and is fully backward compatible with TI's existing C6000 family of DSPs. The C6672 device has a complete set of development tools, which include an enhanced C compiler, an assembly optimizer to simplify programming and scheduling, and a Windows debugger interface for visibility into source-code execution.

Radio frequency power amplifiers (RFPAs) for MRI are designed to take a relatively weak RF signal and boost it up to a stronger RF signal. How well this is done can have a direct impact on signal-to-noise ratio (SNR) and other parameters that can become clearly visible in MRI scans. (For example, failure to achieve the desired noise levels can lead to "ghosting" artifacts in the image.) Based on the STMicroelectronics STAC4932B RF power transistors, the company's STEVAL-IMR002V1 demonstration board helps designers implement a 2-kW 100-V 123-MHz Class AB peak power amplifier (PPA) for 3-Tesla MRI applications. It uses double push-pull bolt-down devices, two STAC4932B N-channel MOSFETs and can exceed 2,000 W at 123 MHz with large signal gain of 19 dB in Class AB and a drain efficiency of 60%.

With Mouser expanding its Medical Applications website, engineers will find a new MRI section with resources listed by supplier to bring them up to date on the newest technology and design developments. An interactive block diagram is used for easy navigation to a broad selection of products.

BY MURRAY SLOVICK

Fig. 1: Analog Devices AD5791 20-bit DAC.

Fig. 2: Functional diagram of TI TMS320C6672.

Engineering Distribution 17

ELECTRONIC PRODUCTS electronicproducts.com AUGUST 2013

IN PARTNERSHIP WITH

MRI Technology and Semiconductors: Worth Closer Examination

Magnetic resonance imaging (MRI), first introduced in hospitals in the early 1980s, is one of the most useful imaging techniques for medical diagnostics. MRI provides very clear and detailed pictures of tissues and internal organs using a strong magnetic field and high-frequency radio waves delivered in pulses. MRI offers images with excellent contrast between soft tissues. MRI images can differ in con-trast based upon the specific imaging technique used. This is different from ultrasound, X-rays, or computed tomography, which use only absorption, reflection, or scattering to form images. Since MRI does not expose the patient to radiation and has many other advantages, applications for MRI have grown very broad. Specifically, it is well suited for cardiology and in diagnosing cancer, stroke, and brain disorders.

For clinical use, MRIs use 1.5- or 3-Tesla magnets, a measure of magnetic field strength. The natural magnetic flux at the earths surface is only about 50 T. MRI resolution improves with a lower signal-to-noise ratio (SNR), which improves with an increasing magnetic field strength. In the MRI chamber, atoms in the body are literally magnetized, and pulsed RF is shot at the patient. The pulse resonates with the magnetized nuclei at a selected frequency. This flips the spin on

all resonating nuclei to align them in the same direction, and is called nuclear magnetic resonance (NMR). NMR is created in the patients body one slice at a time.

The magnetic resonance at the nuclear level is strong enough to induce a perceivable current in the nearby RF coil. This induced current is a signal that can be amplified with very sensitive electronics that are specifically designed to reduce electrical noise in the system. Noise competes with and corrupts the MRI signal. Accurate, precision devices that introduce the least noise and are stable over varying temperatures are required. Analog Devices new family of precision voltage reference chips (ADR45xx) introduce less than 1 Vp-p (peak-to-peak) to a VOUT of 2.048. For MRI, high speed is also a necessary attribute to rapidly communicate and process large amounts of imaging data.

In an MRI, once the signal is captured, magnetized nuclei spin-states return to normal in an exponential decay. The decay is also exploited to manipulate image contrast for diagnostics. RF pulses are repeated with varying amplitudes in every slice.

MRI allows detailed contrast manipulation, which dramatically enhances the diagnostic value of MRI because tissue contrast can be tailored to a particular purpose. Other imaging technologies do not have this feature.

Since newer products tend to provide better overall performance, Mouser has assembled a Medical Imaging site specifically designed to provide design engineers with a jump-start on part selection.

MRI has brought a whole new level of vision to medicine that continues to improve with new technology found at Mouser.

By Mouser Electronics, www.mouser.com

Fig. 1: (Left) Excerpts demonstrating the affect of temperature on output voltage regulation. (Right) The test plots for the occurance of noise (peak 10 Hz) with respect to output voltage. (Courtesy Analog Devices datasheet for AD4525)

Fig. 2: Mouser Medical Imaging applications block diagram with parts selected for MRI across multiple manufacturers.

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Digtal ICs 19

ElEctronic Products electronicproducts.com AuGust 2013

UFS The next generation of embedded storageUniversal Flash Storage is set to improve embedded system performanceBY SCOTT BEEKMAN Director, Managed NAND Memory Products Toshiba America Electronic Components www.toshiba.com/taec/

For a few years now, e-MMC (Embedded Multi-Media Controller) has been the leading high-density embed-ded storage solution for mobile devices and for good reason. As a JEDEC standard solution, widely adopted by an enormous and growing smartphone and tablet market, the e-MCC format enabled a wide variety of applications to take advantage of the infrastructure of memory, chipset, and OS

vendors that support this solution. These applications include games, digital video cameras, printers, servers, eReaders, security systems, medical, automotive, and many more. The e-MMC market has skyrocketed from under $1 billion in global sales in 2009 to about $5 billion in 2012, and it contin-ues to grow.

So, what embedded Gbyte storage solution comes after e-MMC? As mobile devices become more sophisticated, inter-

We provide interconnect designs that take extremesof shock and vibration in stride, and meet ne-pitch specications ranging from 2.54mm down to 0.8mm pin-to-pin spacing. Our extensive selection of headers and sockets can be congured to accommodate awide range of board-to-board requirements.

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Fig.1: UFS vs. e-MMC topology.

20 Digital ICs


face speeds and system level performance for embedded storage must continue to advance. For this reason, a new JEDEC standard embedded storage interface solution is taking shape Universal Flash Storage (UFS). Enabling significant boosts in interconnect performance; UFS is in-tended to be the next gen-eration of mobile mass storage after e-MMC. Like e-MMC, UFS incor-porates into one package one or multiple NAND flash die and a controller die that performs NAND management functions such as error code correc-tion (ECC), wear-leveling and block management, to simplify integration into product designs.

UFS operationUFS is not backward compatible to e-MMC and has a serial interface, in contrast to e-MMC's parallel format. As shown in Fig. 1, UFS supports full duplexing, enabling both reading and writing between the host processor and UFS device at the same time; e-MMC supports half duplexing, only allowing either reading or writing between the host processor and e-MMC device.

One key benefit of UFS is its faster interface. While e-MMC version 4.5 and 5.0 have maximum interface speeds of 200 and 400 Mbytes/s, respectively, UFS version 2.0 HS-G2 (High-Speed Gear 2) can supporttwo lanes, each operat-ing at a maximum speed of around 360 Mbytes/s, for a total of 720 Mbytes/s.

HS-G3 (High-Speed Gear 3) can sup-porttwo lanes, each operating at a max-imum speed of around 720 Mbytes/s, or 1,440 Mbytes/s total.

Since NAND performance can be a bottleneck, especially for write oper-ations, the benefit of the faster UFS

interface is best achieved by interleaving multiple NAND die within the UFS device. This is managed by the UFS con-troller. For this reason, higher densities, which have more die to interleave, can have higher performance, and are ex-pected to be the target for UFS initially. Figure 2 highlights some key differences between UFS and e-MMC.

Other UFS benefitsThe e-MMC solutionhas a feature called Packed Command, which enables the host system to issue a set of multiple commands to the e-MMC device, rather than one command at a time. However,

Fig. 2: UFS vs. e-MMC: key feature comparison.

for e-MMC, these sets of commands must all be read commands, or write commands, but not both intermixed. UFS has Command Queuing, which enables the host system to issue multiple read and write commands, to be executed by the UFS device in parallel, enabling improved

system performance.UFS has better power

efficiency during read and write operations, though e-MMC uses less power during idle or sleep states, and therefore e-MMC likely uses less power overall, depending on the application's use case.

Production rampThe e-MMC market's size and momentum will likely mean that these two mobile embedded solutions will continue to be supported in parallel for some time, with UFS initially supporting the

needs of applications demanding higher performance, and typically at higher densities, and e-MMC supporting the needs of applications driven to maintain the lowest cost.

An earlier version of UFS, version 1.1 (see Fig. 3), has been sampling since early 2013 for initial chipset and OS de-velopment. UFS version 2.0 is expected to be the first high-speed UFS solution that broadly goes to mass production, in early 2014. UFS will likely take a greater share of the embedded storage market as economies of scale increase and the rela-tive additional cost over that of e-MMC decreases over time.

Fig. 3: The THGLF0G9B8JBAIE 64-Gbyte UFS 1.1 storage IC comes in a 169-ball FBGA package.

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22 Product Trends


Insight into current product developments

Applications in

Transportation electronicsThe design of transportation systems is at a crossroads for certain. The move to electric and hybrid-electric automobiles is very significant now and I think it will continue to grow quickly. When will that technology, along newer automotive safety systems, be widely implemented in buses, trucks, and trains? There are some hybrid buses, but not a lot. Maybe a better question is why hasnt it been done already. But, there are many active innovations in public transport and in automotive.

Public transportationThere are some new and interesting applications in public transportation, and systems in many cities could use a number of updates. Fare collection is one area to look at. Rainer Lutz, senior global marketing manager at NXP tells us that electronic ticketing is making access to public transport faster, more reliable, and more secure. Mifare, NXPs extensive range of contactless IC prod-ucts, is the most popular and advanced development platform. It is used in over 650 cities from London to Auckland and from Moscow to Sao Paulo.

Innovative smart mobility concepts are being implemented that combine metro, bus, taxi and micro payments as well as bike and car rental on a single card. In addition, regional and country-wide schemes extend the scope of the passengers travel experience incorporat-ing street parking or museum entrance fees, for example.

Rainer adds that the latest industry trends also include mobile ticketing using NFC phones and banking cards which can be used for public transpor-tation; both can use Mifare function-ality for a seamless integration.Mobile ticketing enables the integration of travel information and ticketing in one device, encouraging a sustainable urban lifestyle.

Automotive convenienceSome significant automotive advances fall under a heading of convenience but, at lease for some people, these may be moving to the Cant Live Without category. Google and Apple Maps with traffic info and Garmin systems with traffic updates are being widely used. And now there are signs on city streets showing real-time availability of parking spaces in nearby garages. But, Id have to say the main emphasis in transportation electronics is in automotive safety.

Automotive safetyRenesasis one of the leading chip suppliers for automotive. I spoke with Amrit Vivekanand, vice president of the automotive marketing unit at Renesas. Amrit said, With all the post-crash safety technology, such as air bags, that we have today, there are still close to 100 automotive related deaths per day in the U.S., and this statistic unfortunately has been staying flat. Focus is shifting to pre-crash active safety and crash prevention as the only way to reduce the level of fatalities. This shift will drive tremendous electronic content into the vehicle.

All this pre-crash and post-crash technologies and the innovation that has been spawned will make autonomous driving a reality, delivering intelligent and self-aware automobiles. For the IC manufacturer, we know that devices that combine the performance of high-end SOCs and the safety levels of drivetrain/chassis applications will be required.

The backup camera may also soon be a safety requirement. The Department of Transportation has delayed the new car requirement until 2015. They say more analysis of the cost, said to be $2.7 B or as much as $18 M per life saved, is needed before issuing the mandate. The agency has previously delayed the rule three times,

Jim Harrison

Vishay Intertechnology: www.vishay.com

Freescale Semiconductor: www.freescale.com

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40-V family of automotive-qualified MOS-FETs offer RDS(on) as low as 0.75-m at 10 VGS. The family of 22 devices come in D2Pak-7P, D2Pak, DPak, TO-262, IPAK, and TO-220 packages and current ratings up to 240 A. The devices offer 765-mJ single-pulse ava-lanche energy and a tested value to 1,485 mJ. Pricing begins at $0.39 ea/100,000.

The AEC-Q200-qual-ified IHTH-0750IZ-5A and IHTH-1125KZ-5A high-current, high-temp through-hole inductors come in

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The Qorivva MPC577xK 32-bit embed-ded MCU is designed for automotive radar systems, providing high levels of

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24 Energy-Saving Initiative

Semiconductor advances make smarter, slimmer power suppliesAs equipment becomes smarter, maximizing energy efficiency and usage modes, power supplies can also act smarter by using the latest power semiconductor innovationsBY TIM KASKE, Product Marketing Manager for DC-DC Power Products, ON Semiconductor, www.onsemi.com

As PCs and televisions adopt ever slimmer and more elegant form factors, power supplies must achieve lower profiles and adapt-ers for ultra-portable computers must become more compact and lightweight travelling companions.

To help meet targets such as these, quasi-square-wave resonant (QR) power supplies provide high switch-ing efficiency and reduce EMI, which can simplify shielding or suppres-sion. Managing the power supply, a combined flyback and power-factor correction (PFC) controller allows designers to reduce component count. Moreover, by turning off the PFC under low/no-load condition, the controller can improve standby efficiency. The roadmap for this type of device is moving towards further feature integration and enhanced switching performance for lower audible noise.

Combination QR/PFC controllersA number of combination devices are available, featuring PFC and quasi-reso-nant flyback control in a single package. High-voltage IC technology allows direct startup from the rectified ac-line voltage. Logic circuitry controls the flyback and PFC switching waveforms as well as functionality such as soft-start and protection features including overcurrent, overvoltage, and overtem-perature protection, safe restart and demagnetization detection.

During normal operation, PFC en-

hances efficiency by minimizing reactive power and preventing distortion of the line-voltage waveform. It is mandatory in appliances rated over 70 W, but is not required at lower power levels, where energy losses in the PFC circuitry can reduce efficiency. To save these losses, some commercial combination flyback/PFC controllers are able to turn the PFC off and hence improve efficiency at light loads and in standby mode.

A novel feature of ON Semicon-

ductors NCP1937 controller allows the user to program the PFC disable threshold based on the percentage of output power. Internal circuitry generates a current proportional to the output power, which is scaled and averaged using an external resistor and capacitor to produce a voltage proportional to output power. The IC uses this voltage in conjunction with an integrated PFC disable timer and a reference that varies with the line voltage to coordinate turning off and re-enabling the PFC. This allows the PFC stage to be disabled between 25 and 50% of the load at low line and be-tween 50 and 75% at high line. The PFC

stage is also disabled during power-up until the flyback soft-start time expires. In addition, the circuitry needed to turn off PFC by opening the feedback connection is integrated in the device. Conventional combination devices re-quire an external feedback connection with a MOSFET circuit to open or close the loop as required. Figure 1 illustrates the PFC on/off control circuitry.

This feature provides one example of how advances in high-voltage IC

technology are allowing manufactur-ers to deliver more highly integrated controllers that allow power supply designers to eliminate additional external circuitry and further improve efficiency across the load range. ICs with high-voltage capability have typ-ically provided only limited digital ca-pability. More advanced high-voltage processes now allow smaller digital feature sizes, permitting extra on-chip functionality, which enables designers to build smarter and more accurate power supply solutions within smaller form factors than has been possible in the past.

Fig. 1: Integrated circuitry for PFC on/off control.

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an electronic products special series

26 Energy-Saving Initiative

Keys to improvementON Semiconductors 700-V high-volt-age process also allows the controller to integrate most of the circuitry for discharging the X2 input filter capacitor when the ac-line voltage is removed a feature required by safety agency standards. This saves the PCB space and power consumed by the external resistor network used for X2 ca-pacitor discharge. The NCP1937 controller has two high-voltage startup circuits, and a novel approach is used to reconfigure these to discharge the input filter capacitance upon removal of the ac-line voltage.

Other integrated features made possible by the advanced process technology, saving sever-al external components, include a power-savings mode (PSM) in which the supply current is reduced to below 70 A. The typical approach taken with conventional flyback control ICs uses an active-off signal to initiate the low-power mode, which requires an additional bias current to pull down the optocoupler on the secondary side and reduces the overall system efficiency. In contrast, the NCP1937 has internal circuitry that eliminates the need for such a bias current, thereby improv-ing system efficiency when no load is present.

The increased digital integration combined with the advanced 700-V high-voltage process also allows more of the circuitry required for protection features, such as fault detection, current sensing, and overpower compensation to be implemented on chip, reducing reliance on external components.

Better user experienceQR operation of the flyback converter is currently popular in laptop power adapters and televisions, mainly by virtue of zero-voltage switching (ZVS), or valley switching, which improves switching efficiency and produces lower electromagnetic interference (EMI) than a hard-switching architecture.

By nature, the QR converters switch-ing frequency varies according to input and output load conditions and tends to increase as the output load decreas-es. In a conventional QR converter, the free-running frequency is typically clamped at 125 kHz, which is below the 150-kHz CISPR-22 EMI starting point. Hence, at light loads, the MOS-

FET cannot turn on as soon as a valley is detected but must wait8 s, causing some valleys to be ignored. However, if the output power is at a level such that the off-time needed for cycle-by-cycle energy balance falls between adjacent valleys, two or three cycles of first-val-ley switching may be followed by one cycle of second-valley switching. This phenomenon, known as valley jumping, causes large variations in the switching frequency, which are compensated by large changes in the peak current, result-ing in audible noise in the transformer.

Skip-cycle or frequency-foldback operation is often used to reduce the switching frequency as the frequency clamp is reached. This is effective in increasing light-load efficiency, but does not prevent valley jumping. Another drawback of this approach is the rela-tively low minimum switching frequency required, typically around 30 kHz, neces-sitating a larger transformer.

ON Semiconductors patented Valley Lockout technique eliminates valley jumping by locking the converter in its

selected valley until a significant change in output power is detected. In the NCP1937 this is achieved by using a gang of comparators to monitor the voltage on the feedback pin and feed the informa-tion to a counter. The hysteresis on each comparator locks the operating valley. In addition to this, a frequency foldback circuit based on a VCO reduces the

switching frequency as the output power decreases, delivering a further improve-ment in efficiency at light load.

With this innovation, which delivers improved efficiency and a better user experience, combined with increased on-chip integration of features essential for correct operation of flyback/PFC combination controllers, designers can meet the requirements of todays con-sumer and business electronics markets.

Demands to continue improving the energy efficiency of high-volume electronic products such as PCs and televisions are coming from many directions, including governments and eco-design bodies. For end users, products that are smaller, slimmer, and lighter are consistent with meeting these requirements as well as their own desires for greater style and mobility. As equipment becomes smarter, maxi-mizing energy efficiency across diverse operating conditions and usage modes, power supplies can also look and act smarter by using the latest power semi-conductor innovations.

Fig. 2: ON Semiconductors valley lockout detection circuitry.

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HCC ultrasound advances diagnostic clinical proceduresCutting-edge ultrasound research requires a high-channel-count (HCC) system that can interface to large matrix arrays

BY DANNY KREINDLER, Senior Director of FAE and Technical MarketingCephasonics, www.cephasonics.com

One area of medical research thathas beengaining a lot of attention is shear-wave elastography imaging. This technique has enormous poten-tial for medical diagnosis due to its higher contrast properties compared to traditional B-mode or harmonic imaging. In shear-wave elastography imaging, after generating a push pulse, a shear wave is created in the region of interest in the tissue. This imaging technique is done today using one-dimensional linear arrays that produce a less satis-factory two-dimensional slice. Capturing the shear-wave with a high-channel-count (HCC) ultrasound matrix array, and then generating and processing volumetric data,may lead not only to research breakthroughs in this field, but eventually clin-ical adoption of new diagnosis methodsfor many diseases, including breast cancer.

Shear-wave elastography, as well ascutting-edge ultrasound research in many fields, requires an HCC ultra-sound system that can interface to large matrix arrays.In the past, researchers seeking such a high channel-count system mostly built the system on their own. However, academic institutes found such an endeavor to be very costly and time-consuming, often running way over budget and taking years longer than planned to build. After all, universities need to focus on conducting research using the system; they are not set up to

build the system itself. Further, support and continuous maintenance of a one-of-a-kind in-house-built system is very costly, and can result in lengthy down-timeduring whichno research can be conductedwith the system.

AnHCC system needs to be, in essence, both a flexible ultrasound gener-ator and a high-bandwidth data acquisi-tion system (DAS). Any HCC system is comprised ofthe five major electronics subsystems seen in Fig.1.

TheHCC system's ultrasound gen-erator (TX) includes all the transmit circuitry and digital beam formation required to generate ultrasound pulses to the transducer.The ultrasound receiver (RX)provides all analog conditioning circuitry, the ADCs, and (optional) digital receive beam formation required to sample RF data from each channel

and, optionally, generate beam data from it. The data transportand interconnect subsystemfundamentally includes the multiple high-speed data links, their con-trol, protocol, cabling, and connectors re-quired to transport the receive data from

the RX subsystem to thehost subsystem.The host computer (Host)isthe

master controllerfor the system hard-ware, including TX and RX, memory, HDD, and so forth. The Host contains very high-end graphic processing units (GPUs) toprovide researchers with fast memory and I/O data paths, as well as access to the high-performance compu-tation needed to run complex research algorithms. Lastly, there is the Power Supply Unit (PSU), whichsupplies all power rails to the system, including the ultrasound-specific high-voltage rails required by the ultrasound generator.

Fig. 1: The high-level block diagram for a high-channel-count systemshowsitsfive major subsystems:(counterclockwise from upper left) the ultrasound generator, the ultrasound receiver, the data transport & interconnect subsytem, the host, and the power supply unit.


30 Cover Story

A realization of such an HCC system will require a hierarchical architecture. A baseline system of some number of channels (typically a power or two such as 64, 128, or 256 channels) can be designed. This baseline system will include a number of transmit and receive channels along with all their control and timing circuitry, and ultrasound-spe-

cific high-voltage power supplies. In this baseline system, the TX subsystem consists of a number of transmitter mod-ules that include a fine delay resolution and multiple-level pulsing circuitry for each channel allowing users to generate virtually any arbitrary transmit sequence at various voltage outputs. Since most ultrasound transducers can use the same

elements both for transit and receive, the baseline RX subsystem will consist of the same number of receiver modules imple-menting the same number of channels. This symmetrical approach simplifies the wiring between the electronics and the transducer connector. Receive channels will be amplified with commontime/gain compensation (TGC) to account for signal attenuation with depth in the tis-sue. Next, at the channel level, sampling of the analog signal is accomplished by a dedicated ADC. Sampling rates should range up to 65 Msamples/s to comfort-ably oversample signals in the ultrasound bandwidth.

HCC systems inherently imply trans-port of huge amounts of data. For exam-ple, a 4,096-channel system, using 12-bit ADCs sampling at 65 MHz will produce approximately 3.2 Tbits of raw RF channel data per second. Many research applications indeed require all this data, and thus the system needs to be designed for such a "worst-case" scenario. But, transporting and storing so much data further upstream can be expensive, and pointless when all that data is not needed to accurately conduct the research at hand. Thus, the RX module should also implement several signal-processing functions including demodulation, fil-tering, and decimation. These functions can be used to reduce data rates. Further, for quick imaging or for probe placement verification, a beam-formed data path can be provided as well.

A number of such baseline systems are then properly interconnected to create larger systems. For example, four 1,024-channel systems can be used to build a 4,096-channel system.

The data transport and interconnect subsystem is designated as its own sub-system due to its complexity andthe very high throughput demands placed on it, as previously discussed. Although often overlooked, the design and implementa-tion of such a subsystem is non-trivial. The performance, robustness, flexibil-ity, and viability of the system depend on it. The subsystem needs to support continuous data transfer without much limitation. In some extreme situations where this is not feasible with raw data,

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32 Cover Story


a capture-and-store option should be supported. For example, in a 128-channel RX module, a 12-cm scan with 6,400 12-bit samples at a 40-MHz sampling rate

will produce 9.83 Mb per fi ring (12 bits/samples x 6,400 samples x 128 channels). Using a fast 9-Gbit DRAM, 1,000 fi rings can be stored in the front-end. Finally, a

scalable protocol for properly handling and tagging the various sources types of data (channel, beam, and so on) needs to be implemented as part of any such subsystem (Fig. 2).

Th e Host complex in a baseline unit of a very-large-channel-count system is responsible for communicating user commands to the front-end controller and timing circuitry, and receiving the very-high-bandwidth data coming from the RX subsystemacross thedata trans-port and interconnect subsystem. Very high-end GPUs in the Host subsystem are responsible for some or all of the researcher's demanding computation needs. In larger systems using two, four, or more baseline systems hierarchically, another CPU/GPU server is needed to aggregate these baseline systems.

Th e PSU has to realize the ultra-sound-specifi c high-voltage dc/dc converter modules. Ultrasound power supplies are nontrivial. Extreme care must be taken to control noise in the design. A noisy PSU can contaminate the acquired data in many ways and may even compro-mise the research being conducted.

Finally, the HCC system must provide researchers full control over all of the system's confi gurability in real time. Th is interface preferably should abstract the hardware and low-level reg-ister access and allow parameters to be defi ned and set in high-level structures such as scans, frames, beams, fi rings, patterns, frequencies, fi lter coeffi cients, and the like. Th e acquired ultrasound data is available to the user via a shared memory interface.

Th e 1,024- to 4,096-channel cQuest Griffi n ultrasound research system recent-ly introduced by Cephasonics employs much of the above-mentioned critical architectural aspects. Th is HCC system also combinesa MATLAB interface topromote a fast learning curvefor sys-temoperation, and with proven, reliable technology to off er a much-needed 'buy' alternative to in-house implementations. Systems such as this willenable worldwide ultrasound researchers to focus entirely on conducting cutting-edge research that will hopefully lead to revolutionary new diagnostic clinical procedures.

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Fig. 2: Th e front end of an actualHCC ultrasound system shows some of theunique electronics needed to implement such a system.

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Measurement Specialties MS5805a miniature altimeter

34 Product RoundupSensors & Transducers


Pressure sensors have gotten more ca-pable and are tackling a wide variety of applications in which measuring pressure doesn't seem to be the point. Among the following sampling of pressure sensing devices from major suppliers, you'll find devices that serve as altimeters and replacements for ultrasonic and radar devices, as well as ones who tackle pressure measurement in novel ways.

Measurement Specialties (www.meas-spec.com) recently released the MS5805a miniature altimeter, actually a low-power digital barometric pressure sensor. The sensor's high precision it integrates a 24-bit delta-sigma ADC suits it for portable, battery-operated devices such as fitness gadgets, bike computers, adven-ture or multimode watches, variome-ters, and dataloggers. The sensor interfaces to virtually any microcontroller.

With a conversion time down to 0.5 ms via an IC interface, the device works from a 1.8 to 3.6-V supply, consuming just 0.6 A in operation and less than 0.1 A in standby mode at 25C. The fast conver-sion time includes an oversampling selection of up to 8192, allowing exceptionally low noise performance. With resolution of 0.02 mbar (equivalent to a 20 cm change in elevation), the inte-grated digital pressure sensor has a pressure accuracy of 4 mbar for pressures ranging from 300 to 1,200 mbar and temperatures of 20 to 85C. Further, it is splashproof down to 40 m and includes temperature measurement capabilities with an accuracy of 2C and a temperature resolution less than 0.01C.It is priced at $5.25 per unit in quantities of 10,000.

The Vortex1 from Farsens (www.farsens.com) is a battery-free RFID sensor tag capable of transmitting pressure data along with a unique identifier to a com-mercial EPC C1G2. The device features a LPS331AP pressure sensor from ST Micro-electronics with an absolute pressure range from 260 to 1,260 mbar. The tag comes in a variety of antenna designs and sizes to adapt the performance to the required application. The reading distance for the battery free pressure sensor tag is around

1.5 m and it can be embedded in a wide variety of materials, such as plastics or concrete. Evaluation kits are available.

The tag is designed for moni-toring pressure-sensitive assets and process management. That it needs no wiring simplifies retrofitting pip-ing systems, gas/liquid containers, or similar assets and processes due to

the low installa-tion investment required and the savings associated to sensor mainte-

nance due to battery changes.American Sensor Technologies (AST,

www.astsensors.com) has released the AST46DS explosion-proof pressure transducer with display. Available for pres-sures from 1 to 20,000 PSI, the sensor is price-competitive, and offers zero function

capability, voltage or 4 to 20-mA output signals, and all 316L stainless steel sensor materials.

The voltage output signal suits oil and gas well site applica-

tions. With many SCADA / RTU

sites powered by solar panels in remote locations, a pressure transducer with low current consumption can have an extended operating life; the AST46DS can operate as low as 8 Vdc and has current consumption as low as 2 mA. For offshore platforms, the transducer housing has a special layered

Farsens Vortex1

American Sensor Technologies AST46DS explosion- proof pressuretransducer with display

American Sen-sor Technologies AST4530 PVDF / PTFE submersible pressure transducer

36 Product RoundupSensors & Transducers


paint suitable for NEMA 4X environments and salt spray conditions. Using 316L stain-less steel, the $825 transducer is compliant to NACE MR0175/ISO 15156.

AST has also introduced the AST4530 PVDF / PTFE submersible pressure trans-ducer with measurement ranges from 0 to 2.5 psi up to 30 psi. Intended for liquid-level measurement of corrosive liquids in which

stainless steel or titanium cannot survive, the AST4530 is designed to offer excellent long-term survivability and stability.

Submersible pressure transducers offer some flexibility in comparison to ultrasonic and radar level sensors. Vapors generated from the liquid will not affect the sensing element of a submersible pressure transducer, since it is designed for optimal

compatibility. Foaming or reflections of the liquid will not generate false readings, be-cause the sensor measures liquid pressure based on specific gravity.

All exposed sensor materials are optimized for compatibility, including the PVDF cable and seal. Changes in pressure are transmitted through a PTFE diaphragm and converted to an output signal using ASIC electronics. Ratiometric 1 to 5 and 0.5 to 4.5-V outputs are available for low-cur-rent-consumption applications, whereas a 4 to 20-mA output is available long distance transmissions. The $595 submersible trans-ducers are vented to atmosphere through the cable for optimal accuracy.

Honeywell Sensing and Control (mea-surementsensors.honeywell.com) is now offering the Model S Series of subminia-ture pressure transducers. Featuring 1% accuracy, the sensors fit into tight spaces with little clearance, and measure pressure

ranges from 100 to 15,000 psi. The rugged transducers are designed to

handle high temperatures as well as pressures, and have a flush

diaphragm manufac-tured from 17-4

PH stainless steel with a high nat-ural frequency for applications

such as engine and transmission test

stands, pressure brake testing, and hydrau-lic sensor testing.

These transducers have a small electri-cal zero-balance circuit board, which is in the lead wire (approximately 1 in x 0.087 in thick); the board does not have to be at the same temperature as the transducers. All transducers have four strain gages in a Wheatstone-bridge configuration.

Honeywell also introduced two new Wing Union / Hammer Union pressure sensors for such applications as oil and gas drilling, mud pumps / mud logging, frac-turing and cementing, acidizing, well-head measurement, and standpipe stimulation. The model 425 is available in two accuracy levels (0.2% or 0.1% BFSL), while the Model 427 (0.2% BFSL) provides a wide, shallow sensing port that facilitates seam-less flow of more viscous media blends.

Richard Comerford

We EngineerThe Sustainable Future.

Engineering is Our PassionEngineers solve problems. Our optical and temperature sensors team solves the most demanding gesture and thermal sensing problems. Based on active light, time-of-flight or far infrared technology, we offer sensors to detect hand gestures with near infrared light or measure contactless temperatures with a single pixel, dual pixel or thermal cameras.

Smart Sensor Systems for a Sustainable FutureSafer Lifetimes by Design. Our engineers work together with our customers to improve quality of life through better sensing. Gesture Recognition sensors in cars simplify complex controls so attention is on the road not the radio. Infrared thermometers and thermal cameras detect fevers and save lives or make airco systems more energy efficient.

n Gesture Recognition Solutions Based on Active Light and Time-of-Flight technology

n Temperature Sensing and Interface Solutions Precise contactless temperature sensors, cost-effective thermal cameras and temperature sensor interfaces

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Temperature SensorsFor The Sustainable Future

Honeywell Sensing and Controls Model S Series sub-miniature pressure transducer

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ANALOG INTEGRATION ISNT FOR EVERYONE

38 Product UpdatePackaging, Cabinets, and Enclosures


Keypad enclosures offer more choicesThe Comtec range of sloping front keypad enclosures is now available in seven standard sizes with external dimensions from 4.72 x 5.90 x 1.69 in. to 11.41 x 7.87 x 3.11 in. Four sizes are available with a battery compartment aperture in the base sec-tion which is designed for mounting an accessory bat-tery cradle. Three types of battery cradle are offered: one 9-V cell, two 9-V cells, or four 1.5-V AA cells.

The enclosures are molded in fine textured ABS (UL 94 HB) and come in two standard colors: off-white (RAL 9002) or black (RAL 9005). Priced starting at $22, they feature a so-called softline design with an ergonomically inclined (10) operating area to ensure comfortable operation of controls. Typical applications include telecom equipment, intercoms, surveillance devices, data collection, point-of-sale terminals, and a broad range of instrumentation.OKW Enclosures: www.okwenclosures.com

Vent aims to improve outdoor enclosureFor large outdoor enclosures with a volume over 200 l, the PolyVent XL screw-in protective vent is said to improve the enclosure's integrity, reliability, and safety in such applications as solar power, telecommunications, and exterior lighting. The vent meets the IP69K and UL 746C requirements, passes the IEC 62108 hail-impact test, performs over a 40 to 125C range, and requires no maintenance for the life of the electronics and the housing.

Changes in environmental temperatures cause air inside large-volume housings to expand resulting in pressures that sometimes exceed 200 mbar (3 psi) which can lead to failure of the housing seals and compromised internal electronics. The vent

Rack enclosures are strong and flexibleFor high-density server and network requirements, Titan DT series rack enclosures

are said to be the strongest rack in the industry - with certified static and dynamic load ratings of 5,400 and 3,300 lbs, respec-tively - andoffer a broad range of rack heights (24, 42, 44, 47, and 51 RU) and depths (36, 42, and 45 in.) to create extra space for power, cable, and cooling management. Cable raceways are available infour widths - 6, 8, 10, and 12 in. - to handle cable bundles of different sizes, and door options include vented or solid styles, including full doors or French doors with keyed handles. Vented doors have a 77% open pattern to provide optimal heat dissipation.

Available in 12 standard colors with a 10 year warranty, the cabinets employ an overhead chimney design to help dissipate thermal loads inside the rack, while hot/cold containment options prevent air mixing and lower total cost of ownership. Mount-ing-channel designs with finger cable management limit twisting and sag, and other mounting-channel options can accept 1-RU devices, freeing-up additional RU slots within the rack. Additional

options include overhead raceway choices, toolless power-strip mounting, and heavy-duty stationary/retractable shelves. An on-line rack configurator simplifies order specification, and racks ship with accessories mounted to user specifications.AMCO Enclosures: www.amcoenclosures.com


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Agilent Infi niiVision4000 X-Series Oscilloscopes 200 MHz to 1.5 GHz12.1-inch screen designed for touchInfi niiScan Zone touch triggering1M waveforms/sec update rateFully upgradable: bandwidth, MSO,dual-channel WaveGen, DVM, serial analysis including USB

Agilents next-generation oscilloscopes offer waveform update rates 20 times faster than the competition. With the latest capacitive touchscreen technology and innovative Infi niiScan Zone touch triggering, you havent really experienced an oscilloscope until now.

The oscilloscope experience redefi ned.

40 Product UpdatePackaging, Cabinets, and Enclosures


Flameproof meter enclosures are IECEx certifiedNow available with IECEx certification, XJ_X series screw-cover flameproof meter enclosures come in 68 standard sizes, all approved to gas group IIB+H2 with an IP66 rating. The enclosures are available with solid cover or viewing window.

In addition to IEC 60079-0:2011, IEC 60079-1:2007-04, IEC 60079-31:2008 international standard qualifications, the enclosures have UL, and cUL approvals, and are also available with certifications rated to the ATEX Directive and compliant with all current standards.Adalet: www.adalet.com

can equalizes internal pressure b

electronic products august 2013

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