electronic costing & technology experts · 2017. 1. 12. · company profile 7 – mcube –...

DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.

© 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 1

Electronic Costing & Technology Experts

www.systemplus.fr21 rue la Nouë Bras de Fer44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected]

March 2016 – Version 1 – Written by Audrey LAHRACH

http://www.systemplus.fr/index.php?lang=ge&page=home.php

mailto:[email protected]

mCube MC3635 3-Axis MEMS Accelerometer

Return to TOC


Glossary1. Overview / Introduction 4

– Executive Summary

– Reverse Costing Methodology

2. Company Profile 7– mCube

– MC3635 Characteristics

3. Physical Analysis 13– Synthesis of the Physical Analysis

– Physical Analysis Methodology

– Package

– Package Views, Dimensions & Pin-Out

– Package Opening

– Wire Bonding Process

– Package Cross-Section

– Die

– Die View & Dimensions

– Die Marking

– Bond Pad Opening

– MEMS Cap Removed

– MEMS Cap Details

– MEMS Sensing Area

– Delayering (Metal Layers Removed)

– IC Process

– Die Cross-Section

– Die Cross-Section – IC

– Die Cross-Section – MEMS Sensor

– Die Cross-Section – Sealing Sensor/Cap

– Die Cross-Section – MEMS Cap

– mCube MEMS Accelerometer Evolutions

4. Comparison with Competitors 66– Comparison with Bosch and STMicroelectronics

3-Axis Accelerometers

– Comparison with Analog Devices Ultra-Low Power3-Axis Accelerometers

5. Manufacturing Process Flow 74– Global Overview

– IC Front-End Process

– MEMS Process Flow

– Wafer Fabrication Unit

– Packaging Process Flow

– Package Assembly Unit

6. Cost Analysis 89– Synthesis of the cost analysis

– Main steps of economic analysis

– Yields Hypotheses

– CMOS Front-End Cost

– MEMS Front-End Cost

– MEMS Front-End Cost per process steps

– Total Front-end Cost

– Back-End 0 : Probe Test & Dicing

– Wafer & Die Cost

– Back-End : Packaging Cost

– Back-End : Packaging Cost per Process Steps

– Back-End : Final Test & Calibration Cost

– MC3413 Component Cost

– MC3413 Component Price

– mCube Accelerometers Cost Evolution

7. Cost & Price Comparison with Bosch and ST 112


Return to TOC


Package top view Package bottom view

Package Side View

1.6mm

0.94mm

1.6mm

• Marking:

CXT

DG

• Package: LGA 10-pin

• Dimensions: 1.6 x 1.6 x 0.94mm

• Pin Pitch: 0.5mm


Return to TOC


• The die marking includes:

MCUBE

©(M) 2015

Die Marking


Return to TOC



Return to TOC


Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts.

Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated).

These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:

electronic costing & technology experts · 2017. 1. 12. · company profile 7 – mcube –...

Documents